CN102338857A - Nondestructive detecting method for chip fracture of card products - Google Patents

Abstract

The invention provides a nondestructive detecting method for chip fracture of card products. The method comprises the following steps: A, confirming the cross section of the card structure of a card sample to judge whether a clearance exists between a chip plastic package material and a plastic substrate, entering step D if no clearance exists, and entering next step if the clearance exists; B, grinding the card sample from the plastic substrate side until the plastic substrate is polished and the internal chip plastic package material is exposed; C, continuing grinding until the plastic package material is ground flat; D, carrying out a nondestructive analysis by using an ultrasound scanning microscope to check whether fracture phenomenon exists in the chip; and E, partly opening and verifying the scanning result of the ultrasound scanning microscope. The method provided by the invention can eliminate the clearance in the card products generated by a manual grinding method, thus facilitating the subsequent scanning analysis by the ultrasound scanning microscope; and meanwhile, the actual effect analysis can be carried out without damaging the products, thus high accuracy and reliability of the analysis results can be ensured.

Description

A kind of cracked lossless detection method of series products chip that blocks

Technical field

The present invention relates to a kind of cracked lossless detection method of series products chip that blocks.

Background technology

Card series products (Card) refers to be embedded with the common name of the plastic clip of microchip, has the function of store information, can realize the intelligent function effect.Chip generally is positioned at a certain side of card, and in the plastic packaging material of plastic packaging in plastic clip, and the general metallic gasket that has corresponding electrode at the opposite side that blocks.

The kind of card series products is a lot, and smart card, subscriber identification card, GSM digital mobile phone card, transportation card, bank card or the like are arranged.Card series products (Card) has the branch of contact and non-contact card again.Contact Type Ic Card: such card is the read-write that contacts laggard line data through the contact of IC-card read-write equipment with the contact of IC-card.Non-contact IC card: such card does not have circuit contacts with IC-card equipment, but reads and writes (like light or wireless technology) through contactless read-write technology.Its embedded chip has increased RF transmit-receive circuit except CPU, logical block, storage unit.

A lot of card series products have similarity on encapsulating structure.General structure can be with reference to accompanying drawing 1.Mainly comprise plastic substrate 1, sealing compound 2, Chip Packaging resin 13, chip signal lead-in wire 14, semi-conductor chip 15 and electrode diaphragm 16.And on the encapsulating structure of some card series products; Because circulation is big, territory of use is wide, and condition difference such as humiture, cold and hot variation are big; In order to cushion the possible stress that expands with heat and contract with cold and cause; Regional sealing compound between chip plastic packaging material and plastic substrate can not fill up fully, can leave certain gap (air), as the buffer area.

If inefficacy occurred in case block series products, need carry out the failure analysis of package level to the card series products, whether confirm to lose efficacy is to occur in package level.General reasonable analysis step is after finish visual examination and electrically measuring, the X-ray analysis that will can't harm earlier confirm inferior weldering situation and ultrasonic scanning microscopic analysis confirm whether to exist encapsulation unusually or chip cracked unusually.But; If between the plastic substrate of plastic packaging material that wraps up chip and card, have space (air); The ultrasonic scanning microscope is that the air that can't see through between the two carries out scanning analysis, so if be left intact, the ultrasonic scanning microscopic analysis can't be carried out.So the classic method of general industry is exactly directly to uncap, the chip that exposes through the destructive analysis Direct observation carries out the cracked differentiation of chip.The traditional analysis method is easy to generate artificial destruction, thus the accuracy that impact analysis is judged.

Summary of the invention

For solving the traditional analysis method card series products is carried out failure analysis because destructiveness causes the inaccurate problem of discriminatory analysis, the present invention provides following technical scheme:

A kind of cracked lossless detection method of series products chip that blocks may further comprise the steps:

A, get a slice card class sample and block the class formation cross section and confirm between chip plastic packaging material and plastic substrate, whether have the space,, then skip to step D,, then continue following step if the space is arranged if there is not the space;

B, simultaneously beginning to grind from plastic substrate should card class sample, is ground to plastic substrate and is polished, and the chip plastic packaging material of inside exposes;

C, continuation are ground, until plastic packaging material is polished;

D, use ultrasonic scanning microscope carry out nondestructive analysis, and whether the inspection chip exists cracked phenomenon;

E, part are uncapped, the microscopical scanning result of checking ultrasonic scanning.

The present invention has following advantage: the present invention has removed the space in the card series products through the method for hand lapping; Thereby made things convenient for the microscopical scanning analysis of follow-up ultrasonic scanning; Under not to the broken situation of changing of product generation, carry out the actual effect analysis, guaranteed the pin-point accuracy property and the reliability of analysis result.

Description of drawings

The general packaging technology structural drawing of Fig. 1 card series products;

Fig. 2 has the card series products structural drawing in space.

Label is among the figure:

Embodiment

Do to set forth in detail in the face of this process implementing example down, thereby protection scope of the present invention is made more explicit defining so that advantage of the present invention and characteristic can be easier to it will be appreciated by those skilled in the art that.

Shown in the card series products structure that Fig. 2 has the space, this card series products comprises front 21, chip 22, metallic gasket 23, plastic packaging layer 24, space 25, the plastic layer 26 of card and the back side 27 of card of card

This card series products is tested according to following steps:

A, this card sample is blocked the class formation cross section confirm, find between chip plastic layer 26 and plastic layer 24, to have space 25;

B, beginning to grind from the back side 27 of card should card class sample, and the plastic layer 26 that is ground to card is polished, and the chip plastic packaging layer 24 of inside exposes, and has so just got rid of space 25;

C, because chip plastic packaging layer 24 be a semicircular structure, plastic packaging layer 24 is continued grindings, until plastic packaging layer 24 is polished;

D, use ultrasonic scanning microscope carry out nondestructive analysis, have found the cracked phenomenon of tangible chip;

E, part are uncapped, and detect the Vcc that chip cracks causes Gnd is opened a way, and have further verified the accuracy of nondestructive analysis among the step D.

The above; Be merely one of embodiment of the present invention; But protection scope of the present invention is not limited thereto; Any those of ordinary skill in the art are in the technical scope that the present invention disclosed, and variation or the replacement that can expect without creative work all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claims were limited.

Claims (1)

1. one kind is blocked the cracked lossless detection method of series products chip, and it is characterized in that: this method may further comprise the steps:

A, get a slice card class sample and block the class formation cross section and confirm between chip plastic packaging material and plastic substrate, whether have the space,, then skip to step D,, then continue following step if the space is arranged if there is not the space;

B, simultaneously beginning to grind from plastic substrate should card class sample, is ground to plastic substrate and is polished, and the chip plastic packaging material of inside exposes;

C, continuation are ground, until plastic packaging material is polished;

D, use ultrasonic scanning microscope carry out nondestructive analysis, and whether the inspection chip exists cracked phenomenon;

E, part are uncapped, the microscopical scanning result of checking ultrasonic scanning.

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