CN103457021A - Manufacturing method of antenna structure - Google Patents
Manufacturing method of antenna structure Download PDFInfo
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- CN103457021A CN103457021A CN2012101816291A CN201210181629A CN103457021A CN 103457021 A CN103457021 A CN 103457021A CN 2012101816291 A CN2012101816291 A CN 2012101816291A CN 201210181629 A CN201210181629 A CN 201210181629A CN 103457021 A CN103457021 A CN 103457021A
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- antenna structure
- conductive housing
- manufacture method
- catalyst
- metal object
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Abstract
The invention discloses a manufacturing method of an antenna structure. The manufacturing method of the antenna structure includes the steps that a non-conducting shell containing a contact agent is provided; a metal object is embedded into a preset area of the non-conducting shell; a plating resistant agent layer covers the surface of the non-conducting shell; a laser engraving method is used for removing the plating resistant agent layer in the preset area on the surface of the non-conducting shell, and a coarsening surface is formed in the preset area; the plating resistant agent layer on the surface of the non-conducting shell is removed; a metal layer is formed on the coarsening surface so that the antenna structure can be formed, and the antenna structure makes contact with the metal object. By means of the manufacturing method of the antenna structure, the manufacturing step of the antenna structure can be simplified, the waterproof effect of the non-conducting shell is achieved, cost needed by production can be lowered, processing time needed by production is greatly shortened, and more diversified customized choices can be provided as well.
Description
Technical field
The present invention relates to a kind of manufacture method of antenna structure, particularly a kind of manufacture method that forms antenna structure on non-conductive housing.
Background technology
Mobile communications device has become the main flow of information products now, and the antenna structure of its receiving and transmitting signal is also along with the progress of manufacturing technology is more and more frivolous.For instance, similarly be to reach and simplify step, save space and the demand such as customized by laser-engraving technique (LDS).
Yet, in known technology, by the laser engraving method, make antenna, often need to form the step of dielectric layer, can plate stable metal level.Finally must carry out the injecting glue step at firing point, to reach the purpose of plastic waterproof.Yet these steps make process complications, and increase material and time cost.Therefore, for the problems referred to above, be necessary to provide a kind of solution of simplifying manufacturing step and reducing production costs.
Thereby, need to provide a kind of manufacture method of antenna structure to solve the problems referred to above.
Summary of the invention
One embodiment of the present invention provides a kind of manufacture method of antenna structure.According to the manufacture method of one embodiment of the invention, at first the non-conductive housing that contains catalyst is provided, and a metal object is embedded in the predeterminable area of non-conductive housing.Then primary antibodie is plated to the surface that blocking layer is covered in non-conductive housing.On the surface of this non-conductive housing, utilize the laser engraving method to remove the anti-plating blocking layer of predeterminable area, and form coarse surface on predeterminable area.Then, remove the anti-plating blocking layer on the surface of non-conductive housing.Form a metal level thing on the coarse surface of predeterminable area, to form antenna structure, and wherein antenna structure contacts with metal object.
The invention provides a kind of manufacture method of antenna structure, the manufacture method of this antenna structure comprises: a non-conductive housing that contains catalyst is provided; One metal object is embedded in a predeterminable area of this non-conductive housing; Cover primary antibodie plating blocking layer on the surface of this non-conductive housing; Utilize the laser engraving method, remove this anti-plating blocking layer on this predeterminable area on surface of this non-conductive housing, and form a coarse surface at this predeterminable area; Remove this anti-plating blocking layer on the surface of this non-conductive housing; And form a metal level on this coarse surface, to form this antenna structure, and this antenna structure contacts with this metal object.
According to one embodiment of the invention, provide the step of the non-conductive housing that contains catalyst to comprise: will contain the plastic injection of catalyst to mould, to form non-conductive housing.
According to one embodiment of the invention, the step that provides metal object to be embedded in the predeterminable area of non-conductive housing comprises: at the plastic injection that contains catalyst, to before mould, first metal object is positioned in mould; Or at the plastic injection that contains catalyst to mould, then will in metal object, be embedded in the non-conductive housing that contains catalyst.
According to one embodiment of the invention, above-mentioned catalyst is dispersed in non-conductive housing.According to another embodiment of the present invention, above-mentioned catalyst is gathered in the surface of non-conductive housing.According to an embodiment more of the present invention, the above-mentioned non-conductive housing that includes catalyst has the non-conductive layer that does not contain catalyst.
According to one embodiment of the invention, above-mentioned embedded metal object penetrates non-conductive housing.According to another embodiment of the present invention, above-mentioned embedded metal object does not penetrate non-conductive housing.
According to one embodiment of the invention, the group that the material of above-mentioned embedded metal object selects free copper, nickel, iron, aluminium and combinations thereof to form.
According to one embodiment of the invention, the group that above-mentioned catalyst selects free metal, inorganic metal compound, organo-metallic compound and combinations thereof to form.According to another embodiment of the present invention, above-mentioned catalyst contains palladium, tin, copper, iron, silver, gold or above-mentioned combination in any.
According to one embodiment of the invention, the material of above-mentioned anti-plating blocking layer comprises resin.
According to one embodiment of the invention, the method that anti-plating blocking layer is formed at non-conductive housing is infusion process or spraying.
According to one embodiment of the invention, the group that the material of above-mentioned metal level selects free copper, nickel, iron, aluminium and combinations thereof to form.
According to one embodiment of the invention, above-mentioned metal level, with the method for chemical plating, forms and is embedded in the surface of non-conductive housing.
According to one embodiment of the invention, the manufacture method of aforementioned antenna structure also comprises utilizes deposition process, to increase the thickness of metal level.
According to one embodiment of the invention, above-mentioned deposition process is electroplating technology or chemical plating process.
The present invention can simplify manufacturing step and reduce and produce required cost, can significantly reduce and produce required process time, and more various customized selection is provided.
The accompanying drawing explanation
Fig. 1 is the non-conductive housing schematic diagram that illustrated according to an embodiment of the present invention.
Fig. 2 is that the anti-plating blocking layer of the non-conductive housing that illustrated according to an embodiment of the present invention forms schematic diagram.
Fig. 3 is the schematic diagram of the non-conductive housing through laser engraving that illustrated according to an embodiment of the present invention.
Fig. 4 is the non-conductive housing schematic diagram that illustrated according to an embodiment of the present invention.
Fig. 5 is the non-conductive housing schematic diagram that illustrated according to an embodiment of the present invention.
Fig. 6 A and Fig. 6 B are the metal object that illustrated the according to an embodiment of the present invention cross-sectional view in non-conductive housing.
Fig. 7 is the manufacture method flow chart of the non-conductive housing that illustrated according to an embodiment of the present invention.
Fig. 8 A and Fig. 8 B are the manufacture method flow charts of the non-conductive housing that illustrated according to an embodiment of the present invention.
The primary clustering symbol description:
The anti-plating blocking layer of 100 non-conductive housing 210
110 metal object 310 predeterminable areas
200 anti-plating resist solution 510 metal levels
710,720,730,740,750,760,810,820,830 and 840 steps
Embodiment
For making the reader more understand polyimide film provided by the present invention, below enumerate several embodiment of the present invention, and be illustrated.Yet these embodiment only, as the embodiment of explanation demonstration, do not constitute any limitation for scope of the present invention and application.On the contrary, these execution modes will make of the present invention open more thoroughly with complete, and give full expression to protection scope of the present invention for those skilled in the art.In the accompanying drawings, in order to know expression, identical reference number will be used to specify same or analogous manufacturing step.
Fig. 1 is the non-conductive housing schematic diagram that illustrated according to an embodiment of the present invention.In Fig. 1, non-conductive housing 100 comprises metal object 110.Wherein, non-conductive housing 100 is consisted of the plastics that contain catalyst (not illustrating), and the method for its formation can be injection moulding, but not as limit.
According to one embodiment of the invention, the group that the material of metal object 110 selects free copper, nickel, iron, aluminium and combinations thereof to form.According to another embodiment of the present invention, catalyst selects the group that free metal, inorganic metal compound, organo-metallic compound and combinations thereof form.According to an embodiment more of the present invention, catalyst contains palladium, tin, copper, iron, silver, gold or above-mentioned combination in any.
Fig. 2 is that the anti-plating blocking layer of the non-conductive housing that illustrated according to an embodiment of the present invention forms schematic diagram.In Fig. 2, non-conductive housing 100 be impregnated in anti-plating resist solution 200, and form anti-plating blocking layer 210 on the surface of non-conductive housing 100.And the metal object 110 be embedded in non-conductive housing 100 is also covered by anti-plating blocking layer 210.Yet, except the infusion process shown in Fig. 2, the generation type of anti-plating blocking layer 210 also comprises spraying (not illustrating).
According to one embodiment of the invention, the material of anti-plating blocking layer 210 comprises resin.
Fig. 3 is the schematic diagram of the non-conductive housing through laser engraving that illustrated according to an embodiment of the present invention.In Fig. 3, non-conductive housing 100, via the laser engraving method, is removed the anti-plating blocking layer on the predeterminable area on the surface of non-conductive housing 100 310.And form coarse surface at predeterminable area 310.Wherein, metal object 110 is arranged in predeterminable area 310.And by the laser engraving method, can activate the catalyst in non-conductive housing 100, to promote the reactivity of catalyst, and can be at the antenna structure of the interior formation specific pattern of predeterminable area 310.
Fig. 4 is the non-conductive housing schematic diagram that illustrated according to an embodiment of the present invention.In Fig. 4, non-conductive housing 100, after degreasing agent cleans, is removed the anti-plating blocking layer 210 on the surface of non-conductive housing 100.Through the step of degreasing agent cleaning, can promote the tack on the surface of subsequent chemistry metal cladding and predeterminable area 310 and metal object 110, to avoid metal level, peel off.
According to one embodiment of the invention, degreasing agent comprises acid degreasing agent or alkaline defatting agent.According to another embodiment of the present invention, degreasing agent is acid degreasing agent, and acid degreasing agent has the effect of activated metal thing 110, can increase the tack to the chemical plating metal layer.
Fig. 5 is the non-conductive housing schematic diagram that illustrated according to an embodiment of the present invention.Through after the cleaning step of degreasing agent, non-conductive housing 100 is utilized the mode of chemical plating, at the coarse surface of the predeterminable area 310 of Fig. 4, forms metal level 510, uses and forms the antenna structure with specific pattern.
According to one embodiment of the invention, the group that the material of metal level 510 selects free copper, nickel, iron, aluminium and combinations thereof to form.
Fig. 6 A and Fig. 6 B are the cross-sectional view of the metal object that illustrates of the A-A' section line segment according to Fig. 5 in non-conductive housing.In Fig. 6 A, metal object 110 penetrates non-conductive housing 100, and contacts with metal level 510.And, in Fig. 6 B, metal object 110 does not penetrate non-conductive housing 100, and contact with metal level 510.
Fig. 7 concludes the manufacturing step of aforementioned antenna structure, and it comprises following step: the non-conductive housing that contains catalyst (step 710) is provided.Metal object is embedded in to the predeterminable area (step 720) of non-conductive housing.At the anti-plating blocking layer of the surface coverage of non-conductive housing (step 730).Utilize the laser engraving method, remove the anti-plating blocking layer of predeterminable area on the surface of non-conductive housing, and form coarse surface (step 740) at predeterminable area.Remove the anti-plating blocking layer (step 750) on the surface of non-conductive housing.Form metal level on coarse surface, to form antenna structure, and antenna structure contacts (step 760) with metal object.Yet, the visual making of manufacturing step of above-mentioned antenna structure need order change, not as limit.
According to one embodiment of the invention, the manufacture method of antenna structure also comprises the thickness that utilizes deposition process to increase metal level.According to another embodiment of the present invention, above-mentioned deposition process is electroplating technology or chemical plating process.According to an embodiment more of the present invention, in electroplating technology, metal object 110 has lower coefficient of friction, can promote the resistance to wear of conductive junction point and mechanical plate.
Fig. 8 A and Fig. 8 B are the manufacture method flow charts of the non-conductive housing that illustrated according to the embodiment of the present invention.In Fig. 8 A, at first metal object is placed in to mould (step 810), then will contain again the plastic injection (step 820) to mould of catalyst, with the non-conductive housing that forms the embedded metal thing and contain catalyst.In Fig. 8 B, at first will contain the plastic injection (step 830) to mould of catalyst, then metal object will be embedded in the non-conductive housing that contains catalyst (step 840), with the non-conductive housing that forms the embedded metal thing and contain catalyst.
According to one embodiment of the invention, catalyst is dispersed in non-conductive housing.According to another embodiment of the present invention, catalyst is gathered in the surface of non-conductive housing.According to an embodiment more of the present invention, the non-conductive housing that contains catalyst has the non-conductive layer that does not contain catalyst.
For the problem of the manufacture method of known antenna structure, the solution that embodiments of the present invention provide, because contain catalyst and metal object in non-conductive housing, and can simplify manufacturing step and reduce and produce required cost.And, because embodiments of the present invention are utilized the laser engraving method, to manufacture the antenna structure of communication equipment.So can significantly reduce and produce required process time, and more various customized selection is provided.
Preferred forms of the present invention is open as mentioned above.Yet above-mentioned cited manufacture method is not limited to embodiments of the invention, any the technical staff in the technical field of the invention, do not departing from outside spirit of the present invention and scope, all can carry out various modifications or conversion.So protection scope of the present invention should with the scope of appending claims the person of being defined be as the criterion.
Claims (17)
1. the manufacture method of an antenna structure, the manufacture method of this antenna structure comprises:
One non-conductive housing that contains catalyst is provided;
One metal object is embedded in a predeterminable area of this non-conductive housing;
Cover primary antibodie plating blocking layer on the surface of this non-conductive housing;
Utilize the laser engraving method, remove this anti-plating blocking layer on this predeterminable area on surface of this non-conductive housing, and form a coarse surface at this predeterminable area;
Remove this anti-plating blocking layer on the surface of this non-conductive housing; And
Form a metal level on this coarse surface, to form this antenna structure, and this antenna structure contacts with this metal object.
2. the manufacture method of antenna structure as claimed in claim 1 wherein provides the step of this non-conductive housing that contains catalyst to comprise:
By a plastic injection that contains catalyst to this mould, to form this non-conductive housing.
3. the manufacture method of antenna structure as claimed in claim 2, the step in this predeterminable area that wherein provides this metal object to be embedded in this non-conductive housing comprises:
Before in plastic injection to a mould that this is contained to catalyst, this metal object is placed in to this mould; Or, after in plastic injection to a mould that this is contained to catalyst, this metal object is embedded in this this non-conductive housing that contains catalyst.
4. as the manufacture method of the described antenna structure of claims 1 to 3 any one, wherein this catalyst is dispersed in this non-conductive housing.
5. as the manufacture method of the described antenna structure of claims 1 to 3 any one, wherein this catalyst is gathered in the surface of this non-conductive housing.
6. as the manufacture method of the described antenna structure of claims 1 to 3 any one, wherein this non-conductive housing that includes catalyst comprises that one does not contain the non-conductive layer of catalyst.
7. as the manufacture method of the described antenna structure of claims 1 to 3 any one, wherein this embedded metal object penetrates this non-conductive housing.
8. as the manufacture method of the described antenna structure of claims 1 to 3 any one, wherein this embedded metal object does not penetrate this non-conductive housing.
9. as the manufacture method of the described antenna structure of claims 1 to 3 any one, wherein the material of this embedded metal object selects the group that free copper, nickel, iron, aluminium and combinations thereof form.
10. as the manufacture method of the described antenna structure of claims 1 to 3 any one, wherein this catalyst selects the group that free metal, inorganic metal compound, organo-metallic compound and combinations thereof form.
11., as the manufacture method of the described antenna structure of claims 1 to 3 any one, wherein this catalyst contains palladium, tin, copper, iron, silver, gold or above-mentioned combination in any.
12. the manufacture method of antenna structure as claimed in claim 1, wherein the material of this anti-plating blocking layer comprises resin.
13. the manufacture method of antenna structure as claimed in claim 1, the method that wherein this anti-plating blocking layer is formed at this non-conductive housing is infusion process or spraying.
14. the manufacture method of antenna structure as claimed in claim 1, wherein the material of this metal level selects the group that free copper, nickel, iron, aluminium and combinations thereof form.
15. the manufacture method of antenna structure as claimed in claim 1, wherein this metal level forms and is embedded in the surface of this non-conductive housing with the method for chemical plating.
16. the manufacture method of antenna structure as claimed in claim 1, also comprise and utilize a deposition process, to increase this metal layer thickness.
17. the manufacture method of antenna structure as claimed in claim 16, wherein this deposition process is electroplating technology or chemical plating process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210181629.1A CN103457021B (en) | 2012-06-04 | 2012-06-04 | The manufacture method of antenna structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210181629.1A CN103457021B (en) | 2012-06-04 | 2012-06-04 | The manufacture method of antenna structure |
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| Publication Number | Publication Date |
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| CN103457021A true CN103457021A (en) | 2013-12-18 |
| CN103457021B CN103457021B (en) | 2016-03-09 |
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| CN201210181629.1A Active CN103457021B (en) | 2012-06-04 | 2012-06-04 | The manufacture method of antenna structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106714507A (en) * | 2015-11-16 | 2017-05-24 | 华为技术有限公司 | Middle frame component and production method thereof |
| CN110519415A (en) * | 2018-05-21 | 2019-11-29 | 富智康精密电子（廊坊）有限公司 | Shell prepared by the preparation method and utilization this method of shell |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102377010A (en) * | 2010-08-24 | 2012-03-14 | 启碁科技股份有限公司 | Method for manufacturing antenna structure |
| CN102377011A (en) * | 2010-08-24 | 2012-03-14 | 启碁科技股份有限公司 | Method for manufacturing antenna structure |
| CN102412437A (en) * | 2010-09-20 | 2012-04-11 | 启碁科技股份有限公司 | Manufacturing method of antenna |
-
2012
- 2012-06-04 CN CN201210181629.1A patent/CN103457021B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102377010A (en) * | 2010-08-24 | 2012-03-14 | 启碁科技股份有限公司 | Method for manufacturing antenna structure |
| CN102377011A (en) * | 2010-08-24 | 2012-03-14 | 启碁科技股份有限公司 | Method for manufacturing antenna structure |
| CN102412437A (en) * | 2010-09-20 | 2012-04-11 | 启碁科技股份有限公司 | Manufacturing method of antenna |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106714507A (en) * | 2015-11-16 | 2017-05-24 | 华为技术有限公司 | Middle frame component and production method thereof |
| WO2017084271A1 (en) * | 2015-11-16 | 2017-05-26 | 华为技术有限公司 | Intermediate frame member and method for manufacturing same |
| US10143110B2 (en) | 2015-11-16 | 2018-11-27 | Huawei Technologies Co., Ltd. | Middle frame member and method for manufacturing middle frame member |
| CN106714507B (en) * | 2015-11-16 | 2019-09-13 | 华为技术有限公司 | Middle framework and its production method |
| CN110519415A (en) * | 2018-05-21 | 2019-11-29 | 富智康精密电子（廊坊）有限公司 | Shell prepared by the preparation method and utilization this method of shell |
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| Publication number | Publication date |
|---|---|
| CN103457021B (en) | 2016-03-09 |
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