CN102404976A - Electronic device - Google Patents
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- Publication number
- CN102404976A CN102404976A CN2010102836645A CN201010283664A CN102404976A CN 102404976 A CN102404976 A CN 102404976A CN 2010102836645 A CN2010102836645 A CN 2010102836645A CN 201010283664 A CN201010283664 A CN 201010283664A CN 102404976 A CN102404976 A CN 102404976A
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- China
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- electronic component
- graphite linings
- heat conduction
- casing
- line
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Abstract
An electronic device comprises a machine casing and an electronic component arranged in the machine casing and is characterized in that a heat conducting composite layer is arranged between the electronic component and the machine casing. The heat conducting composite layer comprises a graphite layer and a heat conducting glue layer. The heat conducting glue layer is attached to the top face of the electronic component toward the machine casing. The graphite layer is attached to the machine casing. Heat conducting rate of the graphite layer along the direction of plane extension is bigger than that of the graphite layer along the direction of the thickness. Area of the graphite layer and the heat conducting glue layer is not smaller than area of the top face of the electronic component. Heat of the electronic component is delivered to the graphite layer through the heat conducting glue layer and then delivered to the machine casing through the graphite layer. The electronic device avoids a problem that a hot spot is produced caused by over high temperature of a local portion of the machine casing, thereby being favorable for accelerating heat transfer between the electronic component and the machine casing to improve radiating efficiency of the electronic device.
Description
Technical field
The present invention relates to a kind of electronic installation, particularly relate to the electronic installation of a kind of use one heat conduction composite bed its heat-generating electronic elements heat radiation.
Background technology
Fast development along with electronic industry; Electronic component in some electronic installations; Increase severely like high speeds such as central processing unit, calculator memory bar, high frequency and integrated its caloric value that makes; Therefore, the heat that how can in limited space, in time take away said electronic component efficiently and produced has become an important topic of industry.For the heat that electronic component is produced is taken away, existing way is that the housing contacts that a radiator is set on electronic component or makes electronic component and place electronic installation is to conduct heat.
Yet; This method of directly electronic component being dispelled the heat with the radiators such as shell of radiator and electronic installation; Usually meeting makes owing to the heat of the position at electronic component place is too concentrated and produces the focus that heat is comparatively concentrated on the said radiator; And then reduce the radiating efficiency of said radiator, when said radiator was the shell of electronic installation, the local temperature that also can make this shell was too high and let the user not feel well.
Summary of the invention
In view of this, be necessary to provide a kind of electronic installation of avoiding electronic component in the heat radiation process, to produce focus.
A kind of electronic installation; Comprise casing and be located at the electronic component in the casing; It is characterized in that: a heat conduction composite bed is set between this electronic component and the casing, and this heat conduction composite bed comprises a graphite linings and a heat conduction glue-line, and this heat-conducting glue layer fits in electronic component on the end face of this casing; This graphite linings fits on this casing; The thermal conductivity of this graphite linings extension direction along the plane is greater than the thermal conductivity of this graphite linings along thickness direction, and the area of this graphite linings and heat conduction glue-line all is not less than the area of the end face of this electronic component, and the heat of this electronic component is passed to this graphite linings through this heat conduction glue-line and evenly is passed to this casing through this graphite linings again.
In the above-mentioned electronic installation; Through a heat conduction glue-line and a graphite linings be used; Because this graphite linings is superior along horizontal heat conductivility, the soaking performance of this graphite flake can make the heat of electronic component evenly be passed to dispersedly on this casing, has avoided the casing local temperature too high and produce the problem of focus; Uniform heat distribution on the casing, thus help heat conduction between accelerated electron element and this casing to improve the radiating efficiency of electronic installation.
Description of drawings
Fig. 1 is the three-dimensional assembly diagram of the electronic installation in the present invention's one preferred embodiment.
Fig. 2 is the sketch map of the radiator structure in the electronic installation shown in Figure 1.
The main element symbol description
Casing 211
Heat conduction composite bed 23
Graphite linings 231
Heat conduction glue-line 232
Embodiment
Shown in Figure 1ly be the electronic installation 200 in the present invention's one preferred embodiment; In the present embodiment; This electronic installation 200 is a notebook computer; It comprises a main frame 21 and a display 22 that pivots and be connected with this main frame 21, and this main frame 21 comprises a casing 211, be located at the interior electronic component 212 (please with reference to Fig. 2) of this casing 211 and be located at the heat conduction composite bed 23 between this electronic component 212 and this casing 211.This electronic component 212 can be central processing unit (CPU), memory bar etc., and electronic component 212 is blocked in the below of this heat conduction composite bed 23 among Fig. 1.The heat that produces during these electronic component 212 work evenly reaches this casing 211 through this heat conduction composite bed 23, and distributes through this casing 211.
Please with reference to Fig. 2, this heat conduction composite bed 23 comprises a graphite linings 231 and a heat conduction glue-line 232.This heat conduction composite bed 23 is located between this electronic component 212 and this casing 211.
This graphite linings 231 is laminar and fits on this casing 211; The thermal conductivity of this graphite linings 231 extension direction along the plane is greater than the thermal conductivity of its thickness direction; The thermal conductivity of this graphite linings 231 extension direction (promptly horizontal) along the plane reaches 450～750W/mk, is far longer than the about 50W/mK of transverse conductivity of metal shell and the about 1～3W/mK of transverse conductivity of heat conduction glue-line.The area of this graphite linings 231 is not less than the area of this electronic component 212 towards the end face of this casing 211, the length and width that draw this graphite linings 231 through experiment contrast respectively and the preferable interval of the ratio between the length and width of this electronic component 212 be 1.5～1 (comprising 1 and 1.5).In addition, this graphite linings 231 can also absorb the electromagnetic radiation that this electronic component 212 produces when work, thereby has electromagnetic radiation protection (Electromagnetic Interference, effect EMI).
This heat conduction glue-line 232 is between the end face of this graphite linings 231 and this electronic component 212.This heat conduction glue-line 232 is heat conduction film or heat conductive silica gel coating; This heat conduction glue-line 232 can reduce the thermal resistance between this graphite linings 231 and this electronic component 212; The damage of this electronic component 212 or graphite linings 231 can be avoided causing, the effect that makes electric insulation between electronic component 212 and the metal casing 211 can also be played simultaneously because of the direct extruding between this graphite linings 231 and this electronic component 212.The area of this heat conduction glue-line 232 is not less than this electronic component 212 towards the area of the end face of this casing 211 and be not more than the area of this graphite linings 231.The length and width of this graphite linings 231 were 1.5～1 (comprising 1 and 1.5) with the preferable interval of the ratio of the length and width of this heat conduction glue-line 232 respectively, and when the length and width of the length and width of this graphite linings 231 and this heat conduction glue-line 232 were identical, this graphite linings 231 can reach best all thermal effects.
During these electronic installation 200 work; The heat that this electronic component 212 produces is passed to this graphite linings 231 through this heat conduction glue-line 232; This graphite linings 231 evenly conducts to heat on this casing 211 dispersedly, produces the focus that heat is concentrated on the casing 211 thereby avoided making.Uniform heat distribution on the casing 211, it is good and occur the too high problem of hot localised points temperature easily with metal chassis 211 transverse heat transfer rates to solve heat conduction glue-line 232.
Claims (9)
1. electronic installation; Comprise casing and be located at the electronic component in the casing; It is characterized in that: a heat conduction composite bed is set between this electronic component and the casing, and this heat conduction composite bed comprises a graphite linings and a heat conduction glue-line, and this heat-conducting glue layer fits in electronic component on the end face of this casing; This graphite linings fits on this casing; The thermal conductivity of this graphite linings extension direction along the plane is greater than the thermal conductivity of this graphite linings along thickness direction, and the area of this graphite linings and heat conduction glue-line all is not less than the area of the end face of this electronic component, and the heat of this electronic component is passed to this graphite linings through this heat conduction glue-line and evenly is passed to this casing through this graphite linings again.
2. electronic installation as claimed in claim 1 is characterized in that: the interval of the ratio between the length of the length of this graphite linings and the end face of this electronic component is 1.5～1.
3. according to claim 1 or claim 2 electronic installation, it is characterized in that: the interval of the ratio between the width of the width of this graphite linings and the end face of this electronic component is 1.5～1.
4. electronic installation as claimed in claim 1 is characterized in that: the area of this graphite linings is not less than the area of this heat conduction glue-line.
5. electronic installation as claimed in claim 4 is characterized in that: the interval of the ratio between the length of the length of this graphite linings and this heat conduction glue-line is 1.5～1.
6. like claim 4 or 5 described electronic installations, it is characterized in that: the interval of the ratio between the width of the width of this graphite linings and this heat conduction glue-line is 1.5～1.
7. electronic installation as claimed in claim 1 is characterized in that: this heat conduction glue-line is thermal conductive silicon glue-line or heat conduction film.
8. electronic installation as claimed in claim 1 is characterized in that: this heat conduction glue-line is an electrical insulating material.
9. electronic installation as claimed in claim 1 is characterized in that: this graphite linings in the form of sheets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102836645A CN102404976A (en) | 2010-09-16 | 2010-09-16 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102836645A CN102404976A (en) | 2010-09-16 | 2010-09-16 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102404976A true CN102404976A (en) | 2012-04-04 |
Family
ID=45886597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102836645A Pending CN102404976A (en) | 2010-09-16 | 2010-09-16 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102404976A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014036738A1 (en) * | 2012-09-10 | 2014-03-13 | 北京中石伟业科技股份有限公司 | Heat exchanger |
| CN105072868A (en) * | 2015-07-14 | 2015-11-18 | 广东欧珀移动通信有限公司 | Mobile terminal and method for heat radiation of mobile terminal |
| CN105407686A (en) * | 2014-09-12 | 2016-03-16 | 奇鋐科技股份有限公司 | Handheld device heat dissipating structure |
| CN107529320A (en) * | 2017-09-04 | 2017-12-29 | 广东欧珀移动通信有限公司 | A kind of electronic equipment, housing unit and circuit board assemblies |
| CN107580449A (en) * | 2017-09-21 | 2018-01-12 | 广东欧珀移动通信有限公司 | Radome, radiating subassembly and electronic equipment |
| CN109549666A (en) * | 2018-11-19 | 2019-04-02 | 飞依诺科技(苏州)有限公司 | Soakage device and hand-held ultrasound detection device |
| CN111246705A (en) * | 2018-11-29 | 2020-06-05 | 广州力及热管理科技有限公司 | Thermal management system of thin electronic device |
| CN113453484A (en) * | 2020-03-26 | 2021-09-28 | 安徽寒武纪信息科技有限公司 | Heat radiation assembly and electronic device thereof |
-
2010
- 2010-09-16 CN CN2010102836645A patent/CN102404976A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014036738A1 (en) * | 2012-09-10 | 2014-03-13 | 北京中石伟业科技股份有限公司 | Heat exchanger |
| CN105407686A (en) * | 2014-09-12 | 2016-03-16 | 奇鋐科技股份有限公司 | Handheld device heat dissipating structure |
| CN105072868A (en) * | 2015-07-14 | 2015-11-18 | 广东欧珀移动通信有限公司 | Mobile terminal and method for heat radiation of mobile terminal |
| WO2017008575A1 (en) * | 2015-07-14 | 2017-01-19 | 广东欧珀移动通信有限公司 | Mobile terminal and method for dissipating heat of said mobile terminal |
| CN105072868B (en) * | 2015-07-14 | 2018-04-27 | 广东欧珀移动通信有限公司 | Mobile terminal and the method to mobile terminal heat dissipation |
| CN107529320A (en) * | 2017-09-04 | 2017-12-29 | 广东欧珀移动通信有限公司 | A kind of electronic equipment, housing unit and circuit board assemblies |
| CN107580449A (en) * | 2017-09-21 | 2018-01-12 | 广东欧珀移动通信有限公司 | Radome, radiating subassembly and electronic equipment |
| CN109549666A (en) * | 2018-11-19 | 2019-04-02 | 飞依诺科技(苏州)有限公司 | Soakage device and hand-held ultrasound detection device |
| CN111246705A (en) * | 2018-11-29 | 2020-06-05 | 广州力及热管理科技有限公司 | Thermal management system of thin electronic device |
| CN113453484A (en) * | 2020-03-26 | 2021-09-28 | 安徽寒武纪信息科技有限公司 | Heat radiation assembly and electronic device thereof |
| WO2021190342A1 (en) * | 2020-03-26 | 2021-09-30 | 安徽寒武纪信息科技有限公司 | Heat dissipation assembly and electronic device comprising same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120404 |