CN113453484A - Heat radiation assembly and electronic device thereof - Google Patents

Abstract

The present disclosure discloses a heat dissipating assembly and an electronic device thereof, wherein the heat dissipating assembly (100) includes: a thermally conductive layer (110) and a heat absorbing layer (120). According to the heat dissipation assembly disclosed by the invention, the heat transfer efficiency can be improved, so that the problem of heat dissipation of a heating device can be effectively solved.

Description

Heat radiation assembly and electronic device thereof

Technical Field

The present disclosure relates generally to the field of heat dissipation. More particularly, the present disclosure relates to a heat dissipation assembly and an electronic device thereof.

Background

With the rapid development of the field of artificial intelligence, the computing power of artificial intelligence products is improved unprecedentedly. However, the increase of the calculation power also brings phenomena of large heat generation power consumption of devices in the product, high device temperature and the like. In addition, the work of many artificial intelligence products is periodic or intermittent, which means that devices inside the products generate heat periodically or intermittently, which may lead to the temperature of the devices being increased intensively and rapidly in a short time, and further may lead to problems such as reliability and life reduction of the products. Meanwhile, the development of artificial intelligence products tends to be miniaturized and light-weighted, and the overall size of the products is strictly required, so that a plurality of traditional heat dissipation measures which occupy more space cannot be applied.

Disclosure of Invention

In view of the above-mentioned technical problems, the technical solution of the present disclosure provides a heat dissipating assembly and an electronic device thereof in various aspects.

In one aspect, the present disclosure provides a heat dissipation assembly comprising: a heat conductive layer for transferring heat periodically or intermittently dissipated from a heat source; and a heat absorbing layer in surface contact with the heat conductive layer for absorbing the heat transferred by the heat conductive layer to be released outward, wherein a thermal conductivity of the heat conductive layer is larger than that of the heat absorbing layer.

In another aspect, the present disclosure provides an electronic device comprising a heat source that operates periodically or intermittently and a heat dissipation assembly as described herein disposed on the heat source.

Through the above description of the solution of the present disclosure, those skilled in the art can understand that the heat dissipation assembly of the present disclosure respectively utilizes the high thermal conductivity of the thermal conductive layer and the heat absorption property of the thermal absorption layer to respectively perform rapid heat transfer and absorption, so that the heat dissipation assembly according to the present disclosure has both high-efficiency heat dissipation and temperature control performance, and further improves the heat transfer efficiency, thereby effectively solving the heat dissipation problem of heat generation of the heat source, especially the heat dissipation problem of periodic or intermittent heat generation of the heat source. Further, the heat dissipation assembly is simple in structure and small in occupied space, and the heat dissipation problem of small-size products can be solved.

Drawings

The above-described features of the present disclosure may be better understood, and its numerous objects, features, and advantages made apparent to those skilled in the art by referencing the accompanying drawings, wherein like reference numerals refer to like elements, and wherein:

FIG. 1 is a schematic diagram generally illustrating a heat dissipation assembly according to the present disclosure;

2 a-2 c are various schematic diagrams illustrating the area of the heat conductive layer of the heat dissipation assembly being greater than or equal to the area of the heat absorbing layer in accordance with an embodiment of the present disclosure;

FIG. 3 is a schematic diagram illustrating a heat dissipation assembly including a fixed layer in accordance with the present disclosure;

4 a-4 c are various schematic diagrams illustrating a heat dissipation assembly including an encapsulation layer according to embodiments of the present disclosure;

FIGS. 5a and 5b are various schematic views illustrating a heat dissipation assembly having flexibility in accordance with an embodiment of the present disclosure;

FIG. 6 is a schematic view illustrating a heat sink assembly including a cooling member according to the present disclosure;

FIG. 7 is a schematic view illustrating the application of a heat dissipation assembly according to the present disclosure to a heat dissipation device;

figures 8a and 8b are various schematic diagrams illustrating adaptive shape adjustment of a heat dissipation assembly according to an embodiment of the present disclosure; and

FIG. 9 is a schematic diagram illustrating the use of a heat dissipation assembly according to an embodiment of the present disclosure as a interstitial heat dissipation assembly.

Detailed Description

The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present disclosure, and not all embodiments. All other embodiments, which can be derived by one skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the scope of protection of the present disclosure.

The present disclosure addresses the deficiencies of the prior art by providing a completely new and useful solution. In particular, the heat dissipation assembly of the present disclosure can rapidly transfer heat dissipated from a heat source through the heat conductive layer with a high thermal conductivity, and can maximally absorb the heat transferred from the heat conductive layer by contacting the heat absorbing layer with the surface of the heat conductive layer, thereby effectively solving the heat dissipation problem during operation of the device. As will be understood by those skilled in the art from the following description, the heat dissipation assembly according to the present disclosure is not only simple in structure and small in occupied space, but also flexible and capable of withstanding a certain bending, thereby being flexibly applicable to different products and different structures of products.

Embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.

Fig. 1 is a schematic diagram generally illustrating a heat dissipation assembly according to the present disclosure. As shown in fig. 1, there is provided a heat dissipation assembly 100, which may include: a heat conductive layer 110 for transferring heat emitted from a heat source; and a heat absorption layer 120 that can be in surface contact with the heat conductive layer 110 for absorbing the heat transferred by the heat conductive layer 110 to be released to the outside, wherein a thermal conductivity of the heat conductive layer 110 is greater than a thermal conductivity of the heat absorption layer 120.

The heat source described above may be an object capable of emitting heat. The thermally conductive layer 110 can be in direct or indirect contact with a heat source to transfer heat dissipated by the heat source. In one embodiment, the thermally conductive layer 110 may be used to transfer heat that is periodically or intermittently dissipated by a heat source. The thermal conductivity of the thermally conductive layer 110 is greater than the thermal conductivity of the heat absorbing layer 120, i.e. the thermal conductivity of the thermally conductive layer 110 is greater than the thermal conductivity of the heat absorbing layer 120. The heat conductive layer 110 having high thermal conductivity can rapidly transfer heat of a heat source to the entire heat conductive layer 110 and can further transfer heat to, for example, the heat absorbing layer 120 or the ambient environment in contact therewith.

As shown in fig. 1, the shape of the thermal conductive layer 110 can be configured as desired, for example, in one embodiment, the shape of the thermal conductive layer 110 can match the shape of the heat source. The thickness of the heat conductive layer 110 can be adjusted as needed, for example, according to the size of the space. In another embodiment, the thermally conductive layer 110 can be flexible (e.g., made thin enough, or made of a flexible material, etc.) and can withstand some degree of bending or folding, such as an arc or zigzag, etc., and thus can better adapt to heat sources of different configurations and shapes.

In one embodiment according to the present disclosure, the heat conductive layer 110 may include at least one of a metal foil and a high thermal conductivity non-metallic material. For example, in one embodiment, the thermally conductive layer 110 can include a metal foil. In another embodiment, the heat conductive layer 110 may comprise a high thermal conductivity non-metallic material. In yet another embodiment, the thermally conductive layer 110 may comprise a composite of a metal foil and a high thermal conductivity non-metallic material. The metal foil may include one or more of copper foil, aluminum foil, silver foil, etc., and since metals generally have high thermal conductivity, according to the disclosure, the metal foil may be selected as the thermal conductive layer 110, and the thermal conductivity of copper may reach 380w/(m · k), taking copper foil as an example. The high thermal conductivity non-metallic material can be a non-metallic material having a thermal conductivity greater than the thermal conductivity of the heat absorbing layer 120, such as one or more of graphene, graphite sheets, and the like.

The heat absorbing layer 120 has a lower thermal conductivity than the heat conductive layer 110, but the heat absorbing layer 120 has a better heat absorbing performance and can absorb heat transferred by the heat conductive layer 110, for example, can absorb heat periodically or intermittently transferred by the heat conductive layer 110. And the heat absorbing layer 120 and the heat conducting layer 110 can be in surface contact to absorb the heat transferred on the heat conducting layer 110 to the maximum extent, so as to avoid the temperature of the heat conducting layer 110 from rising greatly, thereby avoiding the temperature of the heat generating device (i.e. heat source) from rising greatly. In one embodiment, when the heat source periodically or intermittently emits heat, the heat absorbing layer 120 may absorb its heat to prevent the temperature of the heat source from greatly increasing; when the heat source stops generating heat, the heat absorbing layer 120 may gradually release the previously absorbed heat to the ambient environment. In another embodiment, the heat absorbing layer 120 may absorb heat when the heat source periodically or intermittently emits heat, and gradually release the absorbed heat to the surrounding environment.

Further, the heat absorbing layer 120 may be flexible (e.g., made thin enough or selected from a soft material, etc.) and may be able to withstand some degree of bending or folding, and thus may better adapt to different configurations and shapes of heat sources. The thickness of the heat absorbing layer 120 can be adjusted as desired, for example, according to the size of the space or the required heat absorbing capacity. The shape, size, etc. of the heat absorbing layer 120 can be set according to the needs, for example, in one embodiment, the area of the heat absorbing layer 120 can be larger than the area of the heat conducting layer 110, and according to such a setting, the heat transferred by the heat conducting layer 110 may not be transferred to various positions of the heat absorbing layer 120, and the heat absorbing efficiency of the heat absorbing layer 120 will be related to the thermal conductivity of the heat absorbing layer 120. In another embodiment, the area of the thermal conductive layer 110 may be greater than or equal to the area of the thermal absorption layer 120 (i.e. the contact area with the thermal conductive layer 110) to rapidly transfer the heat to the entire contact surface of the thermal absorption layer 120, so that the heat can be absorbed at various positions of the thermal absorption layer 120, thereby fully utilizing the heat absorption potential of the thermal absorption layer 120 to improve the heat dissipation efficiency and the heat dissipation capability of the entire heat dissipation assembly 100.

According to another embodiment of the present disclosure, the heat absorbing layer 120 may be made of a phase change material that absorbs or emits heat during phase change, but the temperature is kept constant, thereby having good temperature control performance. The phase change material can be organic phase change material, inorganic phase change material, composite phase change material, and the like, such as one or more of graphite and paraffin, metal foam and organic or inorganic phase change material, and the like. According to the arrangement, by utilizing the high heat conductivity of the heat conduction layer 110, the heat periodically or intermittently emitted by the heat source can be quickly transferred to the phase change material of the whole heat absorption layer 120, so that the phase change latent heat of the phase change material can be fully utilized to absorb more heat, and the defect that the phase change potential cannot be fully utilized due to the low heat conductivity coefficient and the low heat transfer performance of the phase change material is overcome. Particularly, when the area of the heat conductive layer 110 is greater than or equal to the area of the heat absorbing layer 120, each position of the phase change material can absorb heat, so that the phase change can be integrally performed instead of locally performed, the utilization rate of the phase change material of the heat absorbing layer 120 can be increased, and the heat dissipation capability of the heat dissipation assembly 100 can be directly improved.

While a heat dissipation assembly in accordance with the present disclosure is generally described above in connection with fig. 1, it should be understood by those skilled in the art that the structure of the heat dissipation assembly 100 shown in fig. 1 is exemplary and not limiting, for example, the thickness of the heat conductive layer 110 and the thickness of the heat absorbing layer 120 may not be limited to be equal in the illustration, and may be adjusted as desired, for example, in one embodiment, the thickness of the heat conductive layer 110 may be greater than the thickness of the heat absorbing layer 120; in another embodiment, the thickness of the thermal conductive layer 110 can be less than the thickness of the heat absorbing layer 120. The areas of the heat conductive layer 110 and the heat absorbing layer 120 are not limited to be equal in the illustration, and may be set to be unequal. The area of the heat conductive layer is greater than or equal to the area of the heat absorbing layer, and various arrangements of the heat conductive layer and the heat absorbing layer will be exemplarily described below with reference to fig. 2a to 2 c.

As shown in fig. 2a, according to an embodiment of the present disclosure, the thermal conductive layer 110 may have a first side 111 and a second side 112, the first side 111 may be used for transferring the heat emitted from the heat source 200 (e.g., periodically or intermittently emitted), and the second side 112 may be in surface contact with the heat absorption layer 120 to transfer the heat to the heat absorption layer 120. Heat dissipated (e.g., periodically or intermittently dissipated) by the heat source 200 can be transferred outwardly through the first side 111 of the thermally conductive layer 110 in direct or indirect contact therewith, to various locations (e.g., in the direction of the lateral arrows in the illustration) of the thermally conductive layer 110, and through the second side 112 of the thermally conductive layer 110 to the heat absorbing layer 120 in surface contact therewith (e.g., in the direction of the vertical arrows in the illustration).

The area of the thermal conductive layer 110 may be equal to the area of the heat absorbing layer 120, for example, as shown in fig. 2a, the contact surface 121 of the heat absorbing layer 120 contacting the thermal conductive layer 110 may be equal to the area of the second surface 112 of the thermal conductive layer 110. According to such an arrangement, the heat transferred by the thermal conductive layer 110 can be transferred to the whole contact surface 121 of the thermal absorption layer 120 to the maximum extent, and can be further transferred to various positions in the thermal absorption layer 120, and the first surface 111 and the second surface 112 of the thermal conductive layer 110 can be fully utilized, which is beneficial to reducing the size of the thermal conductive layer 110. Further, such an arrangement can maximize the effective utilization area of the heat absorbing layer 120 on one side of the heat conductive layer 110, which is advantageous for making the heat absorbing layer 120 thinner and having a greater heat absorbing potential.

As shown in fig. 2b, according to another embodiment of the present disclosure, the thermal conductive layer 110 may have a first side 111, and the heat source 200 and the heat absorbing layer 120 may be located on the first side 111, i.e. the heat source 200 and the heat absorbing layer 120 may be located on the same side (e.g. the first side 111 in the figure) of the thermal conductive layer 110, which is beneficial to further reduce the occupied space of the heat dissipation assembly. As can be seen from the above description and shown in fig. 2b, the area of the thermal conductive layer 110 can be larger than the area of the heat absorbing layer 120, i.e. the area of the contact surface 121 of the heat absorbing layer 120 and the thermal conductive layer 110 in the illustration can be smaller than the area of the first surface 111 of the thermal conductive layer 110.

According to such an arrangement, the heat can be transferred in the direction of the arrows in fig. 2b, i.e., the heat emitted (e.g., periodically or intermittently emitted) by the heat source 200 can be transferred outward through the first side 111 of the heat conductive layer 110 directly or indirectly contacting therewith and to various locations of the heat conductive layer 110 (e.g., the direction of the lateral arrows in the illustration), and can still be transferred through the first side 111 of the heat conductive layer 110 to the heat absorbing layer 120 in surface contact therewith (e.g., the direction of the vertical arrows in the illustration).

According to one embodiment of the present disclosure, as shown in fig. 2b, there may be a physical separation between the heat absorbing layer 120 and the heat source 200 (e.g., the heat absorbing layer 120 is shown spaced a distance from the heat source 200). In another embodiment, the heat absorbing layer 120 can be in direct or indirect contact with the heat source 200, i.e., the heat absorbing layer 120 can absorb heat transferred by the heat conductive layer 110 in contact with the heat absorbing layer, and can also directly absorb heat emitted from the heat source 200.

As shown in fig. 2c, the thermal conductive layer 110 can have a first side 111 and a second side 112, the first side 111 can be used to transfer heat periodically or intermittently dissipated by the heat source 200, the heat absorbing layers 120-1, 120-2 can be in surface contact with the thermal conductive layer 110, and the heat source 200 and the heat absorbing layer 120-1 can be located on the first side 111 and the heat absorbing layer 120-2 can be located on the second side 112. The area of the contact surface 121-1 of the heat absorbing layer 120-1 contacting the thermal conductive layer 110 can be smaller than the area of the first surface 111 of the thermal conductive layer 110, and the area of the contact surface 121-2 of the heat absorbing layer 120-2 contacting the thermal conductive layer 110 can be equal to the area of the second surface 112 of the thermal conductive layer 110. The heat absorbing layer 120-1 may be physically spaced from the heat source 200 (as shown) or may be in direct or indirect contact.

According to such an arrangement, the heat can be transferred in the direction of the arrows in fig. 2c, i.e., the heat emitted from the heat source 200 (e.g., periodically or intermittently emitted) can be transferred out through the first side 111 of the thermal conductive layer 110 directly or indirectly contacting the thermal conductive layer 110 and to various locations of the thermal conductive layer 110 (e.g., the direction of the arrows in the thermal conductive layer 110 in the illustration), and can be transferred to the heat absorbing layers 120-1 and 120-2 in contact with the first side 111 and the second side 112 of the thermal conductive layer 110 (e.g., the direction of the arrows in the heat absorbing layers 120-1 and 120-2 in the illustration).

According to such an arrangement, the heat absorbing layer is disposed on both sides of the heat conducting layer 110, so that the total area of the contact surfaces (such as the contact surfaces 121-1 and 121-2 in the illustration) of the heat absorbing layer and the heat conducting layer 110 can be further increased, thereby facilitating the improvement of the heat absorbing capacity and the heat absorbing efficiency of the heat absorbing layer, and the thickness of the heat absorbing layer 120 can be made thinner, thereby facilitating the reduction of the occupied space of the heat dissipating assembly, the improvement of the flexibility of the heat dissipating assembly, and the like.

While various arrangements of the heat conducting layer and the heat absorbing layer of the heat dissipating assembly according to the present disclosure are exemplarily described above with reference to fig. 2 a-2 c, those skilled in the art can adjust the arrangements as needed under the teaching of the present disclosure, for example, the area of the heat absorbing layer 120 may not be limited to the area equal to that of the heat conducting layer 110 shown in fig. 2a, and may be set to be larger or smaller than that of the heat conducting layer 110 as needed. The number of heat sources 200 that the heat conductive layer 110 directly or indirectly contacts may not be limited to the one shown in fig. 2 a-2 c, and the number of heat sources 200 may be more as needed. For example, in one embodiment, the thermal conductive layer 110 of FIG. 2c can be configured to transfer heat dissipated by two heat sources disposed on the first side 111 and the second side 112 of the thermal conductive layer 110, respectively, and the area of the heat absorbing layer 120-2 disposed on the second side 112 can be configured to be smaller than the area of the thermal conductive layer 110. Further, the structure of the heat dissipation assembly may not be limited to the one shown in fig. 2 a-2 c including the heat conductive layer and the heat absorbing layer, but may also include, for example, a fixing layer, etc., which will be described below with reference to fig. 3.

Fig. 3 is a schematic diagram illustrating a heat dissipation assembly including a fixed layer according to the present disclosure. As shown in fig. 3, a heat dissipation assembly 100 is provided that can include a thermally conductive layer 110, a heat absorbing layer 120, and can further include a securing layer 130 that can be disposed on the thermally conductive layer 110 for securing the heat dissipation assembly 100 to the heat source. The thermally conductive layer 110 may make indirect contact with a heat source through the fixed layer 130 and may transfer heat dissipated (e.g., periodically or intermittently) by the heat source. The structure and arrangement of the heat conductive layer 110 and the heat absorbing layer 120 shown in fig. 3 have been described in detail in the foregoing, and are not described in detail herein. The fixing layer 130 will be described below.

As shown in fig. 3, the fixing layer 130 may be disposed on the thermal conductive layer 110, which may be connected with the thermal conductive layer 110 by means of, for example, gluing, mechanical pressing, etc. The area of the fixing layer 130 may be equal to the area of the thermal conductive layer 110 (as shown in the figure), or may be larger or smaller than the area of the thermal conductive layer 110 as required. The fixing layer 130 may be used to fix the heat dissipation assembly 100 on the heat source, for example, by means of adhesion, magnetic attraction, clamping, etc. In one embodiment, the fixing layer 130 may be made of a back adhesive with strong adhesion, and may be directly adhered to a heat source for easy installation. According to another embodiment of the present disclosure, the fixing layer may further have an insulating property. For example, in yet another embodiment, the fixing layer 130 may be composed of an insulating back adhesive.

While the heat dissipation assembly including the fixing layer according to the present disclosure is described above with reference to fig. 3, it will be understood by those skilled in the art that the structure of the heat dissipation assembly 100 shown in the drawings is exemplary and not limiting, and for example, the shape of the fixing layer 130 may be set as desired. For example, in one embodiment, the shape of the fixed layer 130 may match the shape of the heat source. In another embodiment, the fastening layer 130 may be thin and flexible to withstand some degree of bending or folding, such as bending into an arc or zigzag shape, to better accommodate different configurations and shapes of heat sources. The fixed layer 130 may be provided not only as one piece in the illustration but also as a plurality of pieces as necessary. The fixed layer 130 may not be limited to being disposed on one side of the thermal conductive layer 110 as shown, for example, in one embodiment, a plurality of fixed layers 130 may be disposed on different sides of the thermal conductive layer 110, respectively. The structure of the heat dissipation assembly according to the present disclosure may not be limited to the one including the fixing layer, the heat conductive layer, and the heat absorbing layer shown in fig. 3, but may further include other structures, such as an encapsulation layer, etc., as needed, which will be exemplarily described below in connection with fig. 4a to 4 c.

Fig. 4 a-4 c are various schematic diagrams illustrating a heat dissipation assembly including an encapsulation layer according to embodiments of the present disclosure. As shown in fig. 4a, according to an embodiment of the present disclosure, there is provided a heat dissipation assembly 100, which may include a heat conductive layer 110, a heat absorbing layer 120, and may further include an encapsulation layer 140 for fixing and protecting the heat absorbing layer 120, which may be disposed on the heat absorbing layer 120 such that the heat absorbing layer 120 is fixed between the heat conductive layer 110 and the encapsulation layer 140. The structure and arrangement of the heat conducting layer 110 and the heat absorbing layer 120 shown in fig. 4a have been described in detail in the foregoing, and will not be described again here. The encapsulation layer 140 will be described below.

The encapsulation layer 140 described above may be composed of an insulating material. The packaging layer 140 can fix and protect the heat absorbing layer 120 by packaging the heat absorbing layer 120, so as to maintain the shape and structure of the heat dissipating assembly 100, and protect the heat absorbing layer 120 from external influences, so as to prevent the material of the heat absorbing layer 120 from being contaminated and damaged or from being lost. For example, in one embodiment, the heat absorbing layer 120 may include a phase change material, and the encapsulation layer 140 is disposed to effectively prevent the phase change material from changing its shape during the phase change process to affect the shape and structure of the entire heat dissipation assembly 100.

As shown in fig. 4a, the encapsulation layer 140 may be arranged on the heat absorbing layer 120, which may be connected with the heat absorbing layer 120 by means of e.g. gluing, mechanical pressing, etc. The encapsulation layer 140 can be disposed such that the heat absorbing layer 120 is fixed between the thermal conductive layer 110 and the encapsulation layer 140, for example, by disposing the thermal conductive layer 110 and the encapsulation layer 140 on two sides of the heat absorbing layer 120. The area of the encapsulation layer 140 may be equal to the area of the heat absorbing layer 120 (e.g., as shown in the figures), or may be larger or smaller than the area of the heat absorbing layer 120 as desired. For example, in one embodiment, the encapsulation layer 140 may be configured to wrap the heat absorbing layer 120 to facilitate encapsulating the heat absorbing layer 120 therein. This will be described in connection with fig. 4 b.

As shown in fig. 4b, the difference from the heat dissipation assembly 100 shown in fig. 4a is that: the heat dissipation assembly 100 in fig. 4b has the area of the heat conductive layer 110 larger than the area of the heat absorbing layer 120, and the area of the encapsulation layer 140 larger than the area of the heat absorbing layer 120, and the heat absorbing layer 120 can be wrapped inside, so that the heat absorbing layer 120 is fixed between the heat conductive layer 110 and the encapsulation layer 140, i.e. the heat absorbing layer 120 is in surface contact with the heat conductive layer 110 and can be encapsulated in the encapsulation layer 140. The material, function, and connection of the package layer 140 are the same as or similar to those described above with reference to fig. 4a, and are not described again here.

While the heat dissipation assembly including the heat conductive layer, the heat absorbing layer, and the encapsulation layer according to the present disclosure is exemplarily described above with reference to fig. 4a and 4b, it will be understood by those skilled in the art in light of the teachings of the present disclosure that the heat dissipation assembly according to the present disclosure may further include a fixing layer, which will be exemplarily described below with reference to fig. 4 c.

As shown in fig. 4c, a heat dissipation assembly 100 is provided, which may include a fixing layer 130, a thermal conductive layer 110, a heat absorbing layer 120, and an encapsulation layer 140, wherein the fixing layer 130 may be disposed on the thermal conductive layer 110 and may be used to fix the entire heat dissipation assembly 100 to a heat source, the thermal conductive layer 110 may be used to transfer heat dissipated (e.g., periodically or intermittently dissipated) by the heat source, the heat absorbing layer 120 may be disposed between the thermal conductive layer 110 and the encapsulation layer 140 and may be used to absorb heat transferred by the thermal conductive layer 110, and the layers may be connected by gluing, mechanical pressing, or the like. The shapes, materials, and connection manners of the fixing layer 130, the thermal conductive layer 110, the heat absorbing layer 120, and the package layer 140 are described in detail above, and will not be described again.

In addition, the areas of the fixing layer 130, the thermal conductive layer 110, the thermal absorption layer 120, and the encapsulation layer 140 described above may not be limited to be equal as shown in fig. 4c, and the area of each layer may be flexibly set as needed. The arrangement of the layers is not limited to the arrangement shown in the drawings and can be adjusted as required, for example, the fixing layer 130 and the heat absorbing layer 120 are not limited to the arrangement shown in the drawings and can be arranged on the same surface as the heat conductive layer 110. The thickness of each layer of the heat dissipation assembly 100 is not limited to the thickness shown in the drawings, and may be adjusted as needed. The fixing layer 130, the thermal conductive layer 110, the heat absorbing layer 120 and the encapsulation layer 140 can all have flexibility, so that the heat dissipation assembly 100 can have flexibility and can bear a certain degree of bending, for example, can be formed into an arc shape or a zigzag shape, so as to be suitable for heat dissipation of heat sources with different shapes or structures. To facilitate understanding of the flexibility of the heat dissipation assembly according to the present disclosure, an example will be described below in connection with fig. 5a and 5 b.

Fig. 5a and 5b are various schematic views illustrating a heat dissipation assembly having flexibility according to an embodiment of the present disclosure. As shown in fig. 5a, the heat conductive layer 110, the heat absorbing layer 120, the fixing layer 130 and the encapsulation layer 140 of the heat dissipation assembly 100 are all flexible, so that the heat dissipation assembly 100 can be flexible as a whole, for example, to have a zigzag shape as shown in the figure. The composition, shape, connection manner, heat transfer manner, etc. of the heat conduction layer 110, the heat absorption layer 120, the fixing layer 130, and the encapsulation layer 140 are described in detail in the foregoing, and are not described again here.

As shown in fig. 5b, the heat dissipation assembly 100 may include a heat conductive layer 110 having flexibility, a plurality of heat absorption layers (e.g., 120-1, 120-2, etc.), a plurality of fixing layers (e.g., 130-1, 130-2, etc.), and a plurality of encapsulation layers (e.g., 140-1, 140-2, etc.), among them, the heat absorbing layers 120-1, 120-2 may be respectively disposed on both sides of the heat conductive layer 110, the fixing layers 130-1, 130-2 may be respectively disposed on both sides of the heat conductive layer 110, the fixing layer 130-1 and the heat absorbing layer 120-2 may be disposed on the same side of the heat conductive layer 110, the fixing layer 130-2 and the heat absorbing layer 120-1 may be disposed on the same side of the heat conductive layer 110, and the encapsulation layers 140-1 and 140-2 are respectively disposed on the heat absorbing layers 120-1 and 120-2. The heat dissipating module 100 may be folded in a zigzag shape as a whole. According to such an arrangement, the heat dissipation assembly 100 can be fixed on both sides while ensuring the heat dissipation effect of the heat dissipation assembly 100. The composition, shape, connection manner, heat transfer manner, etc. of the heat conduction layer 110, the heat absorption layers (120-1, 120-2), the fixing layers (130-1, 130-2), and the encapsulation layers (140-1, 140-2) are described in detail in the foregoing, and will not be described again.

The flexibility of the heat dissipation assembly according to the present disclosure, and the arrangement of the fixing layer and the heat absorbing layer disposed on the same surface or both surfaces of the heat conductive layer, etc., are exemplarily described above with reference to fig. 5a and 5b, and those skilled in the art can adjust the structure, the number of layers, the arrangement, etc., of the heat dissipation assembly according to the present disclosure as needed. For example, the structure of the heat dissipation assembly may not be limited to the illustrated structure including the encapsulation layer, and in one embodiment, the heat absorption layer may have a stable shape, the encapsulation layer may not be fixed and protected, and the heat dissipation assembly may not be provided with the encapsulation layer. The structure of the heat dissipation assembly may not be limited to the one shown in the drawings including the fixing layer, and for example, in another embodiment, in the case where the heat dissipation assembly can be held in contact with a heat source, the fixing may be performed without the fixing layer. The shape of the heat dissipation assembly may not be limited to the zigzag shape in the figure, and may be an arc shape, a wave shape, a step shape, or the like as needed. A cooling member may be disposed on the heat sink assembly 100 to absorb heat, as will be described with reference to fig. 6.

FIG. 6 is a schematic diagram illustrating a heat sink assembly including a cooling member according to the present disclosure. As shown in fig. 6, the heat dissipation assembly 100 may include a heat conductive layer 110, a heat absorbing layer 120, and may further include a cooling member 150, which may be disposed on at least one of the heat conductive layer 110 and the heat absorbing layer 120, for further absorbing the heat, so that the overall heat absorbing capacity of the heat dissipation assembly 100 may be increased. The heat conductive layer 110 and the heat absorbing layer 120 are the same or similar to those described above and will not be described herein. The cooling member 150 will be described below by way of example.

The cooling member 150 described above may include one or more. The cooling member 150 can be disposed on the thermally conductive layer 110 (e.g., as shown in fig. 6) or can be disposed on other components of the heat dissipation assembly 100, for example, in one embodiment, the cooling member 150 can be disposed on the heat absorbing layer 120. In another embodiment, the cooling member 150 may be disposed on the heat conductive layer 110 and the heat absorbing layer 120. In yet another embodiment, the heat dissipation assembly 100 may further comprise a stationary layer disposed on the heat conductive layer 110, and the cooling member 150 may be disposed on the stationary layer for further absorbing the heat. In yet another embodiment, the heat dissipation assembly 100 may further comprise an encapsulation layer disposed on the heat absorbing layer 120, and the cooling member 150 may be disposed on the encapsulation layer for further absorbing the heat. The manner in which the cooling member 150 is disposed on at least one of the thermal conductive layer 110, the heat absorbing layer 120, the fixing layer, and the encapsulation layer may include a direct or indirect contact manner, a manner in which fixing is performed by gluing, mechanical pressing, fastening with a fastener, welding, or the like.

The cooling member 150 is a member having cooling and heat absorbing functions, and may be one or more of a member containing a cooling medium, a metal conductor, a heat sink, and the like. Since metal is a good thermal conductor, it can act as a cold side carrier for the heat sink 100. In one embodiment, the cooling member 150 may be formed of a housing made of a material with a high thermal conductivity (e.g., a metal housing, etc.) and a content containing a cooling medium (e.g., water, ice, frozen brine, etc., or a mixture thereof). In another embodiment, the cooling element 150 may be a housing of the heat dissipation assembly 100 or a cold end component of a product itself containing a heat source, and selecting the component of the product itself as the cooling element does not cause space occupation, and can meet the requirements of miniaturization of the product and severe requirements on the size of the product.

While the cooling members of the heat dissipating assembly according to the present disclosure have been described above with reference to fig. 6, it will be understood by those skilled in the art that the illustrated cooling members 150 are exemplary and not restrictive, and for example, the number, arrangement positions, etc. of the cooling members 150 may be set as desired. The shape of the cooling member 150 is not limited to the semicircular shape in the drawing, and may be provided as needed, for example, in a sheet shape, a block shape, a strip shape, and the like. The heat dissipation assembly 100 may not be limited to the illustrated structure including the heat conductive layer 110, the heat absorbing layer 120, and the cooling member 150, but may be provided with one or more of a fixing layer, an encapsulation layer, and the like as needed.

The heat dissipation assembly disclosed by the invention has the characteristics of simple structure, small occupied space and the like, and can be applied to various electronic devices or heat dissipation devices for heat dissipation. The heat dissipation assembly disclosed by the invention can have flexibility, can be well adapted to the change of a heat dissipation space, and is favorable for improving the tolerance capability of heat dissipation measures. The heat dissipation assembly disclosed by the invention has the capability of transferring heat and absorbing heat, and is beneficial to improving the heat dissipation efficiency of heat dissipation measures. The following description will be made in conjunction with various embodiments.

Fig. 7 is a schematic view illustrating a heat dissipation assembly according to the present disclosure applied to a heat dissipation device. As shown in fig. 7, there is provided an apparatus 300 for dissipating heat, which may include: a heat dissipation housing 310 having an interior cavity 311 for receiving a heat generating device (i.e., a heat source as described above) and at least one opening 312; and at least one heat dissipating assembly (flexible heat dissipating assembly for short) 320 having flexibility according to the present disclosure, which is connected to the heat dissipating housing 310 and disposed at the opening 312 to contact the heat generating device and transfer heat dissipated from the heat generating device to the heat dissipating housing 310.

One or more openings 312 may be provided in the heat dissipation housing 310. One or more flexible heat dissipation assemblies 320 may be disposed at one of the openings 312 to contact one or more heat generating devices. For example, in one embodiment, one flexible heat dissipation assembly 320 may contact one heat generating device. In another embodiment, multiple flexible heat dissipation assemblies may contact one heat generating device.

The flexible heat sink assembly 320 described above may undergo some degree of bending and may change shape. The flexible heat dissipation assembly 320 may be any of the heat dissipation assemblies described above according to the present disclosure and will not be described herein. A portion of the flexible heat sink assembly 320 may be connected to the heat dissipation housing 310, and another portion thereof may be in contact with the heat generating device to transfer heat emitted from the heat generating device to the heat dissipation housing 310. The flexible heat sink 320 may be disposed at a contact position with the heat generating device as needed, for example, the contact position may be adjusted according to the heat generating position of the heat generating device. The flexible heat dissipation assembly 320 may be in direct contact or indirect contact with the heat generating device. In one embodiment, the flexible heat sink assembly 320 may be attached to the heat generating device by gluing, pressing, welding, or the like. In another embodiment, the flexible heat sink assembly 320 may be detachably contacted with the heat generating device by close contact, magnetic attraction, clamping, elastic contact, or the like. In yet another embodiment, the flexible heat dissipation assembly 320 and the heat generating device may form a point contact, a line contact, a surface contact, or the like.

According to one embodiment of the present disclosure, a heat dissipation assembly may also be used to support the heat generating device. The heat dissipation assembly according to the present disclosure may not only have flexibility but also have a certain strength to maintain shape stability. For example, the heat dissipation assembly is in contact with the bottom of the heat generating device, in some application scenarios, the heat generating device may generate pressure on the heat dissipation assembly, and the heat dissipation assembly may support the heat generating device to maintain a contact state with the heat generating device and a position of the heat generating device to be stable. The heat dissipation assembly according to the present embodiment may not only be used to transfer heat, but also have a mechanical support function.

While the heat dissipation assembly according to the present disclosure has been described above with reference to fig. 7 for a heat dissipation device, it should be understood by those skilled in the art that the structure shown in fig. 7 is exemplary and not limiting, for example, the flexible heat dissipation assembly 320 may not be limited to the heat dissipation housing connected to one side of the opening 312, and may be disposed to extend to the heat dissipation housing on the other side of the opening 312 as needed, so that the flexible heat dissipation assembly 320 is connected to or in contact with the heat dissipation housings on both sides of the opening 312. The shape of the flexible heat dissipation assembly 320 is not limited to the wave shape shown in the drawings, and can be configured into a desired shape, such as a straight line, a step, a zigzag, a circular ring, etc., as required, and the adaptive shape adjustment of the heat dissipation assembly will be exemplarily described below with reference to fig. 8a and 8 b.

Fig. 8a and 8b are various schematic diagrams illustrating adaptive shape adjustment of a heat dissipation assembly according to embodiments of the present disclosure. As shown in fig. 8a and 8b, the flexible heat dissipation assembly 320 is connected with the heat dissipation housing 310 and disposed at the opening 312, and the flexible heat dissipation assembly 320 is in contact with the heat generating device 200 in the inner cavity 311 of the heat dissipation housing 310 to transfer heat dissipated from the heat generating device 200, and the connection of the flexible heat dissipation assembly 320 and the heat dissipation housing 310 may be located on an outer wall of the heat dissipation housing 310.

As shown in fig. 8a, the heat generating device 200 has a size or thickness exceeding the inner cavity 311 of the heat dissipation housing 310, and the flexible heat dissipation assembly 320 may be bent into a suitable shape to adapt to the relative position of the heat generating device 200 and the heat dissipation housing 310, such as similar to a zigzag shape in the drawing, according to which the flexible heat dissipation assembly 320 can be connected with the heat dissipation housing 310 and maintain contact with the heat generating device 200. The connection point of the flexible heat dissipation assembly 320 and the heat dissipation housing 310 may be located on the same plane of the flexible heat dissipation assembly 320 as the contact point of the flexible heat dissipation assembly 320 and the heat generating device 200. It should be understood by those skilled in the art that the shape of the flexible heat dissipation assembly 320 may not be limited to that shown in fig. 8a, but may be adaptively changed according to the thickness, size, etc. of the heat generating device 200. For ease of understanding, the following exemplary description is provided in connection with fig. 8 b.

The difference between the representation in fig. 8b and fig. 8a is that: the size of the heat generating device 200 does not exceed the space of the inner cavity 311, and the flexible heat dissipation assembly 320 may be adjusted to a suitable shape, such as a shape bent in the opposite direction to the shape shown in fig. 8a (as shown in fig. 8 b), according to the relative position of the heat generating device 200 and the heat dissipation housing 310, so that the flexible heat dissipation assembly 320 can be connected with the heat dissipation housing 310 and maintain contact with the heat generating device 200.

While the above describes exemplary embodiments of adaptive shape adjustment of the flexible heat dissipation assembly 320 according to the present disclosure in conjunction with fig. 8a and 8b, it will be understood by those skilled in the art that the shape of the flexible heat dissipation assembly 320 can be adaptively adjusted according to the size of different heat generating devices 200 and the relative positions of the heat generating devices 200 and the heat dissipation housing 310, so as to maintain the contact between the flexible heat dissipation assembly 320 and the heat generating devices 200, thereby ensuring heat dissipation efficiency. The flexible heat sink assembly 320 is connected to the outer wall 8 of the heat sink housing 310 to save space in the inner cavity 311 for the arrangement of heat generating devices. The flexible heat sink assembly 320 may not be limited to being attached to the outer wall of the heat sink housing 310 as shown, and in another embodiment, the connection of the flexible heat sink assembly 320 to the heat sink housing 310 may be located on the inner wall of the heat sink housing 310. In yet another embodiment, the connection of the flexible heat dissipation assembly 320 to the heat dissipation housing 310 may be on a different face of the flexible heat dissipation assembly 320 than the contact of the flexible heat dissipation assembly 320 to the heat generating device 200. The heat dissipation assembly according to the present disclosure may be used not only as a flexible heat dissipation assembly but also as a gap-fill heat dissipation assembly, as will be exemplarily described below with reference to fig. 9.

FIG. 9 is a schematic diagram illustrating the use of a heat dissipation assembly according to an embodiment of the present disclosure as a interstitial heat dissipation assembly. Because the heat radiation component disclosed by the invention has the characteristics of small occupied space, small shape and thickness which can be set according to needs and the like, the limited space can be fully utilized for radiating heat of the heating device. For example, as shown in fig. 9, a heat dissipation assembly 330 according to the present disclosure may be disposed between the inner wall of the heat dissipation case 310 and the heat generating device 200 to dissipate heat from the heat generating device 200 by making full use of the limited space of the inner cavity 311 in a manner of filling up a gap, and such a heat dissipation assembly for gap filling is hereinafter referred to as a gap filling heat dissipation assembly.

As shown in fig. 9, the interstitial heat dissipation assembly 330 may be disposed (e.g., in a padding manner) in a gap between the inner wall of the heat dissipation housing 310 and the heat generating device 200 for transferring and absorbing heat emitted from the heat generating device 200. The thickness of the interstitial heat dissipation assembly 330 may be set according to the size of the gap between the inner wall of the heat dissipation housing 310 and the heat generating device 200. The interstitial heat sink assembly 330 may be in contact or connected with the heat generating device 200.

While the above description is made in connection with fig. 9 for an embodiment in which the heat dissipation assembly according to the present disclosure serves as interstitial heat dissipation, it will be understood by those skilled in the art that the illustration in fig. 9 is exemplary and not limiting, for example, the interstitial heat dissipation assembly 330 may not be limited to being disposed in the gap illustrated between the top of the heat generating device 200 and the heat dissipation housing 310, may be adjusted according to the size, shape, and the like of the heat generating device 200, and for example, in one embodiment, the interstitial heat dissipation assembly 330 may be disposed in a space in the lateral direction between the heat generating device and the heat dissipation housing. The number of interstitial heat dissipation assemblies 330 may not be limited to one of the illustrated, and may be more as needed.

From the above description, those skilled in the art can understand that the heat dissipation device using the heat dissipation assembly according to the present disclosure has good adaptability, can be compatible with heat generating devices with different thickness specifications, has good tolerance capability, and can fully utilize the limited heat dissipation space to improve the heat dissipation efficiency of the heat generating devices. In addition, according to the embodiment of the disclosure, a plurality of heat dissipation assemblies can be in contact with the same heat generating device, so as to further accelerate the heat dissipation speed of the heat generating device.

Further, according to another aspect of the present disclosure, there is provided an electronic device that may include a heat source that operates periodically or intermittently and a heat dissipation assembly as described in the present disclosure disposed on the heat source. The heat source may be a component, device, etc. that generates heat during operation. The heat dissipation assembly and the arrangement of the heat dissipation assembly and the heat source according to the present disclosure have been described in detail in the foregoing with reference to various embodiments, and are not described in detail herein.

The electronic devices on which the heat dissipation assembly of the present disclosure may be arranged may include artificial intelligence products (e.g., integrated circuit boards), data processing devices, robots, computers, printers, scanners, tablets, smart terminals, tachographs, navigators, sensors, cameras, servers, cameras, projectors, mobile storage, wearable devices, vehicles, home appliances, and/or medical devices, among others.

In the above-mentioned technical solution of the heat dissipation assembly of the present disclosure, the heat conduction layer and the heat absorption layer are disposed to respectively utilize the high heat conductivity and the heat absorption property thereof to realize the rapid heat transfer and absorption, so as to solve the heat dissipation problem of the heat generating device (i.e. the heat source), especially the periodic or intermittent heat dissipation problem of the heat generating device. The structure, the thickness and the like of the heat dissipation assembly can be adjusted according to needs (for example, a thin film structure can be formed), the occupied space is small, and the heat dissipation assembly can be suitable for heat dissipation of small-sized products and application scenes with limited heat dissipation space. Further, the heat dissipation assembly according to the present disclosure may have flexibility, may be able to withstand a certain bending, may be able to adapt to heat sources of different shapes or structures, and may have high application flexibility. The heat dissipation assembly disclosed by the invention also has the characteristics of simple structure, low cost and the like.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments. Various technical features of the embodiments may be arbitrarily combined, and for brevity, all possible combinations of the technical features in the embodiments are not described. However, as long as there is no contradiction between combinations of these technical features, the scope of the present specification should be considered as being described.

The foregoing may be better understood in light of the following clauses:

clause a1, a heat dissipation assembly, comprising: a heat conductive layer for transferring heat periodically or intermittently dissipated from a heat source; and a heat absorbing layer in surface contact with the heat conductive layer for absorbing the heat transferred by the heat conductive layer to be released outward, wherein a thermal conductivity of the heat conductive layer is larger than that of the heat absorbing layer.

Clause a2, the heat dissipation assembly of clause a1, wherein the thermally conductive layer has a first face for transferring the heat periodically or intermittently dissipated by the heat source and a second face in facial contact with the heat absorbing layer.

Clause A3, the heat dissipation assembly of clause a1, wherein the thermally conductive layer has a first face, the heat source and the heat absorbing layer being located on the first face.

Clause a4, the heat dissipation assembly of clause a1, wherein the thermally conductive layer has an area greater than or equal to the area of the heat absorbing layer to transfer the heat to the entire contact surface of the heat absorbing layer.

Clause a5, the heat dissipation assembly of any one of clauses a1-a4, further comprising a securing layer disposed on the thermally conductive layer for securing the heat dissipation assembly to the heat source.

Clause a6, the heat dissipation assembly of clause a5, wherein the securing layer is also insulative.

Clause a7, the heat dissipation assembly of clause a1, further comprising an encapsulation layer for securing and protecting the heat absorbing layer, disposed on the heat absorbing layer such that the heat absorbing layer is secured between the heat conductive layer and the encapsulation layer.

Clause A8, the heat dissipation assembly of clause a6 or a7, wherein the heat absorbing layer is comprised of a phase change material and the thermally conductive layer comprises at least one of a metal foil and a high thermal conductivity, non-metallic material.

Clause a9, the heat dissipation assembly of clause a1, further comprising a cooling element disposed on at least one of the thermally conductive layer and the heat absorbing layer for further absorbing the heat.

Clause a10, the heat dissipation assembly of clause a5 or a6, further comprising a cooling member disposed on the fixed layer for further absorbing the heat.

Clause a11, the heat dissipation assembly of clause a7, further comprising a cooling element disposed on the encapsulation layer for further absorbing the heat.

Clause a12, an electronic device, comprising a heat source operating periodically or intermittently and a heat dissipation assembly as recited in any of clauses a1-a11 disposed on the heat source.

The embodiments of the present disclosure have been described in detail, and the principles and embodiments of the present disclosure have been explained herein using specific examples, which are provided only to help understand the concepts of the present disclosure and its core ideas. Meanwhile, a person skilled in the art should, according to the idea of the present disclosure, change or modify the embodiments and applications of the present disclosure. In view of the above, this description should not be taken as limiting the present disclosure.

Claims (12)

1. A heat dissipation assembly, comprising:

a heat conductive layer for transferring heat periodically or intermittently dissipated from a heat source; and

a heat absorbing layer in surface contact with the heat conductive layer for absorbing the heat transferred by the heat conductive layer to be released outward,

wherein the thermal conductivity of the thermally conductive layer is greater than the thermal conductivity of the heat absorbing layer.

2. The heat dissipation assembly of claim 1, wherein the thermally conductive layer has a first side for transferring the heat periodically or intermittently dissipated by the heat source and a second side in facial contact with the heat absorbing layer.

3. The heat dissipation assembly of claim 1, wherein the thermally conductive layer has a first side, the heat source and the heat absorbing layer being located on the first side.

4. The heat dissipation assembly of claim 1, wherein the area of the thermally conductive layer is greater than or equal to the area of the heat absorbing layer to transfer the heat to the entire contact surface of the heat absorbing layer.

5. The heat dissipation assembly of any of claims 1-4, further comprising a securing layer disposed on the thermally conductive layer for securing the heat dissipation assembly to the heat source.

6. The heat dissipation assembly of claim 5, wherein the securing layer further comprises insulation.

7. The heat dissipation assembly of claim 1, further comprising an encapsulation layer for securing and protecting the heat absorption layer, disposed on the heat absorption layer such that the heat absorption layer is secured between the thermal conductive layer and the encapsulation layer.

8. The heat dissipation assembly of claim 6 or 7, wherein the heat absorbing layer is comprised of a phase change material and the thermally conductive layer comprises at least one of a metal foil and a high thermal conductivity non-metallic material.

9. The heat dissipation assembly of claim 1, further comprising a cooling element disposed on at least one of the heat conductive layer and heat absorbing layer for further absorbing the heat.

10. The heat dissipation assembly of claim 5 or 6, further comprising a cooling element disposed on the fixed layer for further absorbing the heat.

11. The heat dissipation assembly of claim 7, further comprising a cooling element disposed on the encapsulation layer for further absorbing the heat.

12. An electronic device comprising a heat source that operates periodically or intermittently and the heat dissipation assembly as defined in any one of claims 1 to 11 disposed on the heat source.

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