CN102543339A - Packaging method of wire-wound resistor - Google Patents
Packaging method of wire-wound resistor Download PDFInfo
- Publication number
- CN102543339A CN102543339A CN2011104556075A CN201110455607A CN102543339A CN 102543339 A CN102543339 A CN 102543339A CN 2011104556075 A CN2011104556075 A CN 2011104556075A CN 201110455607 A CN201110455607 A CN 201110455607A CN 102543339 A CN102543339 A CN 102543339A
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- Prior art keywords
- glass
- wire
- resistor
- wound resistor
- packing
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Links
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000004806 packaging method and process Methods 0.000 title abstract description 3
- 239000011521 glass Substances 0.000 claims abstract description 62
- 239000002002 slurry Substances 0.000 claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 238000012856 packing Methods 0.000 claims description 12
- IVGZFMVIHQRCHJ-UHFFFAOYSA-N [Zn].[Bi].[B] Chemical compound [Zn].[Bi].[B] IVGZFMVIHQRCHJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000011241 protective layer Substances 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000000843 powder Substances 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 4
- 239000003960 organic solvent Substances 0.000 abstract description 4
- 238000001816 cooling Methods 0.000 abstract description 3
- 238000010304 firing Methods 0.000 abstract 1
- 239000000156 glass melt Substances 0.000 abstract 1
- 238000005507 spraying Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 5
- 239000000428 dust Substances 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000010410 dusting Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910001006 Constantan Inorganic materials 0.000 description 1
- 229910000896 Manganin Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000007499 fusion processing Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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Abstract
A packaging method of a wire-wound resistor relates to the technology of electronic components. The invention comprises the following steps: A. heating the glass to melt; B. preheating a wire-wound resistor, and then immersing the wire-wound resistor into glass molten slurry; C. and taking out the wire-wound resistor with the glass melt pulp, axially and horizontally placing the wire-wound resistor, axially rotating the wire-wound resistor, and slowly cooling the wire-wound resistor until the glass is solidified. The invention can directly package the glass protective layer on the on-line wound resistor without using organic solvent or repeatedly spraying powder and firing, thereby improving the production efficiency, reducing the production cost and having greater economic and social benefits.
Description
Technical field
The present invention relates to the electronic devices and components technology.
Background technology
Wirewound resistor is processed on insulation framework with nichrome wire or manganin wire, constantan wire-wound.Insulation framework be by pottery, plastics, different shape such as tubular, the flat that is coated with that the materials such as metal of insulating layer coating process.Characteristics such as wirewound resistor has the resistance accuracy height, and power is big, and work noise is little, and is reliable and stable, high temperature resistant.
The outer general airtight insulating protective layer of one deck that coats of the resistance wire of wire-wound resistor plays anticorrosion, and is anti-oxidation, the effect that improves protection devices such as useful life and heat-resistant stability.General protective material has glass glaze and organic paint vehicle.The organic material that with epoxy resin is representative is made insulating protective layer, receives owing to its decomposition temperature is low using restriction.Glass glaze is made insulating protective layer, at some applied environment irreplaceability is arranged.And its raw material is easy to get, and is with low cost, thereby is used widely.
Factory makes the wire-wound resistor insulating protective layer with glass glaze now generally has two kinds of processes.The first evenly is coated with glass dust and is sprinkling upon on the resistor, and heating makes glass melting in stove then, reaches sealing effectiveness behind the cooling curing.But poor because of the powder tack, once the process of founding can not reach the thickness of insulating layer of resistor requirement, must repeatedly repeat the process that dusting is founded.This explained hereafter efficient is low, and wastage of material is serious, and the working environment of workers is poor, and production cost is high.Another kind of technology is glass dust to be joined size mixing into paste in the solvent, is coated in resistor surface then and in stove, heats and found.Solvent is generally organic material, possesses certain adhesiveness.In this method, heating process organic solvent volatile matter is liberated out gas, and portion gas can not be discharged glassivation, causes the protective layer pore many, and compactness reduces.And the use of organic solvent has increased production cost.
In the existing method for packing; Being coated with insulating varnish just like No. 200920095240.9 employing runners of Chinese utility model patent ZL seals; Patent of invention ZL is coated in element surface based on the fluid bed painting method with insulating powder No. 200510096266.1 and toasts film forming again; Proposing a kind of low temperature glass cream for patent of invention ZL200610163612.8 number is coated on surface to be sealed and reburns into glass-film; The glass encapsulation method that patent of invention relates to for No. 201010529622.5 also is earlier in device surface coated glass sintering film forming then; No. 201010229393.5 propositions of patent of invention place the melten glass of in mould, casting again in the mould with led chip to be packaged, and the method for packing that No. 201020294337.5, utility model patent ZL is to be encapsulated in the device joint portion with melting the glass dust fusion altogether.
Summary of the invention
Technical problem to be solved by this invention is, provide a kind of efficiently, the method for packing of wirewound resistor cheaply.
The technical scheme that the present invention solve the technical problem employing is that the method for packing of wirewound resistor is characterized in that, comprises the steps:
A, with glass heats to the fusing;
B, with the wire-wound resistor The pre-heat treatment, immerse the molten slurry of glass then;
C, taking-up have the wire-wound resistor of the molten slurry of glass, and axially horizontal positioned is also rotated vertically, slowly cools to glass and solidifies.
Said glass is low temperature glass, and in particular, bismuth boron zinc is glass.
In the said steps A, be heated to the molten slurry of glass viscosity about 10
3～10
4DPas.Among the said step B, the temperature of The pre-heat treatment is 250～400 ℃.
Perhaps, said step C is: take out the wire-wound resistor that has the molten slurry of glass, axial horizontal positioned and rotation vertically under the temperature conditions that reduces from the molten slurry of glass temperature to 300 ℃ gradual slow slowly cool to glass then and solidify.
But the present invention's direct-on-line is the packaged glass protective layer on resistor, does not need with an organic solvent or fires through dusting repeatedly, has improved production efficiency, has reduced production cost, has bigger economic benefit and social benefit.
Description of drawings
Fig. 1 is the flow chart of wirewound resistor glass packaging.
Fig. 2 is the structural representation of the resistor after the present invention encapsulates.
Fig. 3 is the DSC-TG curve chart of the glass that adopts of embodiment.
Embodiment
Referring to Fig. 1～3.The raw materials melt of Fig. 1, chilling solidify, powder crushing process is conventional process of glass.
The present invention includes following step:
A, with glass heats to the fusing;
B, with the wire-wound resistor The pre-heat treatment, immerse the molten slurry of glass then;
C, taking-up have the wire-wound resistor of the molten slurry of glass, and axially horizontal positioned is also rotated vertically at a certain temperature, slowly cools to glass and solidifies.
Said glass is the low temperature glass that possesses the characteristics that fusion temperature is low, phase transition temperature interval is narrow, and being reflected on DTA or the DSC curve is exactly that the endotherm peak temperature point of fusion process is low, and less than 700 ℃, and the endothermic peak point is narrow.In the steps A, be heated to the molten slurry of glass viscosity about 10
3～10
4DPas.Among the step B, the temperature of The pre-heat treatment is 250～400 ℃.Among the step C, uniform temperature is to reduce from the molten slurry of glass temperature to 300 ℃ gradual slow, and the temperature changing down is 5～10 ℃/minute.
As an embodiment, it is glass that the present invention adopts bismuth boron zinc, its DSC-TG curve example such as Fig. 2.
During encapsulation, glass powder is heated to temperature reaches the shaping scope in stove, viscosity about 10
3～10
4DPas.Wire-wound resistor to be packaged 250～400 ℃ of preheatings, is immersed in the molten slurry of glass then, and moments later taking-up places temperature to melt the environment that slurry temperature gradual slow is reduced to 300 ℃ from glass; Simultaneously axial horizontal positioned; Rotation is vertically solidified to glass, and encapsulation is accomplished.Wirewound resistor after the encapsulation such as Fig. 1.
Possess the glass material of characteristics as stated, transfer to the environment that temperature slowly reduces by molten state, cooling can cause viscosity to increase, but possesses certain flowability, and axially rotation is coagulated for solid-state after making glass paste cover evenly gradually.In contrast to this, the glass material of heat absorption peak width, the temperature-fall period viscosity changes slow, and it possibly cause the phenomenon of glass spinning or glass paste drippage than large fluidity, causes the packaged glass layer inhomogeneous or thickness is thin excessively.Lower fusion temperature can guarantee resistance wire not oxidized component failure that causes in the environment of encapsulation.Except that These characteristics, glass material also has wettability, associativity preferably with the insulating body of resistance wire and winding thereof.
Claims (7)
1. the method for packing of wirewound resistor is characterized in that, comprises the steps:
A, with glass heats to the fusing;
B, with the wire-wound resistor The pre-heat treatment, immerse the molten slurry of glass then;
C, taking-up have the wire-wound resistor of the molten slurry of glass, and axially horizontal positioned is also rotated vertically, slowly cools to glass and solidifies.
2. the method for packing of wirewound resistor as claimed in claim 1 is characterized in that, among the step C, the temperature changing down is 5～10 ℃/minute.
3. the method for packing of wirewound resistor as claimed in claim 1 is characterized in that, said glass is low temperature glass.
4. the method for packing of wirewound resistor as claimed in claim 1 is characterized in that, said glass is that bismuth boron zinc is glass.
5. the method for packing of wirewound resistor as claimed in claim 1 is characterized in that, in the said steps A, is heated to the molten slurry of glass viscosity about 10
3～10
4DPas.
6. the method for packing of wirewound resistor as claimed in claim 1 is characterized in that, among the said step B, the temperature of The pre-heat treatment is 250～400 ℃.
7. the method for packing of wirewound resistor as claimed in claim 1; It is characterized in that; Said step C is: take out the wire-wound resistor that has the molten slurry of glass; Axial horizontal positioned and rotation vertically under the temperature conditions that reduces from the molten slurry of glass temperature to 300 ℃ gradual slow slowly cool to glass then and solidify.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104556075A CN102543339A (en) | 2011-12-30 | 2011-12-30 | Packaging method of wire-wound resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104556075A CN102543339A (en) | 2011-12-30 | 2011-12-30 | Packaging method of wire-wound resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102543339A true CN102543339A (en) | 2012-07-04 |
Family
ID=46350008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104556075A Pending CN102543339A (en) | 2011-12-30 | 2011-12-30 | Packaging method of wire-wound resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102543339A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2592253B2 (en) * | 1987-06-25 | 1997-03-19 | 株式会社大泉製作所 | Manufacturing method of glass-coated thermistor |
| CN1588574A (en) * | 2004-09-02 | 2005-03-02 | 中国科学院新疆理化技术研究所 | Negative temperature coefficient thermosensitive resistance material and its producing method |
| CN101995306A (en) * | 2010-11-02 | 2011-03-30 | 肇庆爱晟电子科技有限公司 | Method for manufacturing negative temperature coefficient (NTC) thermosensitive chip for high-precision temperature sensor |
| CN102288320A (en) * | 2011-07-22 | 2011-12-21 | 肇庆爱晟电子科技有限公司 | Metal-sheet-based negative temperature coefficient (NTC) thermistor temperature sensor and manufacturing method thereof |
-
2011
- 2011-12-30 CN CN2011104556075A patent/CN102543339A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2592253B2 (en) * | 1987-06-25 | 1997-03-19 | 株式会社大泉製作所 | Manufacturing method of glass-coated thermistor |
| CN1588574A (en) * | 2004-09-02 | 2005-03-02 | 中国科学院新疆理化技术研究所 | Negative temperature coefficient thermosensitive resistance material and its producing method |
| CN101995306A (en) * | 2010-11-02 | 2011-03-30 | 肇庆爱晟电子科技有限公司 | Method for manufacturing negative temperature coefficient (NTC) thermosensitive chip for high-precision temperature sensor |
| CN102288320A (en) * | 2011-07-22 | 2011-12-21 | 肇庆爱晟电子科技有限公司 | Metal-sheet-based negative temperature coefficient (NTC) thermistor temperature sensor and manufacturing method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 何峰: "ZnO 对铋锌硼系电子封接玻璃烧结性能的影响研究", 《陶瓷学报》 * |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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Application publication date: 20120704 |