CN105316737A - High density interconnector (HDI) board blind hole electroplating device - Google Patents
High density interconnector (HDI) board blind hole electroplating device Download PDFInfo
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- CN105316737A CN105316737A CN201510818694.4A CN201510818694A CN105316737A CN 105316737 A CN105316737 A CN 105316737A CN 201510818694 A CN201510818694 A CN 201510818694A CN 105316737 A CN105316737 A CN 105316737A
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- blind hole
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Abstract
The invention discloses a high density interconnector (HDI) board blind hole electroplating device. The HDI board blind hole electroplating device comprises an electroplating bath and a skeet used for clamping a circuit board, and further comprises a swing power device used for enabling the HDI board to swing left and right along a board surface and a vertical spraying device used for spraying electroplate liquid to the board surface. When the HDI board with blind holes are electroplated, the skeet drives the HDI board to swing left and right and shake, and meanwhile the vertical spraying device sprays the electroplate liquid to the board surface; accordingly, the electroplate liquid can effectively enter the blind holes to conduct exchange, and the electroplating quality of the blind holes is improved. According to the HDI board blind hole electroplating device, the electroplate liquid sprayed to the board surface can completely cover the board surface so that the electroplate liquid can fully enter all the blind holes; uneven electroplating conditions are avoided; the electroplate liquid in the blind holes can be subjected to an effective exchange when the circuit board swings left and right and moves once; the electroplating quality and efficiency are obviously improved.
Description
Technical field
The invention belongs to printed circuit board manufacture technology field, relate in particular to a kind of device promoting HDI board blind hole electroplating quality.
Background technology
Along with the constantly progress of electronic product production technology, some comparatively high-end electronic products are gradually towards the future development of high-frequency signal transmission, printed circuit board (Printedcircuitboard, be called for short PCB) as its core component, usually need to electroplate to the blind hole on circuit card plate body and through hole the transmission being beneficial to high-frequency signal.
Existing conventional PCB electroplating assembly line mainly adopts the pneumatic blending mode of installing tracheae bottom plating line, or the mechanical stirring mode that jet pipe carries out spraying is installed bottom plating line, carry out the direction vertical with electroplated plate plate face to rock back and forth and electroplate simultaneously, fully exchange with the liquid medicine reached in plate face and hole, obtain reasonable electroplating quality.
Above-mentioned technology can satisfy the demands for only there being the printed circuit board of through hole to electroplate, but for having the high density interconnecting board (HDI plate) of blind hole, assisting due to pneumatic blending or mechanical stirring swings the liquid medicine exchange help inside and outside blind hole very little with plate body, the liquid medicine in blind hole is caused to be in " stagnant water " state, in electroplating process, cannot obtain fresh plating fluid in blind hole, copper ion concentration declines and affects electroplating effect in electroplating process.
Summary of the invention
For this reason, technical problem to be solved by this invention is that in prior art, electric plating method mainly adopts pneumatic blending or mechanical stirring, swing plate body simultaneously, electroplate liquid is exchanged for being difficult in the HDI plate hole with blind hole, copper ion concentration declines and affects electroplating effect in electroplating process, thus proposes a kind of HDI board blind hole electroplanting device.
For solving the problems of the technologies described above, technical scheme of the present invention is:
The invention provides a kind of HDI board blind hole electroplanting device, comprise, plating tank and fly target for clamping circuit board, also comprising for making HDI plate along the wiggly swinging driving device in direction, plate face with for the perpendicular jetting device to plate face jet electro-plating liquid; Described swinging driving device is swinging driving pump, and it is electrically connected with the described target that flies, and moves left and right and then drive described HDI plate to swing for flying target described in driving.
As preferably, the amplitude that described HDI plate waves is 10cm.
As preferably, described perpendicular jetting device is be arranged at the spray tube between plating tank negative electrode and positive electrode, and described spray tube is provided with nozzle, and the direction of described nozzle ejection is vertical with described HDI plate plate face.
As preferably, described spray tube is at least 2, and the spacing between adjacent described spray tube is 5cm.
As preferably, described nozzle is whirl jet spraying nozzle, spray tube described in every root has 2 whirl jet spraying nozzles at least, along described spray tube length direction spaced set, adjacent two the whirl jet spraying nozzle spacings on every root spray tube are 2 times of the whirlpool circular diameter being injected into plate face.
As preferably, the described whirl jet spraying nozzle on adjacent two spray tubes is arranged in a crossed manner on described spray tube length direction.
As preferably, the speed that described HDI plate waves is 11 times/min.
As preferably, described spray tube is arranged perpendicular to described plating tank bottom surface.
Technique scheme of the present invention has the following advantages compared to existing technology:
(1) HDI board blind hole electroplanting device of the present invention, comprise, plating tank and fly target for clamping circuit board, also comprises for making HDI plate along the wiggly swinging driving device in direction, plate face with for the perpendicular jetting device to plate face jet electro-plating liquid.When the HDI plate with blind hole is electroplated, fly target and drive HDI plate to vacillate now to the left, now to the right to rock, perpendicular jetting device is to plate face jet electro-plating liquid simultaneously, makes electroplate liquid effectively can enter blind hole inside and exchanges, improve blind hole electroplating quality.
(2) HDI board blind hole electroplanting device of the present invention, described perpendicular jetting device is be arranged at the spray tube between plating tank negative electrode and positive electrode, described spray tube is provided with nozzle, described nozzle is whirl jet spraying nozzle, adjacent two whirl jet spraying nozzle spacings on every root spray tube are 2 times of the whirlpool circular diameter being injected into plate face, and the described whirl jet spraying nozzle on adjacent two spray tubes is arranged in a crossed manner on described spray tube length direction.The set-up mode of whirl jet spraying nozzle can make the complete wrapper plate face of electroplate liquid being ejected into plate face, and then make electroplate liquid fully enter in each blind hole, avoid the situation occurring that plating is uneven, circuit card is vacillated now to the left, now to the right and is moved once, plating solution in blind hole just can obtain once effectively exchanging, and significantly improves electroplating quality and efficiency.
Accompanying drawing explanation
In order to make content of the present invention be more likely to be clearly understood, below according to a particular embodiment of the invention and by reference to the accompanying drawings, the present invention is further detailed explanation, wherein
Fig. 1 is the structural representation of the described HDI board blind hole electroplanting device of the embodiment of the present invention.
In figure, Reference numeral is expressed as: 1-plating tank; 2-flies target; 3-spray tube; 4-nozzle; 5-HDI plate; 6-
Embodiment
Embodiment
The present embodiment provides a kind of HDI board blind hole electroplanting device, comprise, plating tank 1 and fly target 2 for clamping circuit board, also comprise for making HDI plate 5 along the wiggly swinging driving device in direction, plate face with for the perpendicular jetting device to plate face jet electro-plating liquid, described swinging driving device is swinging driving pump, it is electrically connected with the described target 2 that flies, move left and right and then drive described HDI plate 5 to swing for flying target 2 described in driving, the amplitude that described HDI plate 5 swings is the speed that 10cm, HDI plate 5 waves is 11 times/min.
When the HDI plate 5 with blind hole is electroplated, fly target 2 and drive HDI plate 5 to vacillate now to the left, now to the right to rock, perpendicular jetting device is to plate face jet electro-plating liquid simultaneously, makes electroplate liquid effectively can enter blind hole inside and exchanges, improve blind hole electroplating quality.
Further, described perpendicular jetting device is the spray tube 3 be arranged between plating tank negative electrode and positive electrode, spray tube 3 is arranged perpendicular to described plating tank 1 bottom surface, and described spray tube 3 is provided with nozzle 4, and the direction that described nozzle 4 sprays is vertical with described HDI plate 5 plate face; Described spray tube 3 is at least 2, and spray tube 3 described in the present embodiment has 5, and the spacing between adjacent described spray tube 2 is 5cm; Described nozzle 4 is whirl jet spraying nozzle, spray tube 3 described in every root have 2 whirl jet spraying nozzles at least, in the present embodiment, every root spray tube 3 is provided with 8 whirl jet spraying nozzles, along the length direction spaced set of described spray tube 3, the spacing of adjacent two whirl jet spraying nozzles on every root spray tube 3 is 2 times of the whirlpool circular diameter that the electroplate liquid being injected into plate face is formed, and, whirl jet spraying nozzle on adjacent two spray tubes 3 is arranged in a crossed manner on described spray tube 3 length direction, to make the electroplate liquid uniform fold HDI plate 5 plate face of ejecting.
The HDI board blind hole electroplanting device that the present embodiment provides, adopt circuit card to swing to electroplate HDI plate with vertical injection simultaneously, described nozzle 4 is whirl jet spraying nozzle, adjacent two whirl jet spraying nozzle spacings on every root spray tube 3 are 2 times of the whirlpool circular diameter being injected into plate face, and the described whirl jet spraying nozzle on adjacent two spray tubes is arranged in a crossed manner on described spray tube 3 length direction.The set-up mode of whirl jet spraying nozzle swings with circuit card and coordinates, the complete wrapper plate face of electroplate liquid being ejected into plate face can be made, and then make electroplate liquid fully enter in each blind hole, avoid the situation occurring that plating is uneven, circuit card is vacillated now to the left, now to the right and is moved once, plating solution in blind hole just can obtain once effectively exchanging, and significantly improves electroplating quality and efficiency.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to embodiment.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all embodiments.And thus the apparent change of extending out or variation be still among the protection domain of the invention.
Claims (8)
1. a HDI board blind hole electroplanting device, comprises, plating tank and fly target for clamping circuit board, it is characterized in that, also comprising for making HDI plate along the wiggly swinging driving device in direction, plate face with for the perpendicular jetting device to plate face jet electro-plating liquid; Described swinging driving device is swinging driving pump, and it is electrically connected with the described target that flies, and moves left and right and then drive described HDI plate to swing for flying target described in driving.
2. HDI board blind hole electroplanting device according to claim 1, is characterized in that, the amplitude that described HDI plate waves is 10cm.
3. HDI board blind hole electroplanting device according to claim 2, it is characterized in that, described perpendicular jetting device is be arranged at the spray tube between plating tank negative electrode and positive electrode, and described spray tube is provided with nozzle, and the direction of described nozzle ejection is vertical with described HDI plate plate face.
4. HDI board blind hole electroplanting device according to claim 3, it is characterized in that, described spray tube is at least 2, and the spacing between adjacent described spray tube is 5cm.
5. HDI board blind hole electroplanting device according to claim 4, it is characterized in that, described nozzle is whirl jet spraying nozzle, spray tube described in every root have 2 whirl jet spraying nozzles at least, along described spray tube length direction spaced set, adjacent two the whirl jet spraying nozzle spacings on every root spray tube are 2 times of the whirlpool circular diameter being injected into plate face.
6. HDI board blind hole electroplanting device according to claim 5, is characterized in that, the described whirl jet spraying nozzle on adjacent two spray tubes is arranged in a crossed manner on described spray tube length direction.
7. HDI board blind hole electroplanting device according to claim 6, is characterized in that, the speed that described HDI plate waves is 11 times/min.
8. HDI board blind hole electroplanting device according to claim 7, is characterized in that, described spray tube is arranged perpendicular to described plating tank bottom surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510818694.4A CN105316737A (en) | 2015-11-23 | 2015-11-23 | High density interconnector (HDI) board blind hole electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510818694.4A CN105316737A (en) | 2015-11-23 | 2015-11-23 | High density interconnector (HDI) board blind hole electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105316737A true CN105316737A (en) | 2016-02-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510818694.4A Pending CN105316737A (en) | 2015-11-23 | 2015-11-23 | High density interconnector (HDI) board blind hole electroplating device |
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| CN (1) | CN105316737A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113789552A (en) * | 2021-11-02 | 2021-12-14 | 四川英创力电子科技股份有限公司 | Device for electroplating through hole on HDI board and working method thereof |
| CN114980541A (en) * | 2022-07-19 | 2022-08-30 | 广德正大电子科技有限公司 | High-order HDI board segmentation jet equipment that leak protection was filled |
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| CA2317233A1 (en) * | 2000-09-01 | 2002-03-01 | Richard Menini | Ultrasonically assisted plating bath for vias metallization in printed circuit board manufacturing |
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2015
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| JP2000144481A (en) * | 1998-11-02 | 2000-05-26 | Asahi Giken Kk | Plating treatment device |
| CA2317233A1 (en) * | 2000-09-01 | 2002-03-01 | Richard Menini | Ultrasonically assisted plating bath for vias metallization in printed circuit board manufacturing |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113789552A (en) * | 2021-11-02 | 2021-12-14 | 四川英创力电子科技股份有限公司 | Device for electroplating through hole on HDI board and working method thereof |
| CN114980541A (en) * | 2022-07-19 | 2022-08-30 | 广德正大电子科技有限公司 | High-order HDI board segmentation jet equipment that leak protection was filled |
| CN114980541B (en) * | 2022-07-19 | 2023-08-04 | 广德正大电子科技有限公司 | Leakage-proof high-order HDI plate segmented jet flow equipment |
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Application publication date: 20160210 |