CN102340938B - 电路板制作方法 - Google Patents
电路板制作方法 Download PDFInfo
- Publication number
- CN102340938B CN102340938B CN2010102388738A CN201010238873A CN102340938B CN 102340938 B CN102340938 B CN 102340938B CN 2010102388738 A CN2010102388738 A CN 2010102388738A CN 201010238873 A CN201010238873 A CN 201010238873A CN 102340938 B CN102340938 B CN 102340938B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- copper foil
- rara externa
- lamina rara
- conducting wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/055—Folded back on itself
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010102388738A CN102340938B (zh) | 2010-07-29 | 2010-07-29 | 电路板制作方法 |
US13/192,474 US9125334B2 (en) | 2010-07-29 | 2011-07-28 | Method for manufacturing multilayer printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010102388738A CN102340938B (zh) | 2010-07-29 | 2010-07-29 | 电路板制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102340938A CN102340938A (zh) | 2012-02-01 |
CN102340938B true CN102340938B (zh) | 2013-08-28 |
Family
ID=45516349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010102388738A Active CN102340938B (zh) | 2010-07-29 | 2010-07-29 | 电路板制作方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US9125334B2 (zh) |
CN (1) | CN102340938B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103582320B (zh) * | 2012-07-19 | 2017-05-10 | 富葵精密组件(深圳)有限公司 | 多层线路板及其制作方法 |
CN103582322B (zh) * | 2012-07-19 | 2016-08-24 | 富葵精密组件(深圳)有限公司 | 多层线路板及其制作方法 |
CN104703395A (zh) * | 2015-02-05 | 2015-06-10 | 叶校然 | 一种柔性线路板连片卷对卷式制作工艺 |
CN112312682B (zh) * | 2019-07-30 | 2023-07-21 | 宏启胜精密电子(秦皇岛)有限公司 | 具有厚铜线路的电路板及其制作方法 |
CN112243319B (zh) * | 2020-10-28 | 2022-03-01 | 瑞声新能源发展(常州)有限公司科教城分公司 | 柔性电路板的制作方法及柔性电路板 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1671274A (zh) * | 2004-03-19 | 2005-09-21 | 松下电器产业株式会社 | 具有层间接合部件的柔性基板及其制造方法 |
CN101203095A (zh) * | 2006-12-13 | 2008-06-18 | 富葵精密组件(深圳)有限公司 | 多层柔性电路板的制备方法 |
CN101207977A (zh) * | 2006-12-20 | 2008-06-25 | 富葵精密组件(深圳)有限公司 | 制作具有断差结构的柔性电路板的方法 |
CN101346047A (zh) * | 2007-07-13 | 2009-01-14 | 富葵精密组件(深圳)有限公司 | 多层电路板制作方法及用于制作多层电路板的内层基板 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5262594A (en) * | 1990-10-12 | 1993-11-16 | Compaq Computer Corporation | Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same |
US5144742A (en) * | 1991-02-27 | 1992-09-08 | Zycon Corporation | Method of making rigid-flex printed circuit boards |
US5499444A (en) * | 1994-08-02 | 1996-03-19 | Coesen, Inc. | Method of manufacturing a rigid flex printed circuit board |
US5795162A (en) * | 1996-03-28 | 1998-08-18 | Lucent Technologies, Inc. | RF flex circuit transmission line and interconnection method |
US6323060B1 (en) * | 1999-05-05 | 2001-11-27 | Dense-Pac Microsystems, Inc. | Stackable flex circuit IC package and method of making same |
US6884653B2 (en) * | 2001-03-21 | 2005-04-26 | Micron Technology, Inc. | Folded interposer |
TWM263719U (en) * | 2004-05-25 | 2005-05-01 | Career Technology Mfg Co Ltd | Multi-laminated flexible board with folding |
US7663064B2 (en) * | 2004-09-25 | 2010-02-16 | Banpil Photonics, Inc. | High-speed flex printed circuit and method of manufacturing |
US20080005896A1 (en) * | 2006-07-05 | 2008-01-10 | Teamchem Company | Method for fabricating multi-layered flexible printed circuit board without via holes |
EP2547183A1 (en) * | 2011-07-15 | 2013-01-16 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof as well as rigid-flex printed circuit board or a sub-assembly thereof |
CN103906374B (zh) * | 2012-12-28 | 2017-02-15 | 富葵精密组件(深圳)有限公司 | 刚挠结合板及其制作方法 |
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2010
- 2010-07-29 CN CN2010102388738A patent/CN102340938B/zh active Active
-
2011
- 2011-07-28 US US13/192,474 patent/US9125334B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1671274A (zh) * | 2004-03-19 | 2005-09-21 | 松下电器产业株式会社 | 具有层间接合部件的柔性基板及其制造方法 |
CN101203095A (zh) * | 2006-12-13 | 2008-06-18 | 富葵精密组件(深圳)有限公司 | 多层柔性电路板的制备方法 |
CN101207977A (zh) * | 2006-12-20 | 2008-06-25 | 富葵精密组件(深圳)有限公司 | 制作具有断差结构的柔性电路板的方法 |
CN101346047A (zh) * | 2007-07-13 | 2009-01-14 | 富葵精密组件(深圳)有限公司 | 多层电路板制作方法及用于制作多层电路板的内层基板 |
Also Published As
Publication number | Publication date |
---|---|
US9125334B2 (en) | 2015-09-01 |
CN102340938A (zh) | 2012-02-01 |
US20120023744A1 (en) | 2012-02-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C53 | Correction of patent for invention or patent application | ||
CB02 | Change of applicant information |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant after: Zhending Technology Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant before: Honsentech Co., Ltd. |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170310 Address after: Guangdong, Shenzhen Province, Fuyong Town, Tong Tong Industrial Zone, factory 5, building 1, building Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |