CN102554782A - Polishing pad cleaning device and polishing pad finisher - Google Patents
Polishing pad cleaning device and polishing pad finisher Download PDFInfo
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- CN102554782A CN102554782A CN2010105999146A CN201010599914A CN102554782A CN 102554782 A CN102554782 A CN 102554782A CN 2010105999146 A CN2010105999146 A CN 2010105999146A CN 201010599914 A CN201010599914 A CN 201010599914A CN 102554782 A CN102554782 A CN 102554782A
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- deionized water
- venturi tube
- cleaning device
- grinding pad
- controller
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- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention relates to a polishing pad cleaning device and a polishing pad finisher. The polishing pad cleaning device comprises a gas delivery pipe, a deionized water delivery pipe, a Venturi tube and a controller, wherein the gas delivery pipe and the deionized water delivery pipe are respectively connected with the Venturi tube, the controller is connected with the gas delivery pipe and the deionized water delivery pipe, after being mixed in the Venturi tube, high-pressure gas delivered by the gas delivery pipe and deionized water delivered by the deionized water delivery pipe are sprayed out from the Venturi tube, and the controller is used for controlling opening and closing of the gas delivery pipe and opening and closing of the deionized water delivery pipe. The polishing pad cleaning device and the polishing pad finisher can generate high impact force to remove residual micro-particles, and a cleaning effect is good.
Description
Technical field
The present invention relates to chemical-mechanical grinding device, relate in particular to a kind of grinding pad cleaning device and grinding mat trimmer.
Background technology
At cmp (chemical mechanical polishing; CMP) in the processing procedure; Grinding head (polishing head) adsorbs wafer rear; Wafer frontside is crushed on the lapped face of grinding pad (pad), and lapping liquid (slurry) places between wafer frontside and the grinding pad lapped face, through the relative motion between wafer frontside and the grinding pad lapped face with the wafer frontside planarization.In process of lapping; Wafer be can pile up on the lapped face of grinding pad and the material that removes and the abrasive grains in the lapping liquid ground; These particulates will fill up, stop up the micropore hole on the lapped face; Make grinding pad lose grainding capacity, and, be deposited in the easy scratch wafer frontside of particulate on the lapped face.
Industry is introduced grinding mat trimmer the lapped face of grinding pad is repaired; As shown in Figure 1; Grinding mat trimmer comprises mechanical arm 110, support member 120, adjustment part 130, an assembly 140, actuator 150, driving shaft 160, motor 170 and wetting nozzle 180; Said mechanical arm 110 comprises housing 111 and is arranged at the pulley 112 and conveyer belt 113 in the said housing 111 that said actuator 150 can make said mechanical arm 110 around said support member 120 rotations, therefore said assembly 140 is moved; So that said adjuster 130 is positioned on the lapped face of grinding pad; Said assembly 140 optionally exerted pressure to said adjustment part 130 with respect to lapped face, and at this moment, said motor 170 drives said driving shaft 160 and said conveyer belt 113 rotations; And then drive said adjustment part 130 rotations, with the lapped face of finishing grinding pad.
Said adjustment part 130 is generally diamond disk; It produces cutting and removes the atomic ability of filling on grinding pad, remove and remain in the particulate on the lapped face, makes the lapped face of grinding pad can be returned to comparatively ideal state again; But; Said adjustment part 130 can not eliminate the particulate that remains on the lapped face, for further removing these particulates, also can adopt deionized water DIW cleaning grinding pad.In the prior art, the impulsive force that the deionized water of cleaning grinding pad produces is less, removes atomic limited in one's abilityly, adds the restriction that receives scavenging period, and therefore, the cleaning performance of prior art is not good.
Summary of the invention
The object of the present invention is to provide a kind of grinding pad cleaning device and grinding mat trimmer, can produce than strong impact force and remove residual particulates, cleaning performance is good.
In order to reach above-mentioned purpose, the present invention provides a kind of grinding pad cleaning device, comprises air shooter, deionized water carrier pipe, Venturi tube and controller; Said air shooter is connected with said Venturi tube respectively with the deionized water carrier pipe; Said controller is connected with the deionized water carrier pipe with said air shooter; Through the gases at high pressure of said air shooter conveying with after the deionized water that said deionized water carrier pipe is carried mixes in said Venturi tube; From said Venturi tube ejection, said controller is used to control the switching of said air shooter and deionized water carrier pipe.
Above-mentioned grinding pad cleaning device, wherein, said Venturi tube is provided with high pressure entry, low-pressure inlet and nozzle; One end of said air shooter is provided with air valve, and its other end is connected with said high pressure entry; One end of said deionized water carrier pipe is provided with water valve, and its other end is connected with said low-pressure inlet; Gases at high pressure that in said Venturi tube, mix and deionized water spray through said nozzle.
Above-mentioned grinding pad cleaning device, wherein, said air valve all is connected with said controller with water valve, by said its switching of controller control.
Above-mentioned grinding pad cleaning device, wherein, said gases at high pressure are nitrogen.
Another technical scheme provided by the invention is a kind of grinding mat trimmer; Comprise mechanical arm; Said mechanical arm comprises housing, is provided with above-mentioned grinding pad cleaning device in the said housing, and gases at high pressure that in said Venturi tube, mix and deionized water penetrate from the sidewall of said housing.
Grinding pad cleaning device of the present invention and grinding mat trimmer mesohigh gas can make the deionized water speedup; Make the nozzle ejection high speed deionized water of said Venturi tube; This high speed deionized water produces than strong impact force grinding pad; Can effectively remove the particulate on the lapped face that remains in grinding pad, cleaning performance.
Description of drawings
Grinding pad cleaning device of the present invention and grinding mat trimmer are provided by following embodiment and accompanying drawing.
Fig. 1 is the structural representation of the grinding mat trimmer of prior art.
Fig. 2 is the structural representation of grinding pad cleaning device of the present invention.
Fig. 3 is the sketch map of grinding mat trimmer of the present invention.
The specific embodiment
Below will combine Fig. 2～Fig. 3 that grinding pad cleaning device of the present invention and grinding mat trimmer are done further to describe in detail.
Referring to Fig. 2, grinding pad cleaning device of the present invention comprises air shooter 210, deionized water carrier pipe 220, Venturi tube 230 and controller 240;
Said air shooter 210 is used to carry gases at high pressure, and an end of this air shooter 210 is provided with air valve 250, and its other end is connected with the high pressure entry 231 of said Venturi tube 230;
Said deionized water carrier pipe 220 is used to carry deionized water, and an end of this deionized water carrier pipe 220 is provided with water valve 260, and its other end is connected with the low-pressure inlet 232 of said Venturi tube 230;
Said air valve 250 all is connected with said controller 240 with water valve 260, and said controller 240 is used to control the switching of said air valve 250 and water valve 260;
Through the gases at high pressure of said air shooter 210 conveyings with after the deionized water that said deionized water carrier pipe 220 is carried mixes in said Venturi tube 230, from nozzle 233 ejections of said Venturi tube 230.
Said gases at high pressure for example adopt nitrogen (N
2);
Said controller 240 for example adopts microprocessor MCU or programmable logic controller (PLC) PLC.
Gases at high pressure in the grinding pad cleaning device of the present invention can make the deionized water speedup; Make the nozzle 233 ejection high speed deionized waters of said Venturi tube 230; This high speed deionized water produces than strong impact force grinding pad; Can effectively remove the particulate on the lapped face that remains in grinding pad, therefore, grinding pad cleaning device cleaning performance of the present invention is good.
Referring to Fig. 3; Grinding mat trimmer of the present invention is provided with above-mentioned grinding pad cleaning device in its mechanical arm; Said air shooter 210 and all length direction settings of the said mechanical arm 300 in edge in the housing 310 of said mechanical arm 300 of deionized water carrier pipe 220, the nozzle 233 of said Venturi tube 230 stretches out from the sidewall 311 of said housing 310.
The operation principle of grinding mat trimmer of the present invention: every grinding finishes a wafer, and grinding mat trimmer of the present invention once cleans grinding pad 400, before the cleaning; Close lapping liquid switch valve (promptly stopping to grind processing procedure), said air valve 250 and water valve 260 are opened in said controller 240 controls simultaneously, and gases at high pressure are delivered to said Venturi tube 230 through said air shooter 210; Deionized water is delivered to said Venturi tube 230 through said deionized water carrier pipe 220; In said Venturi tube 230, gases at high pressure make the deionized water speedup to the deionized water application of force; Nozzle 233 ejection high speed deionized waters from said Venturi tube 230; The high speed deionized water of ejection is washing away the lapped face of grinding pad 400, removes and remains in the particulate on the lapped face, in the cleaning process; Said grinding pad 400 is with the abrasive disk rotation, and said mechanical arm 300 moves around under the support member effect of (not showing among Fig. 3).
Grinding mat trimmer of the present invention is established the grinding pad cleaning device in its mechanical arm, can effectively remove the particulate on the lapped face that remains in grinding pad, prolong grinding pad service life, reduce cost.
Claims (5)
1. a grinding pad cleaning device is characterized in that, comprises air shooter, deionized water carrier pipe, Venturi tube and controller;
Said air shooter is connected with said Venturi tube respectively with the deionized water carrier pipe;
Said controller is connected with the deionized water carrier pipe with said air shooter;
Through the gases at high pressure of said air shooter conveying with after the deionized water that said deionized water carrier pipe is carried mixes in said Venturi tube; From said Venturi tube ejection, said controller is used to control the switching of said air shooter and deionized water carrier pipe.
2. grinding pad cleaning device as claimed in claim 1 is characterized in that said Venturi tube is provided with high pressure entry, low-pressure inlet and nozzle; One end of said air shooter is provided with air valve, and its other end is connected with said high pressure entry; One end of said deionized water carrier pipe is provided with water valve, and its other end is connected with said low-pressure inlet; Gases at high pressure that in said Venturi tube, mix and deionized water spray through said nozzle.
3. grinding pad cleaning device as claimed in claim 2 is characterized in that, said air valve all is connected with said controller with water valve, by said its switching of controller control.
4. grinding pad cleaning device as claimed in claim 1 is characterized in that, said gases at high pressure are nitrogen.
5. grinding mat trimmer; Comprise mechanical arm; Said mechanical arm comprises housing; It is characterized in that, be provided with in the said housing that gases at high pressure that in said Venturi tube, mix and deionized water penetrate from the sidewall of said housing like the described grinding pad cleaning device of arbitrary claim in the claim 1～4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105999146A CN102554782A (en) | 2010-12-20 | 2010-12-20 | Polishing pad cleaning device and polishing pad finisher |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105999146A CN102554782A (en) | 2010-12-20 | 2010-12-20 | Polishing pad cleaning device and polishing pad finisher |
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| Publication Number | Publication Date |
|---|---|
| CN102554782A true CN102554782A (en) | 2012-07-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105999146A Pending CN102554782A (en) | 2010-12-20 | 2010-12-20 | Polishing pad cleaning device and polishing pad finisher |
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| CN (1) | CN102554782A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102873640A (en) * | 2012-09-18 | 2013-01-16 | 上海集成电路研发中心有限公司 | Grinding pad finisher |
| CN104175224A (en) * | 2014-08-26 | 2014-12-03 | 上海华力微电子有限公司 | Cleaning device of chemical mechanical polishing pad and cleaning method thereof |
| CN113418569A (en) * | 2021-06-18 | 2021-09-21 | 马鞍山钢铁股份有限公司 | Cleaning device for venturi tube flow measurement pipeline and control method thereof |
Citations (9)
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|---|---|---|---|---|
| GB879733A (en) * | 1959-11-03 | 1961-10-11 | George Dwight Mcouat | Improvements in or relating to cleaning devices |
| US3244162A (en) * | 1963-05-06 | 1966-04-05 | Ex Cell O Corp | Grinding wheel dressing means and process |
| DE3624843A1 (en) * | 1986-07-23 | 1988-02-04 | Josef Kraenzle | Auxiliary unit for a pressure pump |
| EP0294690A2 (en) * | 1987-06-12 | 1988-12-14 | International Business Machines Corporation | An atomiser for cleaning liquid and a method of using it |
| CN1246402A (en) * | 1998-08-28 | 2000-03-08 | 世大积体电路股份有限公司 | Chemical-mechanical lapping bench |
| CN1362907A (en) * | 1999-04-01 | 2002-08-07 | 皇家菲利浦电子有限公司 | Dual CMP pad conditioner |
| JP2004313954A (en) * | 2003-04-16 | 2004-11-11 | Twinbird Corp | Washing device |
| CN1828840A (en) * | 2005-03-01 | 2006-09-06 | 台湾积体电路制造股份有限公司 | Multipurpose slurry delivery arm for chemical mechanical polishing |
| CN101121247A (en) * | 2006-08-11 | 2008-02-13 | 中芯国际集成电路制造(上海)有限公司 | Device for cleaning grinding head |
-
2010
- 2010-12-20 CN CN2010105999146A patent/CN102554782A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB879733A (en) * | 1959-11-03 | 1961-10-11 | George Dwight Mcouat | Improvements in or relating to cleaning devices |
| US3244162A (en) * | 1963-05-06 | 1966-04-05 | Ex Cell O Corp | Grinding wheel dressing means and process |
| DE3624843A1 (en) * | 1986-07-23 | 1988-02-04 | Josef Kraenzle | Auxiliary unit for a pressure pump |
| EP0294690A2 (en) * | 1987-06-12 | 1988-12-14 | International Business Machines Corporation | An atomiser for cleaning liquid and a method of using it |
| CN1246402A (en) * | 1998-08-28 | 2000-03-08 | 世大积体电路股份有限公司 | Chemical-mechanical lapping bench |
| CN1362907A (en) * | 1999-04-01 | 2002-08-07 | 皇家菲利浦电子有限公司 | Dual CMP pad conditioner |
| JP2004313954A (en) * | 2003-04-16 | 2004-11-11 | Twinbird Corp | Washing device |
| CN1828840A (en) * | 2005-03-01 | 2006-09-06 | 台湾积体电路制造股份有限公司 | Multipurpose slurry delivery arm for chemical mechanical polishing |
| CN101121247A (en) * | 2006-08-11 | 2008-02-13 | 中芯国际集成电路制造(上海)有限公司 | Device for cleaning grinding head |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102873640A (en) * | 2012-09-18 | 2013-01-16 | 上海集成电路研发中心有限公司 | Grinding pad finisher |
| CN104175224A (en) * | 2014-08-26 | 2014-12-03 | 上海华力微电子有限公司 | Cleaning device of chemical mechanical polishing pad and cleaning method thereof |
| CN113418569A (en) * | 2021-06-18 | 2021-09-21 | 马鞍山钢铁股份有限公司 | Cleaning device for venturi tube flow measurement pipeline and control method thereof |
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Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130614 Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHA Effective date: 20130614 |
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Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
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Effective date of registration: 20130614 Address after: 100176 No. 18 Wenchang Avenue, Beijing economic and Technological Development Zone Applicant after: Semiconductor Manufacturing International (Beijing) Corporation Applicant after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 No. 18 Zhangjiang Road, Shanghai Applicant before: Semiconductor Manufacturing International (Shanghai) Corporation |
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Application publication date: 20120711 |