CN102418001A - Bonding gold wire and preparation method thereof - Google Patents
Bonding gold wire and preparation method thereof Download PDFInfo
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- CN102418001A CN102418001A CN2011103625326A CN201110362532A CN102418001A CN 102418001 A CN102418001 A CN 102418001A CN 2011103625326 A CN2011103625326 A CN 2011103625326A CN 201110362532 A CN201110362532 A CN 201110362532A CN 102418001 A CN102418001 A CN 102418001A
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- gold wire
- bonding gold
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- wire
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
Abstract
The invention relates to a packaging material industry which is a sub-industry belonging to an electronic packaging bonding industry, and discloses a bonding gold wire. The bonding gold wire comprises Ag and one or more of Ca, Pd, Cu, In, Sn, Ni, Sc and Ce, wherein the weight percentage of Ag in the bonding gold wire is in a range of 10 to 25%. Compared with the existing bonding gold wire, the bonding gold wire provided by the invention has lower production and use costs, wherein the use cost of the bonding gold wire provided by the invention is about 40 to 50% of that of the existing bonding gold wire, has higher strength and elongation, and has better packaging impact force resistance and packaging material thermal expansion force resistance. The invention also provides a preparation method of the bonding gold wire. The preparation method has simple processes and good production feasibility. The bonding gold wire can be prepared by traditional bonding wire material production equipment without improvement and investment of novel equipment.
Description
Technical field
The invention belongs to the affiliated sub-industry of Electronic Packaging bonding industry: packaged material category technical field is specifically related to a kind of bonding gold wire and preparation method thereof.
Background technology
The tradition bonding gold wire is to be prepared from gold and other trace metals (calcium, palladium, copper, silver etc.), is used for LED and IC encapsulation and produces.Along with the developing rapidly of industries such as semi-conductor, the integrated degree of integrated phone etc. is increasingly high in recent years, and battery lead plate is more and more littler; It is more and more to get number of electrodes on the device, and it is more and more littler that interelectrode distance more and more narrow, packaging density also become; Therefore, the para-linkage spun gold needs increasing.The tradition bonding gold wire is except that costing an arm and a leg, and its tensile strength is on the low side.The gold thread of 20 microns of diameters for example, after welding, its maximum pulling strength is less than 5 gram forces, and unit elongation generally is no more than 6%.Bonding gold wire is to be starting material with gold, along with rising steadily of international price of gold, and the also rising all the way of the price of bonding gold wire; Therefore, how to solve the cost problem of bonding gold wire, do not change quality simultaneously again; Even improve the quality of products through improvement, become the most important thing.
One Chinese patent application number is 200610021373.2,201010622360.7,201110027498.7 open bonding gold wires and preparation method thereof; The bonding gold wire of above-mentioned preparation all is in spun gold, to add the different metal element; Though increase qualitatively; But, be not on the basis production cost and use cost to be studied promptly in quality to the deep research of carrying out of bonding gold wire character.
Summary of the invention
For these reasons, the applicant finds through years of researches unexpectedly; In bonding gold wire, improve the content of argent; Be prepared into new extraordinary bonding gold wire, can reduce and produce and use cost, use cost is merely about the 40-50% of existing bonding gold wire use cost; The intensity and the unit elongation of bonding wire have been improved simultaneously, better opposing encapsulation surging force and packaged material thermal expansion force.The present invention also provides the preparation method of above-mentioned said bonding gold wire, and this method technology is simple, be easy to produce, and can use the device fabrication of conventional keys plying material, need not the new equipment of investment for trnasforming urban land.
The present invention realizes through following technical proposals.
A kind of bonding gold wire is characterized in that in the spun gold adding silver, goes back among addition element Ca (calcium), Pd (palladium), Cu (copper), In (indium), Sn (tin), Ni (nickel), La (lanthanum), Sc (scandium), the Ce (cerium) one or more.
The absolute purity of element according to the invention is all more than or equal to 99.99% (comprising gold and silver, Ca, Pd, Cu, In, Sn, Ni, La, Sc, Ce).
The weight percentage of preferred silver is 10%-25% in the above-mentioned said bonding gold wire.
In the above-mentioned said bonding gold wire among Elements C a (calcium), Pd (palladium), Cu (copper), In (indium), Sn (tin), Ni (nickel), La (lanthanum), Sc (scandium), the Ce (cerium) one or more weight contents be 5-900ppm.
The weight percentage of silver is 20% in the above-mentioned said bonding gold wire, and the calcium weight percentage is 5-100ppm in the element, and the palladium weight percentage is 5-100ppm, and the weight of copper percentage composition is 5-100ppm.
The preparation method of above-mentioned said bonding gold wire includes but not limited to following:
Get and put into Jin Jiyin in the plumbago crucible; Put into Elements C a (calcium), Pd (palladium), Cu (copper), In (indium), Sn (tin), Ni (nickel), La (lanthanum), Sc (scandium), Ce (cerium) one or more; Charge into nitrogen; Smelting temperature is 1100-1200 ℃, draws after stirring, and processes the alloy bar material that diameter is 6-10mm; Get alloy bar material,, bar is drawn into bonding gold wire through drawing wire machine; Under nitrogen protection annealing, annealing temperature is 300-550 ℃, annealing speed be 50-60 rice/minute; Bonding gold wire is wound in take-up axle, vacuum packaging.
A kind of preparation method of bonding gold wire:
Get and put into Jin Jiyin in the plumbago crucible; Put into Elements C a (calcium), Pd (palladium), Cu (copper), In (indium), Sn (tin), Ni (nickel), La (lanthanum), Sc (scandium), Ce (cerium) one or more; Charge into nitrogen; Smelting temperature is 1100-1200 ℃, draws after stirring, and processes the alloy bar material that diameter is 6-10mm; Get alloy bar material,, bar is drawn into bonding gold wire through drawing wire machine; Under nitrogen protection annealing, annealing temperature is 300-550 ℃, annealing speed be 50-60 rice/minute; Bonding gold wire is wound in take-up axle, vacuum packaging.
Metallic element absolute purity among the above-mentioned preparation method is all more than or equal to 99.99% (comprising gold and silver, Ca, Pd, Cu, In, Sn, Ni, La, Sc, Ce).
One, bonding gold wire research trial
Test Example 1: in the bonding gold wire: the weight percentage of calcium is 20%, and all the other metallic element silver weight percentages are 20ppm, and the palladium weight percentage is 20ppm, and the weight of copper percentage composition is 20ppm, and all the other are gold.
Test Example 2: in the bonding gold wire: the weight percentage of copper is 20%, and all the other metallic element calcium weight percentages are 20ppm, and the palladium weight percentage is 20ppm, and silver-colored weight percentage is 20ppm, and all the other are gold.
Test Example 3: in the bonding gold wire: the weight percentage of silver is 20%, and all the other metallic element calcium weight percentages are 20ppm, and the palladium weight percentage is 20ppm, and the weight of copper percentage composition is 20ppm, and all the other are gold.
Method: get and put into gold in the plumbago crucible, put into other metal, charge into nitrogen, smelting temperature is 1150 ℃, draws after stirring, and processes the alloy bar material that diameter is 8mm; Get alloy bar material, through drawing wire machine, it is 30 microns spun gold that bar is drawn into the bonding gold wire diameter; Annealing under nitrogen protection, annealing temperature is 450 ℃, annealing speed is 55 meters/minute; Bonding gold wire is wound in take-up axle, vacuum packaging.
The absolute purity of above-mentioned metallic element is all more than or equal to 99.99%.
Test-results: see table 1.
The mass ratio of the different bonding gold wires of table 1
Annotate: the standard of above-mentioned tensile strength is 220-300N/mm
2The thermal conductivity standard is 2.9-3.3W/cmK; The resistivity standard is less than 2.4 μ Ω cm.
Annotate: above-mentioned test design is on the test of many times basis, carries out the concluding test to technical scheme of the present invention.
Conclusion (of pressure testing): above-mentioned test shows that the bonding wire non-conformity of quality of Test Example 1 and Test Example 2 closes requirement, can not be prepared into up-to-standard bonding wire; And the bonding wire resistivity of Test Example 3 significantly reduces, and tensile strength significantly improves, and thermal conductivity meets the specification of quality of bonding gold wire; Therefore, the applicant thinks, in bonding gold wire, reduces the content of gold; Improve silver content, can be prepared into the more outstanding bonding gold wire of quality, and on the content that reduces gold, the basis of improving the quality of products; The production cost and the use cost of bonding gold wire significantly reduce, and are about the 40%-50% of bonding gold wire cost in the prior art.
The applicant continues to change the content of silver on the basis of above-mentioned test, the result shows that when the content of silver was higher than 25%, the spun gold that obtains can't weld, and can directly weld less than 25% spun gold.Though the wire rod cost greater than 25% is lower, there is the sliding ball phenomenon of welding, and is lower than this problem of can thoroughly avoiding of 25%, do not have sliding ball phenomenon and exist.Therefore, the applicant to select in the bonding gold wire weight percentage of silver be 10%-25%.
Two, preparation embodiment
Embodiment 1
The feature key plying that proportioning content is following: the argentiferous weight content is 25%, and the Ca weight content is 0.0005%, and the Pd weight content is 0.0005%; The Cu weight content is 0.0005%, and the In weight content is 0.0005%, and the Sn weight content is 0.0006%; The Ni weight content is 0.0008%, and the La weight content is 0.001%, and the Sc weight content is 0.008%; The Ce weight content is 0.0005%, and all the other are gold.
Above-mentioned element absolute purity is all more than or equal to 99.99%.
Method: get and put into Jin Jiyin in the plumbago crucible, put into other metal, charge into nitrogen, smelting temperature is 1100 ℃, draws after stirring, and processes the alloy bar material that diameter is 10mm; Get alloy bar material, through drawing wire machine, it is 20 microns spun gold that bar is drawn into the bonding gold wire diameter; Annealing under nitrogen protection, annealing temperature is 350 ℃, annealing speed is 50 meter per seconds; Bonding gold wire is wound in take-up axle, vacuum packaging.
Table 2 embodiment 1 diameter 20 micro wire wood property abilities
Table 3 prior art 4N bonding gold wire performance
Can find out that from last table each item performance index of gold thread of the present invention can better satisfy each item encapsulation requirement all far above traditional gold thread.
Embodiment 2
The feature key plying that proportioning content is following: silver-colored weight content is 15%, and the Ca weight content is 0.001%, and the Pd weight content is 0.007%, and the Cu weight content is 0.0008%, and the In weight content is 0.0008%, and the Sc weight content is 0.01%, and all the other are gold.
Above-mentioned element absolute purity is all more than or equal to 99.99%.
Method: get and put into Jin Jiyin in the plumbago crucible, put into other metal, charge into nitrogen, smelting temperature is 1200 ℃, draws after stirring, and processes the alloy bar material that diameter is 6mm; Get alloy bar material, through drawing wire machine, it is 23 microns spun gold that bar is drawn into the bonding gold wire diameter; Annealing under nitrogen protection, annealing temperature is 400 ℃, annealing speed is 55 meters/minute; Bonding gold wire is wound in take-up axle, vacuum packaging.
Table 4 embodiment 2 diameters 23 micro wire wood property abilities
The traditional 4N bonding gold wire of table 5 performance
Can find out that from last table each item performance index of gold thread of the present invention are all far above traditional gold thread, all size wire rod can both substitute gold thread fully, under the prerequisite that reduces cost, fully optimizes performance.
Embodiment 3
The feature key plying that proportioning content is following: argentiferous weight content 20%, the calcium weight percentage is 10ppm in the element, and the palladium weight percentage is 20ppm, and the weight of copper percentage composition is 5ppm, and all the other are gold.
Above-mentioned element absolute purity is all more than or equal to 99.99%.
Method: get and put into Jin Jiyin in the plumbago crucible, put into other metal, charge into nitrogen, smelting temperature is 11150 ℃, draws after stirring, and processes the alloy bar material that diameter is 8mm; Get alloy bar material, through drawing wire machine, it is 30 microns spun gold that bar is drawn into the bonding gold wire diameter; Annealing under nitrogen protection, annealing temperature is 350 ℃, annealing speed is 60 meters/minute; Bonding gold wire is wound in take-up axle, vacuum packaging.
Table 6 embodiment 3 diameters 30 micro wire wood property abilities
| Test piece number (Test pc No.) | The line footpath | Tensile strength | Unit elongation |
| μm | cN | ％ | |
| 1 | 30 | 15.3 | 13.46 |
| 2 | 30 | 15.5 | 13.31 |
| 3 | 30 | 15.4 | 14.10 |
| 4 | 30 | 15.7 | 13.53 |
| 5 | 30 | 15.4 | 13.90 |
| 6 | 30 | 15.4 | 13.74 |
| MV | 30 | 15.45 | 13.67 |
| Intermediate value | 30 | 15.4 | 13.70 |
Embodiment 4
The feature key plying that proportioning content is following: wherein the weight percentage of silver is 20%, and the calcium weight percentage is 90ppm in the trace element, and the palladium weight percentage is 10ppm, and the weight of copper percentage composition is 95ppm, and all the other are gold.
Above-mentioned element absolute purity is all more than or equal to 99.99%.
Method: get and put into Jin Jiyin in the plumbago crucible, put into other metal, charge into nitrogen, smelting temperature is 1150 ℃, draws after stirring, and processes the alloy bar material that diameter is 9mm; Get alloy bar material, through drawing wire machine, it is 25 microns spun gold that bar is drawn into diameter; Annealing under nitrogen protection, annealing temperature is 450 ℃, annealing speed is 54 meters/minute; Bonding gold wire is wound in take-up axle, vacuum packaging.
Table 7 embodiment 4 diameters 25 micro wire wood property abilities
Said embodiment includes but not limited to above-mentioned.
Claims (6)
1. bonding gold wire is characterized in that adding silver in the spun gold, among addition element Ca, Pd, Cu, In, Sn, Ni, La, Sc, the Ce one or more.
2. a kind of bonding gold wire according to claim 1, wherein the weight percentage of silver is 10%-25% in the bonding gold wire.
3. a kind of bonding gold wire according to claim 1, wherein one or more weight contents are 5-900ppm among Elements C a, Pd, Cu, In, Sn, Ni, La, Sc, the Ce.
4. according to each described a kind of bonding gold wire of claim 1-3, wherein the weight percentage of silver is 20%, and the calcium weight percentage is 5-100ppm in the element, and the palladium weight percentage is 5-100ppm, and the weight of copper percentage composition is 5-100ppm.
5. according to each described a kind of bonding gold wire of claim 1-4, wherein the preparation method of bonding gold wire comprises the steps:
Get and put into Jin Jiyin in the plumbago crucible, put into Elements C a, Pd, Cu, In, Sn, Ni, La, Sc, Ce one or more, charge into nitrogen, smelting temperature is 1100-1200 ℃, draws after stirring, and processes the alloy bar material that diameter is 6-10mm; Get alloy bar material,, bar is drawn into bonding gold wire through drawing wire machine; Under nitrogen protection annealing, annealing temperature is 300-550 ℃, annealing speed be 50-60 rice/minute; Bonding gold wire is wound in take-up axle, vacuum packaging.
6. the preparation method of a bonding gold wire is characterized in that:
Get and put into Jin Jiyin in the plumbago crucible, put into Elements C a, Pd, Cu, In, Sn, Ni, La, Sc, Ce one or more, charge into nitrogen, smelting temperature is 1100-1200 ℃, draws after stirring, and processes the alloy bar material that diameter is 6-10mm; Get alloy bar material,, bar is drawn into bonding gold wire through drawing wire machine; Under nitrogen protection annealing, annealing temperature is 300-550 ℃, annealing speed be 50-60 rice/minute; Bonding gold wire is wound in take-up axle, vacuum packaging.
Priority Applications (1)
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| CN2011103625326A CN102418001A (en) | 2011-11-16 | 2011-11-16 | Bonding gold wire and preparation method thereof |
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| CN2011103625326A CN102418001A (en) | 2011-11-16 | 2011-11-16 | Bonding gold wire and preparation method thereof |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102776405A (en) * | 2012-07-25 | 2012-11-14 | 烟台招金励福贵金属股份有限公司 | Preparation method of bonded gold-silver alloy wire |
| CN103643187A (en) * | 2013-12-11 | 2014-03-19 | 浙江佳博科技股份有限公司 | Anti-oxidation processing method of copper wire |
| CN104388861A (en) * | 2014-10-10 | 2015-03-04 | 河南理工大学 | Manufacturing method of fine silver-gold alloy bonding line for polycrystalline serial LED |
| CN105543532A (en) * | 2016-02-18 | 2016-05-04 | 安徽华晶微电子材料科技有限公司 | Ultramicro bonded mixed alloy wire and preparing method thereof |
| CN105803245A (en) * | 2016-04-15 | 2016-07-27 | 浙江佳博科技股份有限公司 | High-performance bonded alloy wire, preparation method and application thereof |
| CN105950900A (en) * | 2016-05-06 | 2016-09-21 | 河南理工大学 | Manufacturing method of high-strength micro-fine silver alloy bonding wire for small wafer LED packaging |
| CN106011516A (en) * | 2016-05-31 | 2016-10-12 | 河北德田半导体材料有限公司 | Alloy-doped gold bonding wire and cryogenic-treatment preparation method thereof |
| CN109003903A (en) * | 2018-07-02 | 2018-12-14 | 上杭县紫金佳博电子新材料科技有限公司 | A kind of bonding gold wire and preparation method thereof |
| CN112680618A (en) * | 2020-12-29 | 2021-04-20 | 南昌航空大学 | Preparation method of LED bonding alloy wire |
| CN115261663A (en) * | 2022-08-01 | 2022-11-01 | 江西蓝微电子科技有限公司 | Gold alloy bonding wire and preparation method thereof |
| CN116013793A (en) * | 2023-01-09 | 2023-04-25 | 四川威纳尔特种电子材料有限公司 | Multi-element microalloyed bond alloy wire and preparation method and application thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030209810A1 (en) * | 2002-05-07 | 2003-11-13 | Mk Electon Co., Ltd | Gold-silver bonding wire for semiconductor device |
| JP2009033127A (en) * | 2007-06-28 | 2009-02-12 | Nippon Steel Materials Co Ltd | Bonding wire for semiconductor mounting |
| CN102127663A (en) * | 2010-12-30 | 2011-07-20 | 宁波康强电子股份有限公司 | Gold bonding wire and preparation method thereof |
-
2011
- 2011-11-16 CN CN2011103625326A patent/CN102418001A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030209810A1 (en) * | 2002-05-07 | 2003-11-13 | Mk Electon Co., Ltd | Gold-silver bonding wire for semiconductor device |
| JP2009033127A (en) * | 2007-06-28 | 2009-02-12 | Nippon Steel Materials Co Ltd | Bonding wire for semiconductor mounting |
| CN102127663A (en) * | 2010-12-30 | 2011-07-20 | 宁波康强电子股份有限公司 | Gold bonding wire and preparation method thereof |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102776405A (en) * | 2012-07-25 | 2012-11-14 | 烟台招金励福贵金属股份有限公司 | Preparation method of bonded gold-silver alloy wire |
| CN103643187A (en) * | 2013-12-11 | 2014-03-19 | 浙江佳博科技股份有限公司 | Anti-oxidation processing method of copper wire |
| CN103643187B (en) * | 2013-12-11 | 2015-07-22 | 浙江佳博科技股份有限公司 | Anti-oxidation processing method of copper wire |
| CN104388861A (en) * | 2014-10-10 | 2015-03-04 | 河南理工大学 | Manufacturing method of fine silver-gold alloy bonding line for polycrystalline serial LED |
| CN105543532A (en) * | 2016-02-18 | 2016-05-04 | 安徽华晶微电子材料科技有限公司 | Ultramicro bonded mixed alloy wire and preparing method thereof |
| CN105803245A (en) * | 2016-04-15 | 2016-07-27 | 浙江佳博科技股份有限公司 | High-performance bonded alloy wire, preparation method and application thereof |
| CN105950900A (en) * | 2016-05-06 | 2016-09-21 | 河南理工大学 | Manufacturing method of high-strength micro-fine silver alloy bonding wire for small wafer LED packaging |
| CN106011516A (en) * | 2016-05-31 | 2016-10-12 | 河北德田半导体材料有限公司 | Alloy-doped gold bonding wire and cryogenic-treatment preparation method thereof |
| CN106011516B (en) * | 2016-05-31 | 2018-01-23 | 河北德田半导体材料有限公司 | One kind doping billon bonding wire and its subzero treatment preparation method |
| CN109003903A (en) * | 2018-07-02 | 2018-12-14 | 上杭县紫金佳博电子新材料科技有限公司 | A kind of bonding gold wire and preparation method thereof |
| CN112680618A (en) * | 2020-12-29 | 2021-04-20 | 南昌航空大学 | Preparation method of LED bonding alloy wire |
| CN115261663A (en) * | 2022-08-01 | 2022-11-01 | 江西蓝微电子科技有限公司 | Gold alloy bonding wire and preparation method thereof |
| CN115261663B (en) * | 2022-08-01 | 2023-05-02 | 江西蓝微电子科技有限公司 | Gold alloy bonding wire and preparation method thereof |
| CN116013793A (en) * | 2023-01-09 | 2023-04-25 | 四川威纳尔特种电子材料有限公司 | Multi-element microalloyed bond alloy wire and preparation method and application thereof |
| CN116013793B (en) * | 2023-01-09 | 2024-03-19 | 四川威纳尔特种电子材料有限公司 | Multi-element microalloyed bond alloy wire and preparation method and application thereof |
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Application publication date: 20120418 |