CN102505132B - Encapsulation base plate surface electroplating method - Google Patents
Encapsulation base plate surface electroplating method Download PDFInfo
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- CN102505132B CN102505132B CN201110327728.1A CN201110327728A CN102505132B CN 102505132 B CN102505132 B CN 102505132B CN 201110327728 A CN201110327728 A CN 201110327728A CN 102505132 B CN102505132 B CN 102505132B
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- plating
- base plate
- dry film
- packaging
- described base
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- 238000000034 method Methods 0.000 title claims abstract description 53
- 238000005538 encapsulation Methods 0.000 title claims abstract description 17
- 238000009713 electroplating Methods 0.000 title claims abstract description 11
- 238000007747 plating Methods 0.000 claims abstract description 218
- 239000002184 metal Substances 0.000 claims abstract description 46
- 229910052751 metal Inorganic materials 0.000 claims abstract description 46
- 238000002844 melting Methods 0.000 claims abstract description 10
- 230000008018 melting Effects 0.000 claims abstract description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 174
- 238000004806 packaging method and process Methods 0.000 claims description 103
- 229910052759 nickel Inorganic materials 0.000 claims description 87
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 46
- 229910052737 gold Inorganic materials 0.000 claims description 46
- 239000010931 gold Substances 0.000 claims description 46
- 238000003466 welding Methods 0.000 claims description 27
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 238000003384 imaging method Methods 0.000 claims description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000011135 tin Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract 5
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 230000004075 alteration Effects 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 4
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The embodiment of the invention discloses an encapsulation base plate surface electroplating method, which comprises the steps that: soldering resistance agents are printed on an encapsulation base plate with formed circuits for forming a soldering resistance layer; soldering resistance patterns are processed on the soldering resistance layer of the encapsulation base plate; a plating resistance dry film is pasted on the encapsulation base plate with the processed soldering resistance patterns in a cold way, and in addition, a surface metal electroplate object region to be plated is exposed, wherein the film pasting temperature of the plating resistance dry film cold pasting is lower than the melting point temperature of the plating resistance dry film; the surface metal electroplate plating treatment is carried out on the encapsulation base plate pasted with the plating resistance dry film in the cold way; and the plating resistance dry film on the encapsulation base plate after the surface metal electroplate plating treatment is removed. The technical scheme of the embodiment of the invention is favorable for reducing the plating surface color difference and improving the plating acceptance rate of the encapsulation base plate plated with surface metal electroplates.
Description
Technical field
The present invention relates to circuit board fabrication field, be specifically related to a kind of encapsulation base plate surface electroplating method.
Background technology
Base plate for packaging (also claiming support plate) is for example, printed-wiring board (PWB) for carrying electronic devices and components (chip).
For example, in plating surface metal electronplate (gold) process of base plate for packaging, need to stick anti-plating dry film without the region of plating surface metal electronplate.
Taking gold-plated as example, the gold-plated subsides dry film technique of industry is generally carried out pad pasting under the high temperature that exceedes 110 DEG C at present, anti-plating dry film at high temperature has better mobility and fillibility, because copper face and the ink face of base plate for packaging exist difference of altitude, and high temperature pad pasting is very easy to produce point-like bubble at copper face, point-like bubble interface is very thin, in electrogilding process, may occur breaking and on making gold bad, finally cause that client terminal routing is bad, the poor problem such as bad of the golden complexion of outward appearance.
Summary of the invention
The embodiment of the present invention provides encapsulation base plate surface electroplating method, to improving upper plating good rate and the surfacing aberration of base plate for packaging plating surface metal electronplate.
For solving the problems of the technologies described above, the embodiment of the present invention provides following technical scheme:
A kind of encapsulation base plate surface electroplating method, comprising:
On the base plate for packaging that forms circuit, print solder resist to form solder mask;
The solder mask of described base plate for packaging is processed to welding resistance figure;
The anti-plating dry film of cold subsides and expose surface metal electronplate to be plated region on the described base plate for packaging that processes welding resistance figure, wherein, the pad pasting temperature of the anti-plating dry film of described cold subsides is lower than the melting temperature of described anti-plating dry film;
The described base plate for packaging of the anti-plating dry film of cold subsides is plated to the processing of surface metal electronplate;
Remove the anti-plating dry film on the described base plate for packaging after plating surface metal electronplate.
Therefore, in embodiment of the present invention base plate for packaging plating surface metal electronplate process, on the base plate for packaging that forms circuit, print solder resist to form solder mask; The solder mask of this base plate for packaging is processed to welding resistance figure; The anti-plating dry film of cold subsides and expose surface metal electronplate to be plated region on this base plate for packaging that processes welding resistance figure, the pad pasting temperature of the anti-plating dry film of these cold subsides is lower than the melting temperature of this anti-plating dry film; The base plate for packaging of the anti-plating dry film of cold subsides is plated to the processing of surface metal electronplate.Because the pad pasting temperature of the anti-plating dry film of cold subsides is lower than the melting temperature of anti-plating dry film, in pad pasting process, anti-plating dry film just can not melt, can not produce strong mobility and strong fillibility, in anti-plating dry film now, can not form point-like bubble etc. yet, in just there will not be anti-plating dry film like this in plating surface metal electronplate process, break because of bubble and make to plate bad problem, be conducive to improve upper plating good rate and the surfacing aberration of base plate for packaging plating surface metal electronplate, and then can effectively improve the routing good rate of client terminal.
Brief description of the drawings
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the schematic flow sheet of a kind of encapsulation base plate surface electroplating method of providing of the embodiment of the present invention;
Fig. 2-a is a kind of base plate for packaging schematic diagram that forms circuit that the embodiment of the present invention provides;
Fig. 2-b is a kind of base plate for packaging schematic diagram that welding resistance figure of having processed that the embodiment of the present invention provides;
Fig. 2-c is the base plate for packaging schematic diagram of the anti-plating dry film of a kind of cold subsides that provides of the embodiment of the present invention;
Fig. 2-d is the base plate for packaging schematic diagram after the soft gold of a kind of nickel plating that provides of the embodiment of the present invention;
Fig. 2-e is the base plate for packaging schematic diagram of the anti-plating dry film of the cold subsides of another kind that provides of the embodiment of the present invention;
Fig. 2-f is the base plate for packaging schematic diagram after the hard gold of a kind of nickel plating that provides of the embodiment of the present invention.
Embodiment
The embodiment of the present invention provides encapsulation base plate surface electroplating method, to improving upper plating good rate and the surfacing aberration of base plate for packaging plating surface metal electronplate.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
Be elaborated respectively by the following examples.
An embodiment of encapsulation base plate surface electroplating method of the present invention, comprising: on the base plate for packaging that forms circuit, print solder resist to form solder mask; The solder mask of this base plate for packaging is processed to welding resistance figure; The anti-plating dry film of cold subsides and expose surface metal electronplate to be plated region on this base plate for packaging that processes welding resistance figure, the pad pasting temperature of the anti-plating dry film of these cold subsides is lower than the melting temperature of this anti-plating dry film; The base plate for packaging of the anti-plating dry film of cold subsides is plated to the processing of surface metal electronplate; Remove the anti-plating dry film on the base plate for packaging after plating surface metal electronplate.
Referring to Fig. 1, a kind of base plate for packaging gold plating method that the embodiment of the present invention provides can comprise:
101, on the base plate for packaging that forms circuit, print solder resist to form solder mask;
102, the solder mask of base plate for packaging is processed to welding resistance figure;
Wherein, for example, can carry out exposure imaging processing with welding resistance figure to the solder mask of base plate for packaging, or the solder mask of base plate for packaging be processed to the welding resistance figure needing by alternate manner.
For example the pad of the base plate for packaging that forms solder mask is exposed.
For example, referring to Fig. 2-a and Fig. 2-b, wherein, Fig. 2-a shows a kind of base plate for packaging that forms circuit for example, comprises base material 20 and circuit 21.Fig. 2-b shows a kind of base plate for packaging that welding resistance figure of having processed for example, wherein, has formed welding resistance figure 22 on base plate for packaging.
103, the anti-plating dry film of cold subsides and expose surface metal electronplate to be plated region on the base plate for packaging that processes welding resistance figure;
Wherein, the pad pasting temperature of the anti-plating dry film of cold subsides is lower than the melting temperature of anti-plating dry film;
In actual applications, the pad pasting temperature range of the anti-plating dry film of cold subsides for example can be 20 DEG C～50 DEG C or other temperature range, and pad pasting temperature is for example 20 DEG C, 25 DEG C, 30 DEG C, 35 DEG C, 40 DEG C, 45 DEG C, 50 DEG C or 55 DEG C or other temperature etc.
For example can specifically determine pad pasting temperature according to the type of anti-plating dry film and concrete application scenarios.
Wherein, can be on the base plate for packaging that processes welding resistance figure the anti-plating dry film of cold subsides and expose surface metal electronplate to be plated (for example treat the hard golden region of nickel plating or treat the soft golden region of nickel plating).For example, can carry out exposure imaging processing to the anti-plating dry film of cold subsides and treat the hard golden region of nickel plating (or treating the soft golden region of nickel plating) to expose; Or also only the hard golden region of non-nickel plating (or the soft golden region of non-nickel plating) the anti-plating dry film of cold subsides on the base plate for packaging that processes welding resistance figure is treated the hard golden region of nickel plating (or treating the soft golden region of nickel plating) to expose.
Be appreciated that in pad pasting process, anti-plating dry film just can not melt because the pad pasting temperature of the anti-plating dry film of cold subsides is lower than the melting temperature of anti-plating dry film, can not produce strong mobility and strong fillibility, in anti-plating dry film now, also can not form point-like bubble etc.
104, the base plate for packaging of the anti-plating dry film of cold subsides is plated to the processing of surface metal electronplate;
105, remove the anti-plating dry film on the base plate for packaging after plating surface metal electronplate.
In the embodiment of the present invention, to the object of base plate for packaging plate surface Metal plating thing mainly contain following object wherein one or more:
The first utilizes surface metal electronplate layer to carry out protection circuit, in case principal vertical line road is oxidized and/or the wear resistance of enhancing circuit; It two is to ensure in follow-up assembling process, is electroplate with for example, between the circuit of surface metal electronplate and other circuit (chip bonding pad) good electrical communication bonding properties.
In the embodiment of the present invention, surface metal electronplate for example comprises: gold (can base plate for packaging power on Gold plated Layer), nickel gold (can base plate for packaging power on plating nickel gold layer), NiPdAu (can on base plate for packaging electronickelling porpezite layer), silver (can base plate for packaging power on silvered film) or tin (can base plate for packaging power on tin coating) or other can prevent that circuit is oxidized, and/or the wear resistance of enhancing circuit, and/or can ensure that circuit good electrical is communicated with other metal or alloy of bonding properties.
Under a kind of application scenarios, if both need to also need the soft gold of nickel plating at the hard gold of base plate for packaging nickel plating, can carry out exposure imaging processing to the anti-plating dry film that processes cold subsides on the base plate for packaging of welding resistance figure, treat the soft golden region of nickel plating to expose, this base plate for packaging of the anti-plating dry film of cold subsides is carried out to the soft gold of nickel plating and process (soft gold is plated in for example first nickel plating again); Remove the anti-plating dry film on the soft gold of nickel plating base plate for packaging after treatment; Then, on the soft gold of nickel plating this base plate for packaging after treatment, the anti-plating dry film of cold subsides and exposing treats that the hard golden region of nickel plating (for example carries out exposure imaging processing to the anti-plating dry film of these cold subsides and treat the hard golden region of nickel plating to expose, or also only the anti-plating dry film of the non-nickel plating cold subsides in hard golden region on the soft gold of nickel plating this base plate for packaging after treatment is treated the hard golden region of nickel plating to expose); This base plate for packaging for the treatment of the hard golden region of nickel plating to exposing carries out the hard gold processing of nickel plating (hard gold is plated in for example first nickel plating again); Remove the anti-plating dry film on the hard gold of nickel plating this base plate for packaging after treatment.
Under another kind of application scenarios, if both need to also need the soft gold of nickel plating at the hard gold of base plate for packaging nickel plating, can carry out exposure imaging processing to the anti-plating dry film that processes cold subsides on the base plate for packaging of welding resistance figure, treat the hard golden region of nickel plating to expose, this base plate for packaging of the anti-plating dry film of cold subsides is carried out to the hard gold of nickel plating and process (hard gold is plated in for example first nickel plating again); Remove the anti-plating dry film on the hard golden base plate for packaging after treatment of nickel plating; Then, on the hard gold of nickel plating this base plate for packaging after treatment, the anti-plating dry film of cold subsides and exposing treats that the soft golden region of nickel plating (for example carries out exposure imaging processing to the anti-plating dry film of these cold subsides and treat the soft golden region of nickel plating to expose, or, also the anti-plating dry film of the non-nickel plating cold subsides in soft golden region on the hard gold of nickel plating this base plate for packaging after treatment only, treats the soft golden region of nickel plating to expose); This base plate for packaging for the treatment of the soft golden region of nickel plating to exposing carries out the soft gold processing of nickel plating (soft gold is plated in for example first nickel plating again); Remove the anti-plating dry film on the soft gold of nickel plating this base plate for packaging after treatment.
In actual applications, the soft golden region of nickel plating (wherein, anti-plating dry film, the soft golden region of non-nickel plating and welding resistance figure can form enclosed space jointly) is treated to expose in the soft golden region of non-nickel plating that anti-plating dry film can unsettledly cover on base plate for packaging; And/or the hard golden region of non-nickel plating that anti-plating dry film can unsettledly cover on base plate for packaging treats that to expose (wherein, anti-plating dry film, the hard golden region of non-nickel plating and welding resistance figure can form enclosed space jointly in nickel plating hard golden region.Follow-up, for example can utilize turn a millstone line or other instrument to remove the anti-plating dry film on plating nickel gold base plate for packaging after treatment.
Please also refer to Fig. 2-c～2-f, wherein, Fig. 2-c shows the base plate for packaging of the anti-plating dry film of a kind of cold subsides for example, and anti-plating dry film 231 is unsettled have been covered electroless plating region 24 and has treated the hard golden region 25 of nickel plating, has exposed and has treated the soft golden region 26 of nickel plating.Anti-plating dry film 231, welding resistance figure 22 and electroless plating region 24 and treat that the hard golden region 25 of nickel plating has formed enclosed space 27.
Fig. 2-d shows the base plate for packaging after the soft gold of a kind of nickel plating for example, is treating that the soft golden region of nickel plating has plated nickel soft golden 261.Fig. 2-e shows the base plate for packaging of the anti-plating dry film of another kind of cold subsides for example, and anti-plating dry film 232 is unsettled has covered electroless plating region 24 and the soft golden region 26 of nickel plating, has exposed and has treated the hard golden region 25 of nickel plating.The soft golden region 26 of anti-plating dry film 232, welding resistance figure 22 and electroless plating region 24 and nickel plating has formed enclosed space 27.Fig. 2-f shows the base plate for packaging after the hard gold of a kind of nickel plating for example, is treating that the hard golden region of nickel plating has plated the hard gold 251 of nickel.
Fig. 2-c～Fig. 2 f shows the technological process of the hard gold of nickel plating after the soft gold of the first nickel plating of base plate for packaging for example, certainly also can select the soft gold of nickel plating after the hard gold of first nickel plating, and its technological process can be similar to figure 2-c～Fig. 2 f.Similarly, electroplate the technological process of other surface metal electronplate at base plate for packaging, also can be similarly with reference to figure 2-c～Fig. 2 f.
Therefore, in embodiment of the present invention base plate for packaging plating surface metal electronplate process, on the base plate for packaging that forms circuit, print solder resist to form solder mask; The solder mask of this base plate for packaging is processed to welding resistance figure; The anti-plating dry film of cold subsides and expose surface metal electronplate to be plated region on this base plate for packaging that processes welding resistance figure, the pad pasting temperature of the anti-plating dry film of these cold subsides is lower than the melting temperature of this anti-plating dry film; The base plate for packaging of the anti-plating dry film of cold subsides is plated to the processing of surface metal electronplate.Because the pad pasting temperature of the anti-plating dry film of cold subsides is lower than the melting temperature of anti-plating dry film, in pad pasting process, anti-plating dry film just can not melt, can not produce strong mobility and strong fillibility, in anti-plating dry film now, can not form point-like bubble etc. yet, in just there will not be anti-plating dry film like this in plating surface metal electronplate process, break because of bubble and make to plate bad problem, be conducive to improve upper plating good rate and the surfacing aberration of base plate for packaging plating surface metal electronplate, and then can effectively improve the routing good rate of client terminal.
It should be noted that, for aforesaid each embodiment of the method, for simple description, therefore it is all expressed as to a series of combination of actions, but those skilled in the art should know, the present invention is not subject to the restriction of described sequence of operation, because according to the present invention, some step can adopt other orders or carry out simultaneously.Secondly, those skilled in the art also should know, the embodiment described in specification sheets all belongs to preferred embodiment, and related action and module might not be that the present invention is necessary.
The encapsulation base plate surface electroplating method above embodiment of the present invention being provided is described in detail, applied specific case herein principle of the present invention and embodiment are set forth, the explanation of above embodiment is just for helping to understand method of the present invention and core concept thereof; , for one of ordinary skill in the art, according to the embodiment of the present invention, all will change in specific embodiments and applications meanwhile, to sum up describe, this description should not be construed as limitation of the present invention.
Claims (10)
1. an encapsulation base plate surface electroplating method, is characterized in that, comprising:
On the base plate for packaging that forms circuit, print solder resist to form solder mask;
The solder mask of described base plate for packaging is processed to welding resistance figure;
The anti-plating dry film of cold subsides and expose surface metal electronplate to be plated region on the described base plate for packaging that processes welding resistance figure, wherein, the pad pasting temperature of the anti-plating dry film of described cold subsides is lower than the melting temperature of described anti-plating dry film;
The described base plate for packaging of the anti-plating dry film of cold subsides is plated to the processing of surface metal electronplate;
Remove the anti-plating dry film on the described base plate for packaging after plating surface metal electronplate.
2. method according to claim 1, is characterized in that, described on the described base plate for packaging that processes welding resistance figure the anti-plating dry film of cold subsides and expose surface metal electronplate to be plated region, comprising:
The anti-plating dry film of cold subsides on the described base plate for packaging that processes welding resistance figure;
Described anti-plating dry film is carried out to exposure imaging processing to expose surface metal electronplate to be plated region.
3. method according to claim 1, is characterized in that,
Described surface metal electronplate comprises: gold, golden, the NiPdAu of nickel, silver or tin.
4. method according to claim 2, is characterized in that, described described anti-plating dry film is carried out to exposure imaging processing to expose surface metal electronplate to be plated region, comprising:
Described anti-plating dry film is carried out to exposure imaging processing and treat the soft golden region of nickel plating to expose;
The described described base plate for packaging to the anti-plating dry film of cold subsides plates the processing of surface metal electronplate, remove the anti-plating dry film on the described base plate for packaging after plating surface metal electronplate, comprise: the described base plate for packaging of the anti-plating dry film of cold subsides is carried out to the soft gold of nickel plating and process, remove the anti-plating dry film on the soft gold of nickel plating described base plate for packaging after treatment.
5. method according to claim 4, it is characterized in that, after anti-plating dry film on the soft gold of described removal nickel plating described base plate for packaging after treatment, also comprise: the anti-plating dry film of cold subsides and expose and treat the hard golden region of nickel plating on the soft gold of nickel plating described base plate for packaging after treatment;
The described base plate for packaging for the treatment of the hard golden region of nickel plating to exposing carries out the hard gold processing of nickel plating;
Remove the anti-plating dry film on the hard gold of nickel plating described base plate for packaging after treatment.
6. method according to claim 2, is characterized in that, described described anti-plating dry film is carried out to exposure imaging processing to expose surface metal electronplate to be plated region, comprising:
Described anti-plating dry film is carried out to exposure imaging processing and treat the hard golden region of nickel plating to expose;
The described described base plate for packaging to the anti-plating dry film of cold subsides plates the processing of surface metal electronplate, remove the anti-plating dry film on the described base plate for packaging after plating surface metal electronplate, comprise: the described base plate for packaging of the anti-plating dry film of cold subsides is carried out to the hard gold of nickel plating and process, remove the anti-plating dry film on the hard gold of nickel plating described base plate for packaging after treatment.
7. method according to claim 6, is characterized in that,
After anti-plating dry film on the hard gold of described removal nickel plating described base plate for packaging after treatment, also comprise:
The anti-plating dry film of cold subsides and expose and treat the soft golden region of nickel plating on the hard gold of nickel plating described base plate for packaging after treatment;
The described base plate for packaging for the treatment of the soft golden region of nickel plating to exposing carries out the soft gold processing of nickel plating;
Remove the anti-plating dry film on the soft gold of nickel plating described base plate for packaging after treatment.
8. according to the method described in claim 1 to 7 any one, it is characterized in that,
The pad pasting temperature range of the anti-plating dry film of described cold subsides is 20 DEG C～50 DEG C.
9. method according to claim 8, is characterized in that,
The pad pasting temperature range of the anti-plating dry film of described cold subsides is 40 DEG C.
10. method according to claim 8, is characterized in that,
The soft golden region of nickel plating is treated to expose in the unsettled soft golden region of non-nickel plating covering on described base plate for packaging of described anti-plating dry film; And/or the hard golden region of nickel plating is treated to expose in the unsettled hard golden region of non-nickel plating covering on described base plate for packaging of described anti-plating dry film.
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| CN201110327728.1A CN102505132B (en) | 2011-10-25 | 2011-10-25 | Encapsulation base plate surface electroplating method |
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| CN201110327728.1A CN102505132B (en) | 2011-10-25 | 2011-10-25 | Encapsulation base plate surface electroplating method |
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| CN103237416B (en) * | 2013-05-08 | 2015-10-07 | 无锡江南计算技术研究所 | Same surface realizes the pattern-producing method of the hard gold of plating and electroplating mild alloy |
| CN103281870B (en) * | 2013-05-13 | 2017-02-01 | 四川省华兴宇电子科技有限公司 | Local electrogilding circuit board manufacturing method capable of avoiding nickel layer suspended falling |
| CN103716988A (en) * | 2013-10-30 | 2014-04-09 | 胜宏科技（惠州）股份有限公司 | Multi-coating circuit board and production method thereof |
| KR102493463B1 (en) | 2016-01-18 | 2023-01-30 | 삼성전자 주식회사 | Printed circuit board, semiconductor package having the same, and method for manufacturing the same |
| CN109831880A (en) * | 2019-03-11 | 2019-05-31 | 厦门华天华电子有限公司 | A kind of processing technology of FPC electroplated layer |
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| JP3975969B2 (en) * | 2003-05-16 | 2007-09-12 | カシオ計算機株式会社 | Dry film resist laminating method |
| CN100484370C (en) * | 2005-12-15 | 2009-04-29 | 比亚迪股份有限公司 | Production of flexible printing circuit board |
| KR100732385B1 (en) * | 2006-06-02 | 2007-06-27 | 삼성전기주식회사 | Manufacturing method of package substrate |
| CN101302636A (en) * | 2008-01-18 | 2008-11-12 | 深圳市深南电路有限公司 | Metal piece electroplating method |
| CN101772270B (en) * | 2009-12-31 | 2011-11-09 | 广州杰赛科技股份有限公司 | Preprocessing method for image transfer of flexible PCB (printed circuit board) |
| CN102079158B (en) * | 2010-11-11 | 2013-06-19 | 东莞红板多层线路板有限公司 | Circuit board film-adhering method |
| CN102026491B (en) * | 2010-12-07 | 2012-05-09 | 深南电路有限公司 | Manufacturing process of whole gold-plated panel |
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