WO2014036738A1

WO2014036738A1 - Heat exchanger

Info

Publication number: WO2014036738A1
Application number: PCT/CN2012/081194
Authority: WO
Inventors: 吴晓宁
Original assignee: 北京中石伟业科技股份有限公司
Priority date: 2012-09-10
Filing date: 2012-09-10
Publication date: 2014-03-13

Abstract

A heat exchanger, which comprises a heat sink (103) and a graphite film (304) that covers the surface of the heat sink (103). The heat exchanger uses the high thermal conductivity of the graphite film (304) to quickly transfer heat through the surface of the graphite film (304), thus decreasing heat conduction paths inside the heat sink (103), increasing the heat dissipation speed of the heat exchanger, and shortening the time required for a thermal conducting interface material (102) or a heating device (101) to transfer heat to the heat sink (103). The heat exchanger decreases or eliminates temperature gradients in heat conduction paths, thereby lowering the temperature of the heating device (101), eliminating temperature imbalance hotspot areas inside a device, and improving the overall reliability and long-time working capability of the heating device (101) and the device.

Description

一种散热器技术领域 A radiator

本发明涉及散热器，特别是涉及表面覆有石墨膜的散热器。背景技术 The present invention relates to a heat sink, and more particularly to a heat sink having a surface coated with a graphite film. Background technique

众所周知，散热器的作用是将电路和电子元件在工作过程中产生的热量驱散到空气中。在现有技术中，电路和电子元件作为发热器件如图 1 所示进行散热。损耗功率的传输首先是由发热器件 101 传出，经导热界面材料 102 到达散热体 103。在散热体 103 内部热量的分散是经热传导完成的，而从散热体 103 向空气的热量传递则需借助辐射和对流来完成。但是由于发热器件 101 与散热体 103 的接触面积有限，热量在散热体 103 内部受散热器本体材料的导热率限制，热传导速度较慢。因此，在导热路径上形成热积累和较高温度梯度分布，导致发热器件温度偏高，散热体 103的散热效率发挥有限。 As we all know, the role of the heat sink is to dissipate the heat generated by the circuit and electronic components during operation into the air. In the prior art, circuits and electronic components are used as heat generating devices to dissipate heat as shown in FIG. The transmission of the power loss is first transmitted from the heat generating device 101 and reaches the heat sink 103 via the thermally conductive interface material 102. The dispersion of heat inside the heat sink 103 is accomplished by heat conduction, and the heat transfer from the heat sink 103 to the air is accomplished by radiation and convection. However, since the contact area of the heat generating device 101 and the heat sink 103 is limited, the heat is limited inside the heat radiating body 103 by the heat conductivity of the heat sink body material, and the heat conduction speed is slow. Therefore, heat accumulation and a high temperature gradient distribution are formed on the heat conduction path, resulting in a high temperature of the heat generating device, and the heat dissipation efficiency of the heat sink 103 is limited.

随着器件的不断变小，功率密度的不断增加，导致损耗功率上升，因此良好的散热是必不可少的。因此，要求设计出效率更高的散热器，在这种散热器的表面上能够迅速地进行热传播，并在散热器内达成热平衡。从而，降低或消除热传导路径上温度梯度，使发热器件的温度变低，消除设备内部的温度不平衡热点区域，提高器件和设备的整体可靠性和长时间工作能力。 As devices continue to shrink and power density increases, resulting in increased power dissipation, good heat dissipation is essential. Therefore, it is required to design a more efficient heat sink on which the heat can be rapidly propagated and the heat balance is achieved in the heat sink. Thereby, the temperature gradient on the heat conduction path is reduced or eliminated, the temperature of the heat generating device is lowered, the temperature unbalanced hot spot inside the device is eliminated, and the overall reliability and long-term working ability of the device and the device are improved.

石墨膜是一种全新的导热散热材料，具有独特的晶粒取向，沿两个方向均匀导热，片层状结构可很好地适应任何表面。在本申请人未公开的专利 EP12158250.6 中，提出一种制造石墨薄膜的方法，该方法选用高分子膜作为原料膜，将多张原料膜层叠在一起填充在装料容器中，使原料膜在竖直状态下进行热处理，获得石墨膜。发明内容 Graphite film is a new type of heat-conducting heat-dissipating material with unique grain orientation and uniform heat conduction in two directions. The layered structure can be well adapted to any surface. In the patent EP12158250.6, which is not disclosed by the present applicant, a method for manufacturing a graphite film is proposed. The method uses a polymer film as a raw material film, and a plurality of raw material films are stacked and filled in a charging container to make a raw material film. The heat treatment was performed in a vertical state to obtain a graphite film. Summary of the invention

有鉴于此，本发明的目的在于提出一种散热器，用以消除现有散热器散热能力较低、散热速度慢的弊端。 In view of the above, an object of the present invention is to provide a heat sink for eliminating the disadvantages of low heat dissipation capability and slow heat dissipation rate of the existing heat sink.

基于上述目的，本发明提供一种散热器，所述散热器包括散热体以及覆盖在散热体表面的石墨膜。 Based on the above object, the present invention provides a heat sink including a heat sink and a cover A graphite film covering the surface of the heat sink.

可选地，所述石墨膜覆盖在所述散热体表面的通过导热界面材料与发热器件相接触的部位上。 Optionally, the graphite film covers a portion of the surface of the heat sink that is in contact with the heat generating device through the heat conducting interface material.

较佳地，所述石墨膜覆盖在所述散热体的通过导热界面材料与发热器件相接触的整个表面上。 Preferably, the graphite film covers the entire surface of the heat sink that is in contact with the heat generating device through the thermally conductive interface material.

可选地，所述散热体的表面全部覆盖有所述石墨膜。 Optionally, the surface of the heat sink is completely covered with the graphite film.

可选地，所述石墨膜通过导热粘接剂覆盖于所述散热体的表面。 Optionally, the graphite film is covered on the surface of the heat sink by a heat conductive adhesive.

较佳地，所述导热粘接剂为选自导热环氧树脂粘接剂、丙烯酸系树脂导热环氧树脂粘接剂和硅系导热粘接剂中的任意一种。 Preferably, the thermally conductive adhesive is any one selected from the group consisting of a thermally conductive epoxy resin adhesive, an acrylic resin thermal epoxy resin adhesive, and a silicon thermal conductive adhesive.

优选地，所述导热环氧树脂粘接剂为选自室温硫化导热环氧树脂粘接剂和高温硫化导热环氧树脂粘接剂中的任意一种。 Preferably, the thermally conductive epoxy resin adhesive is any one selected from the group consisting of a room temperature vulcanization thermally conductive epoxy resin adhesive and a high temperature vulcanization thermal conductive epoxy resin adhesive.

可选地，所述导热粘接剂的厚度约为 0.05~lmm。 Optionally, the thermally conductive adhesive has a thickness of about 0.05 to 1 mm.

较佳地，所述导热粘接剂的厚度约为 0.1~0.5mm。 Preferably, the thermally conductive adhesive has a thickness of about 0.1 to 0.5 mm.

可选地，所述导热粘接剂的导热率为不小于 0.5 W/mK。 Optionally, the thermal conductive adhesive has a thermal conductivity of not less than 0.5 W/mK.

较佳地，所述导热粘接剂的导热率为不小于 lW/mK。 Preferably, the thermal conductive adhesive has a thermal conductivity of not less than 1 W/mK.

可选地，所述散热体是选自用于计算机芯片的带风扇鳍状散热体、不带风扇鳍状散热体、用于功率电子设备的金属压铸散热腔或箱体、用于移动电子设备中可充当散热器的金属结构件、非金属结构件中的任意一种。 Optionally, the heat sink is selected from a fan fin heat sink for a computer chip, a fan fin heat sink without a fan, a metal die casting heat sink or a box for a power electronic device, and a mobile electronic device. Any of a metal structural member or a non-metallic structural member that can serve as a heat sink.

可选地，所述石墨膜为将高分子膜经热处理后得到的人工石墨膜。 Optionally, the graphite film is an artificial graphite film obtained by heat-treating a polymer film.

较佳地，所述高分子膜选自聚噁二唑、聚酰亚胺、聚对亚苯基亚乙烯、聚苯并咪唑、聚苯并噁唑、聚苯并双噁唑、聚噻唑、聚苯并噻唑、聚苯并双噻唑和聚酰胺的膜中的至少一种。 Preferably, the polymer film is selected from the group consisting of polyoxadiazole, polyimide, polyparaphenylene vinylene, polybenzimidazole, polybenzoxazole, polybenzobisoxazole, polythiazole, At least one of a film of polybenzothiazole, polybenzobisthiazole, and polyamide.

从上面所述可以看出，本发明提供的散热器，利用石墨膜的高导热性 As can be seen from the above, the heat sink provided by the present invention utilizes the high thermal conductivity of the graphite film.

(平面导热率约 1500W/mK)，热量能迅速沿着石墨膜进行面传递，从而减少了散热体内部的热传导路径，提高了散热体的散热速度，还能缩短导热界面材料或者发热器件向散热体传热所需的时间。本发明提供的散热器具有较高的导热速度，以及优越的散热性，可以迅速在表面进行热传播，并在散热器内达成热平衡。从而降低或消除热传导路径上温度梯度，使发热器件的温度变低，消除设备内部的温度不平衡热点区域，提高器件和设备的整体可靠性和长时间工作能力。因此，本发明具有较高的导热速度以及优越的散热性，具有可批量应用的实用价值。附图说明 (The plane thermal conductivity is about 1500W/mK), the heat can be transferred along the graphite film quickly, which reduces the heat conduction path inside the heat sink, improves the heat dissipation speed of the heat sink, and shortens the heat conduction interface material or the heat dissipation device. The time required for heat transfer. The heat sink provided by the invention has high heat conduction speed and superior heat dissipation, can rapidly spread heat on the surface, and achieve heat balance in the heat sink. Thereby, the temperature gradient on the heat conduction path is reduced or eliminated, the temperature of the heat generating device is lowered, the temperature unbalanced hot spot region inside the device is eliminated, and the overall reliability and long-term working ability of the device and the device are improved. Therefore, the invention has high heat conduction speed and superior heat dissipation, and has practical value for batch application. DRAWINGS

图 1为现有散热器的示意图； Figure 1 is a schematic view of a conventional heat sink;

图 2为本发明实施例 1的散热器的结构示意图; 2 is a schematic structural view of a heat sink according to Embodiment 1 of the present invention;

图 3为本发明实施例 2的散热器的结构示意图; 3 is a schematic structural view of a heat sink according to Embodiment 2 of the present invention;

图 4为本发明实施例 3的散热器的结构示意图; 4 is a schematic structural view of a heat sink according to Embodiment 3 of the present invention;

图 5为本发明实施例 6的散热器的结构示意图。具体实施方式 Fig. 5 is a schematic structural view of a heat sink according to Embodiment 6 of the present invention. detailed description

为使本发明的目的、技术方案和优点更加清楚明白，以下结合具体实施例，并参照附图，对本发明进一步详细说明。 In order to make the objects, the technical solutions and the advantages of the present invention more comprehensible, the present invention will be further described in detail below with reference to the accompanying drawings.

本发明提供一种散热器，所述散热器包括散热体以及覆盖在散热体表面的石墨膜。实施例 1 The present invention provides a heat sink including a heat sink and a graphite film covering the surface of the heat sink. Example 1

参考图 2，其为本发明实施例 1 的散热器的结构示意图。作为本发明的一个实施例，将石墨膜 204覆盖于散热体 103的表面，为使发热器件 101上的热量通过导热界面材料 102快速传至散热体 103，石墨膜 204的覆盖范围为散热体 103表面的通过导热界面材料 102与发热器件 101的接触部位处。 Referring to FIG. 2, it is a schematic structural view of a heat sink according to Embodiment 1 of the present invention. As an embodiment of the present invention, the graphite film 204 is covered on the surface of the heat sink 103, so that the heat on the heat generating device 101 is quickly transmitted to the heat sink 103 through the heat conductive interface material 102, and the coverage of the graphite film 204 is the heat sink 103. The surface passes through the contact portion of the thermally conductive interface material 102 with the heat generating device 101.

因此，当石墨膜 204的任何一个部分接收到导热界面材料 102传来的热量后，热量迅速在石墨膜 204上进行横向传导，然后整张石墨膜 204同时向散热体 103传递热量，提高了发热器件 101通过导热界面材料 102向散热体 103传输热量的速度。 Therefore, when any portion of the graphite film 204 receives the heat transferred from the thermally conductive interface material 102, the heat is rapidly conducted laterally on the graphite film 204, and then the entire graphite film 204 simultaneously transfers heat to the heat sink 103, thereby improving heat generation. The speed at which the device 101 transfers heat to the heat sink 103 through the thermally conductive interface material 102.

需要注意的是，所述石墨膜 204可以直接夹在导热界面材料 102和散热器件 103之间。如此，当导热界面材料 102与散热器件 103压合时，石墨膜 204就会覆盖于散热体 103的表面。 It should be noted that the graphite film 204 may be directly sandwiched between the thermally conductive interface material 102 and the heat dissipation device 103. Thus, when the thermally conductive interface material 102 is pressed against the heat sink member 103, the graphite film 204 covers the surface of the heat sink 103.

较佳地，导热界面材料 102 与石墨膜 204 尽可能地紧密接触，散热体 103与石墨膜 204也尽可能地紧密接触，以提高导热界面材料 102 向散热体 103传输热量的速度。实施例 2 Preferably, the thermally conductive interface material 102 is in intimate contact with the graphite film 204 as much as possible, and the heat sink 103 and the graphite film 204 are also brought into close contact as much as possible to increase the rate at which the thermally conductive interface material 102 transfers heat to the heat sink 103. Example 2

参考图 3，其为本发明实施例 2 的散热器的结构示意图。本实施例为本发明的优选实施例，将石墨膜 304覆盖于散热体 103 的表面，为进一步提高散热体 103的传热速度，石墨膜 304的覆盖范围为散热体 103的通过导热界面材料 102与发热器件 101相接触的整个表面。 Referring to FIG. 3, it is a schematic structural view of a heat sink according to Embodiment 2 of the present invention. This embodiment is In a preferred embodiment of the invention, the graphite film 304 is covered on the surface of the heat dissipating body 103. To further improve the heat transfer speed of the heat dissipating body 103, the coverage of the graphite film 304 is such that the heat dissipating body 103 passes through the heat conducting interface material 102 and the heat generating device 101. The entire surface of the contact.

所以，当石墨膜 304的任何一个部分接收到导热界面材料 102传来的热量后，热量迅速在石墨膜 304上进行横向传导，然后整张石墨膜 304同时向散热体 103进行纵向传热，使得散热体 103 内部也进行纵向传热，减短了传热路径。 Therefore, when any part of the graphite film 304 receives the heat transferred from the heat conducting interface material 102, the heat is rapidly conducted laterally on the graphite film 304, and then the entire graphite film 304 is simultaneously longitudinally transferred to the heat sink 103, so that Longitudinal heat transfer is also performed inside the heat sink 103, which shortens the heat transfer path.

优选地，导热界面材料 102 与石墨膜 304 尽可能地紧密接触，散热体 103与石墨膜 304也尽可能地紧密接触，以提高导热界面材料 102 向散热体 103传输热量的速度。 Preferably, the thermally conductive interface material 102 is in intimate contact with the graphite film 304 as much as possible, and the heat sink 103 and the graphite film 304 are also in intimate contact as much as possible to increase the rate at which the thermally conductive interface material 102 transfers heat to the heat sink 103.

本实例不但提高了导热界面材料 102 向散热体 103传输热量的速度，还提高了散热体 103内部的传热速度。实施例 3 This example not only increases the speed at which the thermal interface material 102 transfers heat to the heat sink 103, but also increases the heat transfer rate inside the heat sink 103. Example 3

石墨膜的覆盖范围并不仅限于上述实施例，为进一步提高散热器的传热速度，还可以在其更多的表面覆盖石墨膜。 The coverage of the graphite film is not limited to the above embodiment, and in order to further increase the heat transfer rate of the heat sink, it is also possible to cover the graphite film on more of its surface.

参考图 4，其为本发明实施例 3 的散热器的结构示意图，可以在散热体 103的整个表面上都覆盖石墨膜 404。在本实施例中，当石墨膜 404的任何一个部分接收到导热界面材料 102传来的热量后，热量迅速在石墨膜 404上传递。由于散热体 103 的整个表面都覆有石墨膜 404，所以热量迅速传至散热体 103的表面，无需进行散热体 103内部的热传导，散热体 103便可向外界进行交流热传递。 Referring to FIG. 4, which is a schematic structural view of a heat sink according to Embodiment 3 of the present invention, a graphite film 404 may be covered on the entire surface of the heat sink 103. In the present embodiment, when any portion of the graphite film 404 receives heat from the thermally conductive interface material 102, heat is rapidly transferred to the graphite film 404. Since the entire surface of the heat radiating body 103 is covered with the graphite film 404, heat is quickly transferred to the surface of the heat radiating body 103, and heat conduction inside the heat radiating body 103 is not required, and the heat radiating body 103 can transmit AC heat to the outside.

当然，导热界面材料 102与石墨膜 404尽可能地紧密接触，散热体 103 与石墨膜 404也尽可能地紧密接触，以提高导热界面材料 102 向散热体 103 传输热量的速度。实施例 4 Of course, the thermal interface material 102 is in intimate contact with the graphite film 404 as much as possible, and the heat sink 103 and the graphite film 404 are also in close contact as much as possible to increase the rate at which the thermal interface material 102 transfers heat to the heat sink 103. Example 4

但是在实施例 2和 3中，未与导热界面材料 102紧密接触的石墨膜却无法与散热体 103 保持紧密接触，真正起到传热作用的仅仅是与导热界面材料 102紧密接触的石墨膜，这会降低石墨膜的利用率。 However, in Embodiments 2 and 3, the graphite film which is not in close contact with the thermal conductive interface material 102 cannot be in close contact with the heat dissipating body 103, and only the graphite film which is in close contact with the thermal conductive interface material 102 is actually used for heat transfer. This will reduce the utilization of the graphite film.

因此，为了进一步提高散热器的传热速度，充分发挥散热体 103 表面石墨膜的利用率，在本实施例中，石墨膜通过导热粘接剂覆盖于所述散热体 103的表面。 Therefore, in order to further increase the heat transfer rate of the heat sink and fully utilize the utilization rate of the graphite film on the surface of the heat sink 103, in the present embodiment, the graphite film is covered with the heat sink by a heat conductive adhesive. The surface of 103.

选用片状高温硫化导热环氧树脂粘接剂（HTV, 即导热环氧树脂预固化片）作为本实施例的导热粘接剂：首先在片状 HTV的一侧叠放石墨膜，然后进行充分压合，使石墨膜固定于片状 HTV上；再将 HTV的另一侧放置于散热体 103的表面，然后进行压合，使片状 HTV固定于散热体 103的表面，得到表面覆盖有石墨膜的散热体；最后，将面覆盖有石墨膜的散热体进行热固化，热固化温度为约 60~70°C，热固化时间为约 10 分钟，得到石墨膜与散热体 103表面紧密接触的散热器。 A sheet-shaped high-temperature vulcanization thermally conductive epoxy resin adhesive (HTV, that is, a thermally conductive epoxy resin prepreg) is used as the thermal conductive adhesive of the present embodiment: First, a graphite film is stacked on one side of the sheet-shaped HTV, and then fully performed. Pressing, the graphite film is fixed on the sheet HTV; the other side of the HTV is placed on the surface of the heat sink 103, and then pressed to fix the sheet HTV to the surface of the heat sink 103, and the surface is covered with graphite. The heat sink of the film; finally, the heat sink covered with the graphite film is thermally cured, the heat curing temperature is about 60-70 ° C, and the heat curing time is about 10 minutes, and the graphite film is in close contact with the surface of the heat sink 103. heat sink.

较佳地，所述片状 HTV的面积不小于石墨膜的面积。所述片状 HTV的厚度约为 0.1mm, 导热率约为 lW/mK。实施例 5 Preferably, the area of the sheet-like HTV is not less than the area of the graphite film. The sheet-like HTV has a thickness of about 0.1 mm and a thermal conductivity of about lW/mK. Example 5

作为本发明的另一个实施例，本实施例选用液态高温硫化导热环氧树脂粘接剂（HTV) 作为导热粘接剂。 As another embodiment of the present invention, this embodiment employs a liquid high temperature vulcanization thermally conductive epoxy resin adhesive (HTV) as a thermally conductive adhesive.

选用液态高温硫化粘结剂（HTV) 作为本实施例的导热粘接剂：首先，采用刮涂的方法将液态 HTV均匀地涂覆于散热体 103的表面，然后将石墨膜固定于液态 HTV上，得到表面覆盖有石墨膜的散热体；最后，将表面覆盖有石墨膜的散热体进行热固化，热固化温度为约 60~70°C，热固化时间为约 lOmin, 得到石墨膜与散热体 103表面紧密接触的散热器。 The liquid high temperature vulcanization adhesive (HTV) is selected as the thermal conductive adhesive of the embodiment: First, the liquid HTV is uniformly applied to the surface of the heat dissipating body 103 by a doctor blade method, and then the graphite film is fixed on the liquid HTV. A heat sink having a surface covered with a graphite film is obtained. Finally, the heat sink covered with the graphite film is thermally cured, the heat curing temperature is about 60 to 70 ° C, and the heat curing time is about 10 min, and the graphite film and the heat sink are obtained. 103 heat sink with close contact with the surface.

较佳地，所述液态 HTV的涂覆厚度约为 0.1mm, 导热率约为 lW/mK。除此之外，也可以采用喷涂的方式将液态 HTV均匀地喷涂于散热体 103 需要指出的是，所述导热粘接剂并不限于高温硫化粘结剂（HTV), 也可以采用其他导热粘接剂使石墨膜覆盖于散热体的表面。 Preferably, the liquid HTV has a coating thickness of about 0.1 mm and a thermal conductivity of about lW/mK. In addition, the liquid HTV can be uniformly sprayed on the heat sink 103 by spraying. It should be noted that the heat conductive adhesive is not limited to a high temperature vulcanization adhesive (HTV), and other heat conductive adhesives may be used. The bonding agent covers the graphite film on the surface of the heat sink.

可选地，所述导热粘接剂为选自导热环氧树脂粘接剂、丙烯酸系树脂导热环氧树脂粘接剂和硅系导热粘接剂中的任意一种。 Alternatively, the thermally conductive adhesive is any one selected from the group consisting of a thermally conductive epoxy resin adhesive, an acrylic resin thermal epoxy resin adhesive, and a silicon thermal conductive adhesive.

优选地，所述导热环氧树脂粘接剂为选自室温硫化导热环氧树脂粘接剂和高温硫化导热环氧树脂粘接剂中的任意一种。实施例 6 Preferably, the thermally conductive epoxy resin adhesive is any one selected from the group consisting of a room temperature vulcanization thermally conductive epoxy resin adhesive and a high temperature vulcanization thermal conductive epoxy resin adhesive. Example 6

本实施例采用与实施例 2 相同的应用方式，不同之处在于，不使用导热界面材料 102，图 5为其示意图，发热器件 101直接与石墨膜 504接触。发热器件 101直接向散热体 103快速传热，从而消除了导热界面材料的热阻，提高热效率，从而节约了生产成本。较佳地，石墨膜 504通过导热粘接剂覆盖于所述散热体 103的表面。 This embodiment adopts the same application method as that of Embodiment 2, except that the heat conductive interface material 102 is not used, and FIG. 5 is a schematic view thereof, and the heat generating device 101 is directly in contact with the graphite film 504. The heat generating device 101 directly transfers heat to the heat sink 103, thereby eliminating the thermal resistance of the heat conducting interface material and improving the heat efficiency, thereby saving production costs. Preferably, the graphite film 504 is covered on the surface of the heat sink 103 by a thermally conductive adhesive.

当然，也可在实施例 1和 3中不使用导热界面材料 102，将发热器件 101 直接与石墨膜接触。 Of course, it is also possible to use the thermally conductive interface material 102 in Examples 1 and 3 to directly contact the heat generating device 101 with the graphite film.

需要指出的是，除以上所述实施例外，也可以在除散热体与导热界面材料或者发热器件的接触部位之外的任何一处或者多处覆盖石墨膜，使得该处的热传递速度提高，从而提高散热体的散热速度。 It should be noted that, in addition to the above-mentioned implementation, the graphite film may be covered at any one or more places except the contact portion of the heat sink and the heat conductive interface material or the heat generating device, so that the heat transfer speed there is improved. Thereby increasing the heat dissipation speed of the heat sink.

优选地，至少将石墨膜覆盖在散热体与导热界面材料或者发热器件的接触部位。如此，不但能提高散热器的散热速度，还能缩短导热界面材料或者发热器件向散热器传热所需的时间。 Preferably, at least the graphite film is covered on the contact portion of the heat sink and the thermally conductive interface material or the heat generating device. In this way, not only can the heat dissipation rate of the heat sink be increased, but also the time required for the heat transfer interface material or the heat generating device to transfer heat to the heat sink can be shortened.

上述实施例所使用的散热体，其本体材料可以包括金属、金属合金和非金属材料中的至少一种。较佳地，所述金属材料可以包括铝和铜中的至少一种；所述金属合金材料可以包括铝合金和铜合金中的至少一种；所述非金属材料可以包括有机玻璃和结构塑料中的至少一种。 The heat sink used in the above embodiment may have at least one of a metal, a metal alloy, and a non-metal material. Preferably, the metal material may include at least one of aluminum and copper; the metal alloy material may include at least one of an aluminum alloy and a copper alloy; the non-metal material may include organic glass and structural plastic. At least one of them.

所述散热体的形状并不唯一，可以是选自用于计算机芯片的带风扇鳍状散热体、不带风扇鳍状散热体、用于功率电子设备的金属压铸散热腔或箱体、以及用于移动电子设备中可充当散热器的金属结构件和 /或非金属结构件中的任意一种。 The shape of the heat sink is not unique, and may be selected from a fan fin heat sink for a computer chip, a fan fin heat sink without a fan, a metal die casting heat sink or a case for a power electronic device, and Any of a metal structural member and/or a non-metallic structural member that can function as a heat sink in a mobile electronic device.

如上所述，本发明提供的散热器，利用石墨膜的高导热性，热量能迅速沿着石墨膜进行面传递，从而减少了散热体内部的热传导路径，提高了散热体的散热速度，还能缩短导热界面材料或者发热器件向散热体传热所需的时间。 As described above, the heat sink provided by the present invention utilizes the high thermal conductivity of the graphite film, and the heat can be quickly transferred along the surface of the graphite film, thereby reducing the heat conduction path inside the heat sink and improving the heat dissipation speed of the heat sink. Shorten the time required for the thermal interface material or the heat generating device to transfer heat to the heat sink.

因此，本发明提供的散热器具有较高的导热速度，以及优越的散热性。这种新型的散热器可以迅速在表面进行热传播，并在散热器内达成热平衡，从而，降低或消除热传导路径上温度梯度，使发热器件的温度变低，消除设备内部的温度不平衡热点区域，提高器件和设备的整体可靠性和长时间工作 Therefore, the heat sink provided by the invention has a high heat conduction speed and superior heat dissipation. This new type of heat sink can quickly heat the surface and achieve thermal equilibrium in the heat sink, thereby reducing or eliminating the temperature gradient on the heat conduction path, lowering the temperature of the heat generating device, and eliminating the temperature imbalance hotspot inside the device. Improve overall reliability and long-term operation of devices and equipment

Claims

权利要求书 Claim

1. 一种散热器，其特征在于，所述散热器包括散热体以及覆盖在散热体表面的石墨膜。 A heat sink, characterized in that the heat sink comprises a heat sink and a graphite film covering the surface of the heat sink.

2. 根据权利要求 1所述的散热器，其特征在于，所述石墨膜覆盖在所述散热体表面的通过导热界面材料与发热器件相接触的部位上。 The heat sink according to claim 1, wherein the graphite film covers a portion of the surface of the heat sink that is in contact with the heat generating device through the heat conductive interface material.

3. 根据权利要求 2所述的散热器，其特征在于，所述石墨膜覆盖在所述散热体的通过导热界面材料与发热器件相接触的整个表面上。 3. The heat sink according to claim 2, wherein the graphite film covers the entire surface of the heat sink that is in contact with the heat generating device through the heat conductive interface material.

4. 根据权利要求 1所述的散热器，其特征在于，所述散热体的表面全部覆盖有所述石墨膜。 The heat sink according to claim 1, wherein the surface of the heat sink is entirely covered with the graphite film.

5. 根据权利要求 1所述的散热器，其特征在于，所述石墨膜通过导热粘接剂覆盖于所述散热体的表面。 The heat sink according to claim 1, wherein the graphite film is covered on a surface of the heat sink by a heat conductive adhesive.

6. 根据权利要求 5所述的散热器，其特征在于，所述导热粘接剂为选自导热环氧树脂粘接剂、丙烯酸系树脂导热粘接剂、硅系导热粘接剂中的任意一禾中。 The heat sink according to claim 5, wherein the heat conductive adhesive is any one selected from the group consisting of a thermally conductive epoxy resin adhesive, an acrylic resin thermal conductive adhesive, and a silicon thermal conductive adhesive. One in the middle.

7. 根据权利要求 6所述的散热器，其特征在于，所述导热环氧树脂粘接剂为选自室温硫化导热环氧树脂粘接剂和高温硫化导热环氧树脂粘接剂中的任意一种。 The heat sink according to claim 6, wherein the thermally conductive epoxy resin adhesive is any one selected from the group consisting of a room temperature vulcanization thermally conductive epoxy resin adhesive and a high temperature vulcanization thermal conductive epoxy resin adhesive. One.

8. 根据权利要求 5所述的散热器，其特征在于，所述导热粘接剂的厚度为 0.05~lmm。 The heat sink according to claim 5, wherein the heat conductive adhesive has a thickness of 0.05 to 1 mm.

9. 根据权利要求 8所述的散热器，其特征在于，所述导热粘接剂的厚度为 0.1~0.5mm。 The heat sink according to claim 8, wherein the heat conductive adhesive has a thickness of 0.1 to 0.5 mm.

10. 根据权利要求 5 所述的散热器，其特征在于，所述导热粘接剂的导热率为不小于 0.5 W/mK。 The heat sink according to claim 5, wherein the heat conductive adhesive has a heat conductivity of not less than 0.5 W/mK.

11. 根据权利要求 10所述的散热器，其特征在于，所述导热粘接剂的导热率为不小于 lW/mK。 The heat sink according to claim 10, wherein the heat conductive adhesive has a heat conductivity of not less than 1 W/mK.

12. 根据权利要求 1~11 中任意一项所述的散热器，其特征在于，所述散热体是选自用于计算机芯片的带风扇鳍状散热体、不带风扇鳍状散热体、用于功率电子设备的金属压铸散热腔或箱体、以及用于移动电子设备中可充当散热器的金属结构件和 /或非金属结构件中的任意一种。 The heat sink according to any one of claims 1 to 11, wherein the heat sink is selected from a fan fin heat sink for a computer chip, a fan fin heat sink, and A metal die-cast heat sink or case for a power electronic device, and any one of a metal structural member and/or a non-metallic structural member that can serve as a heat sink for use in a mobile electronic device.

13. 根据权利要求 1 所述的导热体，其特征在于，所述石墨膜为将高分子膜经热处理后得到的人工石墨膜。 The heat conductor according to claim 1, wherein the graphite film is a high score An artificial graphite film obtained by heat treatment of a sub-film.

14. 根据权利要求 13所述的导热体，其特征在于，所述高分子膜选自聚噁二唑、聚酰亚胺、聚对亚苯基亚乙烯、聚苯并咪唑、聚苯并噁唑、聚苯并双噁唑、聚噻唑、聚苯并噻唑、聚苯并双噻唑和聚酰胺的膜中的至少一种。 The heat conductor according to claim 13, wherein the polymer film is selected from the group consisting of polyoxadiazole, polyimide, polyparaphenylene vinylene, polybenzimidazole, polybenzoxazole At least one of a film of azole, polybenzobisoxazole, polythiazole, polybenzothiazole, polybenzobisthiazole, and polyamide.