CN102377011A - Method for manufacturing antenna structure - Google Patents
Method for manufacturing antenna structure Download PDFInfo
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- CN102377011A CN102377011A CN2010102611425A CN201010261142A CN102377011A CN 102377011 A CN102377011 A CN 102377011A CN 2010102611425 A CN2010102611425 A CN 2010102611425A CN 201010261142 A CN201010261142 A CN 201010261142A CN 102377011 A CN102377011 A CN 102377011A
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- dielectric layer
- antenna structure
- manufacturing approach
- conductive housing
- predeterminable area
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Abstract
The invention discloses a method for manufacturing an antenna structure. The method comprises the following steps of: providing a non-conducting shell, and coating a dielectric layer which contains catalyzer and a sensitive material on the surface of the non-conducting shell; providing a mask, wherein the mask is provided with a light-transmitting part, and allowing a light beam to irradiate the dielectric layer through the transmitting part so as to cure the dielectric layer in one preset area on the surface of the non-conducting shell; removing the dielectric layer outside the preset area; and forming a metal layer on the dielectric layer in the preset area. In the antenna structure, a metal assembly which has a special shape is not needed to be manufactured additionally, so that complex assembly processes can be saved, cost can be effectively reduced, manufacturing time can be greatly shortened and production efficiency is improved.
Description
Technical field
The present invention relates to a kind of manufacturing approach of antenna structure, particularly a kind of method that on non-conductive housing, forms antenna structure.
Background technology
Antenna structure production method on the general mobile phone normally will have the metal assembly installing of special shape or pattern and be fixed on the plastic casing; Just this kind manufacture often needs the built-up time and the manufacturing cost of labor, therefore lacks economic benefit.Because aforementioned known problem points, how a kind of manufacturing process steps and cost simplified is provided, and the antenna structure manufacturing approach that can significantly promote production efficiency begins to become an important problem.
Summary of the invention
The present invention provides a kind of manufacturing approach of antenna structure, and this method comprises: a non-conductive housing is provided, and at this non-conductive housing surface coverage one dielectric layer, wherein this dielectric layer contains plating catalyst (catalyzer) and photosensitive material; One light shield (mask) is provided, and wherein this light shield has a transmittance section, and applies a light and expose on this dielectric layer via this transmittance section, makes that this dielectric layer in the predeterminable area solidifies on this non-conductive housing surface; Remove this outer dielectric layer of this predeterminable area; And, form a metal level on this dielectric layer in this predeterminable area.
In an embodiment, aforementioned dielectric layer activator (activator) composition or the soda acid salt etc. that also contain palladium or silver are gone up the plating catalyst.
In an embodiment, aforementioned light is ultraviolet light, and aforementioned photosensitive material is photoresist or UV glue or silver bromide.
In an embodiment, the aforementioned metal layer is formed on the dielectric layer with chemical plating (electroless plating) mode.
In an embodiment, aforementioned dielectric layer is formed at the non-conductive housing surface with the mode of soaking.
In an embodiment, aforementioned dielectric layer is formed at the non-conductive housing surface with the mode of spraying or print.
In an embodiment, the aforementioned metal layer has copper or the golden or silver-colored material of nickel.
In an embodiment, aforementioned non-conductive housing is the working of plastics made from injection molding.
Antenna structure of the present invention does not need the metal assembly of extra manufacturing special shape, therefore can save complicated packaging technology, can not only effectively reduce cost, and also can significantly shorten manufacturing time to enhance productivity.
For making above-mentioned purpose of the present invention, characteristic and the advantage can be more obviously understandable, hereinafter is special to be lifted preferred embodiment and also cooperates appended accompanying drawing to elaborate.
Description of drawings
Fig. 1 representes the sketch map of non-conductive housing of the present invention;
Fig. 2 representes that non-conductive housing of the present invention coats the sketch map of a dielectric layer with the mode of soaking;
Fig. 3 representes to utilize Exposure mode to make the sketch map of the dielectric layer curing in the predeterminable area;
Fig. 4 representes the sketch map that the dielectric layer that predeterminable area is outer is removed;
Fig. 5 is illustrated in the sketch map that forms a metal level on the dielectric layer in the aforementioned predeterminable area;
Fig. 6 representes the flow chart of manufacturing approach of the antenna structure of the embodiment of the invention one; And
Fig. 7 representes the flow chart of manufacturing approach of the antenna structure of the embodiment of the invention two.
The primary clustering symbol description:
Non-conductive housing 10 transmittance sections 31
Embodiment
Embodiment one
The manufacturing approach of the antenna structure of the embodiment of the invention one is mainly in order to form the antenna structure of specific pattern on a non-conductive housing; This method mainly may further comprise the steps: a non-conductive housing 10 (as shown in Figure 1) at first is provided; Aforementioned non-conductive housing 10 for example can be macromolecule or plastic material, and can make by injection molding.Then; The mode that can pass through to soak is at non-conductive housing 10 surface coverage one dielectric layer 20 (as shown in Figure 2); Wherein aforementioned dielectric layer 20 contains photosensitive material; For example be photoresist or UV glue or silver bromide, also can contain charged element such as activator compositions such as palladium element or tin palladium colloid or soda acid salt simultaneously, so can help a metal structure is attached on the dielectric layer 20 through the chemical plating mode.Will be appreciated that except can dielectric layer 20 being formed at non-conductive housing 10 surfaces through the mode of soaking, the mode that can also spray or print makes dielectric layer 20 be attached to non-conductive housing 10 surfaces in the present embodiment.
Then see also Fig. 3, after accomplishing abovementioned steps, can apply light and shine a predeterminable area A on dielectric layer 20 via light shield 30.As shown in Figure 3; Aforementioned light shield 30 has a transmittance section 31; Light in the present embodiment can adopt ultraviolet light, and 20 of dielectric layers for example plate the exposure agent for going up, when ultraviolet light passes transmittance section 31 and is radiated at the 20 last times of dielectric layer in the predeterminable area A; Can make dielectric layer 20 in the predeterminable area A solidify and, be beneficial to carry out follow-up chemical plating process stably attached on the non-conductive housing 10.
See also Fig. 4 again, after the dielectric layer in the predeterminable area A 20 solidifies completion, just can 20 parts of the dielectric layer outside the predeterminable area A be removed with acidity or basic lotion.What need special instruction is that owing to the dielectric layer 20 that is positioned at predeterminable area A this moment solidifies through UV-irradiation, so lotion only can be got rid of the outer dielectric layer 20 of predeterminable area A.
At last, can use the antenna structure that produces specific pattern through forming a metal level M (as shown in Figure 5) on the dielectric layer 20 of mode in aforementioned predeterminable area A of chemical plating.What need special instruction is that the present invention mainly solidifies the dielectric layer 20 in the predeterminable area A by Exposure mode, and can get rid of the outer dielectric layer 20 of predeterminable area A by this; Aforementioned dielectric layer 20 is because of containing activator compositions such as palladium element, so can be beneficial to through the chemical plating mode metal level M is formed thereon, and then can produce the antenna structure of specific pattern.For example, aforementioned metal layer M can be copper or the golden or silver-colored material of nickel, and wherein the dielectric layer P in the pattern magnitude of metal level M and the aforementioned predeterminable area A is corresponding each other.
Each manufacturing process steps of aforementioned antenna structure roughly can be concluded as shown in Figure 6: a non-conductive housing at first is provided, and at this non-conductive housing surface coverage one dielectric layer, wherein this dielectric layer contains and can go up plating photosensitive material (step S11); Apply a light and expose on this dielectric layer, make that this dielectric layer in the predeterminable area solidifies (step S12) on this non-conductive housing surface via the transmittance section of a light shield; Remove outer this dielectric layer (step S13) of this predeterminable area; And, form a metal level (step S14) on this dielectric layer in this predeterminable area.
Embodiment two
See also Fig. 1, Fig. 2; The manufacturing approach of the antenna structure of the embodiment of the invention two is equally in order to form the antenna structure of specific pattern on a non-conductive housing; This method mainly may further comprise the steps: a non-conductive housing 10 (as shown in Figure 1) at first is provided; Wherein aforementioned non-conductive housing 10 for example can comprise macromolecule or plastic material fully, and can make by injection molding.Then; The mode that can pass through to soak is at non-conductive housing 10 surface coverage one dielectric layer 20 (as shown in Figure 2); Wherein aforementioned dielectric layer 20 contains photosensitive material, for example is photoresist or UV glue or silver bromide, also contains the resinous principle of adsorbable palladium element or tin palladium colloid simultaneously; The adsorbable palladium element of aforementioned resin also is attached to dielectric layer 20, so can help a metal structure is attached on the dielectric layer 20 through the chemical plating mode.Will be appreciated that except can dielectric layer 20 being formed at non-conductive housing 10 surfaces through the mode of soaking, the mode that can also spray or print makes dielectric layer 20 be attached to non-conductive housing 10 surfaces in the present embodiment.
Then see also Fig. 3, after accomplishing abovementioned steps, can apply light and shine a last predeterminable area A via light shield 30 in dielectric layer 20 surfaces.As shown in Figure 3; Aforementioned light shield 30 has a transmittance section 31; Light in the present embodiment can adopt ultraviolet light, and 20 of dielectric layers for example are adsorbable palladium element or the resin of tin palladium colloid and the mixture of photosensitive material, when ultraviolet light passes transmittance section 31 and is radiated at the 20 last times of dielectric layer in the predeterminable area A; Can make dielectric layer 20 in the predeterminable area A solidify and, be beneficial to carry out follow-up chemical plating process stably attached on the non-conductive housing 10.
See also Fig. 4 again, after the dielectric layer in the predeterminable area A 20 solidifies completion, just can 20 parts of the dielectric layer outside the predeterminable area A be removed with acidity or basic lotion.What need special instruction is that owing to the dielectric layer 20 that is positioned at predeterminable area A this moment solidifies through UV-irradiation, so lotion only can be got rid of the outer dielectric layer 20 of predeterminable area A.
At last, can use the antenna structure that produces specific pattern through forming a metal level M (as shown in Figure 5) on the dielectric layer 20 of mode in aforementioned predeterminable area A of chemical plating.What need special instruction is that the present invention mainly solidifies the dielectric layer 20 in the predeterminable area A by Exposure mode, and can get rid of the outer dielectric layer 20 of predeterminable area A by this; Aforementioned dielectric layer 20 is because of containing the resinous principle of activators such as adsorbable palladium element or tin palladium colloid, so can be beneficial to through the chemical plating mode metal level M is formed thereon, and then can produce the antenna structure of specific pattern.For example, aforementioned metal layer M can be copper or the golden or silver-colored material of nickel, and wherein the dielectric layer P in the pattern magnitude of metal level M and the aforementioned predeterminable area A is corresponding each other.
Each manufacturing process steps of aforementioned antenna structure roughly can be concluded as shown in Figure 7: a non-conductive housing at first is provided; And at this non-conductive housing surface coverage one dielectric layer, wherein this dielectric layer contains the resinous principle (step S21) of photosensitive material and adsorbable palladium element or tin palladium colloid; Apply a light and expose on this dielectric layer, make that this dielectric layer in the predeterminable area solidifies (step S22) on this non-conductive housing surface via the transmittance section of a light shield; Remove outer this dielectric layer (step S23) of this predeterminable area; And, form a metal level (step S24) on this dielectric layer in this predeterminable area.
Because antenna structure of the present invention does not need the metal assembly of extra manufacturing special shape, therefore can save complicated packaging technology, can not only effectively reduce cost, also can significantly shorten manufacturing time to enhance productivity.
Though the present invention with aforesaid embodiment openly as above, yet it is not in order to limit the present invention.Those of ordinary skill under the present invention in the technical field is not breaking away from the spirit and scope of the present invention, should do a little change and retouching.Therefore protection scope of the present invention scope person of defining that should look appending claims is as the criterion.
Claims (10)
1. the manufacturing approach of an antenna structure, this method comprises:
One non-conductive housing is provided, and at this non-conductive housing surface coverage one dielectric layer, wherein this dielectric layer contains plating catalyst and photosensitive material;
One light shield is provided, and wherein this light shield has a transmittance section, and applies a light and expose on this dielectric layer via this transmittance section, makes that this dielectric layer in the predeterminable area solidifies on this non-conductive housing surface;
Remove this outer dielectric layer of this predeterminable area; And
Form a metal level on this dielectric layer in this predeterminable area.
2. the manufacturing approach of antenna structure as claimed in claim 1, wherein this dielectric layer also contains the palladium element.
3. the manufacturing approach of antenna structure as claimed in claim 1, wherein this dielectric layer also contains the resin of adsorbable palladium element.
4. the manufacturing approach of antenna structure as claimed in claim 1, wherein this dielectric layer also contains the elemental composition such as acid, alkali, salt of charging property.
5. the manufacturing approach of antenna structure as claimed in claim 1, wherein this light is ultraviolet light, and this photosensitive material is photoresist or UV glue or silver bromide.
6. the manufacturing approach of antenna structure as claimed in claim 1, wherein this metal level is formed on this dielectric layer with the chemical plating mode.
7. the manufacturing approach of antenna structure as claimed in claim 1, wherein this dielectric layer is formed at this non-conductive housing surface with the mode of soaking.
8. the manufacturing approach of antenna structure as claimed in claim 1, wherein this dielectric layer is to spray or the mode of printing is formed at this non-conductive housing surface.
9. the manufacturing approach of antenna structure as claimed in claim 1, wherein this metal level has copper, nickel, gold or silver-colored material.
10. the manufacturing approach of antenna structure as claimed in claim 1, wherein this non-conductive housing is the working of plastics made from injection molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102611425A CN102377011A (en) | 2010-08-24 | 2010-08-24 | Method for manufacturing antenna structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102611425A CN102377011A (en) | 2010-08-24 | 2010-08-24 | Method for manufacturing antenna structure |
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| CN102377011A true CN102377011A (en) | 2012-03-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010102611425A Pending CN102377011A (en) | 2010-08-24 | 2010-08-24 | Method for manufacturing antenna structure |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103457021A (en) * | 2012-06-04 | 2013-12-18 | 启碁科技股份有限公司 | Manufacturing method of antenna structure |
| CN104470235A (en) * | 2014-11-28 | 2015-03-25 | 昆山联滔电子有限公司 | Method for manufacturing antenna circuit |
| US9112265B2 (en) | 2012-06-01 | 2015-08-18 | Wistron Neweb Corporation | Method for manufacturing antenna structure |
| CN107709609A (en) * | 2015-08-19 | 2018-02-16 | 株式会社尼康 | The manufacture method of the manufacture method of wiring pattern, the manufacture method of conducting film and transistor |
| CN109659682A (en) * | 2018-12-13 | 2019-04-19 | 泉州萃思技术开发有限公司 | A kind of communication antenna production technology |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1202023A (en) * | 1998-07-09 | 1998-12-16 | 复旦大学 | Manufacture of curved patch antenna |
| CN1898413A (en) * | 2003-12-05 | 2007-01-17 | 传导喷墨技术有限公司 | Formation of layers on substrates |
| CN101523663A (en) * | 2006-10-17 | 2009-09-02 | 莱尔德技术股份有限公司 | Method of production of an antenna pattern |
-
2010
- 2010-08-24 CN CN2010102611425A patent/CN102377011A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1202023A (en) * | 1998-07-09 | 1998-12-16 | 复旦大学 | Manufacture of curved patch antenna |
| CN1898413A (en) * | 2003-12-05 | 2007-01-17 | 传导喷墨技术有限公司 | Formation of layers on substrates |
| CN101523663A (en) * | 2006-10-17 | 2009-09-02 | 莱尔德技术股份有限公司 | Method of production of an antenna pattern |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9112265B2 (en) | 2012-06-01 | 2015-08-18 | Wistron Neweb Corporation | Method for manufacturing antenna structure |
| CN103457021A (en) * | 2012-06-04 | 2013-12-18 | 启碁科技股份有限公司 | Manufacturing method of antenna structure |
| CN103457021B (en) * | 2012-06-04 | 2016-03-09 | 启碁科技股份有限公司 | The manufacture method of antenna structure |
| CN104470235A (en) * | 2014-11-28 | 2015-03-25 | 昆山联滔电子有限公司 | Method for manufacturing antenna circuit |
| CN107709609A (en) * | 2015-08-19 | 2018-02-16 | 株式会社尼康 | The manufacture method of the manufacture method of wiring pattern, the manufacture method of conducting film and transistor |
| CN109659682A (en) * | 2018-12-13 | 2019-04-19 | 泉州萃思技术开发有限公司 | A kind of communication antenna production technology |
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Application publication date: 20120314 |