CN102400116B - Plating device applicable to print circuit board - Google Patents
Plating device applicable to print circuit board Download PDFInfo
- Publication number
- CN102400116B CN102400116B CN201110027292.4A CN201110027292A CN102400116B CN 102400116 B CN102400116 B CN 102400116B CN 201110027292 A CN201110027292 A CN 201110027292A CN 102400116 B CN102400116 B CN 102400116B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- pcb
- printed circuit
- coating solution
- injection unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Abstract
Provided is a plating device applicable to a print circuit board. The plating device comprises: a plating groove accepting the print circuit board, a first injection unit and a second injection unit which are formed at different positions of the edge of the print circuit board contained in the plating groove and composed of multiple nozzles for injecting plating solution, and a first guide direction and a second guide direction which are formed ahead of the first injection unit and the second injection unit and change the flowing of the plating solution injected from the first and second injection units to the print circuit board.
Description
The cross reference of related application
The application requires the right of priority of in September, 2010 korean patent application No.10-2010-0089026 that 10 Korea S Department of Intellectual Property submits to, and its content is incorporated into this for your guidance.
Technical field
The present invention relates to a kind of plater for printed circuit board (PCB), more specifically, relate to a kind of like this plater for printed circuit board (PCB), it can carry out plating by forming along the mobile streamline of whole printed circuit board (PCB) on whole printed circuit board (PCB).
Background technology
Printed circuit board (PCB) (PCB) for example, by (being formed at insulating material, resol insulcrete, epoxy resins insulation plate etc.) on wiring diagram each device being mounted thereon is electrically connected to, to each device, supply electric power etc., and simultaneously, machinery is fixed these devices.As printed circuit board (PCB), have and only in a side of insulated substrate, on the one side PCB of formation wiring, the both sides at insulated substrate, form the two-sided PCB of wiring and with multilayer, form the multi-ply wood (MLB) connecting up.
Wherein, the technique of manufacturing two-sided PCB or MLB comprises such technique: when forming schematic circuit on the both sides of PCB or when being formed at the protective layer that on the contact pad on outermost layer, formation is made by gold (Au), nickel (Ni) etc., on the both sides of PCB, carry out plating.
According to the plater for plating printed circuit board (PCB) of prior art, several printed circuit board (PCB)s are incorporated into plating groove, and use from the plating liquid plating printed circuit board (PCB) of nozzle ejection.Due to several printed circuit board (PCB)s are contained in plating groove simultaneously, because of the mobile ununiformity of the coating solution in plating groove, cause the local obstruction of coating solution (congest), or the coating solution being incorporated in the gap between printed circuit board (PCB) can not smooth flow.Therefore, cannot carry out equably plating, thereby cause the mass defect of printed circuit board (PCB).
Especially, when plating groove is narrower, may near printed circuit board (PCB), form eddy current, make not to whole printed circuit board (PCB) plating, on the contrary, a part of plating to printed circuit board (PCB) only, thus the mass defect of printed circuit board (PCB) caused.
Summary of the invention
One aspect of the present invention provides a kind of plater for printed circuit board (PCB), and it has by being formed on streamline mobile on whole printed circuit board (PCB) flow line system that can the whole printed circuit board (PCB) of plating.
According to an aspect of the present invention, provide a kind of plater for printed circuit board (PCB), comprising: the plating groove that holds printed circuit board (PCB); Injection unit, it is formed on the inwall of plating groove and by a plurality of nozzles that spray coating solution and forms, and coating solution is flowed along the inwall of plating groove; And liner, be formed on the direction of the coating solution spraying from injection unit, and this liner changes flowing of coating solution in the parallel direction in the surface with printed circuit board (PCB), make the surface flow along the mobile coating solution of the inwall of plating groove along printed circuit board (PCB).
Injection unit can be configured to comprise the first injection unit and the second injection unit, they are formed at the different positions place on the inwall of plating groove, and formed by a plurality of nozzles that spray coating solution, coating solution is flowed along the inwall of plating groove, and, liner can be configured to comprise the first liner and the second liner, they are formed on from the first and second injection units sprays the direction of coating solution, and in the parallel direction in the surface with printed circuit board (PCB), change flowing of coating solution, make the coating solution that sprays from the first and second injection units along the surface flow of printed circuit board (PCB).
The first and second injection units can be formed on the same level on the inwall of plating groove, and, the first and second liners can be formed on the injection direction of the first and second injection units, to change flowing of coating solution in the parallel direction in the surface with printed circuit board (PCB), make the surface flow along the mobile coating solution of the inwall of plating groove along printed circuit board (PCB).
The first injection unit can be arranged on the lower edge of plating groove, the second injection unit can be formed on the lower center of plating groove, and, the first and second liners can all be formed on the injection direction of the first and second injection units, so that the direction of the mobile coating solution of the inwall along plating groove is changed into the direction parallel with the surface of printed circuit board (PCB), coating solution is flowed along lower surface and the upper surface of printed circuit board (PCB).
Injection unit can utilize transverse injection scheme to spray coating solution.
Plating groove can hold a plurality of printed circuit board (PCB)s simultaneously.
The amount that is incorporated into the coating solution in the gap between each printed circuit board (PCB)s of described a plurality of printed circuit board (PCB)s can be 35% or more of its overall flow rate.
Electroless Plating Ni, electroless plating Pd and soak gold (ENEPIG) technique can be for printed circuit board (PCB).Particularly, can be for the plating Pd of ENEPIG technique for the plater of printed circuit board (PCB).
Accompanying drawing explanation
From the detailed description below in conjunction with accompanying drawing, will more clearly understand above and other aspect of the present invention, feature and other advantage, in accompanying drawing:
Fig. 1 is according to the broken-open perspective view of the plater for printed circuit board (PCB) of an exemplary embodiment of the present invention;
Fig. 2 is according to the cross-sectional view of the plater for printed circuit board (PCB) of an exemplary embodiment of the present invention; And
Fig. 3 shows the mobile glide path figure for the coating solution in the plater of printed circuit board (PCB) being formed at according to an exemplary embodiment of the present invention.
Embodiment
Hereinafter, with reference to accompanying drawing detailed description exemplary embodiment, make one of skill in the art of the present invention can put into practice like a cork these illustrative embodiments.Yet, in describing illustrative embodiments of the present invention, omit the detailed description of well-known function or structure, can by unnecessary detailed description, not make description of the invention fuzzy like this.
In addition, in all figure, similar reference number represents to carry out the parts of identity function and action.
In addition, unless described clearly in addition, will understand " comprising " any parts and represent to comprise other parts, rather than get rid of any other parts.
Fig. 1 is according to the broken-open perspective view of the plater for printed circuit board (PCB) of an exemplary embodiment of the present invention, and Fig. 2 is according to the cross-sectional view of the plater for printed circuit board (PCB) of an exemplary embodiment of the present invention.
With reference to figure 1, according to the plater for printed circuit board (PCB) of an exemplary embodiment of the present invention, comprise: the plating groove 100 that holds printed circuit board (PCB) 110; Injection unit, is formed on the inwall of plating groove and by a plurality of nozzles that spray coating solution and forms, and coating solution is flowed along the inwall of plating groove; And liner, be formed on from injection unit and spray the direction of coating solution, and this liner changes flowing of coating solution, make the surface flow along the mobile coating solution of the inwall of plating groove along printed circuit board (PCB).
Can in single plating groove, form a plurality of injection units.According to an illustrative embodiment of the invention, injection unit can be configured to comprise two injection units,, the first injection unit and the second injection unit, they are formed at the different positions place on the inwall of plating groove, and formed by a plurality of nozzles that spray coating solution, coating solution is flowed along the inwall of plating groove, but be not limited to this.
In addition, plater according to an illustrative embodiment of the invention comprises being formed on from the first injection unit and the second injection unit and sprays the first liner and the second liner the direction of coating solution.The first liner can be changed into the direction parallel with the surface of printed circuit board (PCB) by the mobile direction of inwall flowing from coating solution along plating groove of coating solution with the second liner,, coating solution is along the direction of the surface flow of printed circuit board (PCB), makes the coating solution that sprays from the first injection unit and the second injection unit along the whole surface flow of printed circuit board (PCB).
Particularly, according to an illustrative embodiment of the invention, the first injection unit and the second injection unit are formed on the same level on the inwall of plating groove, and, the first liner is formed on the distance separating with predetermined space on the injection direction of the first injection unit, and the second liner is formed on the distance separating with predetermined space on the injection direction of the second injection unit, thereby make will to change into along the direction of the surface flow of printed circuit board (PCB) along the direction of the mobile coating solution of inwall.
With reference to figure 1, the first injection unit 10,20 and 30, be arranged on the lower edge of plating groove, and the first liner 201 is formed on the distance separating with predetermined space on the injection direction of the first injection unit 10,20 and 30.In addition, be appreciated that the second injection unit 40,50 and 60 is formed on the lower center of plating groove, and the second liner 202 is formed on its lower edge.
Mobile along the inwall of plating groove from the coating solution of the first injection unit and the injection of the second injection unit.Then, the first liner and the second liner be the mobile surface flow of changing into along printed circuit board (PCB) of coating solution, that is, and and in the parallel direction in the surface with printed circuit board (PCB).
Plating groove 100 is according to an illustrative embodiment of the invention carried out plating technic by spray coating solution in plating technic.
Plating groove 100 according to an illustrative embodiment of the invention can be used in Electroless Plating Ni, electroless plating Pd and soak in gold (ENEPIG) technique, but is not limited to this.ENEPIG technique is mainly divided into plating Ni, plating Pd and plating Au.The plating groove using in ENEPIG technique is carried out plating, arranges 10 to 25 printed circuit board (PCB)s simultaneously according to the size of plating groove in a plating groove.
Particularly, plating groove 100 according to an illustrative embodiment of the invention can be for plating Pd.In order to carry out plating Pd, adopt such scheme: from the coating solution of the nozzle ejection in plating groove 100 be disposed to printed circuit board (PCB) with by Pd ion-transfer to printed circuit board (PCB).
According to an illustrative embodiment of the invention, in order to carry out metal deposition in plating groove, 10 to 25 printed circuit board (PCB)s are incorporated in plating groove 100.Then, by the first injection unit 10,20 and the 30 and second injection unit 40,50 and 60, spray coating solution, described injection unit consists of a plurality of nozzles that are positioned at the edge of the printed wiring panel area that is contained in plating groove 110.Coating solution is being evenly distributed on whole printed circuit board (PCB) with after to its supplying metal ion, coating solution flows out to a strainer by outlet.In addition, plating groove has the hot well tank being arranged on wherein, to carry out reposefully plating, makes in heat protocol, the temperature of coating solution to be remained on to 80 ℃.
The plater for printed circuit board (PCB) according to an illustrative embodiment of the invention prevents that coating solution is interior local obstruction of plating groove 100, or prevents from producing eddy current in a part for printed circuit board (PCB).And its coating solution that prevents from being incorporated in the gap between printed circuit board (PCB) does not flow reposefully.Therefore, can be at a plurality of printed circuit board (PCB)s carry out equably on the whole metal deposition.
According to an illustrative embodiment of the invention, a plurality of printed circuit board (PCB)s 110 can be incorporated in plating groove 100.According to an illustrative embodiment of the invention, can utilize single plating technic to carry out a plurality of printed circuit board (PCB)s 110 of plating.
And nonessentially utilize single plating technic to carry out a plurality of printed circuit board (PCB)s 110 of plating.Yet, in order effectively to carry out plating technic and to shorten the plating time, can utilize single plating technic to carry out the several printed circuit board (PCB)s of plating.And, printed circuit board (PCB) can be incorporated in plating groove 100, so that its both sides of plating or one-sided.
With reference to figure 1 and Fig. 2, be appreciated that and in plating groove 100, be formed with a plurality of nozzles 10,20,30,40,50 and 60.
According to an illustrative embodiment of the invention, the first injection unit 10,20 and the 30 and second injection unit 40,50 and 60 are all formed on the bottom of plating groove 100, to construct a flow line system, make coating solution at the interior formation streamline of plating groove 100.
The first injection unit 10,20 and the 30 and second injection unit 40,50 and 60 can utilize various schemes to spray coating solution.As the scheme of spraying coating solution, there is the Jet with downward flow direction scheme of Jet with downward flow direction coating solution in plating groove 100 and the transverse injection scheme of transverse injection coating solution in plating groove 100.
According to an illustrative embodiment of the invention, can adopt the transverse injection scheme that coating solution is laterally injected into plating groove 100, but be not limited to this.
In using the situation of Jet with downward flow direction scheme, may form eddy current in the bottom of printed circuit board (PCB), and 25% or coating solution still less of overall flow rate are introduced in the gap between printed circuit board (PCB).
Yet, according to an illustrative embodiment of the invention, adopt transverse injection scheme, thereby make to prevent that the bottom at printed circuit board (PCB) from producing eddy current, and the coating solution in the gap being incorporated between printed circuit board (PCB) is increased to 35% or more of its overall flow rate.
According to an illustrative embodiment of the invention, can be by being formed at the first injection unit 10,20 and the 30 and second injection unit 40,50 and 60 the first liner 201 and the second liner 202 above, the coating solution of the side of plating groove 100 will be injected into from the first injection unit 10,20 and the 30 and second injection unit 40,50 and 60, guiding for upwards flowing in plating groove 100, that is, in printed circuit board (PCB) direction, flow.
With reference to figure 1 and Fig. 2, the first liner 201 according to an illustrative embodiment of the invention and the second liner 202 be formed on the first injection unit 10,20 of being formed by three nozzles and 30 and the second injection unit 40,50 of being formed by three nozzles and 60 before, to change from the direction of the coating solution of the first injection unit 10,20 and the 30 and second injection unit 40,50 and 60 transverse injections.
According to an illustrative embodiment of the invention, the first injection unit 10,20 and 30, the first liner 210, the second injection unit 40,50 and the 60 and second liner 202 form flow line system, to form a plurality of streamlines of coating solution on whole printed circuit board (PCB), thereby spray coating solution on whole printed circuit board (PCB).Therefore, the whole printed circuit board (PCB) of plating equably.
Fig. 3 shows the glide path figure being formed at according to the streamline for the coating solution in the plater of printed circuit board (PCB) of example meaning property embodiment of the present invention.
Referring to figs. 2 and 3, be appreciated that the streamline of the coating solution forming according to an exemplary embodiment of the present invention is formed on whole printed circuit board (PCB).
According to an illustrative embodiment of the invention, the first injection unit 10,20 and 30, the first liner 210, the second injection units 40,50 and the 60 and second liner 202 are configured for forming the flow line system of the streamline of coating solution on whole printed circuit board (PCB).
The first injection unit 10,20 and 30 is arranged on the lower edge of printed circuit board (PCB) 110, and the first liner 201 is arranged on the lower center of printed circuit board (PCB), to separate with predetermined space with the first injection unit, thereby form the streamline along the mobile coating solution in the bottom of printed circuit board (PCB).
Therefore, form like this streamline, make coating solution be injected into a plurality of printed circuit board (PCB) 110 centers and bottom, that is, be injected into the bottom righthand side of printed circuit board (PCB) 110, thereby make on the bottom righthand side of printed circuit board (PCB) 110, to carry out plating.
The second injection unit 40,50 and 60 is arranged on the lower center of printed circuit board (PCB), and the second liner 202 is arranged on the lower edge of printed circuit board (PCB), to separate with predetermined space with the second injection unit 40,50 and 60, thereby form the streamline along the mobile coating solution in the top of printed circuit board (PCB).
Therefore, form like this streamline, make coating solution be injected into a plurality of printed circuit board (PCB) 110 centers and top, that is, be injected into the left upper end of printed circuit board (PCB), thereby make on the left upper end of printed circuit board (PCB) 110, to carry out plating.
Flow line system is according to an illustrative embodiment of the invention not necessarily limited to this.The first injection unit 10,20 and 30 can be arranged on to left hand edge place, and, can suitably regulate the direction of the first and second liners 201 and 202, make to spray the coating solution from the first and second injection units on whole printed circuit board (PCB).
Plater for printed circuit board (PCB) according to the present invention comprises a plurality of the first injection units 10,20 and 30 in plating groove 100, the second injection unit 40,50 and 60, the first liner 210 and the second liner 202, thus make to form along the mobile streamline of whole printed circuit board (PCB).Therefore, can reduce significantly the eddy current of the bottom that is formed at printed circuit board (PCB).In addition, the flow velocity being incorporated in the gap between printed circuit board (PCB) is 35% or more of overall flow rate, thereby makes a plurality of printed circuit board (PCB)s of plating equably.
According to an illustrative embodiment of the invention, in plating groove, be formed with the streamline of the mobile coating solution of the edge direction parallel with the surface of printed circuit board (PCB), thereby reduced the incidence of eddy current and printed circuit board (PCB) collision.
Therefore, can prevent the surface of printed circuit board (PCB) plating unevenly, and several printed circuit board (PCB)s of plating effectively, even in thering is the plating groove of small volume.
As a result, according to the present invention, simplify the manufacturing process for printed circuit board (PCB), especially, simplified the plating technic for printed circuit board (PCB), to reduce the cost of plating technic, thereby made to reduce the manufacturing cost of printed circuit board (PCB).
As mentioned above, according to an illustrative embodiment of the invention, by being formed at the flow line system for the plater of printed circuit board (PCB), on whole printed circuit board (PCB), form streamline.Therefore, can provide can the whole printed circuit board (PCB) of plating the plater for printed circuit board (PCB).
Although illustrated and described the present invention in conjunction with illustrative embodiments, but, it is evident that to those skilled in the art, not deviating under the prerequisite of the spirit and scope of the invention that are defined by the following claims, can modify and change.
Claims (9)
1. for a plater for printed circuit board (PCB), comprising:
Plating groove, holds described printed circuit board (PCB);
Injection unit, is formed on the inwall of described plating groove bottom and by a plurality of nozzles that spray coating solution and forms, and coating solution is flowed along the inwall of described plating groove; And
Liner, be formed on from described injection unit and spray the direction of coating solution, and, described liner changes flowing of coating solution in the parallel direction in the surface with described printed circuit board (PCB), makes the surface flow along the mobile coating solution of the inwall of described plating groove along described printed circuit board (PCB).
2. the plater for printed circuit board (PCB) according to claim 1, wherein, described injection unit is constructed to comprise the first injection unit and the second injection unit, described the first injection unit and the second injection unit are formed at the different positions place on the inwall of described plating groove, and formed by a plurality of nozzles that spray coating solution, coating solution is flowed along the inwall of described plating groove, and
Described liner is constructed to comprise the first liner and the second liner, described the first liner and the second liner are formed on from described the first and second injection units and spray the direction of coating solution, and in the parallel direction in the surface with described printed circuit board (PCB), change flowing of coating solution, make the coating solution that sprays from described the first and second injection units along the surface flow of described printed circuit board (PCB).
3. the plater for printed circuit board (PCB) according to claim 2, wherein, described the first and second injection units are formed on the same level on the inwall of described plating groove, and
Described the first and second liners are formed on the injection direction of described the first and second injection units, to change flowing of coating solution in the parallel direction in the surface with described printed circuit board (PCB), make the surface flow along the mobile coating solution of the inwall of described plating groove along described printed circuit board (PCB).
4. the plater for printed circuit board (PCB) according to claim 3, wherein, described the first injection unit is arranged on the lower edge of described plating groove, and described the second injection unit is formed on the lower center of described plating groove, and
Described the first and second liners are all formed on the injection direction of described the first and second injection units, so that the direction of the mobile coating solution of the inwall along described plating groove is changed into the direction parallel with the surface of described printed circuit board (PCB), coating solution is flowed along lower surface and the upper surface of described printed circuit board (PCB).
5. the plater for printed circuit board (PCB) according to claim 1, wherein, described injection unit utilizes transverse injection scheme to spray coating solution.
6. the plater for printed circuit board (PCB) according to claim 1, wherein, described plating groove holds a plurality of printed circuit board (PCB)s simultaneously.
7. the plater for printed circuit board (PCB) according to claim 6, wherein, the flow velocity that is incorporated into the coating solution in the gap between each printed circuit board (PCB) in described a plurality of printed circuit board (PCB) is more than or equal to 35% of its overall flow rate.
8. the plater for printed circuit board (PCB) according to claim 1, wherein, Electroless Plating Ni, electroless plating Pd and soak gold (ENEPIG) technique for described printed circuit board (PCB).
9. the plater for printed circuit board (PCB) according to claim 8, wherein, it is for the plating Pd of ENEPIG technique.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100089026A KR101153537B1 (en) | 2010-09-10 | 2010-09-10 | A plating device for printed circuit board a plating device for printed circuit board |
| KR10-2010-0089026 | 2010-09-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102400116A CN102400116A (en) | 2012-04-04 |
| CN102400116B true CN102400116B (en) | 2014-12-10 |
Family
ID=45882747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110027292.4A Expired - Fee Related CN102400116B (en) | 2010-09-10 | 2011-01-21 | Plating device applicable to print circuit board |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101153537B1 (en) |
| CN (1) | CN102400116B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1235879A (en) * | 1998-05-15 | 1999-11-24 | 阿托技术美国公司 | Fluid delivery apparatus and method |
| TW565895B (en) * | 2001-04-06 | 2003-12-11 | Sony Corp | Apparatus and method for electroless plating |
| CN101235494A (en) * | 2007-01-30 | 2008-08-06 | 三星电机株式会社 | Device and method for chemical plating |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3079698B2 (en) * | 1991-10-09 | 2000-08-21 | イビデン株式会社 | Surface treatment equipment for printed wiring boards |
| TWI229367B (en) * | 2002-12-26 | 2005-03-11 | Canon Kk | Chemical treatment apparatus and chemical treatment method |
| JP4805141B2 (en) * | 2003-03-11 | 2011-11-02 | 株式会社荏原製作所 | Electroplating equipment |
| JP2006093651A (en) * | 2004-08-26 | 2006-04-06 | Ngk Spark Plug Co Ltd | Manufacturing method of wiring board and non-electrolytic plating device for wiring board manufacture |
-
2010
- 2010-09-10 KR KR1020100089026A patent/KR101153537B1/en not_active IP Right Cessation
-
2011
- 2011-01-21 CN CN201110027292.4A patent/CN102400116B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1235879A (en) * | 1998-05-15 | 1999-11-24 | 阿托技术美国公司 | Fluid delivery apparatus and method |
| TW565895B (en) * | 2001-04-06 | 2003-12-11 | Sony Corp | Apparatus and method for electroless plating |
| CN101235494A (en) * | 2007-01-30 | 2008-08-06 | 三星电机株式会社 | Device and method for chemical plating |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101153537B1 (en) | 2012-06-11 |
| CN102400116A (en) | 2012-04-04 |
| KR20120026858A (en) | 2012-03-20 |
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