CN102485426A - 一种研磨垫修整器及研磨垫修整方法 - Google Patents
一种研磨垫修整器及研磨垫修整方法 Download PDFInfo
- Publication number
- CN102485426A CN102485426A CN2010105736121A CN201010573612A CN102485426A CN 102485426 A CN102485426 A CN 102485426A CN 2010105736121 A CN2010105736121 A CN 2010105736121A CN 201010573612 A CN201010573612 A CN 201010573612A CN 102485426 A CN102485426 A CN 102485426A
- Authority
- CN
- China
- Prior art keywords
- grinding pad
- grinding
- finishing
- finishing head
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Description
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010105736121A CN102485426A (zh) | 2010-12-03 | 2010-12-03 | 一种研磨垫修整器及研磨垫修整方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010105736121A CN102485426A (zh) | 2010-12-03 | 2010-12-03 | 一种研磨垫修整器及研磨垫修整方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102485426A true CN102485426A (zh) | 2012-06-06 |
Family
ID=46151020
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010105736121A Pending CN102485426A (zh) | 2010-12-03 | 2010-12-03 | 一种研磨垫修整器及研磨垫修整方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102485426A (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104175224A (zh) * | 2014-08-26 | 2014-12-03 | 上海华力微电子有限公司 | 化学机械研磨之研磨垫的清洗装置及其方法 |
CN105234823A (zh) * | 2015-10-27 | 2016-01-13 | 上海华力微电子有限公司 | 研磨液供给及研磨垫整理装置、研磨机台 |
CN106041741A (zh) * | 2016-06-21 | 2016-10-26 | 大连理工大学 | 一种含有多孔结构的cmp抛光垫修整器 |
CN106078516A (zh) * | 2016-06-21 | 2016-11-09 | 大连理工大学 | 一种新型cmp抛光垫修整器 |
CN108500843A (zh) * | 2018-04-04 | 2018-09-07 | 河南科技学院 | 一种用于固结磨料研抛垫的磨料射流自适应修整方法 |
WO2020062581A1 (zh) * | 2018-09-25 | 2020-04-02 | 重庆陈氏清洁服务有限公司 | 高压气液研磨装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5679063A (en) * | 1995-01-24 | 1997-10-21 | Ebara Corporation | Polishing apparatus |
US6004193A (en) * | 1997-07-17 | 1999-12-21 | Lsi Logic Corporation | Dual purpose retaining ring and polishing pad conditioner |
CN1402313A (zh) * | 2001-08-02 | 2003-03-12 | 联华电子股份有限公司 | 研磨垫片恢复器的结构及其应用 |
CN1947945A (zh) * | 2005-10-14 | 2007-04-18 | 联华电子股份有限公司 | 化学机械抛光装置及其抛光垫的清洗方法与平坦化的方法 |
US20080032609A1 (en) * | 2006-03-08 | 2008-02-07 | Benedict Jeffrey H | Apparatus for reducing contaminants from a chemical mechanical polishing pad |
-
2010
- 2010-12-03 CN CN2010105736121A patent/CN102485426A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5679063A (en) * | 1995-01-24 | 1997-10-21 | Ebara Corporation | Polishing apparatus |
US6004193A (en) * | 1997-07-17 | 1999-12-21 | Lsi Logic Corporation | Dual purpose retaining ring and polishing pad conditioner |
CN1402313A (zh) * | 2001-08-02 | 2003-03-12 | 联华电子股份有限公司 | 研磨垫片恢复器的结构及其应用 |
CN1947945A (zh) * | 2005-10-14 | 2007-04-18 | 联华电子股份有限公司 | 化学机械抛光装置及其抛光垫的清洗方法与平坦化的方法 |
US20080032609A1 (en) * | 2006-03-08 | 2008-02-07 | Benedict Jeffrey H | Apparatus for reducing contaminants from a chemical mechanical polishing pad |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104175224A (zh) * | 2014-08-26 | 2014-12-03 | 上海华力微电子有限公司 | 化学机械研磨之研磨垫的清洗装置及其方法 |
CN105234823A (zh) * | 2015-10-27 | 2016-01-13 | 上海华力微电子有限公司 | 研磨液供给及研磨垫整理装置、研磨机台 |
CN105234823B (zh) * | 2015-10-27 | 2017-09-29 | 上海华力微电子有限公司 | 研磨液供给及研磨垫整理装置、研磨机台 |
CN106041741A (zh) * | 2016-06-21 | 2016-10-26 | 大连理工大学 | 一种含有多孔结构的cmp抛光垫修整器 |
CN106078516A (zh) * | 2016-06-21 | 2016-11-09 | 大连理工大学 | 一种新型cmp抛光垫修整器 |
CN108500843A (zh) * | 2018-04-04 | 2018-09-07 | 河南科技学院 | 一种用于固结磨料研抛垫的磨料射流自适应修整方法 |
WO2020062581A1 (zh) * | 2018-09-25 | 2020-04-02 | 重庆陈氏清洁服务有限公司 | 高压气液研磨装置 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN205021392U (zh) | 用于基板抛光的装置 | |
CN102485426A (zh) | 一种研磨垫修整器及研磨垫修整方法 | |
US9138861B2 (en) | CMP pad cleaning apparatus | |
CN105538110B (zh) | 一种用于基片加工的研磨与抛光两用柔性加工装置 | |
CN204658194U (zh) | 一种清洗装置 | |
CN206445670U (zh) | 一种圆环不锈钢零件的化学机械抛光设备 | |
CN103522191A (zh) | 应用在晶圆化学机械平坦化设备中的抛光垫修整装置 | |
CN201913543U (zh) | 一种化学机械研磨设备 | |
CN105081957A (zh) | 一种用于晶圆平坦化生产的化学机械研磨方法 | |
CN105234823B (zh) | 研磨液供给及研磨垫整理装置、研磨机台 | |
CN103878680B (zh) | 降低晶圆被刮伤的方法、化学机械研磨机台及清洗器 | |
CN103878678A (zh) | 一种晶圆研磨抛光方法 | |
CN103878688B (zh) | 一种研磨垫清扫装置 | |
CN105583720A (zh) | SiC基板的研磨方法 | |
CN103273414A (zh) | 化学机械研磨装置及其方法 | |
CN206464992U (zh) | 化学机械抛光工艺抛光垫的修整器 | |
CN201998046U (zh) | 一种化学机械研磨设备 | |
TWI556912B (zh) | 高品質磨料之化學機械研磨修整器 | |
CN204149007U (zh) | 一种研磨垫调整器 | |
CN201046545Y (zh) | 研磨液清洗装置 | |
CN202200170U (zh) | 研磨头及化学机械研磨设备 | |
CN205271740U (zh) | 研磨垫修整器及研磨装置 | |
CN105500208A (zh) | Cmp工艺抛光垫的修整装置 | |
CN205363592U (zh) | Cmp工艺抛光垫的修整装置 | |
CN102339742A (zh) | 多晶硅化学机械研磨工艺的研磨垫预研磨方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130619 Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHA Effective date: 20130619 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20130619 Address after: 100176 No. 18 Wenchang Avenue, Beijing economic and Technological Development Zone Applicant after: Semiconductor Manufacturing International (Beijing) Corporation Applicant after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 No. 18 Zhangjiang Road, Shanghai Applicant before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
C12 | Rejection of a patent application after its publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120606 |