CN102485358A - Wafer cleaning device and method - Google Patents
Wafer cleaning device and method Download PDFInfo
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- CN102485358A CN102485358A CN2010105736210A CN201010573621A CN102485358A CN 102485358 A CN102485358 A CN 102485358A CN 2010105736210 A CN2010105736210 A CN 2010105736210A CN 201010573621 A CN201010573621 A CN 201010573621A CN 102485358 A CN102485358 A CN 102485358A
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Abstract
The invention provides a wafer cleaning device which comprises a cleaning trough, a wafer rotating device, a spray tube and a cleaning mechanism, wherein the wafer rotating device is configured in the cleaning trough and used to fix and drive a wafer to be cleaned to rotate; the spray tube comprises a plurality of nozzles and is configured in the cleaning trough and positioned above the wafer to be cleaned; the cleaning mechanism is positioned on the side of the wafer to be cleaned and comprises a loading mechanism and cleaning brushes; and the loading mechanism is provided with at least two cleaning brushes, and the cleaning brushes can alternately clean the wafer to be cleaned. The wafer cleaning device provided by the invention can realize multi-channel cleaning technical mode, namely that a plurality of cleaning brushes can be arranged in one cleaning device, and the cleaning brushes alternately clean the wafer in the cleaning process, thus under the condition of not affecting the cleaning process, the wafer to be cleaned can be brushed and washed and the cleaning brushes can be cleaned. Therefore, the cleaning effect of the cleaning brushes can be increased, the working efficiency can be increased, and the service life of the cleaning brushes can be prolonged.
Description
Technical field
The present invention relates to a kind of semiconductor fabrication process, relate in particular to a kind of wafer cleaning device and method thereof.
Background technology
Chemically mechanical polishing (Chemical Mechanical Polishing; CMP) technology is the technology of mechanical skiving and chemical attack combination; Chemical Mechanical Polishing Technique forms bright and clean smooth plane by the chemical attack effect of ultramicronized abrasive action and slurry on polished dielectric surface.Chemical Mechanical Polishing Technique is the product of integrated circuit (IC) to granular, multiple stratification, slimming, flatening process development; Become the mainstream technology of semiconductor manufacturing, also be wafer to 200mm, 300mm and even bigger diameter excessively, enhance productivity, reduce manufacturing cost and the indispensable technology of substrate globalize planarization.Chemical Mechanical Polishing Technique has become the maincenter technology of semiconductor fabrication process.
A complete CMP process mainly is made up of operations such as polishing, back cleaning and measurements.Wherein the back is cleaned and to be comprised and the cleaning to wafer also comprise the cleaning to each parts of cmp polissoir.The main purpose that the back is cleaned is to be reduced to acceptable level to the residual residual particles of CMP process with staining.At present after metal or medium are carried out chemically mechanical polishing; Residual on the wafer have a large amount of residues; Comprise that polishing fluid in the polishing process (contains less abrasive grains in the said polishing fluid; Diameter is 0.1 to 1.0 micron or bigger scope), and the metal of crystal column surface or other particle residue things.When being exposed in the air, these residues can crystallization become big.Residue can pollute the polished wafer of next group: the particle of growing up in the residue is directly stained or the scratch wafer; If residue can not get timely cleaning; Along with the increase of polishing number of times, residue can accumulate gradually and propagate, thereby causes the cross pollution of wafer.Device yield is produced great side effect.So residue on the said wafer after the effective cleaning chemistry machine glazed finish of needs.
Fig. 1 is the structural representation of wafer cleaning device in the prior art.Fig. 2 is another structural representation of wafer cleaning device in the prior art.Please combine illustrated in figures 1 and 2, in the prior art after the chemically mechanical polishing cleaning device of wafer comprise rinse bath 12, be disposed at jet pipe 16, cleaning brush 20 and wafer tumbler 14 in the rinse bath 12; After polishing process finishes; Wafer 10 to be cleaned is fixed on the said wafer tumbler 14, and cleaning brush 20 is pressed close to wafer 10 to be cleaned, scrubs the front and back of said wafer to be cleaned 10; Simultaneously; Jet pipe 16 removes cleaning fluid or ionized water to crystal column surface spray to be cleaned, removes the impurity on wafer to be cleaned 10 surfaces, thereby reaches the purpose of thorough cleaning.
Then, in the prior art, because cleaning equipment uses for a long time, have following problem and occur: the long-time use speckles with dirt on cleaning brush 20; For example comprise organic residue, surface particles, dirt rests on the cleaning brush, under the situation of continuous operation; Cleaning brush 20 can not get cleaning timely, or the cleaning of cleaning brush is limited, will form scratch on wafer to be cleaned 10 surfaces; Influence the quality of wafer, if stop to clean, changing cleaning brush 20 can influence operating efficiency again.
Summary of the invention
The technical problem that the present invention will solve is, provides a kind of and can be used alternatingly cleaning brush, and the wafer cleaning device that can clean automatically the cleaning brush of not working.
For addressing the above problem, the present invention provides a kind of wafer cleaning device and method thereof.
Said wafer cleaning device comprises: rinse bath; The wafer tumbler is disposed in the said rinse bath, is used for fixing and drives wafer to be cleaned to rotate; Jet pipe comprises a plurality of shower nozzles, is disposed in the said rinse bath, is positioned at the top of said wafer to be cleaned; Wiper mechanism is positioned at said wafer to be cleaned side, and said wiper mechanism comprises load carrier and cleaning brush, and said load carrier is provided with at least two cleaning brush, and said cleaning brush can alternately be scrubbed said wafer to be cleaned.
Further, to said wafer cleaning device, said load carrier is provided with motion, and said motion can drive said load carrier and rotate and move.
Further, to said wafer cleaning device, said wiper mechanism also comprises a plurality of cleaning brush nozzles, and said cleaning brush nozzle is positioned at by the said cleaning brush.
Further, to said wafer cleaning device, said load carrier comprises at least two, lays respectively at the both sides of said wafer to be cleaned.
Further, to said wafer cleaning device, each said load carrier is provided with at least two cleaning brush, is positioned at that cleaning brush can be used alternatingly on the same load carrier.
To said cleaning method, may further comprise the steps: said wafer to be cleaned is written in the said rinse bath, and said wafer tumbler is fixed said wafer to be cleaned; Said wafer tumbler drives said wafer to be cleaned and rotates, and said jet pipe ejects on cleaning fluid or deionized water to the said crystal column surface to be cleaned; Said cleaning brush is alternately scrubbed said wafer to be cleaned.
Further, to said cleaning method, said load carrier is provided with motion, and said motion can drive said load carrier and rotate and move, make on the said load carrier cleaning brush alternately near and scrub said wafer to be cleaned.
Further, to said cleaning method, said wiper mechanism also comprises a plurality of cleaning brush nozzles, and said cleaning brush nozzle is positioned at by the said cleaning brush, and when cleaning brush was not scrubbed said wafer to be cleaned, said cleaning brush nozzle was to said cleaning brush jet cleaning liquid.
Further, to said cleaning method, said load carrier comprises at least two, lays respectively at the both sides of said wafer to be cleaned.
Further, to said cleaning method, each said load carrier is provided with at least two cleaning brush, is positioned at that cleaning brush can be used alternatingly on the same load carrier.
The present invention also provides the cleaning method of said wafer cleaning device,
In sum, wafer cleaning device according to the invention can be realized multiple cleaning procedure pattern, and a plurality of cleaning brush can be set in same cleaning device; Under the situation that does not influence cleaning process; Can scrub wafer to be cleaned simultaneously, carry out cleaning again, thereby both improve the cleaning effect of cleaning brush cleaning brush self; Increase work efficiency, prolonged the service life of cleaning brush again.
Description of drawings
Fig. 1 is the structural representation of wafer cleaning device in the prior art.
Fig. 2 is another structural representation of wafer cleaning device in the prior art.
Fig. 3 is the structural representation of wafer cleaning device one embodiment of the present invention.
Fig. 4 is another structural representation of wafer cleaning device one embodiment of the present invention.
The specific embodiment
For making content of the present invention clear more understandable,, content of the present invention was done a step explanation below in conjunction with Figure of description.Certainly the present invention is not limited to this specific embodiment, and the general replacement that those skilled in the art knew also is encompassed in protection scope of the present invention.
Secondly, the present invention utilizes sketch map to carry out detailed statement, and when instance of the present invention was detailed, for the ease of explanation, sketch map did not amplify according to general ratio is local, should be with this as to qualification of the present invention.
Fig. 3 is the structural representation of wafer cleaning device one embodiment of the present invention.As shown in Figure 3, the present invention provides a kind of wafer cleaning device, comprising:
Rinse bath 108,108 are used to place wafer 100 to be cleaned and dispose other wiper mechanisms in the said rinse bath;
Further; Said load carrier 204 is provided with motion 206; Said motion 206 can drive said load carrier 204 and rotate and move, and said motion 206 can switch the cleaning brush 202 of the work of scrubbing when rotating, and can adjust the distance on cleaning brush 202 and wafer to be cleaned 100 surfaces when laterally moving; Thereby reach best cleaning performance, and avoid damaging the surface of wafer 100 to be cleaned.
Further; To said wafer cleaning device; Said wiper mechanism also comprises a plurality of cleaning brush nozzles 208, and said cleaning brush nozzle 208 is positioned at by the said cleaning brush, when a certain cleaning brush 202 is scrubbed work; Activation pin is to this cleaning brush nozzle 208, and the ejection cleaning fluid is scrubbed this cleaning brush.
To said cleaning method, may further comprise the steps: said wafer 100 to be cleaned is written in the said rinse bath 108 said wafer tumbler 104 fixing said wafers 100 to be cleaned; Said wafer tumbler 104 drives said wafer to be cleaned 100 and rotates, and said jet pipe 106 ejects on cleaning fluid or deionized water to said wafer to be cleaned 100 surfaces as required; Said cleaning brush 202 is alternately scrubbed said wafer to be cleaned 100.The technology pattern that cleans can have multiple choices; For example; Normal mode: be written into first wafer to be cleaned and utilize A-A group cleaning brush to scrub, then be written into second wafer to be cleaned and utilize B-B group cleaning brush to scrub, cleaning brush 202 is alternately scrubbed wafer 100 to be cleaned by that analogy; Another kind of is the multiple tracks cleaning mode: each wafer to be cleaned carries out a plurality of cleaning processes; As utilize A-A group cleaning brush agitation wafer tentatively to clean; Utilizing B-B group cleaning brush agitation wafer to carry out chemical cleaning solution scrubs; Utilize C-C group cleaning brush agitation wafer to carry out washed with de-ionized water, the purpose that the realization cleaning brush is alternately scrubbed the band cleaning wafer.
Wherein, Motion 206 on the said load carrier 204 can drive said load carrier 204 and rotate and move; Said motion 206 can switch the cleaning brush 202 of the work of scrubbing when rotating; Can adjust the distance on cleaning brush 202 and wafer to be cleaned 100 surfaces when laterally moving, thereby reach best cleaning performance, and avoid damaging the surface of wafer 100 to be cleaned.
Wherein, Each said cleaning brush 202 side all is provided with some said cleaning brush nozzles 208, and when a certain cleaning brush 202 was scrubbed work, activation pin was to the cleaning brush nozzle 208 of this cleaning brush 202; The ejection cleaning fluid cleans this cleaning brush 202; The cleaning brush of not working is turned to the surface away from wafer 100 to be cleaned, and the direction of said cleaning brush mouth spray 208 ejaculation cleaning fluids or deionized water is crystal column surface dorsad, thereby avoids polluting wafer 100 to be cleaned.
Fig. 4 is another structural representation of wafer cleaning device one embodiment of the present invention.Please combine Fig. 3 and Fig. 4; In the present embodiment, said wafer wiper mechanism comprises two load carriers 204, lays respectively at the front and back of said wafer to be cleaned 100; Each load carrier 204 is provided with three cleaning brush A, B, C; After wafer 100 to be cleaned is written into and is fixed on wafer tumbler 104, be arranged at motion 206 on the load carrier 204 and rotate cleaning brush 202 and make one of them (for example cleaning brush A among Fig. 3) aim at wafer to begin to scrub wafer, said wafer 100 to be cleaned be that axle rotates along self center vertical line; Cleaning brush thoroughly cleans wafer 100 to be cleaned along self axle center rotation.Other cleaning brush of not working 202 (for example cleaning brush B, the C among Fig. 3) open then that corresponding cleaning brush nozzle 208 cleans should correspondence cleaning brush 202; After scrubbing a period of time; Rotating mechanism 206 drives said cleaning brush 202 and rotates; Reversing of position, another cleaning brush (the for example cleaning brush B among Fig. 4) begins the work of scrubbing.Three pairs of cleaning brush 202 among the figure three can be used alternatingly, and scrub the cleaning brush A-A of work, B-B, and A-C, multiple combination such as B-C is placed.Two or three above cleaning brush 202 are also in the thought range of invention in addition.
In sum, wafer cleaning device according to the invention can be realized multiple cleaning procedure pattern, and a plurality of cleaning brush can be set in same cleaning device; Under the situation that does not influence cleaning process; Can scrub wafer to be cleaned simultaneously, carry out cleaning again, thereby both improve the cleaning effect of cleaning brush cleaning brush self; Increase work efficiency, prolonged the service life of cleaning brush again.
Though the present invention discloses as above with preferred embodiment; Right its is not in order to limit the present invention; Has common knowledge the knowledgeable in the technical field under any; Do not breaking away from the spirit and scope of the present invention, when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking claims person of defining.
Claims (10)
1. a wafer cleaning device is characterized in that, comprises
Rinse bath;
The wafer tumbler is disposed in the said rinse bath, is used for fixing and drives wafer to be cleaned to rotate;
Jet pipe comprises a plurality of shower nozzles, is disposed in the said rinse bath, is positioned at the top of said wafer to be cleaned;
Wiper mechanism is positioned at said wafer to be cleaned side, and said wiper mechanism comprises load carrier and cleaning brush, and said load carrier is provided with at least two cleaning brush, and said cleaning brush can alternately be scrubbed said wafer to be cleaned.
2. wafer cleaning device as claimed in claim 1 is characterized in that said load carrier is provided with motion, and said motion can drive said load carrier and rotate and move.
3. wafer cleaning device as claimed in claim 1 is characterized in that, said wiper mechanism also comprises a plurality of cleaning brush nozzles, and said cleaning brush nozzle is positioned at by the said cleaning brush.
4. wafer cleaning device as claimed in claim 1 is characterized in that said load carrier comprises at least two, lays respectively at the both sides of said wafer to be cleaned.
5. wafer cleaning device as claimed in claim 4 is characterized in that, each said load carrier is provided with at least two cleaning brush, is positioned at that cleaning brush can be used alternatingly on the same load carrier.
6. the cleaning method of wafer cleaning device as claimed in claim 1 is characterized in that, may further comprise the steps:
Said wafer to be cleaned is written in the said rinse bath, and said wafer tumbler is fixed said wafer to be cleaned;
Said wafer tumbler drives said wafer to be cleaned and rotates, and said jet pipe ejects on cleaning fluid or deionized water to the said crystal column surface to be cleaned;
Said cleaning brush is alternately scrubbed said wafer to be cleaned.
7. cleaning method as claimed in claim 6; It is characterized in that; Said load carrier is provided with motion, and said motion can drive said load carrier and rotate and move, make on the said load carrier cleaning brush alternately near and scrub said wafer to be cleaned.
8. cleaning method as claimed in claim 6; It is characterized in that said wiper mechanism also comprises a plurality of cleaning brush nozzles, said cleaning brush nozzle is positioned at by the said cleaning brush; When cleaning brush was not scrubbed said wafer to be cleaned, said cleaning brush nozzle was to said cleaning brush jet cleaning liquid.
9. cleaning method as claimed in claim 6 is characterized in that said load carrier comprises at least two, lays respectively at the both sides of said wafer to be cleaned.
10. cleaning method as claimed in claim 9 is characterized in that, each said load carrier is provided with at least two cleaning brush, is positioned at that cleaning brush can be used alternatingly on the same load carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105736210A CN102485358A (en) | 2010-12-03 | 2010-12-03 | Wafer cleaning device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105736210A CN102485358A (en) | 2010-12-03 | 2010-12-03 | Wafer cleaning device and method |
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| CN102485358A true CN102485358A (en) | 2012-06-06 |
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| CN2010105736210A Pending CN102485358A (en) | 2010-12-03 | 2010-12-03 | Wafer cleaning device and method |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106944381A (en) * | 2016-01-06 | 2017-07-14 | 中芯国际集成电路制造(上海)有限公司 | Wafer cleaning device and its cleaning method |
| CN108428623A (en) * | 2018-04-09 | 2018-08-21 | 上海华虹宏力半导体制造有限公司 | Semiconductor device fabrication method |
| CN109201547A (en) * | 2017-06-30 | 2019-01-15 | 中电海康集团有限公司 | Wafer cleaning device |
| CN109887865A (en) * | 2019-03-07 | 2019-06-14 | 上海华力微电子有限公司 | A kind of wafer cleaning drying device, method and work-table of chemicomechanical grinding mill |
| CN111146116A (en) * | 2019-11-28 | 2020-05-12 | 华海清科股份有限公司 | Wafer cleaning method and wafer post-processing device |
| CN111341699A (en) * | 2020-03-09 | 2020-06-26 | 杭州众硅电子科技有限公司 | Cleaning brush precleaning system |
| CN111389772A (en) * | 2020-03-24 | 2020-07-10 | 长江存储科技有限责任公司 | Cleaning device and cleaning method |
| CN111755319A (en) * | 2019-03-29 | 2020-10-09 | 中芯集成电路（宁波）有限公司 | Wafer cleaning method and photoresist patterning method |
| CN111889437A (en) * | 2020-08-27 | 2020-11-06 | 江苏无恙半导体科技有限公司 | Wafer cleaning machine |
| CN113118100A (en) * | 2019-12-31 | 2021-07-16 | 清华大学 | Wafer cleaning device and cleaning method |
| CN113118951A (en) * | 2019-12-31 | 2021-07-16 | 清华大学 | Cavitation jet nozzle and wafer processing device with same |
| CN117445563A (en) * | 2023-12-22 | 2024-01-26 | 恒科科技产业有限公司 | Printing equipment diagnosis device and method |
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Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106944381A (en) * | 2016-01-06 | 2017-07-14 | 中芯国际集成电路制造(上海)有限公司 | Wafer cleaning device and its cleaning method |
| CN109201547A (en) * | 2017-06-30 | 2019-01-15 | 中电海康集团有限公司 | Wafer cleaning device |
| CN108428623B (en) * | 2018-04-09 | 2020-07-31 | 上海华虹宏力半导体制造有限公司 | Semiconductor device processing method |
| CN108428623A (en) * | 2018-04-09 | 2018-08-21 | 上海华虹宏力半导体制造有限公司 | Semiconductor device fabrication method |
| CN109887865A (en) * | 2019-03-07 | 2019-06-14 | 上海华力微电子有限公司 | A kind of wafer cleaning drying device, method and work-table of chemicomechanical grinding mill |
| CN109887865B (en) * | 2019-03-07 | 2021-08-20 | 上海华力微电子有限公司 | Wafer cleaning and drying device and method and chemical mechanical polishing machine |
| CN111755319A (en) * | 2019-03-29 | 2020-10-09 | 中芯集成电路（宁波）有限公司 | Wafer cleaning method and photoresist patterning method |
| CN111146116A (en) * | 2019-11-28 | 2020-05-12 | 华海清科股份有限公司 | Wafer cleaning method and wafer post-processing device |
| CN113118100A (en) * | 2019-12-31 | 2021-07-16 | 清华大学 | Wafer cleaning device and cleaning method |
| CN113118951A (en) * | 2019-12-31 | 2021-07-16 | 清华大学 | Cavitation jet nozzle and wafer processing device with same |
| CN113118100B (en) * | 2019-12-31 | 2022-09-06 | 清华大学 | Wafer cleaning device and cleaning method |
| CN111341699A (en) * | 2020-03-09 | 2020-06-26 | 杭州众硅电子科技有限公司 | Cleaning brush precleaning system |
| CN111341699B (en) * | 2020-03-09 | 2023-03-31 | 杭州众硅电子科技有限公司 | Cleaning brush precleaning system |
| CN111389772A (en) * | 2020-03-24 | 2020-07-10 | 长江存储科技有限责任公司 | Cleaning device and cleaning method |
| CN111889437A (en) * | 2020-08-27 | 2020-11-06 | 江苏无恙半导体科技有限公司 | Wafer cleaning machine |
| CN117445563A (en) * | 2023-12-22 | 2024-01-26 | 恒科科技产业有限公司 | Printing equipment diagnosis device and method |
| CN117445563B (en) * | 2023-12-22 | 2024-03-05 | 恒科科技产业有限公司 | Printing equipment diagnosis device and method |
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