CN102593074B - 电源模块用基板、电源模块和电源模块用基板的制造方法 - Google Patents
电源模块用基板、电源模块和电源模块用基板的制造方法 Download PDFInfo
- Publication number
- CN102593074B CN102593074B CN201110009776.6A CN201110009776A CN102593074B CN 102593074 B CN102593074 B CN 102593074B CN 201110009776 A CN201110009776 A CN 201110009776A CN 102593074 B CN102593074 B CN 102593074B
- Authority
- CN
- China
- Prior art keywords
- power module
- substrate
- circuit layer
- metal tunicle
- tunicle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009172164A JP5359644B2 (ja) | 2009-07-23 | 2009-07-23 | パワーモジュール用基板、パワーモジュール及びパワーモジュール用基板の製造方法 |
CN201110009776.6A CN102593074B (zh) | 2009-07-23 | 2011-01-11 | 电源模块用基板、电源模块和电源模块用基板的制造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009172164A JP5359644B2 (ja) | 2009-07-23 | 2009-07-23 | パワーモジュール用基板、パワーモジュール及びパワーモジュール用基板の製造方法 |
CN201110009776.6A CN102593074B (zh) | 2009-07-23 | 2011-01-11 | 电源模块用基板、电源模块和电源模块用基板的制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102593074A CN102593074A (zh) | 2012-07-18 |
CN102593074B true CN102593074B (zh) | 2016-08-10 |
Family
ID=54478507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110009776.6A Active CN102593074B (zh) | 2009-07-23 | 2011-01-11 | 电源模块用基板、电源模块和电源模块用基板的制造方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5359644B2 (ja) |
CN (1) | CN102593074B (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5548167B2 (ja) * | 2011-07-11 | 2014-07-16 | 日本発條株式会社 | 積層体及び積層体の製造方法 |
JP5809901B2 (ja) * | 2011-09-20 | 2015-11-11 | 日本発條株式会社 | 積層体及び積層体の製造方法 |
JP5947090B2 (ja) * | 2012-04-13 | 2016-07-06 | 昭和電工株式会社 | 絶縁基板の製造方法 |
JP2014072314A (ja) * | 2012-09-28 | 2014-04-21 | Toyota Industries Corp | 半導体装置、及び半導体装置の製造方法 |
JP6269116B2 (ja) * | 2014-02-05 | 2018-01-31 | 三菱マテリアル株式会社 | 下地層付き金属部材、絶縁回路基板、半導体装置、ヒートシンク付き絶縁回路基板、及び、下地層付き金属部材の製造方法 |
DE102014214784A1 (de) * | 2014-07-28 | 2016-02-11 | Continental Automotive Gmbh | Schaltungsträger, elektronische Baugruppe, Verfahren zum Herstellen eines Schaltungsträgers |
JP6454262B2 (ja) | 2015-12-24 | 2019-01-16 | タツタ電線株式会社 | 半田接続構造、および成膜方法 |
US9532448B1 (en) * | 2016-03-03 | 2016-12-27 | Ford Global Technologies, Llc | Power electronics modules |
EP3587621B1 (en) * | 2017-02-24 | 2021-12-15 | National Institute for Materials Science | Method for manufacturing aluminum circuit board |
CN107334358B (zh) * | 2017-04-21 | 2022-12-09 | 佛山市顺德区美的电热电器制造有限公司 | 一种电磁加热的炊具及其制造方法 |
JP7369508B2 (ja) * | 2017-08-04 | 2023-10-26 | デンカ株式会社 | セラミックス回路基板 |
JP7299671B2 (ja) * | 2017-08-04 | 2023-06-28 | デンカ株式会社 | セラミックス回路基板 |
JP7147313B2 (ja) * | 2018-07-18 | 2022-10-05 | 三菱マテリアル株式会社 | 金属ベース基板 |
CN114930528A (zh) * | 2020-01-16 | 2022-08-19 | 三菱电机株式会社 | 半导体装置以及电力变换装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1783473A (zh) * | 2004-11-25 | 2006-06-07 | 富士电机控股株式会社 | 绝缘衬底和半导体器件 |
CN1862795A (zh) * | 2005-05-13 | 2006-11-15 | 富士电机控股株式会社 | 接线板 |
CN102549738A (zh) * | 2010-05-18 | 2012-07-04 | 丰田自动车株式会社 | 半导体装置及其制造方法 |
-
2009
- 2009-07-23 JP JP2009172164A patent/JP5359644B2/ja active Active
-
2011
- 2011-01-11 CN CN201110009776.6A patent/CN102593074B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1783473A (zh) * | 2004-11-25 | 2006-06-07 | 富士电机控股株式会社 | 绝缘衬底和半导体器件 |
CN1862795A (zh) * | 2005-05-13 | 2006-11-15 | 富士电机控股株式会社 | 接线板 |
CN102549738A (zh) * | 2010-05-18 | 2012-07-04 | 丰田自动车株式会社 | 半导体装置及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN102593074A (zh) | 2012-07-18 |
JP5359644B2 (ja) | 2013-12-04 |
JP2011029323A (ja) | 2011-02-10 |
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