CN102501323B - Charging and discharging device for silicon wafer multi-line cutting machine - Google Patents
Charging and discharging device for silicon wafer multi-line cutting machine Download PDFInfo
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- CN102501323B CN102501323B CN201110394691.4A CN201110394691A CN102501323B CN 102501323 B CN102501323 B CN 102501323B CN 201110394691 A CN201110394691 A CN 201110394691A CN 102501323 B CN102501323 B CN 102501323B
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Abstract
The invention discloses a charging and discharging device for a silicon wafer multi-line cutting machine, which comprises a body, a sliding block and a positioning assembly, wherein the lower part of the body is provided with a guide slot; the sliding block is positioned in the guide slot to slide along the guide slot; the lower part of the sliding block is provided with a guidance sliding plate; the positioning assembly is positioned above the body and comprises a connecting block, a first positioning block and a second positioning block, wherein the first positioning block is used for positioning a cutting machine door; the second positioning block is used for positioning the bracket of a charging and discharging trolley; and the position of the opened cutting machine door is conveniently positioned by the first positioning block. In the charging and discharging device for a silicon wafer multi-line cutting machine, the sliding mechanism serves as an intermediate to charge and discharge so as to greatly reduce the sliding of a crystal support; after the sliding block slides in advance to finish butt joint, the crystal support only needs to slid along the rail to avoid the defect of difficulty in positioning by adopting the crystal support in the prior art; meanwhile, the design of the positioning block causes positioning in the charging process to be simpler and more convenient; and the working efficiency of charging is improved.
Description
Technical field
The present invention relates to a kind of multi-line cutting machine, particularly a kind of multi-wire cutting machine for silicon wafer handling materials device that is suitable for high-place assembling material.
Background technology
Solar level cell silicon chip is by multi-line cutting machine, silico briquette or silicon rod cutting to be formed at present.As shown in Figure 1, existing multi-wire cutting machine for silicon wafer handling material frock, is comprised of two 100mm guide plates, crystal bar need to be arranged on after brilliant holder above, by crystalline substance holder, on guide plate, is slided and pushes station.When work-handling material, need two guide plate alignment, regulate difficulty large; Secondly because guide plate is too short, apart from the about 200mm of work stage, crystal bar, when handling, easily occurs that skew causes crystal bar collision or stuck; The 3rd, guide plate long term wear, can cause brilliant holder to push station generation and rock, the accident of more serious meeting generation crystal bar dislocation.
Summary of the invention
Goal of the invention: technical problem to be solved by this invention is for the deficiencies in the prior art, provides a kind of multi-wire cutting machine for silicon wafer handling materials device.
In order to solve the problems of the technologies described above, the invention discloses a kind of multi-wire cutting machine for silicon wafer handling materials device, comprise body, sliding shoe and positioning component;
Body bottom is provided with gathering sill, and sliding shoe is positioned at gathering sill and slides along gathering sill, and sliding shoe bottom is provided with blade fin;
Described positioning component is positioned at body top, comprises contiguous block, for the first locating piece of positional dissection gate and for locating the second locating piece of handling trolley support.By the first locating piece, the position after being convenient to cut gate and opening is fixed.By the design of the second locating piece, guarantee to load and unload trolley support and can accurately locate with this device in moving process, thereby solved location difficulty in prior art, the artificial defect of locating of charging location dependence, one-time positioning.
In the present invention, described sliding shoe two ends are provided with limited block, for anti-skidding piece, skid off gathering sill.
In the present invention, described contiguous block is between the first locating piece and the second locating piece.
In the present invention, described the first locating piece is provided with locating hole or locating slot.Certainly, in frame for movement, simple location structure has a variety of, at this, do not enumerate, but any simple location structure distortion, all based on thinking of the present invention.
In the present invention, described the second locating piece is provided with locating hole or locating slot.Certainly, in frame for movement, simple location structure has a variety of, at this, do not enumerate, but any simple location structure distortion, all based on thinking of the present invention.
The present invention is installed on multi-line cutting machine cutting chamber body top by contiguous block, when loading/unloading material, first cutting chamber Qianmen is opened, sliding shoe is pushed to cutting chamber, align with work stage pull bar, the brilliant holder of guiding silicon crystal bar enters work stage or pulls out from work stage, and then sliding shoe is pulled out, door is closed, complete handling material.
Beneficial effect: the present invention loads and unloads material by a slide mechanism as intermediate, thereby greatly reduced the slip of brilliant holder, slip in advance by sliding shoe completes after docking, brilliant holder is slided as long as press track, avoided prior art to utilize the difficult defect in brilliant holder location, made collision that crystal bar do not occur that when handling material skew causes and stuck; Adopt locating piece design to make the location simple and fast more in charging process simultaneously, improved the operating efficiency of charging.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is done further and illustrated, above-mentioned and/or otherwise advantage of the present invention will become apparent.
Fig. 1 is prior art structural representation.
Fig. 2 is schematic diagram one of the present invention.
Fig. 3 is schematic diagram two of the present invention.
Fig. 4 is schematic diagram three of the present invention.
Fig. 5 is schematic diagram four of the present invention.
Fig. 6 is schematic diagram five of the present invention.
Fig. 7 is schematic diagram six of the present invention.
The specific embodiment
As shown in Fig. 2, Fig. 4, Fig. 5 and Fig. 6, the invention discloses a kind of multi-wire cutting machine for silicon wafer handling materials device, comprise body 3, sliding shoe 32 and positioning component; Described body 3 belows are provided with gathering sill 38, and sliding shoe 32 is positioned at gathering sill 38 and slides along gathering sill, and sliding shoe has blade fin 33; Described positioning component is positioned at body top, comprises contiguous block 34, for the first locating piece 36 of positional dissection gate and for locating the second locating piece 39 of handling trolley support.Described sliding shoe two ends are provided with limited block 31.Described contiguous block 34, between the first locating piece and the second locating piece 39, will fill discharge component and machine tool frame (existing equipment, not shown) and be connected, and contiguous block can be arranged on the protruding support 35 of body.Described the first locating piece 36 is provided with locating hole.Described the second locating piece 39 is provided with locating slot.One side of body 3 is provided with location-plate 37, and its effect is that constraint sliding shoe 32 rotates.
As shown in Figure 1, original-pack discharging frock, comprising prior art: body (not shown), two blade fins, connection bracket.When handling material, need first alignment to be adjusted in two blade fin left and right that separate, adjust up and down alignment, then align with the adjustment of work stage pull bar.
Embodiment:
In the present embodiment, as shown in Figure 3, Figure 5 and Figure 6, the cutting gate 21 of cutting gate body 2 is opened, and is located pin 22 and inserts in the locating piece 36 with locating hole, and cutting gate 21 is fixing, and sliding shoe 32 is pushed to the station shown in Fig. 6.
As shown in Figure 3 and Figure 4, silicon crystal bar 4 is connected on glass plate by gluing, and glass plate is bonded in brilliant holder 7 again.The brilliant support of bonding crystal bar is entered to the upper excellent dolly with slide plate, dolly adopts hydraulic way lifting, dolly is elevated to certain altitude, then decline, the positioning head 5 that makes of dolly support 6 front ends is dropped in the locating piece 39 with locating slot, complete the crystalline substance holder 7 of dolly and aliging of blade fin in this device 33.
As shown in Figure 5, promote crystal bar, crystal bar, under the guiding of blade fin 33, enters brilliant support in work stage 1.Because blade fin 33 aligns with the pull bar 12 of work stage 1, therefore, brilliant holder 7 is just easy to enter in the V-type groove 11 of work stage 1.Finally cutting chamber door is closed, complete workpiece and load.
After having cut, the reversed in order of workpiece when unloading and loading.In brief, first cutting gate is opened, slide rail is pushed to the station at Fig. 6.With linking up with, crystal bar is drawn out to upper excellent dolly along slide rail slide plate, then dolly is elevated to and departs from locating piece 39, then pull-out, then decline, cutting gate is closed, complete workpiece unloading.
The invention provides a kind of thinking and method of multi-wire cutting machine for silicon wafer handling materials device; method and the approach of this technical scheme of specific implementation are a lot; the above is only the preferred embodiment of the present invention; should be understood that; for those skilled in the art; under the premise without departing from the principles of the invention, can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.In the present embodiment not clear and definite each part all available prior art realized.
Claims (5)
1. a multi-wire cutting machine for silicon wafer handling materials device, is characterized in that, comprises body, sliding shoe and positioning component; Body bottom is provided with gathering sill, and sliding shoe is positioned at gathering sill and slides along gathering sill, and sliding shoe bottom is provided with blade fin; Described positioning component is positioned at body top, comprises contiguous block, for the first locating piece of positional dissection gate and for locating the second locating piece of handling trolley support.
2. a kind of multi-wire cutting machine for silicon wafer handling materials device according to claim 1, is characterized in that, described sliding shoe two ends are provided with limited block.
3. a kind of multi-wire cutting machine for silicon wafer handling materials device according to claim 1 and 2, is characterized in that, described contiguous block is between the first locating piece and the second locating piece.
4. a kind of multi-wire cutting machine for silicon wafer handling materials device according to claim 1 and 2, is characterized in that, described the first locating piece is provided with locating hole or locating slot.
5. a kind of multi-wire cutting machine for silicon wafer handling materials device according to claim 1 and 2, is characterized in that, described the second locating piece is provided with locating hole or locating slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110394691.4A CN102501323B (en) | 2011-12-02 | 2011-12-02 | Charging and discharging device for silicon wafer multi-line cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110394691.4A CN102501323B (en) | 2011-12-02 | 2011-12-02 | Charging and discharging device for silicon wafer multi-line cutting machine |
Publications (2)
| Publication Number | Publication Date |
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| CN102501323A CN102501323A (en) | 2012-06-20 |
| CN102501323B true CN102501323B (en) | 2014-05-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110394691.4A Active CN102501323B (en) | 2011-12-02 | 2011-12-02 | Charging and discharging device for silicon wafer multi-line cutting machine |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103434035A (en) * | 2013-07-19 | 2013-12-11 | 江苏美科硅能源有限公司 | Crystal-bar removing tooling |
| CN104400923B (en) * | 2014-10-28 | 2016-08-24 | 江苏美科硅能源有限公司 | A kind of unload on MB type silicon chip cutter rod frock |
| CN106274035A (en) * | 2016-08-29 | 2017-01-04 | 江苏永能光伏科技有限公司 | A kind of position block |
| CN106938503A (en) * | 2017-03-17 | 2017-07-11 | 浙江好亚能源股份有限公司 | Crystal bar dicing method |
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| US4774759A (en) * | 1985-11-08 | 1988-10-04 | Matsushita Electric Industrial Co., Ltd. | Part inserting apparatus |
| US4779336A (en) * | 1986-10-22 | 1988-10-25 | Toyota Jidosha Kabushiki Kaisha | Part positioning apparatus associated with body assembly installation |
| CN201485069U (en) * | 2009-08-20 | 2010-05-26 | 大连远东工具有限公司 | Automatic loading and unloading mechanism |
| CN201616449U (en) * | 2010-01-25 | 2010-10-27 | 深圳市创益科技发展有限公司 | Positioning device of a substrate holder in automatic coating system |
| CN101941251A (en) * | 2010-09-11 | 2011-01-12 | 周金生 | Feeding structure for stone cutter |
| CN201784064U (en) * | 2010-11-02 | 2011-04-06 | 宇骏(潍坊)新能源科技有限公司 | Onboard fixture for loading and unloading |
| CN202318611U (en) * | 2011-12-02 | 2012-07-11 | 苏州协鑫光伏科技有限公司 | Loading and unloading device for multi-wire cutting machine for silicon wafer |
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2011
- 2011-12-02 CN CN201110394691.4A patent/CN102501323B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4774759A (en) * | 1985-11-08 | 1988-10-04 | Matsushita Electric Industrial Co., Ltd. | Part inserting apparatus |
| US4779336A (en) * | 1986-10-22 | 1988-10-25 | Toyota Jidosha Kabushiki Kaisha | Part positioning apparatus associated with body assembly installation |
| CN201485069U (en) * | 2009-08-20 | 2010-05-26 | 大连远东工具有限公司 | Automatic loading and unloading mechanism |
| CN201616449U (en) * | 2010-01-25 | 2010-10-27 | 深圳市创益科技发展有限公司 | Positioning device of a substrate holder in automatic coating system |
| CN101941251A (en) * | 2010-09-11 | 2011-01-12 | 周金生 | Feeding structure for stone cutter |
| CN201784064U (en) * | 2010-11-02 | 2011-04-06 | 宇骏(潍坊)新能源科技有限公司 | Onboard fixture for loading and unloading |
| CN202318611U (en) * | 2011-12-02 | 2012-07-11 | 苏州协鑫光伏科技有限公司 | Loading and unloading device for multi-wire cutting machine for silicon wafer |
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| CN102501323A (en) | 2012-06-20 |
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