CN102593074B - 电源模块用基板、电源模块和电源模块用基板的制造方法 - Google Patents

电源模块用基板、电源模块和电源模块用基板的制造方法 Download PDF

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Publication number
CN102593074B
CN102593074B CN201110009776.6A CN201110009776A CN102593074B CN 102593074 B CN102593074 B CN 102593074B CN 201110009776 A CN201110009776 A CN 201110009776A CN 102593074 B CN102593074 B CN 102593074B
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China
Prior art keywords
power module
substrate
circuit layer
metal tunicle
tunicle
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CN201110009776.6A
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English (en)
Chinese (zh)
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CN102593074A (zh
Inventor
长友义幸
黑光祥郎
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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Priority to JP2009172164A priority Critical patent/JP5359644B2/ja
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to CN201110009776.6A priority patent/CN102593074B/zh
Publication of CN102593074A publication Critical patent/CN102593074A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201110009776.6A 2009-07-23 2011-01-11 电源模块用基板、电源模块和电源模块用基板的制造方法 Active CN102593074B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009172164A JP5359644B2 (ja) 2009-07-23 2009-07-23 パワーモジュール用基板、パワーモジュール及びパワーモジュール用基板の製造方法
CN201110009776.6A CN102593074B (zh) 2009-07-23 2011-01-11 电源模块用基板、电源模块和电源模块用基板的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009172164A JP5359644B2 (ja) 2009-07-23 2009-07-23 パワーモジュール用基板、パワーモジュール及びパワーモジュール用基板の製造方法
CN201110009776.6A CN102593074B (zh) 2009-07-23 2011-01-11 电源模块用基板、电源模块和电源模块用基板的制造方法

Publications (2)

Publication Number Publication Date
CN102593074A CN102593074A (zh) 2012-07-18
CN102593074B true CN102593074B (zh) 2016-08-10

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CN201110009776.6A Active CN102593074B (zh) 2009-07-23 2011-01-11 电源模块用基板、电源模块和电源模块用基板的制造方法

Country Status (2)

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JP (1) JP5359644B2 (ja)
CN (1) CN102593074B (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5548167B2 (ja) * 2011-07-11 2014-07-16 日本発條株式会社 積層体及び積層体の製造方法
JP5809901B2 (ja) * 2011-09-20 2015-11-11 日本発條株式会社 積層体及び積層体の製造方法
JP5947090B2 (ja) * 2012-04-13 2016-07-06 昭和電工株式会社 絶縁基板の製造方法
JP2014072314A (ja) * 2012-09-28 2014-04-21 Toyota Industries Corp 半導体装置、及び半導体装置の製造方法
JP6269116B2 (ja) * 2014-02-05 2018-01-31 三菱マテリアル株式会社 下地層付き金属部材、絶縁回路基板、半導体装置、ヒートシンク付き絶縁回路基板、及び、下地層付き金属部材の製造方法
DE102014214784A1 (de) * 2014-07-28 2016-02-11 Continental Automotive Gmbh Schaltungsträger, elektronische Baugruppe, Verfahren zum Herstellen eines Schaltungsträgers
JP6454262B2 (ja) 2015-12-24 2019-01-16 タツタ電線株式会社 半田接続構造、および成膜方法
US9532448B1 (en) * 2016-03-03 2016-12-27 Ford Global Technologies, Llc Power electronics modules
EP3587621B1 (en) * 2017-02-24 2021-12-15 National Institute for Materials Science Method for manufacturing aluminum circuit board
CN107334358B (zh) * 2017-04-21 2022-12-09 佛山市顺德区美的电热电器制造有限公司 一种电磁加热的炊具及其制造方法
JP7369508B2 (ja) * 2017-08-04 2023-10-26 デンカ株式会社 セラミックス回路基板
JP7299671B2 (ja) * 2017-08-04 2023-06-28 デンカ株式会社 セラミックス回路基板
JP7147313B2 (ja) * 2018-07-18 2022-10-05 三菱マテリアル株式会社 金属ベース基板
CN114930528A (zh) * 2020-01-16 2022-08-19 三菱电机株式会社 半导体装置以及电力变换装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1783473A (zh) * 2004-11-25 2006-06-07 富士电机控股株式会社 绝缘衬底和半导体器件
CN1862795A (zh) * 2005-05-13 2006-11-15 富士电机控股株式会社 接线板
CN102549738A (zh) * 2010-05-18 2012-07-04 丰田自动车株式会社 半导体装置及其制造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1783473A (zh) * 2004-11-25 2006-06-07 富士电机控股株式会社 绝缘衬底和半导体器件
CN1862795A (zh) * 2005-05-13 2006-11-15 富士电机控股株式会社 接线板
CN102549738A (zh) * 2010-05-18 2012-07-04 丰田自动车株式会社 半导体装置及其制造方法

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Publication number Publication date
CN102593074A (zh) 2012-07-18
JP5359644B2 (ja) 2013-12-04
JP2011029323A (ja) 2011-02-10

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