CN201998046U - 一种化学机械研磨设备 - Google Patents
一种化学机械研磨设备 Download PDFInfo
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- CN201998046U CN201998046U CN2010206741724U CN201020674172U CN201998046U CN 201998046 U CN201998046 U CN 201998046U CN 2010206741724 U CN2010206741724 U CN 2010206741724U CN 201020674172 U CN201020674172 U CN 201020674172U CN 201998046 U CN201998046 U CN 201998046U
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- grinding
- grinding pad
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- pad
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- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
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CN2010206741724U CN201998046U (zh) | 2010-12-21 | 2010-12-21 | 一种化学机械研磨设备 |
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CN2010206741724U CN201998046U (zh) | 2010-12-21 | 2010-12-21 | 一种化学机械研磨设备 |
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CN201998046U true CN201998046U (zh) | 2011-10-05 |
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CN2010206741724U Expired - Lifetime CN201998046U (zh) | 2010-12-21 | 2010-12-21 | 一种化学机械研磨设备 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103144040A (zh) * | 2013-03-15 | 2013-06-12 | 上海华力微电子有限公司 | 化学机械研磨设备 |
CN104742008A (zh) * | 2013-12-27 | 2015-07-01 | 中芯国际集成电路制造(上海)有限公司 | 化学机械研磨方法及化学机械研磨装置 |
CN109311136A (zh) * | 2016-04-04 | 2019-02-05 | 菲尔罗伯蒂克斯顺从式机器人技术有限公司 | 用于自动更换磨削件的更换站 |
CN112440203A (zh) * | 2019-09-03 | 2021-03-05 | 芯恩(青岛)集成电路有限公司 | 一种晶圆研磨***和晶圆研磨方法 |
-
2010
- 2010-12-21 CN CN2010206741724U patent/CN201998046U/zh not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103144040A (zh) * | 2013-03-15 | 2013-06-12 | 上海华力微电子有限公司 | 化学机械研磨设备 |
CN104742008A (zh) * | 2013-12-27 | 2015-07-01 | 中芯国际集成电路制造(上海)有限公司 | 化学机械研磨方法及化学机械研磨装置 |
CN104742008B (zh) * | 2013-12-27 | 2017-03-22 | 中芯国际集成电路制造(上海)有限公司 | 化学机械研磨方法及化学机械研磨装置 |
CN109311136A (zh) * | 2016-04-04 | 2019-02-05 | 菲尔罗伯蒂克斯顺从式机器人技术有限公司 | 用于自动更换磨削件的更换站 |
CN112440203A (zh) * | 2019-09-03 | 2021-03-05 | 芯恩(青岛)集成电路有限公司 | 一种晶圆研磨***和晶圆研磨方法 |
CN112440203B (zh) * | 2019-09-03 | 2022-04-05 | 芯恩(青岛)集成电路有限公司 | 一种晶圆研磨***和晶圆研磨方法 |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130326 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
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TR01 | Transfer of patent right |
Effective date of registration: 20130326 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
CX01 | Expiry of patent term |
Granted publication date: 20111005 |
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CX01 | Expiry of patent term |