CN102637813B - Led封装结构及使用该封装结构的led灯 - Google Patents
Led封装结构及使用该封装结构的led灯 Download PDFInfo
- Publication number
- CN102637813B CN102637813B CN201210121104.9A CN201210121104A CN102637813B CN 102637813 B CN102637813 B CN 102637813B CN 201210121104 A CN201210121104 A CN 201210121104A CN 102637813 B CN102637813 B CN 102637813B
- Authority
- CN
- China
- Prior art keywords
- led
- encapsulation structure
- link
- led encapsulation
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 7
- 238000005538 encapsulation Methods 0.000 claims description 39
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 21
- 241000218202 Coptis Species 0.000 claims description 15
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 14
- 239000012634 fragment Substances 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210121104.9A CN102637813B (zh) | 2012-04-23 | 2012-04-23 | Led封装结构及使用该封装结构的led灯 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210121104.9A CN102637813B (zh) | 2012-04-23 | 2012-04-23 | Led封装结构及使用该封装结构的led灯 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102637813A CN102637813A (zh) | 2012-08-15 |
CN102637813B true CN102637813B (zh) | 2014-12-17 |
Family
ID=46622128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210121104.9A Active CN102637813B (zh) | 2012-04-23 | 2012-04-23 | Led封装结构及使用该封装结构的led灯 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102637813B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102938440B (zh) * | 2012-11-01 | 2016-07-06 | 厦门立达信照明有限公司 | Led封装结构及使用该led封装结构的led灯 |
CN104315374A (zh) * | 2014-10-10 | 2015-01-28 | 广东祥新光电科技有限公司 | 一种led灯用模块 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101617412A (zh) * | 2007-02-15 | 2009-12-30 | 松下电工株式会社 | Led封装件以及立体电路部件的安装结构 |
CN201858543U (zh) * | 2010-08-26 | 2011-06-08 | 蔡新传 | 一种可方便更换led灯的灯体结构 |
CN102214769A (zh) * | 2010-04-12 | 2011-10-12 | 富士迈半导体精密工业(上海)有限公司 | 固态发光元件及具有该固态发光元件的光源模组 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02128483A (ja) * | 1988-11-08 | 1990-05-16 | Aichi Electric Co Ltd | 固体発光表示装置 |
JP4639596B2 (ja) * | 2004-01-21 | 2011-02-23 | 住友電装株式会社 | 発光素子ユニット |
JP2010272736A (ja) * | 2009-05-22 | 2010-12-02 | Toshiba Lighting & Technology Corp | 発光装置 |
KR20110073661A (ko) * | 2009-12-24 | 2011-06-30 | 엘지디스플레이 주식회사 | 발광 다이오드 패키지를 구비한 발광 장치 |
JP5626862B2 (ja) * | 2010-08-05 | 2014-11-19 | 日本航空電子工業株式会社 | Ledデバイス及び発光装置 |
-
2012
- 2012-04-23 CN CN201210121104.9A patent/CN102637813B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101617412A (zh) * | 2007-02-15 | 2009-12-30 | 松下电工株式会社 | Led封装件以及立体电路部件的安装结构 |
CN102214769A (zh) * | 2010-04-12 | 2011-10-12 | 富士迈半导体精密工业(上海)有限公司 | 固态发光元件及具有该固态发光元件的光源模组 |
CN201858543U (zh) * | 2010-08-26 | 2011-06-08 | 蔡新传 | 一种可方便更换led灯的灯体结构 |
Also Published As
Publication number | Publication date |
---|---|
CN102637813A (zh) | 2012-08-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: 363999 Xingda Road, Fujian city of Zhangzhou province Changtai Xingtai Development Zone Zhangzhou lidaxin Green Lighting Co. Ltd. Applicant after: Leedarson Green Lighting Co., Ltd. Address before: 363999 Xingda Road, Fujian city of Zhangzhou province Changtai Xingtai Development Zone Zhangzhou lidaxin Green Lighting Co. Ltd. Applicant before: Zhangzhou Lidaxin Green Lighting Co.,Ltd. |
|
COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: ZHANGZHOU LEEDARSON GREEN LIGHTING CO., LTD. TO: LEEDERSON GREEN LIGHTING CO., LTD. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170123 Address after: The Lake District of Xiamen City, Fujian province 361010 Fang Hubei two road 1511, 7 floor 701 unit Patentee after: Xiamen lidaxin Green Lighting Group Limited Address before: 363999 Xingda Road, Fujian city of Zhangzhou province Changtai Xingtai Development Zone Zhangzhou lidaxin Green Lighting Co. Ltd. Patentee before: Leedarson Green Lighting Co., Ltd. |
|
CP01 | Change in the name or title of a patent holder |
Address after: The Lake District of Xiamen City, Fujian province 361010 Fang Hubei two road 1511, 7 floor 701 unit Patentee after: Lida trust IOT Technology Co., Ltd Address before: The Lake District of Xiamen City, Fujian province 361010 Fang Hubei two road 1511, 7 floor 701 unit Patentee before: Xiamen lidaxin Green Lighting Group Limited |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: The Lake District of Xiamen City, Fujian province 361010 Fang Hubei two road 1511, 7 floor 701 unit Patentee after: Lida trust IOT Technology Co., Ltd Address before: The Lake District of Xiamen City, Fujian province 361010 Fang Hubei two road 1511, 7 floor 701 unit Patentee before: XIAMEN ECO LIGHTING Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210702 Address after: 629000 Sichuan Suining economic and Technological Development Zone Microelectronics Industrial Park workshop Patentee after: Suining Heidexin Photoelectric Technology Co.,Ltd. Address before: 361010 7 unit 701 unit 1511, Hubei two road, Huli District, Xiamen, Fujian. Patentee before: Lida trust IOT Technology Co.,Ltd. |