CN102405123A - 用于改良易碎材料处理的方法 - Google Patents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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Abstract
本发明揭示一种用于易碎材料,像是玻璃,以进行特征的镭射加工的改良方法,其中与一特征相关联的工具路径经分析,藉以决定需利用非邻近激光脉冲多少来施行镭射加工该特征。定位在后续的多次操作过程中所施予的激光脉冲,藉以对先前的镭射光点位置重迭一预定重迭量值。按此方式,则无任何单一点会接受到因邻近于一先前脉冲位置所施予紧随后续激光脉冲而造成的过度镭射辐射。
Description
技术领域
本发明是有关用于像是玻璃的易碎材料的镭射处理方法。尤其,本发明是有关用以对于玻璃等等材料中的特征进行镭射加工的方法,而同时避免应力断折和碎裂并且维持可接受的***产出量。
背景技术
玻璃切割处理在传统上是利用机械锯器所实作,此工具雕割该玻璃然后再进行机械性的折破步骤。近年来,激光技术既经运用在玻璃切割处理,这概略是利用镭射作为一局部性加热源,且可经伴随以一冷却喷嘴,以沿这些路线产生应力及微裂痕来切割该玻璃。这些所获应力及微裂痕可为足以令该玻璃断折并沿所设计路线分离,或者是可能需要一后续折破步骤以分离该玻璃。仅运用镭射而无冷却源的现有技术包含多重激光束吸收(multiple laser beamabsorption,MLBA),即如于2007年2月22日所申审,发明人Michael Haase及Oliver Haupt的美国专利申请案第2007/0039932号「DEVICE FORSEPARATIVE MACHINING OF COMPONENTS MADE FROM BRITTLEMATERIAL WITH STRESS-FREE COMPONENT MOUNTING」,以及于2007年7月26日所申审,发明人Oliver Haupt和Bernd Lange的美国专利申请案第2007/0170162号「METHOD AND DEVICE FOR CUTTING THROUGHSEMICONDUCTOR MATERIALS」,案文所述的,然不限于此,其中是利用一近IR镭射源,且并同于一对反射性映镜,藉以沿该待予分离的路径上将玻璃内的光子能量的容积吸收最大化,因此将会产生出足够的热应力以供折破这些部份而不需要施予额外的力。然此技术确需一初始机械缺口以作为预裂痕。镭射产生的应力将会使得该初始裂痕传播以形成该分离。美国佛罗里达州LakeMary市(32746)Fonon Technology International公司的ZWLDT「Zero-WidthLaser Dicing Technology」(零宽度镭射切出技术)是利用一CO2源以加热该玻璃,随后再以一冷却喷嘴产生应力,藉此沿着该切割路径上启生微裂痕,然后再施予一机械性的折破步骤以分离该玻璃。由于与这些制程相关联的近乎为零的隙缝宽度,因此所有前述方式皆因为难以精准地控制裂痕传播的方向而不易适用在其中这些路线牵涉到圆角或曲型路径的情况。即使是施加一机械性折破步骤,欲以精准地分离部份而不致在体型玻璃造成显著的碎裂或裂痕依旧是非常困难。
因此,所需的为一种用于以镭射而按可接受速率来切割具有牵涉到圆角或曲型节段的路线的易碎材料的方法,像是玻璃,然又不致造成不可接受碎裂及裂痕。
发明内容
本发明的一特点为一种用于对像是玻璃的易碎材料中的复杂路线进行镭射加工的方法,以避免该材料中出现与环绕该特征的范围内过度热堆积相关联的碎裂及裂痕,而不需要昂贵额外设备或是导致***产出量显著降低。可藉由当加工该特征时将这些激光脉冲予以间隔,故而后续激光脉冲不会重迭于与先前脉冲相同的位置上,以避免在该范围内的过度热堆积。本发明的一具体实施例分析与一特征相关联的工具路径,藉以给定一所欲脉冲重迭和步进大小,决定需进行多少次通行以将该特征镭射加工至一工件内。工具路径是一工件上一系列的位置,这些位置表示应将一激光脉冲导引至何处以加工该相关特征。一特征可根据所使用的镭射参数而拥有多条可能的工具路径,并仍能产生相同的特征。本具体实施例将一或更多激光脉冲导引至该工具路径上的一选定点处。然后,不以将该镭射移动一焦点距离的一分数并且将另一脉冲导引至该工件以达到所欲重迭,而是该***会在该工件路径上的一经算得数量的潜在脉冲位置上步进,然后将一激光脉冲导引至该工件。接着该***续行于该工具路径,将激光脉冲导引至按一经算得数量的潜在脉冲位置相分隔的工件,直到该工具路径耗终为止。然后该***启动,将一激光脉冲导引至一工件,此工件位在自该第一激光脉冲位置移离一激光脉冲光点距离的分数的位置处,藉此达到脉冲重迭而不致造成过度加热。接着,依该经算得步进大小将该***编定于次一位置处,此位置会与下一个先前激光脉冲位置重迭相同的重迭位移。该程序继续进行,直到整个特征加工完毕为止。
为达成前述和其它根据本发明目的的目标,即如本揭中所具体实作且广义描述的,兹揭示一种方法及设备。
附图说明
图1为具单次镭射处理通行的工具路径。
图2为具五次镭射处理通行的工具路径。
图3为显示所完成镭射处理的工具路径。
主要组件符号说明
8 工件
10 工具路径
12 圆圈(激光脉冲)
14 脉冲样式
16 激光脉冲
具体实施方式
本发明的一具体实施例为一种用于以一镭射处理***在易碎材料中镭射加工一特征的经改良方法。此镭射处理***具有一工具路径,或一工件上一系列的位置,这些位置是表示应将一激光脉冲导引至何处以进行该相关特征的加工。一种可经调适以具体实作本发明的示范性镭射处理***为美国奥瑞冈州波特兰市(97229)Electro Scientific Industries,Inc.公司所制造的MM5800。该***是利用两种镭射,其一或两者可为经二极管泵驱,按自约1064微米下至约255微米波长而以30到70KHz之间的脉冲重复频率,并且在30KHz脉冲重复频率处具有大于约5.7W的平均功率,运作的固态Q切换Nd:YAG或是Nd:YVO4镭射。
本发明的具体实施例可代表于2007年8月21日所申审,发明人Robert M.Pailthorp、Weisheng Lei、Hisashi Matsumoto、Glenn Simonson、David A.Watt、Mark A.Unrath和William J.Jordens的美国专利第7,259,354号「METHODSFOR PROCESSING HOLES BY MOVING PRECISELY TIME LASER PULSESIN CIRCULAR AND SPIRAL TRAJECTORIES」案文所揭示技术的一种新式应用,兹将该案依其整体而按参考方式并入本案,其中是利用一小于所钻凿孔洞的镭射光点大小以在材料内进行孔洞钻凿,而需以圆形或螺旋形工具路径移动激光脉冲。现已证实在该圆形的圆周附近将这些激光脉冲相隔确能提供拥有较佳质量的孔洞。本发明为该项揭示的延伸,其中可藉由计算出经施予一易碎工件上任意工具路径的激光脉冲的相隔与计时来增加易碎材料镭射加工的质量和产出量。藉由当进行特征加工时令激光脉冲沿该工具路径而在时间与空间上彼此相隔,即可避免在任何特定区域内的过度热堆积以提高切割的质量。而藉由根据本发明具体实施例的激光脉冲化,可在对一邻近位置脉冲照射之前先行冷却既经脉冲照射的位置,藉以让激光脉冲能够将每个脉冲所移除的材料量最大化,却无须忧虑残余损害。如此即能优化整个制程以提高产出量,而同时又能维持质量。
本发明的一特点可如图1所示,其中显示一工件8上的一条复杂工具路径10。此工具路径含有曲型区段,若欲加以切割而又不致造成裂痕及碎裂确有所困难。这些圆圈,其中一个是经标注为12,是表示在单一通行中经导引至该工件的激光脉冲。一旦完成此通行后,会将样式编定一个步进大小并且重复进行。图2显示,经过五次通行后,一工件8上的工具路径10上的脉冲样式14。图3显示出这些激光脉冲16既已加工完成由该工件8上的工具路径10所描述的特征。
在镭射通径钻凿应用项目中,当在***处以多次重复方式钻凿一环锯工具时,会希望对扫描速度及重复速率进行微调,使得脉冲能够均匀地分布在该孔洞***的附近,藉以达到均匀地移除材料,并且针对通径质量而言能够获得较佳的通径对通径一致性。在脉冲之间的位置增量应为相等且为最小化。可定义一个新的数量,即一想象少量大小(bite size),此值沿***上在第一环转里所递送的第一脉冲与在第二环转里所递送的第一脉冲间的距离。一算法是经标定以拉扯工具速度,藉此来设定该想象少量大小而优化该脉冲间隔为均衡并且尽可能地细致分布。该算法亦为一种用以计时该Q切换镭射命令,俾将所有脉冲同步化于由该所欲工具路径要求的计时的方法。
熟谙本项技艺的人士应将能了解可对前述的本发明具体实施例细节进行诸多变更而不致悖离其基本原理。故而本发明范畴应仅由记载申请专利范围所决定。
Claims (8)
1.一种以一镭射处理***在易碎材料中进行一特征的镭射加工的改良方法,该镭射处理***具有一工具路径,其中包含:
提供具有运作以对该易碎材料进行镭射加工的激光脉冲及激光脉冲参数的镭射;
根据该工具路径以计算这些激光脉冲参数,其中各个激光脉冲的数量和位置经计算以提供对于该工具路径上各个位置的预定脉冲重迭与计时;以及
按照这些经算得激光脉冲参数,导引该镭射以发射这些激光脉冲以撞击于该易碎材料上,藉以在该易碎材料内加工该特征。
2.根据权利要求1所述的方法,其中该预定脉冲重迭与计时经选定以在这些激光脉冲之间提供间隔。
3.根据权利要求1所述的方法,其中这些镭射参数包含脉冲重复速率、扫描速度、光点大小、少量大小及通过次数。
4.根据权利要求2所述的方法,其中该脉冲重复速率是在约1KHz至1MHz之间。
5.根据权利要求2所述的方法,其中该扫描速度是在约100mm/s至5000mm/s之间。
6.根据权利要求2所述的方法,其中该光点大小是在约10微米至500微米之间。
7.根据权利要求2所述的方法,其中该少量大小是在约10微米至500微米之间。
8.根据权利要求2所述的方法,其中该通过次数是在约1次至约100次之间。
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US61/164,162 | 2009-03-27 | ||
US12/732,020 US20100252959A1 (en) | 2009-03-27 | 2010-03-25 | Method for improved brittle materials processing |
US12/732,020 | 2010-03-25 | ||
PCT/US2010/028856 WO2010111609A2 (en) | 2009-03-27 | 2010-03-26 | Method for improved brittle materials processing |
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Also Published As
Publication number | Publication date |
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KR20120000073A (ko) | 2012-01-03 |
TW201043380A (en) | 2010-12-16 |
US20100252540A1 (en) | 2010-10-07 |
WO2010111609A3 (en) | 2011-02-03 |
US20100252959A1 (en) | 2010-10-07 |
JP2012521889A (ja) | 2012-09-20 |
WO2010111609A2 (en) | 2010-09-30 |
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