CN102505132B - Encapsulation base plate surface electroplating method - Google Patents
Encapsulation base plate surface electroplating method Download PDFInfo
- Publication number
- CN102505132B CN102505132B CN201110327728.1A CN201110327728A CN102505132B CN 102505132 B CN102505132 B CN 102505132B CN 201110327728 A CN201110327728 A CN 201110327728A CN 102505132 B CN102505132 B CN 102505132B
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- CN
- China
- Prior art keywords
- plating
- base plate
- dry film
- packaging
- described base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims abstract description 53
- 238000005538 encapsulation Methods 0.000 title claims abstract description 17
- 238000009713 electroplating Methods 0.000 title claims abstract description 11
- 238000007747 plating Methods 0.000 claims abstract description 218
- 239000002184 metal Substances 0.000 claims abstract description 46
- 229910052751 metal Inorganic materials 0.000 claims abstract description 46
- 238000002844 melting Methods 0.000 claims abstract description 10
- 230000008018 melting Effects 0.000 claims abstract description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 174
- 238000004806 packaging method and process Methods 0.000 claims description 103
- 229910052759 nickel Inorganic materials 0.000 claims description 87
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 46
- 229910052737 gold Inorganic materials 0.000 claims description 46
- 239000010931 gold Substances 0.000 claims description 46
- 238000003466 welding Methods 0.000 claims description 27
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 238000003384 imaging method Methods 0.000 claims description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000011135 tin Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract 5
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 230000004075 alteration Effects 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 4
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110327728.1A CN102505132B (en) | 2011-10-25 | 2011-10-25 | Encapsulation base plate surface electroplating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110327728.1A CN102505132B (en) | 2011-10-25 | 2011-10-25 | Encapsulation base plate surface electroplating method |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102505132A CN102505132A (en) | 2012-06-20 |
CN102505132B true CN102505132B (en) | 2014-07-09 |
Family
ID=46217260
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110327728.1A Active CN102505132B (en) | 2011-10-25 | 2011-10-25 | Encapsulation base plate surface electroplating method |
Country Status (1)
Country | Link |
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CN (1) | CN102505132B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103237416B (en) * | 2013-05-08 | 2015-10-07 | 无锡江南计算技术研究所 | Same surface realizes the pattern-producing method of the hard gold of plating and electroplating mild alloy |
CN103281870B (en) * | 2013-05-13 | 2017-02-01 | 四川省华兴宇电子科技有限公司 | Local electrogilding circuit board manufacturing method capable of avoiding nickel layer suspended falling |
CN103716988A (en) * | 2013-10-30 | 2014-04-09 | 胜宏科技(惠州)股份有限公司 | Multi-coating circuit board and production method thereof |
KR102493463B1 (en) | 2016-01-18 | 2023-01-30 | 삼성전자 주식회사 | Printed circuit board, semiconductor package having the same, and method for manufacturing the same |
CN109831880A (en) * | 2019-03-11 | 2019-05-31 | 厦门华天华电子有限公司 | A kind of processing technology of FPC electroplated layer |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3975969B2 (en) * | 2003-05-16 | 2007-09-12 | カシオ計算機株式会社 | Dry film resist laminating method |
CN100484370C (en) * | 2005-12-15 | 2009-04-29 | 比亚迪股份有限公司 | Production of flexible printing circuit board |
KR100732385B1 (en) * | 2006-06-02 | 2007-06-27 | 삼성전기주식회사 | Manufacturing method of package substrate |
CN101302636A (en) * | 2008-01-18 | 2008-11-12 | 深圳市深南电路有限公司 | Metal piece electroplating method |
CN101772270B (en) * | 2009-12-31 | 2011-11-09 | 广州杰赛科技股份有限公司 | Preprocessing method for image transfer of flexible PCB (printed circuit board) |
CN102079158B (en) * | 2010-11-11 | 2013-06-19 | 东莞红板多层线路板有限公司 | Circuit board film-adhering method |
CN102026491B (en) * | 2010-12-07 | 2012-05-09 | 深南电路有限公司 | Manufacturing process of whole gold-plated panel |
-
2011
- 2011-10-25 CN CN201110327728.1A patent/CN102505132B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN102505132A (en) | 2012-06-20 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENNAN CIRCUITS Co.,Ltd. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: SHENNAN CIRCUITS Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20231109 Address after: Building 101, No. 2 Shennan Circuit, East Zone, Gaoqiao Brand Industrial Park, Gaoqiao Community, Pingdi Street, Longgang District, Shenzhen City, Guangdong Province, 518100 Patentee after: Shenzhen Guangxin Packaging Substrate Co.,Ltd. Address before: 518053, No. 99, East Road, overseas Chinese town, Shenzhen, Guangdong, Nanshan District Patentee before: SHENNAN CIRCUITS Co.,Ltd. |