CN102505132A - Encapsulation base plate surface electroplating method - Google Patents
Encapsulation base plate surface electroplating method Download PDFInfo
- Publication number
- CN102505132A CN102505132A CN2011103277281A CN201110327728A CN102505132A CN 102505132 A CN102505132 A CN 102505132A CN 2011103277281 A CN2011103277281 A CN 2011103277281A CN 201110327728 A CN201110327728 A CN 201110327728A CN 102505132 A CN102505132 A CN 102505132A
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- Prior art keywords
- plating
- base plate
- dry film
- packaging
- nickel plating
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- 238000000034 method Methods 0.000 title claims abstract description 47
- 238000009713 electroplating Methods 0.000 title claims abstract description 11
- 238000005538 encapsulation Methods 0.000 title abstract 8
- 238000007747 plating Methods 0.000 claims abstract description 202
- 239000002184 metal Substances 0.000 claims abstract description 45
- 229910052751 metal Inorganic materials 0.000 claims abstract description 45
- 238000002844 melting Methods 0.000 claims abstract description 10
- 230000008018 melting Effects 0.000 claims abstract description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 176
- 238000004806 packaging method and process Methods 0.000 claims description 111
- 229910052759 nickel Inorganic materials 0.000 claims description 88
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 86
- 229910052737 gold Inorganic materials 0.000 claims description 86
- 239000010931 gold Substances 0.000 claims description 86
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 238000003384 imaging method Methods 0.000 claims description 11
- 238000007639 printing Methods 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000011135 tin Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract 5
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 230000004075 alteration Effects 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
Images
Abstract
The embodiment of the invention discloses an encapsulation base plate surface electroplating method, which comprises the steps that: soldering resistance agents are printed on an encapsulation base plate with formed circuits for forming a soldering resistance layer; soldering resistance patterns are processed on the soldering resistance layer of the encapsulation base plate; a plating resistance dry film is pasted on the encapsulation base plate with the processed soldering resistance patterns in a cold way, and in addition, a surface metal electroplate object region to be plated is exposed, wherein the film pasting temperature of the plating resistance dry film cold pasting is lower than the melting point temperature of the plating resistance dry film; the surface metal electroplate plating treatment is carried out on the encapsulation base plate pasted with the plating resistance dry film in the cold way; and the plating resistance dry film on the encapsulation base plate after the surface metal electroplate plating treatment is removed. The technical scheme of the embodiment of the invention is favorable for reducing the plating surface color difference and improving the plating acceptance rate of the encapsulation base plate plated with surface metal electroplates.
Description
Technical field
The present invention relates to circuit card and make the field, be specifically related to a kind of base plate for packaging method for electroplating surface.
Background technology
Base plate for packaging (also claiming support plate) is the PC board that is used to carry electronic devices and components (for example chip).
In the plating surface metal electronplate of base plate for packaging (for example gold) process, need stick anti-plating dry film in the zone that need not to plate the surface metal electronplate.
With gold-plated is example; The gold-plated subsides dry film technology of industry is generally being carried out pad pasting above under 110 ℃ the high temperature at present, and anti-plating dry film at high temperature has better flowability and fillibility, because there are difference of altitude in the copper face and the printing ink face of base plate for packaging; And the high temperature pad pasting is very easy to produce the point-like bubble at copper face; Point-like bubble interface is extremely thin, in the electrogilding process, possibly occur breaking and makes that gold is bad, finally causes problems such as the client terminal routing is bad, the golden complexion difference of outward appearance is bad.
Summary of the invention
The embodiment of the invention provides the base plate for packaging method for electroplating surface, plates good rate and surfacing aberration in the hope of improving going up of base plate for packaging plating surface metal electronplate.
For solving the problems of the technologies described above, the embodiment of the invention provides following technical scheme:
A kind of base plate for packaging method for electroplating surface comprises:
The printing solder resist is to form solder mask on the base plate for packaging that forms circuit;
The solder mask of said base plate for packaging is processed resistance weldering figure;
Cold subsides are anti-on the said base plate for packaging that processes resistance weldering figure plates dry film and exposes surface metal electronplate to be plated zone, and wherein, the pad pasting temperature of the anti-plating of said cold subsides dry film is lower than the melting temperature of said anti-plating dry film;
Said base plate for packaging to the anti-plating of cold subsides dry film plates the processing of surface metal electronplate;
Anti-plating dry film on the said base plate for packaging behind the removal plating surface metal electronplate.
Therefore in the embodiment of the invention base plate for packaging plating surface metal electronplate process, the printing solder resist is to form solder mask on the base plate for packaging that forms circuit; The solder mask of this base plate for packaging is processed resistance weldering figure; Cold subsides are anti-on this base plate for packaging that processes resistance weldering figure plates dry film and exposes surface metal electronplate to be plated zone, and the pad pasting temperature of the anti-plating of these cold subsides dry film is lower than this anti-melting temperature that plates dry film; Base plate for packaging to the anti-plating of cold subsides dry film plates the processing of surface metal electronplate.Because the pad pasting temperature of the anti-plating of cold subsides dry film is lower than the melting temperature of anti-plating dry film; Anti-plating dry film just can not melt in the pad pasting process; Can not produce strong flowability and strong fillibility; Can not form point-like bubble etc. in the anti-plating dry film of this moment yet; In plating surface metal electronplate process, make like this and help the problem that plating is bad improving going up of base plate for packaging plating surface metal electronplate and plate good rate and surfacing aberration, and then can effectively improve the routing good rate of client terminal with regard to not occurring in the anti-plating dry film breaking because of bubble.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art; To do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below; Obviously, the accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills; Under the prerequisite of not paying creative work property, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the schematic flow sheet of a kind of base plate for packaging method for electroplating surface of providing of the embodiment of the invention;
Fig. 2-a is a kind of base plate for packaging synoptic diagram that forms circuit that the embodiment of the invention provides;
Fig. 2-b is a kind of base plate for packaging synoptic diagram that resistance weldering figure of having processed that the embodiment of the invention provides;
Fig. 2-c is the anti-base plate for packaging synoptic diagram that plates dry film of a kind of cold subsides that the embodiment of the invention provides;
Fig. 2-d is the base plate for packaging synoptic diagram behind the soft gold of a kind of nickel plating that provides of the embodiment of the invention;
Fig. 2-e is the anti-base plate for packaging synoptic diagram that plates dry film of another kind of cold subsides that the embodiment of the invention provides;
Fig. 2-f is the base plate for packaging synoptic diagram behind the hard gold of a kind of nickel plating that provides of the embodiment of the invention.
Embodiment
The embodiment of the invention provides the base plate for packaging method for electroplating surface, plates good rate and surfacing aberration in the hope of improving going up of base plate for packaging plating surface metal electronplate.
To combine the accompanying drawing in the embodiment of the invention below, the technical scheme in the embodiment of the invention is carried out clear, intactly description, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
Below be elaborated respectively through embodiment.
An embodiment of base plate for packaging method for electroplating surface of the present invention comprises: the printing solder resist is to form solder mask on the base plate for packaging that forms circuit; The solder mask of this base plate for packaging is processed resistance weldering figure; Cold subsides are anti-on this base plate for packaging that processes resistance weldering figure plates dry film and exposes surface metal electronplate to be plated zone, and the pad pasting temperature of the anti-plating of these cold subsides dry film is lower than this anti-melting temperature that plates dry film; Base plate for packaging to the anti-plating of cold subsides dry film plates the processing of surface metal electronplate; Anti-plating dry film on the base plate for packaging behind the removal plating surface metal electronplate.
Referring to Fig. 1, a kind of base plate for packaging gold plating method that the embodiment of the invention provides can comprise:
101, on the base plate for packaging that forms circuit, print solder resist to form solder mask;
102, the solder mask with base plate for packaging processes resistance weldering figure;
Wherein, for example can carry out exposure imaging to the solder mask of base plate for packaging and handle, perhaps the solder mask of base plate for packaging processed the resistance weldering figure that needs through alternate manner with resistance weldering figure.
The pad that for example will form the base plate for packaging of solder mask exposes.
For example referring to Fig. 2-a and Fig. 2-b, wherein, Fig. 2-a shows a kind of base plate for packaging that forms circuit for example, comprises base material 20 and circuit 21.Fig. 2-b shows a kind of base plate for packaging that resistance weldering figure of having processed for example, wherein, has formed resistance weldering figure 22 on the base plate for packaging.
103, cold subsides are anti-on the base plate for packaging that processes resistance weldering figure plates dry film and exposes surface metal electronplate to be plated zone;
Wherein, the pad pasting temperature of the anti-plating of cold subsides dry film is lower than the melting temperature of anti-plating dry film;
In practical application, the pad pasting TR of the anti-plating of cold subsides dry film for example can be 20 ℃～50 ℃ or other TR, and the pad pasting temperature for example is 20 ℃, 25 ℃, 30 ℃, 35 ℃, 40 ℃, 45 ℃, 50 ℃ or 55 ℃ or other temperature etc.
For example can come the concrete pad pasting temperature of confirming with concrete application scenarios based on the type of anti-plating dry film.
Wherein, can on the base plate for packaging that processes resistance weldering figure, cold subsides resist the plating dry film and expose surface metal electronplate to be plated (for example treat nickel plating hard gold zone or treat the soft golden zone of nickel plating).For example, can carry out the exposure imaging processing to the anti-plating dry film of cold subsides and treat the hard gold of nickel plating zone (or treating that the soft gold of nickel plating is regional) to expose; Or also only the hard gold of the non-nickel plating on the base plate for packaging that processes resistance weldering figure zone (or the soft gold of non-nickel plating zone) the anti-plating of cold subsides dry film is treated the hard gold of nickel plating zone (or treating the soft gold of nickel plating zone) to expose.
Be appreciated that anti-plating dry film just can not melt in the pad pasting process because the pad pasting temperature of the anti-plating of cold subsides dry film is lower than the melting temperature of anti-plating dry film, can not produce strong flowability and strong fillibility, also can not form point-like bubble etc. in the anti-plating dry film of this moment.
104, the base plate for packaging to the anti-plating of cold subsides dry film plates the processing of surface metal electronplate;
105, the anti-plating dry film on the base plate for packaging behind the removal plating surface metal electronplate.
In the embodiment of the invention, to the purpose of base plate for packaging plate surface Metal plating thing mainly contain following purpose wherein one or more:
The first utilizes surface metal electronplate layer to come protection circuit, in case the principal vertical line road is oxidized and/or the wear resistance of enhancing line; It two is to guarantee in the follow-up assembling process, is electroplate with good electrical communication bonding properties between circuit and other circuit (for example chip bonding pad) of surface metal electronplate.
In the embodiment of the invention; The surface metal electronplate for example comprises: gold (can base plate for packaging power on Gold plated Layer), nickel gold (can at electronickelling gold layer on the base plate for packaging), NiPdAu (can on base plate for packaging electronickelling porpezite layer), silver (can base plate for packaging power on silvered film) or tin (can base plate for packaging power on tin coating) or other can prevent that circuit is oxidized; And/or the wear resistance of enhancing line, and/or can guarantee that the circuit good electrical is communicated with other metal or alloy of bonding properties.
Under a kind of application scenarios; If both need also need the soft gold of nickel plating at the hard gold of base plate for packaging nickel plating; Can carry out exposure imaging to the anti-plating dry film of cold subsides on the base plate for packaging that processes resistance weldering figure handles; Treat anti-this base plate for packaging that plates dry film of cold subsides to be carried out the soft gold of nickel plating handle (soft gold is plated in for example first nickel plating again) in the soft gold of nickel plating zone to expose; Remove the anti-plating dry film on the base plate for packaging after the soft gold of nickel plating is handled; Then; Cold subsides anti-plating dry film and exposing treats that (for example the anti-plating dry film of these cold subsides being carried out exposure imaging handles to expose and treat the hard gold of nickel plating zone in the hard gold of nickel plating zone on this base plate for packaging after the soft gold of nickel plating is handled; Perhaps, also only the anti-plating of the regional cold subsides of the hard gold of the non-nickel plating dry film on this base plate for packaging after the soft gold of nickel plating is handled treat the hard gold of nickel plating zone to expose); Carry out nickel plating hard golden handle (hard gold is plated in for example first nickel plating again) to exposing this base plate for packaging of treating the hard gold of nickel plating zone; Remove the anti-plating dry film on this base plate for packaging after the hard gold of nickel plating is handled.
Under another kind of application scenarios; If both need also need the soft gold of nickel plating at the hard gold of base plate for packaging nickel plating; Can carry out exposure imaging to the anti-plating dry film of cold subsides on the base plate for packaging that processes resistance weldering figure handles; Treat anti-this base plate for packaging that plates dry film of cold subsides to be carried out the hard gold of nickel plating handle (hard gold is plated in for example first nickel plating again) in the hard gold of nickel plating zone to expose; Remove the anti-plating dry film on the base plate for packaging after the hard gold of nickel plating is handled; Then; Cold subsides anti-plating dry film and exposing treats that (for example the anti-plating dry film of these cold subsides being carried out exposure imaging handles to expose and treat the soft gold of nickel plating zone in the soft gold of nickel plating zone on this base plate for packaging after the hard gold of nickel plating is handled; Perhaps; Also only the regional cold subsides of the soft gold of non-nickel plating on this base plate for packaging after the hard gold processing of nickel plating resist the plating dry film, treat the soft gold of nickel plating zone to expose); Carry out the soft gold processing of nickel plating (soft gold is plated in for example first nickel plating again) to exposing this base plate for packaging of treating the soft gold of nickel plating zone; Remove the anti-plating dry film on this base plate for packaging after the soft gold of nickel plating is handled.
In actual applications, the soft gold of nickel plating regional (wherein, anti-plating dry film, the soft golden zone of non-nickel plating and welding resistance figure can form enclosure space jointly) is treated to expose in the soft gold of the non-nickel plating zone that resists the plating dry film can unsettledly cover on the base plate for packaging; And/or the hard gold of the non-nickel plating zone that anti-plating dry film can unsettledly cover on the base plate for packaging treats that to expose (wherein, anti-plating dry film, the hard golden zone of non-nickel plating and welding resistance figure can form enclosure space jointly in the hard gold of nickel plating zone.Follow-up, for example can utilize the instrument of turn a millstone line or other to remove the anti-plating dry film on the base plate for packaging after the nickel plating gold is handled.
Please in the lump referring to Fig. 2-c～2-f, wherein, Fig. 2-c shows the base plate for packaging of the anti-plating of a kind of cold subsides dry film for example, and anti-plating dry film 231 is unsettled have been covered electroless plating zone 24 and treated the hard gold of nickel plating zone 25, has exposed and has treated the soft gold of nickel plating zone 26.Resist plating dry film 231, welding resistance figure 22 and electroless coating zone 24 and treat that the hard gold regional 25 of nickel plating has formed enclosure space 27.
Fig. 2-d shows the base plate for packaging behind the soft gold of a kind of nickel plating for example, is treating that the soft golden zone of nickel plating has plated nickel soft golden 261.Fig. 2-e shows the base plate for packaging of the anti-plating of another kind of cold subsides dry film for example, and anti-plating dry film 232 is unsettled to have covered electroless plating zone 24 and the soft gold of nickel plating zone 26, has exposed and has treated the hard gold regional 25 of nickel plating.Resist plating dry film 232, resistance weldering figure 22 and electroless plating zone 24 to reach the soft gold of nickel plating zone 26 and formed enclosed space 27.Fig. 2-f shows the base plate for packaging behind the hard gold of a kind of nickel plating for example, is treating that the hard golden zone of nickel plating has plated the hard gold 251 of nickel.
Fig. 2-c～Fig. 2 f shows the technological process of the hard gold of the soft gold back nickel plating of base plate for packaging elder generation nickel plating for example, also can select the soft gold of the hard gold back nickel plating of first nickel plating certainly, and its technological process can be similar to figure 2-c～Fig. 2 f.Similarly, in the technological process that base plate for packaging is electroplated other surface metal electronplate, also can be similarly with reference to figure 2-c～Fig. 2 f.
Therefore in the embodiment of the invention base plate for packaging plating surface metal electronplate process, the printing solder resist is to form solder mask on the base plate for packaging that forms circuit; The solder mask of this base plate for packaging is processed resistance weldering figure; Cold subsides are anti-on this base plate for packaging that processes resistance weldering figure plates dry film and exposes surface metal electronplate to be plated zone, and the pad pasting temperature of the anti-plating of these cold subsides dry film is lower than this anti-melting temperature that plates dry film; Base plate for packaging to the anti-plating of cold subsides dry film plates the processing of surface metal electronplate.Because the pad pasting temperature of the anti-plating of cold subsides dry film is lower than the melting temperature of anti-plating dry film; Anti-plating dry film just can not melt in the pad pasting process; Can not produce strong flowability and strong fillibility; Can not form point-like bubble etc. in the anti-plating dry film of this moment yet; In plating surface metal electronplate process, make like this and help the problem that plating is bad improving going up of base plate for packaging plating surface metal electronplate and plate good rate and surfacing aberration, and then can effectively improve the routing good rate of client terminal with regard to not occurring in the anti-plating dry film breaking because of bubble.
Need to prove; For aforesaid each method embodiment, for simple description, so it all is expressed as a series of combination of actions; But those skilled in the art should know; The present invention does not receive the restriction of described sequence of operation, because according to the present invention, some step can adopt other orders or carry out simultaneously.Secondly, those skilled in the art also should know, the embodiment described in the specification sheets all belongs to preferred embodiment, and related action and module might not be that the present invention is necessary.
More than the base plate for packaging method for electroplating surface that the embodiment of the invention provided is described in detail; Used specific case herein principle of the present invention and embodiment are set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to the embodiment of the invention, the part that all can change is in specific embodiments and applications to sum up described, and this description should not be construed as limitation of the present invention.
Claims (10)
1. a base plate for packaging method for electroplating surface is characterized in that, comprising:
The printing solder resist is to form solder mask on the base plate for packaging that forms circuit;
The solder mask of said base plate for packaging is processed resistance weldering figure;
Cold subsides resist the plating dry film and expose and treat gold-plated zone on the said base plate for packaging that processes resistance weldering figure, and wherein, the pad pasting temperature of the anti-plating of said cold subsides dry film is lower than the melting temperature of said anti-plating dry film;
Said base plate for packaging to the anti-plating of cold subsides dry film plates the processing of surface metal electronplate;
Anti-plating dry film on the said base plate for packaging behind the removal plating surface metal electronplate.
2. method according to claim 1 is characterized in that, said on the said base plate for packaging that processes resistance weldering figure cold subsides anti-plating dry film and expose surface metal electronplate to be plated zone, comprising:
Processing the anti-plating of cold subsides dry film on the said base plate for packaging of welding resistance figure;
Said anti-plating dry film is carried out exposure imaging to be handled to expose surface metal electronplate to be plated zone.
3. method according to claim 1 and 2 is characterized in that,
Said surface metal electronplate comprises: gold, golden, the NiPdAu of nickel, silver or tin.
4. method according to claim 2 is characterized in that, saidly said anti-plating dry film is carried out exposure imaging handles to expose surface metal electronplate to be plated zone, comprising:
Said anti-plating dry film is carried out the exposure imaging processing treat the soft gold of nickel plating zone to expose;
Said said base plate for packaging to the anti-plating of cold subsides dry film plates the surface metal electronplate and handles; Anti-plating dry film on the said base plate for packaging behind the removal plating surface metal electronplate; Comprise: the said base plate for packaging to the anti-plating of cold subsides dry film carries out the soft gold processing of nickel plating, removes the anti-plating dry film on the said base plate for packaging after the soft gold of nickel plating is handled.
5. method according to claim 4 is characterized in that,
After the anti-plating dry film on the said base plate for packaging after the soft gold of said removal nickel plating is handled, also comprise:
Cold subsides resist the plating dry film and expose and treat that the hard gold of nickel plating is regional on the said base plate for packaging after the soft gold processing of nickel plating;
Carry out hard golden processing of nickel plating to exposing the said base plate for packaging of treating the hard gold of nickel plating zone;
Remove the anti-plating dry film on the said base plate for packaging after the hard gold of nickel plating is handled.
6. method according to claim 2 is characterized in that, saidly said anti-plating dry film is carried out exposure imaging handles to expose surface metal electronplate to be plated zone, comprising:
Said anti-plating dry film is carried out the exposure imaging processing treat the hard gold of nickel plating zone to expose;
Said said base plate for packaging to the anti-plating of cold subsides dry film plates the surface metal electronplate and handles; Anti-plating dry film on the said base plate for packaging behind the removal plating surface metal electronplate; Comprise: the said base plate for packaging to the anti-plating of cold subsides dry film carries out the hard gold processing of nickel plating, removes the anti-plating dry film on the said base plate for packaging after the hard gold of nickel plating is handled.
7. method according to claim 6 is characterized in that,
After the anti-plating dry film on the said base plate for packaging after the hard gold of said removal nickel plating is handled, also comprise:
Cold subsides resist the plating dry film and expose and treat the soft gold of nickel plating zone on the said base plate for packaging after the hard gold processing of nickel plating;
Carry out the soft gold processing of nickel plating to exposing the said base plate for packaging of treating the soft gold of nickel plating zone;
Remove the anti-plating dry film on the said base plate for packaging after the soft gold of nickel plating is handled.
8. according to each described method of claim 1 to 7, it is characterized in that,
The pad pasting TR of the anti-plating of said cold subsides dry film is 20 ℃～50 ℃.
9. method according to claim 8 is characterized in that,
The pad pasting TR of the anti-plating of said cold subsides dry film is 40 ℃.
10. method according to claim 8 is characterized in that,
The soft gold of nickel plating zone is treated to expose in the unsettled soft gold of the non-nickel plating zone that covers on the said base plate for packaging of said anti-plating dry film; And/or the hard gold of nickel plating zone is treated to expose in the unsettled hard gold of the non-nickel plating zone that covers on the said base plate for packaging of said anti-plating dry film.
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| CN103281870A (en) * | 2013-05-13 | 2013-09-04 | 四川省华兴宇电子科技有限公司 | Local electrogilding circuit board manufacturing method capable of avoiding nickel layer suspended falling |
| CN103716988A (en) * | 2013-10-30 | 2014-04-09 | 胜宏科技（惠州）股份有限公司 | Multi-coating circuit board and production method thereof |
| CN106982508A (en) * | 2016-01-18 | 2017-07-25 | 三星电子株式会社 | Printed circuit board (PCB) and the semiconductor packages including the printed circuit board (PCB) |
| CN109831880A (en) * | 2019-03-11 | 2019-05-31 | 厦门华天华电子有限公司 | A kind of processing technology of FPC electroplated layer |
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| CN103281870A (en) * | 2013-05-13 | 2013-09-04 | 四川省华兴宇电子科技有限公司 | Local electrogilding circuit board manufacturing method capable of avoiding nickel layer suspended falling |
| CN103281870B (en) * | 2013-05-13 | 2017-02-01 | 四川省华兴宇电子科技有限公司 | Local electrogilding circuit board manufacturing method capable of avoiding nickel layer suspended falling |
| CN103716988A (en) * | 2013-10-30 | 2014-04-09 | 胜宏科技（惠州）股份有限公司 | Multi-coating circuit board and production method thereof |
| CN106982508A (en) * | 2016-01-18 | 2017-07-25 | 三星电子株式会社 | Printed circuit board (PCB) and the semiconductor packages including the printed circuit board (PCB) |
| CN106982508B (en) * | 2016-01-18 | 2019-11-08 | 三星电子株式会社 | Printed circuit board and semiconductor packages including the printed circuit board |
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| CN109831880A (en) * | 2019-03-11 | 2019-05-31 | 厦门华天华电子有限公司 | A kind of processing technology of FPC electroplated layer |
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