CN102497741A - Treatment process for quickly manufacturing printed circuit board - Google Patents
Treatment process for quickly manufacturing printed circuit board Download PDFInfo
- Publication number
- CN102497741A CN102497741A CN2011104021338A CN201110402133A CN102497741A CN 102497741 A CN102497741 A CN 102497741A CN 2011104021338 A CN2011104021338 A CN 2011104021338A CN 201110402133 A CN201110402133 A CN 201110402133A CN 102497741 A CN102497741 A CN 102497741A
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- circuit board
- green oil
- printed circuit
- soldering
- printed
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Abstract
The invention discloses a manufacturing process for a printed circuit board. The manufacturing process mainly comprises the following steps of: 1, chemical tin plating, namely pre-treating an etched circuit board, impregnating the pre-treated circuit board in a tin plating solution for tin plating, flushing the tin-plated circuit board by using clear water, and drying the flushed circuit board; 2, manufacture of a green oil solder mask, namely attaching a photographic film on which a soldering-pan pattern is printed to the circuit board coated with green oil, and feeding the circuit board into an ultrasonic curing machine to cure the green oil solder mask; and 3, printing of component marks, namely printing component mark symbols on smooth heat transfer paper by using an ink-jet printer, and transferring the mark symbols on the circuit board. In such a way, the manufacturing process for the circuit board can be automatically operated in a laboratory, and is simple, convenient and quick.
Description
Technical field
The present invention relates to the electronic information integration field, particularly relate to a kind of manufacture craft of printed circuit board (PCB).
Background technology
Circuit board is the carrier of electronic circuit, and any circuit all need be installed in components and parts on the circuit board after designing could realize its function.Though and the process for manufacturing circuit board of specialty is very ripe; The technological process of specialty circuit board manufacturing is: draw, and----------------check--electroplates that----solidify--franking character--and solidify dryly, wherein photomechanical process and throwing web plate are complicacy, the most time taking steps in the whole flow process to print soldering-resistance layer to the holeization to the photochemistry figure transfer to the throwing web plate in boring in etching in blanking in photomechanical process.Design and produce in the laboratory in the circuit boards, a circuit board figure can only do one or two blocks of plates, and preferably can in one or two hours, finish.If each photomechanical process and do silk screen plate in the design process, one does not have so much time, and two come cost too high, therefore needs a kind of laboratory that is adapted at from line operate, simple and rapid process for manufacturing circuit board.
To above-mentioned situation; My researcher of company is on the basis of circuit board " hot transfer printing+etching " facture; Developed a cover and be fit to use in the laboratory, the circuit board post-process treatment technology efficiently that saves time, mainly comprised: chemical plating stannum, making green oil soldering-resistance layer, printing components and parts sign etc.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of treatment process of quick Fabrication printed circuit board (PCB), can quick Fabrication and handle printed circuit board (PCB).
For solving the problems of the technologies described above; The technical scheme that the present invention adopts is: the quick Fabrication technology that a kind of printed circuit board (PCB) is provided; Mainly comprise the steps: step 1, chemical plating stannum: after the circuit board after the etching is carried out preliminary treatment; Be immersed in the tin plating electrolyte zinc-plated, with flushing with clean water clean back oven dry; Step 2, making green oil soldering-resistance layer: the film plaster that will print pad figure is coating on the circuit board of green oil; Send into the curing of carrying out the green oil soldering-resistance layer in the uv cure machine; Step 3, print the components and parts sign: use ink-jet printer after on the light face heat-transferring printing paper components and parts marking pattern being printed, be transferred to graphic symbol on the circuit board.
What preferably, said step 1 chemical nickel plating was selected for use is the electroless plated technology of plating continuously.
Preferably, the curing of the green oil soldering-resistance layer in the said step 2 is divided into precuring and full solidification.
The invention has the beneficial effects as follows: the invention provides a kind of can be in the laboratory from line operate, simple and rapid process for manufacturing circuit board.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is set forth in detail, thereby protection scope of the present invention is made more explicit defining so that advantage of the present invention and characteristic can be easier to it will be appreciated by those skilled in the art that.
The embodiment of the invention comprises: step 1, chemical plating stannum: (1) preliminary treatment: the circuit face of circuit board after the etching is clean with fine sandpaper (or wet cloth is stained with cleanser) polishing, and measure big available pickling of words and alkali cleaning and handle.(2) plating: circuit board is immersed in the off-the-shelf tin plating electrolyte, slowly shakes pot, immersion plating can form the coating of light in tens minutes, and thickness of coating is relevant with the immersion plating time.(3) plated back taking-up and clean with flushing with clean water, the oven dry of reusable heat wind gets final product.
Step 2, making green oil soldering-resistance layer: pad figure is printed in (1): on transparent film, with printing of inkjet printer pad figure (only beating pad and plank frame).(2) be coated with green oil: circuit board is placed on below the silk screen of screen printing apparatus, picks an amount of green oil blade coating on silk screen, evenly be coated with the last layer green oil for following circuit board with scraper.(3) precuring: the ready transparent film of the first step is attached on the circuit board that coats green oil, covers a clean glass above again, and clip, send into precuring in the uv cure machine then with Small clamp.State of cure can not be too dark, and all the other local green oils that should control to except that pad just solidify, and the green oil of pad figure under covering can not solidify.(4) clean: the circuit board that precuring is intact takes out, and inspection speckles with machine solvent (alcohol, gasoline, net washing water etc.) with coarse cloth and cleans after confirming that state of cure is suitable, and the green oil that the pad place is uncured is wiped, exposed pad.(5) full solidification: will clean good circuit board and send into once more in the ultra-violet curing machine, and, make green oil soldering-resistance layer full solidification at a slow speed through (line speed is located at 2 grades).Can use the check of 6H pencil, it is qualified not drawing impression.
Step 3, print the components and parts sign: use ink-jet printer after on the light face heat-transferring printing paper components and parts marking pattern being printed, be transferred to graphic symbol on the circuit board.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (3)
1. the manufacture craft of a printed circuit board (PCB) is characterized in that, comprising: step 1: chemical plating stannum: after the circuit board after the etching is carried out preliminary treatment, be immersed in the tin plating electrolyte zinc-plated, with flushing with clean water clean back oven dry; Step 2: make the green oil soldering-resistance layer: the film plaster that will print pad figure is coating on the circuit board of green oil; Send into the curing of carrying out the green oil soldering-resistance layer in the uv cure machine; Step 3: print the components and parts sign: use ink-jet printer after on the light face heat-transferring printing paper components and parts marking pattern being printed, be transferred to graphic symbol on the circuit board.
2. the manufacture craft of printed circuit board (PCB) according to claim 1 is characterized in that, what said step 1 chemical nickel plating was selected for use is the electroless plated technology of plating continuously.
3. the manufacture craft of printed circuit board (PCB) according to claim 1 is characterized in that, the curing of the green oil soldering-resistance layer in the said step 2 is divided into precuring and full solidification.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104021338A CN102497741A (en) | 2011-12-07 | 2011-12-07 | Treatment process for quickly manufacturing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104021338A CN102497741A (en) | 2011-12-07 | 2011-12-07 | Treatment process for quickly manufacturing printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102497741A true CN102497741A (en) | 2012-06-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104021338A Pending CN102497741A (en) | 2011-12-07 | 2011-12-07 | Treatment process for quickly manufacturing printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102497741A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883546A (en) * | 2012-09-19 | 2013-01-16 | 胜宏科技（惠州）股份有限公司 | Thick copper plate solder resistance process |
| CN103660652A (en) * | 2012-09-04 | 2014-03-26 | 深南电路有限公司 | Silk screen printing technology for printed circuit board |
| CN108116031A (en) * | 2017-12-29 | 2018-06-05 | 东莞市合鼎电路有限公司 | A kind of wiring board text printout method |
-
2011
- 2011-12-07 CN CN2011104021338A patent/CN102497741A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103660652A (en) * | 2012-09-04 | 2014-03-26 | 深南电路有限公司 | Silk screen printing technology for printed circuit board |
| CN103660652B (en) * | 2012-09-04 | 2016-04-06 | 深南电路有限公司 | For the silk-screen printing technique of printed circuit board (PCB) |
| CN102883546A (en) * | 2012-09-19 | 2013-01-16 | 胜宏科技（惠州）股份有限公司 | Thick copper plate solder resistance process |
| CN102883546B (en) * | 2012-09-19 | 2016-01-20 | 胜宏科技（惠州）股份有限公司 | A kind of thick copper plate solder resistance technique |
| CN108116031A (en) * | 2017-12-29 | 2018-06-05 | 东莞市合鼎电路有限公司 | A kind of wiring board text printout method |
| CN108116031B (en) * | 2017-12-29 | 2021-07-06 | 东莞市合鼎电路有限公司 | Circuit board character printing method |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120613 |