CN1246402A - Chemical-mechanical lapping bench - Google Patents
Chemical-mechanical lapping bench Download PDFInfo
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- CN1246402A CN1246402A CN98116968A CN98116968A CN1246402A CN 1246402 A CN1246402 A CN 1246402A CN 98116968 A CN98116968 A CN 98116968A CN 98116968 A CN98116968 A CN 98116968A CN 1246402 A CN1246402 A CN 1246402A
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Abstract
A chemico-mechanical lapping bench with a caterpillar regulating brush at least has one long shaft as main body structure and a caterpillar on which multiple hard particles and many rollers are distributed. Said caterpillar covers the external side of long shaft and revolves at a fixed speed. Said rollers are axially and parallelly arranged at internal side of caterpillar, are in contact with the caterpillar, and rotate under the drive of caterpillar. There also are multiple particles on the surface of caterpillar for scraping the surface of lapping pad to remove the residual impurities. On the regulating brush, there is a washer for washing caterpillar to remove residual impurities.
Description
The present invention relates to a kind of work-table of chemicomechanical grinding mill, particularly relate to a kind of work-table of chemicomechanical grinding mill that crawler type is regulated brush configuration that has.
In the semiconductor fabrication process technology, having an even surface is to handle an important technology of high density photoetching, because there is not the flat surfaces of high low head just can avoid the scattering that exposes, and forms accurate design transfer (pattern transfer).Planarization mainly contains two kinds of spin-on glasses method (Spin-OnGlass-SOG) and chemical mechanical milling methods (CMP) etc., but enter millimicron (sub-half-micron) afterwards in the semiconductor fabrication process technology, the spin-on glasses method can't satisfy required flatness, so the cmp technology is uniquely can provide ultra-large type integrated circuit (Very-LargeScale Integration-VLSI) now, even very big type integrated circuit (Ultra-Large ScaleIntegration-ULSI) manufacturing process, a kind of technology of " comprehensive planarization (global planarization) ".
Please be simultaneously with reference to Figure 1A and Figure 1B, it draws overlooking and side view of a kind of existing work-table of chemicomechanical grinding mill (Chemical-Mechanical Polishing-CMP) respectively.Comprising: a grinding table (polishing table) 10; One lever (holder) 11 is in order to catch polished wafer 12; One grinding pad 13 (polishing pad) is layered on the grinding table 10; One pipe fitting 14 (tube) is in order to carry lapping liquid 15 (slurry) to grinding pad 13; One liquid pump 16 is in order to pump to lapping liquid 15 in the pipe fitting 14; And one regulate brush (Conditioner) 17, in order to wipe the surface of grinding pad 13 off.When carrying out cmp, grinding table 10 and lever 11 be respectively along certain direction rotation, and shown in arrow 18a and 18b among the figure, and lever 11 catches the back side 19 of wafer 12, and the front 20 of wafer 12 is pressed on the grinding pad 13.The lapping liquid 15 that pipe fitting 14 is called in liquid pump 16 is fed on the grinding pad 13 continuously.So, the cmp program is exactly the chemical reagent that utilizes in the lapping liquid 15, on the front 20 of wafer 12, produce chemical reaction, make it to form an easy grinding layer, cooperate again wafer 12 on grinding pad 13 by the auxiliary mechanical lapping of the abrasive grains in the lapping liquid 15 (abrasive particles), the projection of easy grinding layer is ground, and above-mentioned chemical reaction of repetitiousness and mechanical lapping can form smooth surface.Basically, the cmp technology is to utilize the principle of machine glazed finish, cooperates suitable chemical reagent (reagent) and abrasive grains, the profile that the surface is is just risen and fallen and differs, the planarization of " polishing " in addition simultaneously.
The shortcoming of above-mentioned existing work-table of chemicomechanical grinding mill is, traditional adjusting brush 17 can't be effectively and the surface of wipeing grinding pad 13 equably off.Please refer to Fig. 2 A, it draws the vertical view and the side view of existing first kind of work-table of chemicomechanical grinding mill.The model of this board is IPEC-472, and a grinding pad 30 is wherein arranged, and it is positioned on the grinding table 32, structures such as wafer 34 and adjusting brush 36 are arranged on grinding pad 30, when wafer 34 is ground, regulate the motion that brush 36 can be done back and forth repetitiousness with the direction of arrow 38, in order to wipe the surface of grinding pad 30 off.Again, please refer to Fig. 3 A and Fig. 3 B, it draws the vertical view and the side view of existing second kind of work-table of chemicomechanical grinding mill.The model of this board is AMAT-Mirra, and a grinding pad 40 is wherein arranged, and it is positioned on the grinding table 42, and structures such as wafer 44 and adjusting brush 46 are arranged on the grinding pad 40.When wafer 44 is ground, regulate the motion that brush 46 can be done back and forth repetitiousness with the direction of arrow 48, in order to wipe the surface of grinding pad 40 off, then, refer again to Fig. 4, it draws the strickling track schematic diagram that above-mentioned two kinds of work-table of chemicomechanical grinding mill are regulated brush.Can see that the track of strickling distributes also inhomogeneously, some part is not almost by scraped finish, and the phenomenon of scraping a little less than being easy to generate (under conditioning) is for example at blank track 54 places.Some part then repeats scraped finish because of easy, and produces the phenomenon (overconditioning) of scraping, for example at track intersection point 56 places.Have only minority ground that normal strickling situation (normal conditioning) is arranged just now, for example at track 52 places.
Then, please refer to Fig. 5 A and Fig. 5 B, it draws the vertical view and the side view of existing the third work-table of chemicomechanical grinding mill.The model of this board is SpeedFam Auriga, and grinding pad 60 is wherein arranged, and it is positioned on the grinding table 62, and structures such as wafer 64 and adjusting brush 66 are arranged on grinding pad 60.Regulate the structure example of brush 66 herein as being diamond ring (diamond ring).When wafer 64 was ground, regulating brush 66 can be in the periphery motion of grinding table 62, in order to wipe the surface of grinding pad 60 off.Refer again to Fig. 6, it draws Fig. 5 A and Fig. 5 B regulates the strickling result schematic diagram of brushing.Wherein, the unit of transverse axis is a centimetre (cm), can see, after adjusting brush 66 is scraped after a while, the high low head of the section of the grinding pad 60 on grinding table 62 (pad profile) can be very big, and for example the middle body of grinding pad 60 is higher, and the marginal portion is ground lower.Thus, the grinding of wafer 64 also can be and then inhomogeneous, and for example wafer 64 central portion branches are ground morely, and that the marginal portion is ground is less.
Then, please refer to Fig. 7 A and Fig. 7 B, it draws the vertical view and the side view of existing the 4th kind of work-table of chemicomechanical grinding mill.The model of this board is Cybeq-IP8000, and grinding pad 70 is wherein arranged, and it is positioned on the grinding table 72, and structures such as wafer 74 and adjusting brush 76 are arranged on grinding pad 70.When wafer 74 was ground, regulating brush 76 can be in the periphery motion of grinding table 72, in order to wipe the surface of grinding pad 70 off.Refer again to Fig. 8, it draws the strickling result schematic diagram of the adjusting brush of Fig. 7 A and Fig. 7 B.Can see, grinding pad section 78 high low heads after scraping after a while are very big, and thus, the grinding of wafer 74 also can be and then inhomogeneous, for example wafer 74 central portion branches are ground lessly, and more (this situation and above-mentioned inverted configuration) then ground in the marginal portion.
In sum, no matter be the adjusting brush configuration of existing which kind of model,, therefore all has the uneven shortcoming of scraped finish because wipe track distribution of results all inhomogeneous (as shown in Figure 4) off.As long as use a period of time, will cause the section of grinding pad very poor, high low head is (as Fig. 6 and shown in Figure 8) very obviously.Thus, the grinding of wafer also can be and then inhomogeneous, seriously reduces the quality and the effect of cmp.
The purpose of this invention is to provide a kind of work-table of chemicomechanical grinding mill, introduce a kind of improved crawler type and regulate brush configuration, it has the roller that a plurality of axially parallels in diamond crawler belt and the crawler belt are arranged, and wherein the diamond crawler belt rotates with a fixed rate, and can drive and then rotation of roller.So, can make the strickling track of regulating brush very even, and regulate brush after use a period of time, the section of grinding pad also can be kept more smoothly.
Another object of the present invention provides a kind of work-table of chemicomechanical grinding mill, it has crawler type and regulates brush configuration, and regulate on the brush configuration at this, also include a cleaning device, it can be when the adjusting brush be wipeed action off, wash the step of regulating brush,, improve the quality of striking off of regulating brush the Impurity removal that remains on the crawler belt.
The object of the present invention is achieved like this, and a kind of work-table of chemicomechanical grinding mill promptly is provided, and this board comprises: a grinding table, rotate with a fixed-direction; One grinding pad is located at this and is ground on the platform; One lever in order to catching the back side of a wafer, is pressed in the front of this wafer on this grinding pad; One crawler type is regulated brush, places on this grinding pad, in order to wipe the surface of this grinding pad off, removes the impurity that remains on this grinding pad; And a pipe fitting, place this grinding pad top, in order to carry a lapping liquid to this grinding pad.Wherein, also comprise a liquid pump, be connected on the pipe fitting handle of pipe fitting, in order to lapping liquid is pumped in the pipe fitting.
The present invention also provides a kind of adjusting brush configuration, be used for a work-table of chemicomechanical grinding mill, this work-table of chemicomechanical grinding mill comprises a grinding table, a grinding pad and a pipe fitting, wherein, this grinding table rotates with a fixed-direction, and this grinding pad is positioned on this grinding table, and this pipe fitting is positioned at this grinding pad top, in order to carry a lapping liquid to this grinding pad, this adjusting brush configuration comprises: a major axis main body; One crawler belt is coated on this major axis external side of main body, rotates with a fixed rate; A plurality of rollers, the axially parallel of this each roller is arranged, and this each roller is positioned at this crawler belt inboard and contacts with this crawler belt, and this each roller can be driven by this crawler belt and and then rotate; And a plurality of grits, be distributed in the surface of this crawler belt, in order to wipe the surface of this grinding pad off, remove the impurity that remains on this grinding pad.
The structure that above-mentioned crawler type is regulated brush is characteristics of the present invention, and it is the structure of a long strip type, comprising: a major axis agent structure; One crawler belt is a belt for example, is coated on the outside of major axis structure, rotates with a fixed rate; A plurality of rollers, axially all being arranged in parallel of roller, it is inboard and contact with crawler belt that it is positioned at crawler belt, so roller can be driven by crawler belt and and then rotation; One rotary driver is positioned on the major axis agent structure, in order to drive the rotation of crawler belt; And a plurality of grits are arranged at the outer surface of crawler belt, and for example be the splints particle, in order to wipe the surface of grinding pad off, remove the impurity that remains on the grinding pad.In addition, also comprise a cleaning device, it is installed in crawler type and regulates the end of brush away from grinding pad, remains in impurity on the crawler belt in order to cleaning.This cleaning device comprises a cleaning brush and a water jet, and the function of cleaning can be provided simultaneously.Wherein, cleaning brush contacts with the surface of crawler belt, and water jet is sprayed onto the contact-making surface between cleaning brush and the crawler belt in order to spray required cleaning fluid.
The advantage of apparatus of the present invention is that it is provided with the adjusting brush configuration, can make the strickling track very even, improves the quality and the effect of cmp.
Below in conjunction with accompanying drawing, describe embodiments of the invention in detail, wherein:
Figure 1A is the existing integrally-built vertical view of a kind of work-table of chemicomechanical grinding mill;
Figure 1B is the existing integrally-built side view of a kind of work-table of chemicomechanical grinding mill;
Fig. 2 A and Fig. 2 B are the vertical view and the side view of existing first kind of work-table of chemicomechanical grinding mill;
Fig. 3 A and Fig. 3 B are the vertical view and the side view of existing second kind of work-table of chemicomechanical grinding mill;
Fig. 4 is existing first kind of strickling track schematic diagram of brushing with second kind of work-table of chemicomechanical grinding mill adjusting;
Fig. 5 A and Fig. 5 B are the vertical view and the side view of existing the third work-table of chemicomechanical grinding mill;
The strickling result schematic diagram that Fig. 6 regulates brush for existing the third work-table of chemicomechanical grinding mill;
Fig. 7 A and Fig. 7 B are the vertical view and the side view of existing the 4th kind of work-table of chemicomechanical grinding mill;
The strickling result schematic diagram that Fig. 8 regulates brush for existing the 4th kind of work-table of chemicomechanical grinding mill;
Fig. 9 is a preferred embodiment of the present invention, regulates the side view of brush in a kind of work-table of chemicomechanical grinding mill;
Figure 10 is a preferred embodiment of the present invention, regulates the vertical view of brush in a kind of work-table of chemicomechanical grinding mill;
Figure 11 is a preferred embodiment of the present invention, regulates the strickling track schematic diagram of brush in a kind of work-table of chemicomechanical grinding mill;
Figure 12 is a preferred embodiment of the present invention, regulates the strickling effect generalized section of brush in a kind of work-table of chemicomechanical grinding mill.
Characteristics of the present invention are, introduce a new adjusting brush configuration, in order to improve existing the scarce of brush of regulating The point. It is a long strip type structure, has rolling of the interior a plurality of axially parallels arrangements of diamond crawler belt and crawler belt Wheel, wherein, the diamond crawler belt rotates with a fixed rate, and can drive and then rotation of roller. So, transfer The scraped finish at each position of joint brush and strength can equalizations, make that to strike off track very even. In addition, this The bright cleaning device of also introducing provides the function (insitu-cleaning) of cleaning simultaneously, and it can When the adjusting brush strikes off action, wash the step of regulating brush, will remain on the crawler belt Impurity removal improves the quality that strikes off of regulating brush.
Please refer to Fig. 9 and Figure 10, it is a preferred embodiment of the present invention, regulates the vertical view and the side view of brush in a kind of work-table of chemicomechanical grinding mill.In the work-table of chemicomechanical grinding mill of the present invention, part-structure is identical with the structure of existing Figure 1A, represents with identical label, and structure of the present invention comprises: a grinding table 84; One lever 11 (shown in Figure 1A and Figure 1B) is in order to catch polished wafer 12 (shown in Figure 1B); One grinding pad 82 is layered on the grinding table 84; One pipe fitting 14 (shown in Figure 1A and Figure 1B), it places grinding pad 82 tops, in order to carry lapping liquid 15 to grinding pad 82; One liquid pump 16 is in order to pump to lapping liquid 15 (shown in Figure 1A and Figure 1B) in the pipe fitting 14.
Characteristics of the present invention are to regulate the improvement of brush configuration, for example regulate brush 80 for crawler type, and they are different fully with existing structure, can be in order to effectively and equably to wipe the surface of grinding pad 82 off, and detailed structure is described below.As Fig. 9 and shown in Figure 10, it is the structure of a long strip type (linear), and this structure comprises: at first, one major axis agent structure 81 is provided, it is regulated for crawler type and brushes 80 main strut, and in order to connect other all component structures, its length is approximately greater than polished wafer diameter.Then, a crawler belt 86, belt for example, it is coated on the outside of major axis agent structure 81, rotates with a fixed rate, and rotation direction is shown in arrow 83.Being distributed with many grits 85 on crawler belt 86, for example is the splints particle, all distributes and is covered with in the outer surface of crawler belt 86, in order to wipe the surface of grinding pad 82 off, removes the impurity that remains on the grinding pad 82.Then, also comprise a plurality of rollers 88, axially all being arranged in parallel of roller 88, it is inboard and contact with crawler belt 86 that it is positioned at crawler belt 86, so roller 88 can be driven by crawler belt 86 and and then rotate.In addition, also have rotary driver 92, be positioned on the major axis agent structure 81, and be positioned at the inboard of crawler belt 86, for example be positioned at the two ends of major axis agent structure 81, can be in order to drive the rotation of crawler belt 86.
The present invention can also comprise cleaning device 98 except crawler type is regulated the major part of brush 80, it can be installed in crawler type and regulate brush 80 ends away from grinding pad 82, and the action of cleaning synchronously remains in impurity on the crawler belt 86 in order to cleaning.This cleaning device 98 comprises cleaning brush 96 (bursher) and water jet 94 (water sprayer).Wherein, cleaning brush 96 contacts with the surface of crawler belt 86, and water jet 94 is then in order to spraying required cleaning fluid, and cleaning fluid is sprayed onto contact-making surface between cleaning brush 96 and the crawler belt 86, and then cooperates the action of cleaning brush 96 and brush impurity on the crawler belt 86.Cleaning device 98 mainly is to wash the step of regulating brush 80 when adjusting brush 80 is wipeed action off, and the impurity that remains on the crawler belt 86 is removed in the lump, improves the quality of striking off that saves brush 80.
Then, please refer to Figure 11, it is preferred embodiment of the present invention, utilizes to regulate to brush and wipes the results trace schematic diagram of action off.Wherein, curve 100 representatives are regulated brush when wipeing action off, regulate the path that brush is passed through on grinding pad.What can see is that this curve 100 and existing results trace do not have interlaced part by comparison, and the path is with also very evenly neat at interval.The phenomenon of scraping a little less than neither being easy to generate (under conditioning) also is not easy to produce the phenomenon (overconditioning) of scraping, and all maintains everywhere under the uniform strickling situation.Therefore, adjusting of the present invention is brushed, and can keep the flatness and the uniformity of grinding pad, reaches preferable strickling result.In addition, the present invention regulates brush 80 structures and has cleaning device 98, can wash the step of regulating brush when the adjusting brush is wipeed action off, and the impurity that remains on the crawler belt 86 is removed simultaneously, improves the quality of striking off that saves brush 80.
Refer again to Figure 12, it is a preferred embodiment of the present invention, utilizes to regulate to brush and wipes the generalized section of action off.Wherein, transverse axis is represented length (unit is cm), and grinding pad 104 is positioned on the grinding table 106, and wafer 102 is positioned on the grinding pad 104.After the adjusting brush was wipeed action a period of time off, we can see the degree that grinding pad 104 is consumed, and figure is shown in 108 for its surface section, though can cave in because of loss,, also still can keep good homogeneous and flatness at recess.
In sum, work-table of chemicomechanical grinding mill structure proposed by the invention has following characteristics:
(1) 80 structures are brushed in adjusting proposed by the invention, and it has the roller 88 that a plurality of axially parallels in diamond crawler belt 86 and the crawler belt are arranged, and wherein diamond crawler belt 86 rotates with a fixed speed, and can drive and then rotation of roller 88.So, can make the strickling track of regulating brush 80 very even.
(2) 80 structures are brushed in adjusting proposed by the invention, and after it used a period of time, though there is consume on the surface of grinding pad 82, the section of grinding pad 82 still can be kept smoothly and be even.Therefore, can not influence the uniformity that wafer grinds, improve the quality and the effect of cmp.
(3) 80 structures are brushed in adjusting proposed by the invention, also include cleaning device 98, and it comprises cleaning brush 96 and water jet 94, and the function of cleaning can be provided simultaneously.When adjusting brush 80 is wipeed action off, wash the step of regulating brush 80, with the Impurity removal that remains on the crawler belt 86, improve the strickling quality of adjusting brush 80.
In sum; though above in conjunction with preferred embodiment exposure the present invention, its also non-limiting the present invention, and this area skill personnel are without departing from the spirit and scope of the present invention; can make various changes and retouching, so protection scope of the present invention should be limited to the appended claims.
Claims (20)
1. a work-table of chemicomechanical grinding mill is characterized in that, this board comprises:
One grinding table rotates with a fixed-direction;
One grinding pad is located on this grinding table;
One lever in order to catching the back side of a wafer, is pressed in the front of this wafer on this grinding pad;
One crawler type is regulated brush, places on this grinding pad, in order to wipe the surface of this grinding pad off, removes the impurity that remains on this grinding pad; And
One pipe fitting places this grinding pad top, in order to carry a lapping liquid to this grinding pad.
2. work-table of chemicomechanical grinding mill as claimed in claim 1 is characterized in that, also comprises a cleaning device, and this cleaning device is installed in this crawler type and regulates the end of brush away from this grinding pad, remains in this crawler type in order to cleaning and regulates the impurity that brushes.
3. work-table of chemicomechanical grinding mill as claimed in claim 2 is characterized in that this cleaning device also comprises a cleaning brush, and this cleaning brush contacts with the surface that this crawler type is regulated brush.
4. work-table of chemicomechanical grinding mill as claimed in claim 2 is characterized in that this cleaning device also comprises a water jet, in order to spray required cleaning fluid to the contact-making surface between this cleaning brush and this crawler type adjusting brush.
5. work-table of chemicomechanical grinding mill as claimed in claim 1 is characterized in that, also comprises a liquid pump, is connected on this pipe fitting handle of this pipe fitting, in order to this lapping liquid is pumped in this pipe fitting.
6. work-table of chemicomechanical grinding mill as claimed in claim 1 is characterized in that, it is a long strip type that this crawler type is regulated brush.
7. work-table of chemicomechanical grinding mill as claimed in claim 1 is characterized in that, the length that this crawler type is regulated brush is approximately greater than the diameter of this wafer.
8. work-table of chemicomechanical grinding mill as claimed in claim 1 is characterized in that, this crawler type is regulated brush and comprised:
One major axis agent structure;
One crawler belt is coated on the outside of this major axis agent structure, rotates with a fixed rate;
A plurality of rollers, the axially parallel of this each roller is arranged, and this each roller is positioned at this crawler belt inboard and contacts with this crawler belt, so this each roller can be driven by this crawler belt and and then rotate; And
A plurality of grits are distributed in the surface of this crawler belt, in order to wipe the surface of this grinding pad off, remove the impurity that remains on this grinding pad.
9. work-table of chemicomechanical grinding mill as claimed in claim 8 is characterized in that, this crawler belt that this crawler type is regulated brush comprises a belt.
10. work-table of chemicomechanical grinding mill as claimed in claim 8 is characterized in that, this each grit that this crawler type is regulated brush comprises the splints particle.
11. work-table of chemicomechanical grinding mill as claimed in claim 8 is characterized in that, this crawler type is regulated brush and is also comprised a rotary driver, is positioned on this major axis agent structure, in order to drive this crawler belt.
12. regulate brush configuration for one kind, be used for a work-table of chemicomechanical grinding mill, this work-table of chemicomechanical grinding mill comprises a grinding table, a grinding pad and a pipe fitting, wherein, this grinding table rotates with a fixed-direction, and this grinding pad is positioned on this grinding table, and this pipe fitting is positioned at this grinding pad top, in order to carry a lapping liquid to this grinding pad, it is characterized in that this adjusting brush configuration comprises:
One major axis main body;
One crawler belt is coated on this major axis external side of main body, rotates with a fixed rate
A plurality of rollers, the axially parallel of this each roller is arranged, and this each roller is positioned at this crawler belt inboard and contacts with this crawler belt, and this each roller can be driven by this crawler belt and and then rotate; And
A plurality of grits are distributed in the surface of this crawler belt, in order to wipe the surface of this grinding pad off, remove the impurity that remains on this grinding pad.
13. adjusting brush configuration as claimed in claim 12 is characterized in that, also comprises a cleaning device, this cleaning device is installed in this crawler type and regulates the end of brush away from this grinding pad, remains in this crawler type in order to cleaning and regulates the impurity that brushes.
14. adjusting brush configuration as claimed in claim 13 is characterized in that this cleaning device also comprises a cleaning brush, this cleaning brush contacts with the surface that this crawler type is regulated brush.
15. adjusting brush configuration as claimed in claim 13 is characterized in that this cleaning device also comprises a water jet, in order to spray required cleaning fluid to the contact-making surface between this cleaning brush and this crawler type adjusting brush.
16. adjusting brush configuration as claimed in claim 12 is characterized in that, this major axis main body is a long strip type.
17. adjusting brush configuration as claimed in claim 12 is characterized in that, the length of this major axis main body is approximately greater than a polished wafer diameter.
18. adjusting brush configuration as claimed in claim 12 is characterized in that this crawler belt comprises a belt.
19. adjusting brush configuration as claimed in claim 12 is characterized in that this grit comprises the splints particle.
20. adjusting brush configuration as claimed in claim 12 is characterized in that, also comprises a rotary driver, is positioned on this major axis main body, in order to drive this crawler belt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN98116968A CN1080619C (en) | 1998-08-28 | 1998-08-28 | Chemical-mechanical lapping bench |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN98116968A CN1080619C (en) | 1998-08-28 | 1998-08-28 | Chemical-mechanical lapping bench |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1246402A true CN1246402A (en) | 2000-03-08 |
| CN1080619C CN1080619C (en) | 2002-03-13 |
Family
ID=5225288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN98116968A Expired - Lifetime CN1080619C (en) | 1998-08-28 | 1998-08-28 | Chemical-mechanical lapping bench |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1080619C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101767307B (en) * | 2008-11-07 | 2011-11-09 | 高鸿镀膜科技(浙江)有限公司 | Stainless steel sheet grinder |
| CN102554782A (en) * | 2010-12-20 | 2012-07-11 | 中芯国际集成电路制造(上海)有限公司 | Polishing pad cleaning device and polishing pad finisher |
| US8920572B2 (en) | 2010-12-29 | 2014-12-30 | Semiconductor Manufacturing International (Shanghai) Corporation | Cleaning device and a cleaning method of a fixed abrasives polishing pad |
| CN111941221A (en) * | 2020-08-12 | 2020-11-17 | 赣州市业润自动化设备有限公司 | Belt-type chemical mechanical polishing device |
| CN112959223A (en) * | 2021-02-22 | 2021-06-15 | 长江存储科技有限责任公司 | Chemical mechanical polishing apparatus and chemical mechanical polishing method |
| CN114833117A (en) * | 2022-04-25 | 2022-08-02 | 嘉兴立鸿科技有限公司 | Wafer cleaning machine |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0621107B1 (en) * | 1993-04-22 | 1998-09-30 | Nippon Telegraph And Telephone Corporation | Optical fiber connector ferrule end face polishing plate and polishing apparatus |
| US5503592A (en) * | 1994-02-02 | 1996-04-02 | Turbofan Ltd. | Gemstone working apparatus |
| DE19651761A1 (en) * | 1996-12-12 | 1998-06-18 | Wacker Siltronic Halbleitermat | Method and device for polishing semiconductor wafers |
-
1998
- 1998-08-28 CN CN98116968A patent/CN1080619C/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101767307B (en) * | 2008-11-07 | 2011-11-09 | 高鸿镀膜科技(浙江)有限公司 | Stainless steel sheet grinder |
| CN102554782A (en) * | 2010-12-20 | 2012-07-11 | 中芯国际集成电路制造(上海)有限公司 | Polishing pad cleaning device and polishing pad finisher |
| US8920572B2 (en) | 2010-12-29 | 2014-12-30 | Semiconductor Manufacturing International (Shanghai) Corporation | Cleaning device and a cleaning method of a fixed abrasives polishing pad |
| US9475170B2 (en) | 2010-12-29 | 2016-10-25 | Semiconductor Manufacturing International (Shanghai) Corporation | Device for cleaning fixed abrasives polishing pad |
| CN111941221A (en) * | 2020-08-12 | 2020-11-17 | 赣州市业润自动化设备有限公司 | Belt-type chemical mechanical polishing device |
| CN112959223A (en) * | 2021-02-22 | 2021-06-15 | 长江存储科技有限责任公司 | Chemical mechanical polishing apparatus and chemical mechanical polishing method |
| CN114833117A (en) * | 2022-04-25 | 2022-08-02 | 嘉兴立鸿科技有限公司 | Wafer cleaning machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1080619C (en) | 2002-03-13 |
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