CN102318091A - LED leadframe package, LED package using the same, and method of manufacturing the LED package - Google Patents
LED leadframe package, LED package using the same, and method of manufacturing the LED package Download PDFInfo
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- CN102318091A CN102318091A CN2010800077963A CN201080007796A CN102318091A CN 102318091 A CN102318091 A CN 102318091A CN 2010800077963 A CN2010800077963 A CN 2010800077963A CN 201080007796 A CN201080007796 A CN 201080007796A CN 102318091 A CN102318091 A CN 102318091A
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- 239000000463 material Substances 0.000 claims abstract description 76
- 229920005989 resin Polymers 0.000 claims abstract description 40
- 239000011347 resin Substances 0.000 claims abstract description 40
- 238000000034 method Methods 0.000 claims abstract description 26
- 239000000565 sealant Substances 0.000 claims description 93
- 239000011248 coating agent Substances 0.000 claims description 75
- 238000000576 coating method Methods 0.000 claims description 75
- 238000005538 encapsulation Methods 0.000 claims description 53
- 230000017525 heat dissipation Effects 0.000 claims description 53
- 230000003287 optical effect Effects 0.000 claims description 33
- 238000009413 insulation Methods 0.000 claims description 25
- 229920001296 polysiloxane Polymers 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 241001025261 Neoraja caerulea Species 0.000 claims description 5
- 208000034189 Sclerosis Diseases 0.000 claims description 5
- 229920006375 polyphtalamide Polymers 0.000 claims description 5
- 239000004954 Polyphthalamide Substances 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims 1
- 229920000515 polycarbonate Polymers 0.000 claims 1
- 239000007788 liquid Substances 0.000 abstract description 5
- 238000007789 sealing Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 36
- 239000000203 mixture Substances 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
A LED lead frame package, a LED package using the LED lead frame package, and a method of manufacturing the LED package. In the manufacture of the LED package, a liquid transparent resin material is disposed over at least two ring-shaped protrusions having a sharp upper edge and inclined sidewalls and at least one ring-shaped groove formed between two of the at least two ring-shaped protrusions, and thus a sealing layer having a convex curvature may be easily formed by using surface tension in one process.
Description
Technical field
The present invention relates to light-emitting diode (LED) leadframe package, use the LED of this LED leadframe package to encapsulate; And the method for making this LED encapsulation; More particularly, the method that relates to the LED leadframe package that a kind of manufacturing cost that can reduce easily makes, the LED encapsulation of using this LED leadframe package and make this LED encapsulation.
Background technology
Light-emitting diode (LED) is a kind of semiconductor illumination device, compares with conventional lighting device, has multiple advantage.For example, to have long useful life, advantages of small volume, power consumption few and do not have a mercury pollution for LED.Therefore, LED has replaced conventional lighting device and frequently has been used as novel lighting apparatus.
In order to improve the light output of LED encapsulation, on the external optical layer of LED encapsulation, introduce convex lens structures usually.In conventional LED encapsulation, said convex lens structures is installed in the conventional LED encapsulation for making in advance then.Since the said convex lens structures of extra manufacturing with and assembling procedure, need extra manufacturing process and apparatus for assembling for this reason.In addition, the convex lens structures of making in advance is installed in conventional LED encapsulation when lasting, in convex lens structures and between the sealant of formation in the LED encapsulation, may form undesirable air layer.In addition, according to routine techniques, when on the LED tube core, forming sealant, be difficult to form convex curvature at the outer surface of sealant with protection LED tube core.Therefore, relatively low according to the manufacturing productive rate of the method for the manufacturing LED of routine techniques encapsulation, production cost is higher.
For the white light LEDs that sends white light is provided, generally on blue-ray LED tube core or ultraviolet light (UV) LED tube core, directly apply fluorescence coating.For example, when using the blue-ray LED tube core, the light with various wavelength that produces in the fluorescent material can mix mutually, or the light with various wavelength can mix with the blue excitation light that the blue-ray LED tube core sends, thereby sends white light.But, when on the LED tube core, directly applying fluorescence coating and since between LED tube core and the fluorescence coating each other very near, the light that fluorescent material sends gets into the LED tube core, and is absorbed by the LED tube core.
Therefore, suggestion is provided with transparent spacer (spacer) between LED tube core and fluorescence coating, so that near the substrate that the light that fluorescence coating sends incides on the LED tube core or the LED tube core is, thereby the probability of reduction light absorption.Fig. 1 has explained U.S. Patent number 5,959, an example of 316 disclosed above-mentioned technology.With reference to figure 1, LED tube core 60 is installed on the substrate 62, and fluorescence coating 66 separates with LED tube core 60 through the spacer 64 that covers LED tube core 60.In addition, outside fluorescence coating 66, form protective layer 68.But, in this structure, the light that fluorescence coating 66 sends also possibly incide on the LED tube core 60 with substrate 62 on, therefore almost can't be absorbed without interruption.
Summary of the invention
Technical problem
The present invention provides a kind of light-emitting diode (LED) leadframe package and the LED encapsulation of using this LED leadframe package, can be made at an easy rate with the manufacturing cost that reduces.
The solution of problem
The present invention also provides a kind of LED encapsulation, and wherein, the light that fluorescent material sends incides on the LED tube core and is absorbed, thereby has reduced optical absorption loss.
The present invention also provides a kind of method of the LED of manufacturing encapsulation, can make the LED encapsulation at an easy rate with the manufacturing cost that reduces.
According to an aspect of the present invention, the present invention provides a kind of leadframe package, comprising:
Heat dissipation base;
A plurality of electrodes around said heat dissipation base layout;
Around said heat dissipation base and a plurality of electrode, with the insulation support section of fixing said heat dissipation base and a plurality of electrodes;
At least two annular projections that the circumference profile of the upper surface of the said insulation support section in edge forms; And
At least one annular groove that between said at least two annular projections, forms.
According to an aspect of the present invention, light-emitting diode (LED) encapsulation that comprises above-mentioned leadframe package is provided.
For example, said LED encapsulation comprises:
Be attached at least one LED tube core of the bottom surface of heat dissipation base;
Be electrically connected many electric wires of said at least one LED tube core and a plurality of electrodes; And
Cover the LED tube core and comprise the sealant structure of one deck at least with convex external surface,
Wherein, the edge of one deck at least of said sealant structure extends on the corresponding annular projection of said two annular projections at least.
According to a further aspect in the invention, a kind of method of the LED of manufacturing encapsulation is provided, said method comprises:
Leadframe package is provided, and said leadframe package comprises: heat dissipation base; A plurality of electrodes around said heat dissipation base layout; Center on said heat dissipation base and a plurality of electrode insulation support section with fixing said heat dissipation base and a plurality of electrodes; At least two annular projections that the circumference profile of the upper surface of the said insulation support section in edge forms; And at least one annular groove that forms between two annular projections in said at least two annular projections,
At least one LED tube core is attached on the bottom surface of said heat dissipation base; Said LED tube core is connected with a plurality of electrode electricity; And
Formation has convex external surface one deck at least with covering LED tube core,
Wherein, the edge of one deck at least of sealant structure extends on the corresponding annular projection of said two annular projections at least.
Description of drawings
Above-mentioned and other feature and advantage of the present invention will specify exemplary embodiments of the present invention in conjunction with the drawings and become more obvious, wherein:
Fig. 1 is the profile of an instance of the white light emitting diode (LED) according to routine techniques;
Fig. 2 is the stereogram of LED leadframe package structure according to an embodiment of the invention;
Fig. 3 is the vertical view of LED leadframe package shown in Figure 2;
Fig. 4 is the stereogram of the layout of the heat dissipation base of LED leadframe package shown in Figure 2 according to an embodiment of the invention and the nonisulated support section of a plurality of electrodes;
Fig. 5 is the section of structure of LED leadframe package shown in Figure 2;
Fig. 6 is the section of structure of LED encapsulation according to an embodiment of the invention;
Fig. 7 is the section of structure of LED encapsulation in accordance with another embodiment of the present invention; And
Fig. 8 and Fig. 9 are the cross-sectional schematic of the principle of the method for making the LED encapsulation according to an embodiment of the invention.
Embodiment
To combine accompanying drawing to describe the present invention more fully now, show exemplary embodiment of the present invention in the accompanying drawing.Reference numeral identical in the accompanying drawing is represented components identical, with clear description, has amplified size of component for ease.
Fig. 2 is the stereogram of the structure of light-emitting diode (LED) leadframe package 20 according to an embodiment of the invention.With reference to figure 2, four electrodes 1 that LED leadframe package 20 comprises heat dissipation base 2, arrange around heat dissipation base 2 and around heat dissipation base 2 and a plurality of electrode 1 with the fixing insulation support section 3 of heat dissipation base 2 and a plurality of electrode 1.In the present embodiment, LED leadframe package 20 comprises four electrodes 1; But the present invention is not limited to this, and LED leadframe package 20 can comprise one or more electrodes 1.The insulation support section 3 can by insulating plastics material for example polyphthalamide (PPA) process.
Fig. 3 is the vertical view of LED leadframe package 20 shown in Figure 2.With reference to 3, LED leadframe package 20 comprises four identical metal electrodes 1 radially arranging.Said four electrodes 1 can be arranged around the central shaft of heat dissipation base 2 with an angle of 90 degrees respectively, and extend radially from the central shaft of heat dissipation base 2.Fig. 4 is the schematic perspective view of the layout of heat dissipation base 2 and four electrode 1 nonisulated support sections 3.With reference to figure 4, the peak of the upper surface of said four electrodes 1 and heat dissipation base 2 is in equal height.In addition, to shown in Figure 4, the first end of electrode 1 can be towards the circumference of heat dissipation base 2 sides like Fig. 2, and the second end of electrode 1 can be set to stretch out from the outer wall of insulation support section 3.The upper surface of said electrode 1 can apply for example high reflecting material, such as silver or aluminium.
In addition, as shown in Figure 4, said heat dissipation base 2 can have the reflector 10 of cavity shape.The bottom surface of reflector 10 can apply high reflecting material, for example silver or aluminium.The upper surface of reflector 10 is in the peak of heat dissipation base 2.That is, the upper surface of reflector 10 can form on the height identical with the upper surface of electrode 1.
As shown in Figure 4, heat dissipation base 2 is fixing by the insulation support section 3 around both with a plurality of electrodes 1.For this reason, electrode 1, heat dissipation base 2 and insulation support section 3 can pass through an operation, and for example injection-molded operation is one-body molded.
Fig. 5 is the section of structure of LED leadframe package 20 shown in Figure 2.With reference to figure 5 and Fig. 2; Said LED leadframe package 20 can further comprise at least two annular projections that form along the circumference profile of the upper surface of insulation support section 3; That is, annular projection 11,12,13 and 14, and at least one annular groove that forms between two annular projections in annular projection 11,12,13 and 14 respectively; That is, annular groove 15,16 and 17.A plurality of annular projections 11,12,13 and 14 and a plurality of annular groove 15,16 and 17 can be at the upper surface of insulation support section 3 with being formed centrally.As shown in Figure 5, can be formed with a plurality of annular projections 11,12,13 and 14 of sharp edges and sloped sidewall.
A plurality of annular projections 11,12,13 can be by processing with insulation support section 3 identical PPA plastics with 17 with a plurality of annular grooves 15,16 with 14, and can be used as the part of insulation support section 3.For example, can form a plurality of annular projections 11,12,13 and 14 and a plurality of annular groove 15,16 and 17 at the upper surface of insulation support section 3 through the transfer modling operation.Perhaps, a plurality of annular projections 11,12,13 and 14 and a plurality of annular groove 15,16 and 17 can during injection-molded operation, form, in this operation, a plurality of electrode 1, heat dissipation base 2 and insulation support section 3 are one-body molded.In Fig. 5, form four annular projections and three annular grooves, but the quantity of annular projection and annular groove can be carried out different choice according to embodiments of the invention.
In the manufacture process of LED encapsulation, use to have said structure, comprise a plurality of annular projections 11,12,13 and 14 and during the LED leadframe package 20 of a plurality of annular groove 15,16 and 17, can form sealant at an easy rate with sandwich construction.Fig. 6 is the section of structure that uses the LED encapsulation 30 of LED leadframe package 20 according to one embodiment of the invention.With reference to figure 6; LED encapsulation 30 comprise the bottom surface that is attached to heat dissipation base 2 LED tube core 4, be electrically connected LED tube core 4 and the many electric wires 6 of electrode 1, the sealant 7 of the covering LED tube core 4 that on the reflector 10 of heat dissipation base 2, forms, cover the fluorescence coating 8 of sealant 7 and the optical lens layer 9 that covers fluorescence coating 8.
LED tube core 4 can be fixed on the bottom surface of heat dissipation base 2 with for example tube core jointing material 5, that is, and and the bottom surface of the reflector 10 of heat dissipation base 2.The instance of said tube core jointing material 5 is silver paste and scolder.In the present embodiment, LED encapsulation 30 comprises a LED tube core 4 of the bottom surface that is arranged in heat dissipation base 2; But the present invention is not limited to this, and LED encapsulation 30 can comprise a plurality of LED tube cores 4 of the bottom surface that is arranged in heat dissipation base 2.For example, can be selected from least a in the group of forming by ultraviolet leds, blue-ray LED, green light LED and red-light LED in the sole arrangement of heat dissipation base 2.
Sealant 7, fluorescence coating 8 and optical lens layer 9 constitute multi-layer sealed layer structure.For effectively light output, sealant 7, fluorescence coating 8 and optical lens layer 9 can have convex external surface.In addition, absorb in order to prevent that light that fluorescence coating 8 sends from inciding on the LED tube core 4 and by LED tube core 4, in the wavelength of visible light band, the effective refractive index of sealant 7 can be less than the effective refractive index of fluorescence coating 8.
Fluorescence coating 8 sends visible light under ultraviolet light, blue light or green glow excite.For this reason, fluorescence coating 8 can be processed by mixture, in this mixture, and transparent material, for example, glass, Merlon (PC), polymethyl methacrylate (PMMA) or silicones evenly mix with fluorescent material.The instance of said fluorescent material comprises at least a fluorescent material that under the exciting of ultraviolet light, blue light or green glow, sends the visible light of different wave length.For example, fluorescent material can be and is selected from by the visible light that sends different wave length at least a in the group formed of the various fluorescent materials of blue light, green glow, gold-tinted, orange light or ruddiness for example.Green, yellow, orange and red fluorescence material can partially absorb blue light or green glow at least, or complete absorbing ultraviolet light, and in green, yellow, orange and red wave-length coverage, sends the spectrum with peak wavelength.Equally, thus blue fluorescent material can send the spectrum with peak wavelength through complete absorbing ultraviolet light in blue spectrum.
Through using fluorescence coating 8, can provide the LED encapsulation 30 of sending white light.For example, when LED tube core 4 sent blue light in the wave-length coverage of 450nm to 480nm, fluorescence coating 8 can be sent the light with yellow peak wavelength by blue-light excited.Then, gold-tinted and residue blue light, thus form white light.In addition, fluorescence coating 8 can comprise various fluorescent materials, and this fluorescent material sends the light of various wavelength under the exciting of the light with excitation wavelength that LED tube core 4 sends.In this case, when the light of various wavelength mixes, send white light.For example, when LED tube core 4 is emitted in the near ultraviolet ray of 380nm to 450nm scope, fluorescence coating 8 can be included in send respectively under exciting of near ultraviolet ray have blueness, blueness, green and the red fluorescence material of the light of green and red peak wavelength.Then, when blue light, green glow and ruddiness mix, form white light.
According to current embodiment of the present invention, the size of sealant 7, fluorescence coating 8 and optical lens layer 9 and the curvature of upper surface thereof can through a plurality of annular projections 11,12,13 and 14 and a plurality of annular groove 15,16 and 17 adjust at an easy rate.As shown in Figure 6, the edge of sealant 7 extends to annular projection 11, and the edge of fluorescence coating 8 extends to annular projection 12, and the edge of optical lens layer 9 extends to annular projection 13.When the edge of sealant 7, fluorescence coating 8 and optical lens layer 9 was limited to annular projection 11,12 and 13 respectively, the size of sealant 7, fluorescence coating 8 and optical lens layer 9 can easily be defined.In addition, be limited to the amount of material of sealant 7, fluorescence coating 8 and the optical lens layer 9 of corresponding annular projection 11,12 and 13 through adjustment, can easily confirm the curvature of the upper surface of sealant 7, fluorescence coating 8 and optical lens layer 9.
Hereinafter will be elaborated to the method for manufacturing LED encapsulation 30 mentioned above.At first; Utilize for example injection-molded operation to make LED leadframe package 20; This LED leadframe package 20 comprises: heat dissipation base 2, a plurality of electrodes 1 of arranging around heat dissipation base 2, around heat dissipation base 2 and a plurality of electrode 1 with the insulation support section 3 of fixedly heat dissipation base 2 and a plurality of electrode 1, at a plurality of annular projections 11,12,13 and 14 of the upper surface formation of insulation support section 3, and a plurality of annular grooves 15,16 and 17 that form between two annular projections in a plurality of annular projections 11,12,13 and 14 respectively.Then, at least one LED tube core 4 usefulness tube core jointing material 5 is attached on the bottom surface of heat dissipation base 2, and LED tube core 4 is electrically connected mutually with a plurality of electrodes 1 through many electric wires 6.
Next, filling liquid transparent resin material in the reflector 10 of heat dissipation base 2 is to cover LED tube core 4.For example, the liquid-transparent resin material can be silicones.The liquid-transparent resin material that q.s can be provided is in the liquid-transparent resin material is limited to said annular projection 11.Then, the outer surface of liquid-transparent resin material in the sharp-pointed top edge of annular projection 11 because surface tension forms convex surface.For example, as shown in Figure 8, when being provided with the transparent resin material 18 of q.s in the annular projection 11, form convex external surface owing to receiving surface tension.The curvature of convex external surface can be confirmed by the amount of transparent resin material 18.Even used too much transparent resin material 18 and therefore transparent resin material 18 overflow annular projection 11, transparent resin material 18 can be limited in the annular projection 12 once more, and is as shown in Figure 9.When the outer surface of transparent resin material reached the curvature of expection by this way, liquid-transparent resin material 18 hardened through heating or ultraviolet irradiation, thereby formed sealant 7.Therefore, can easily limit the size and the curvature of sealant 7.
Then, on sealant 7, form to cover sealant 7 with the mixed uniformly another kind of liquid-transparent resin material of fluorescent material.For example, the mixed uniformly mixture of liquid silicone and fluorescent material can form on sealant 7.Mixture is limited to annular projection 12, and because surface tension forms convex external surface in the sharp upper edge of annular projection 12.The outer surface of mixture reaches after the curvature of expection, and liquid mixture hardens through heating or ultraviolet irradiation, thereby forms fluorescence coating 8.
At last, another kind of liquid-transparent resin material forms on fluorescence coating 8 to cover fluorescence coating 8.For example, the liquid-transparent resin material can be silicones.Liquid-transparent resin material on the fluorescence coating 8 is limited on the 3rd annular projection 13, and because surface tension forms convex external surface in the sharp upper edge of the 3rd annular projection 13.Then, the formation optical lens layer 9 thereby the liquid-transparent resin material on the fluorescence coating 8 hardens.So, can form sealant 7, fluorescence coating 8 and the optical lens layer 9 of the outer surface curvature of size with expection and expection.
Fig. 7 is that LED encapsulates 40 section of structure in accordance with another embodiment of the present invention.Encapsulate two sealants that 30 different, shown in Figure 7 LED encapsulation 40 is included in fluorescence coating 8 belows with LED shown in Figure 6, that is, and first sealant 7 and the second sealant 7a.That is, between the fluorescence coating 8 and first sealant 7, also form the second transparent sealant 7a.The remainder of the structure of LED encapsulation 40 shown in Figure 7 is identical with the structure of LED encapsulation 30 shown in Figure 6.Therefore, with the explanation of the remainder of the structure of omitting LED encapsulation 40.
Form multi-layer sealed layer structure with reference to figure 7, the first sealants 7, the second sealant 7a, fluorescence coating 8 and optical lens layer 9 are common.For effectively light output, said first sealant 7, the second sealant 7a, fluorescence coating 8 and optical lens layer 9 can have convex external surface.In addition; Absorb in order to prevent that light that fluorescence coating 8 sends from inciding on the LED tube core 4 and by LED tube core 4; In wavelength of visible light, the effective refractive index of the second sealant 7a is less than the effective refractive index of fluorescence coating 8, and also less than the effective refractive index of first sealant 7.
As shown in Figure 7, the edge of first sealant 7 extends on the annular projection 11, and the edge of the second sealant 7a extends on the annular projection 12, and the edge of fluorescence coating 8 extends on the annular projection 13, and the edge of optical lens layer 9 extends on the Fourth Ring shape projection 14.Edge through with first sealant 7, the second sealant 7a, fluorescence coating 8 and optical lens layer 9 is limited to respectively on a plurality of annular projections 11,12,13 and 14, and the size of first sealant 7, the second sealant 7a, fluorescence coating 8 and optical lens layer 9 can be defined at an easy rate.In addition; Be limited to the amount of the material that is used for first sealant 7, the second sealant 7a, fluorescence coating 8 and optical lens layer 9 in a plurality of annular projections 11,12,13 and 14 through adjustment respectively, can confirm the curvature of the upper surface of first sealant 7, the second sealant 7a, fluorescence coating 8 and optical lens layer 9 at an easy rate.
The sealant structure of LED encapsulation 40 shown in Figure 7 can form through the method for using above-mentioned manufacturing LED encapsulation 30.Difference between the said LED encapsulation 40 and 30 is, before forming fluorescence coating 8 on first sealant 7, forms the second sealant 7a.That is, at first adopt said method to form first sealant 7, on first sealant 7, form the liquid-transparent resin material then to cover first sealant 7.For example, the liquid-transparent resin material can be silicones.Compare with first sealant 7, the liquid-transparent resin material of formation has less effective refractive index.For example, can in liquid silicone, add the additive that is used to adjust effective refractive index.Liquid-transparent resin material on first sealant 7 is limited in the annular projection 12, and because surface tension forms convex external surface in the sharp upper edge of annular projection 12.Then, through adopting heating or the ultraviolet irradiation liquid-transparent resin material on first sealant 7 that hardens, can form the second sealant 7a.Next, in the same manner as described above, on the second sealant 7a, sequentially form fluorescence coating 8 and optical lens layer 9.Yet the material of filling fluorescence coating 8 is limited in the annular projection 13 it, and the material of filling optical lens layer 9 is limited in the annular projection 14 it.
Use fluent material to form above-mentioned first sealant 7, the second sealant 7a, fluorescence coating 8 and optical lens layer 9 in proper order, but some layer also can adopt independent operation to prepare in advance.
For example, said fluorescence coating 8 can form in advance.In this case, in reflector 10, form first sealant 7 to cover LED tube core 4.Then, in the concave surface inside of the fluorescence coating 8 for preparing in advance, be provided for forming the liquid-transparent resin of the second sealant 7a with concave surface inside and convex surface outside.Then,, and be placed on first sealant 7, then through adopting heating or ultraviolet irradiation sclerosis transparent resin material the fluorescence coating that is filled with transparent resin material 8 upsets.Then, between first sealant 7 and fluorescence coating 8, form the second sealant 7a, fluorescence coating 8 can closely be fixed on first sealant 7.Then, as stated, can on fluorescence coating 8, form optical lens layer 9.
Perhaps, can prepare fluorescence coating 8 and optical lens layer 9 in advance.In this case, the fluorescence coating 8 of preparation is fixed on first sealant 7 in the above described manner in advance.Then, the optical lens layer 9 of preparation can be attached on the fluorescence coating 8 in advance.And can only prepare optical lens layer 9 in advance.In this case, adopt fluent material to form first sealant 7, the second sealant 7a and fluorescence coating 8 in proper order, the optical lens layer 9 that will prepare in advance then is attached on the fluorescence coating 8.
In order to make the white light LEDs encapsulation, can use the aforesaid multi-layer sealed layer structure that comprises fluorescence coating 8.But when color LED when encapsulation that the light of predetermined wavelength is sent in manufacturing, the LED tube core 4 that sends the light of this wavelength can be attached on the bottom surface of heat dissipation base 2, and on LED tube core 4, can only form a transparent seal layer.For example, as shown in Figure 8, transparent resin material 18 can be limited in one of them of first to fourth annular projection 11 to 14, sclerosis then, thus accomplish the color LED encapsulation.
Although with reference to exemplary embodiment of the present invention; The present invention illustrated in detail and explanation have been carried out; But it will be appreciated by those skilled in the art that in not departing from the defined the spirit and scope of the present invention of following claim, can carry out the change of various forms and details the present invention.
Claims (25)
1. a leadframe package is characterized in that, comprising:
Heat dissipation base;
A plurality of electrodes around said heat dissipation base layout;
Around said heat dissipation base and a plurality of electrode, with the insulation support section of fixing said heat dissipation base and a plurality of electrodes;
At least two annular projections that the circumference profile of the upper surface of the said insulation support section in edge forms; And
At least one annular groove that between said at least two annular projections, forms.
2. leadframe package according to claim 1 is characterized in that, said insulation support section is processed by polyphthalamide PPA plastics.
3. leadframe package according to claim 1 is characterized in that, arranges that said a plurality of electrode makes the side of the first end of said electrode towards heat dissipation base, and the second end of said electrode stretches out from the outer wall of insulation support section.
4. leadframe package according to claim 1 is characterized in that said heat dissipation base comprises reflector, and wherein, the coated on bottom side of said reflector is covered with reflectorized material.
5. leadframe package according to claim 1 is characterized in that, said at least two annular projections comprise sharp-pointed top edge and sloped sidewall separately.
6. leadframe package according to claim 1 is characterized in that, said heat dissipation base, a plurality of electrode and insulation support section are one-body molded through injection-molded operation.
7. leadframe package according to claim 1 is characterized in that, said annular projection and annular groove form through the upper surface of transfer modling operation at the insulation support section.
8. a LED encapsulation is characterized in that, comprises each described leadframe package in the claim 1 to 7.
9. LED encapsulation according to claim 8 is characterized in that, said LED encapsulation comprises:
Be attached at least one LED tube core of the bottom surface of heat dissipation base;
Be electrically connected many electric wires of said at least one LED tube core and a plurality of electrodes; And
Cover the LED tube core and comprise the sealant structure of the one deck at least with convex external surface, wherein, the edge of one deck at least of said sealant structure extends on the corresponding annular projection of said two annular projections at least.
10. LED according to claim 9 encapsulation is characterized in that, said LED tube core comprises and is selected from least a in the group of being made up of ultraviolet leds, blue-ray LED, green light LED and red-light LED.
11. LED encapsulation according to claim 9 is characterized in that said sealant structure comprises at least one transparent seal layer.
12. LED according to claim 9 encapsulation is characterized in that, the curvature of the upper surface of said one deck at least is used for the amount of material of one deck at least of said sealant structure and confirms through adjustment.
13. LED encapsulation according to claim 9 is characterized in that said sealant structure comprises:
Transparent and directly cover first sealant of LED tube core;
Cover the fluorescence coating of first sealant; And
Cover the optical lens layer of fluorescence coating.
14. LED encapsulation according to claim 13 is characterized in that in the wavelength of visible light band, the effective refractive index of said first sealant is less than the effective refractive index of said fluorescence coating.
15. LED encapsulation according to claim 13 is characterized in that said sealant structure further comprises transparent and is formed at second sealant between said first sealant and the said fluorescence coating.
16. LED encapsulation according to claim 15 is characterized in that in the wavelength of visible light band, the effective refractive index of said second sealant is less than the effective refractive index of said first sealant and the effective refractive index of said fluorescence coating.
17. LED encapsulation according to claim 16 is characterized in that said fluorescence coating forms through fluorescent material evenly is blended in glass, polycarbonate, polymetylmethacrylate or the silicones.
18. LED encapsulation according to claim 17 is characterized in that said fluorescent material sends visible light under the exciting of ultraviolet light, blue light or green glow.
19. LED encapsulation according to claim 18 is characterized in that said fluorescent material comprises at least a fluorescent material that under the exciting of ultraviolet light, blue light or green glow, sends the visible light of different wave length.
20. a method of making the LED encapsulation is characterized in that said method comprises:
Leadframe package is provided, and said leadframe package comprises: heat dissipation base; A plurality of electrodes around said heat dissipation base layout; Center on said heat dissipation base and a plurality of electrode insulation support section with fixing said heat dissipation base and a plurality of electrodes; At least two annular projections that the circumference profile of the upper surface of the said insulation support section in edge forms; And at least one annular groove that forms between two annular projections in said at least two annular projections;
At least one LED tube core is attached on the bottom surface of said heat dissipation base; Said LED tube core is connected with a plurality of electrode electricity; And
Formation has convex external surface to cover one deck at least of LED tube core;
Wherein, the edge of one deck at least of sealant structure extends on the corresponding annular projection of said two annular projections at least.
21. method according to claim 20 is characterized in that, forms said sealant structure and comprises:
On heat dissipation base, provide the liquid-transparent resin material to cover the LED tube core; And
Form first sealant through the said liquid-transparent resin material that hardens, wherein, in the sharp-pointed top edge of an annular projection in said a plurality of annular projections, said first sealant has the convex external surface that is formed by surface tension.
22. method according to claim 21 is characterized in that, said method further comprises:
On said first sealant, provide the liquid-transparent resin material to cover said first sealant;
Said liquid-transparent resin material through on said first sealant that hardens forms second sealant;
On said second sealant, provide the liquid-transparent resin material to cover said second sealant, wherein, in said liquid-transparent resin material, evenly be mixed with fluorescent material;
The liquid-transparent resin material that is mixed with fluorescent material through sclerosis forms fluorescence coating;
On said fluorescence coating, provide the liquid-transparent resin material to cover said fluorescence coating; And
Liquid-transparent resin material through on the sclerosis fluorescence coating forms the optical lens layer.
23. method according to claim 22; It is characterized in that; In the sharp-pointed top edge of another annular projection in said a plurality of annular projections; Said second sealant has the convex external surface that is formed by surface tension, and in the sharp-pointed top edge of another annular projection in said a plurality of annular projections, said fluorescence coating has the convex external surface that is formed by surface tension; In the sharp-pointed top edge of another annular projection in said a plurality of annular projections, said optical lens layer has the convex external surface that is formed by surface tension.
24. method according to claim 21 is characterized in that, said method further comprises:
On said first sealant, provide the liquid-transparent resin material that evenly is mixed with fluorescent material to cover said first sealant;
The liquid-transparent resin material that is mixed with fluorescent material through sclerosis forms fluorescence coating;
On said fluorescence coating, provide the liquid-transparent resin material to cover said fluorescence coating; And
Form the optical lens layer through the liquid-transparent resin material on the said fluorescence coating that hardens.
25. method according to claim 24; It is characterized in that; In the sharp-pointed top edge of another annular projection in said a plurality of annular projections; Said fluorescence coating has the convex external surface that is formed by surface tension, and in the sharp-pointed top edge of another annular projection in said a plurality of annular projections, said optical lens layer has the convex external surface that is formed by surface tension.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/381,408 US8058667B2 (en) | 2009-03-10 | 2009-03-10 | Leadframe package for light emitting diode device |
| US12/381,409 US8039862B2 (en) | 2009-03-10 | 2009-03-10 | White light emitting diode package having enhanced white lighting efficiency and method of making the same |
| US12/381,409 | 2009-03-10 | ||
| US12/381,408 | 2009-03-10 | ||
| PCT/KR2010/001134 WO2010104276A2 (en) | 2009-03-10 | 2010-02-24 | Led leadframe package, led package using the same, and method of manufacturing the led package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102318091A true CN102318091A (en) | 2012-01-11 |
Family
ID=42728911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010800077963A Pending CN102318091A (en) | 2009-03-10 | 2010-02-24 | LED leadframe package, LED package using the same, and method of manufacturing the LED package |
Country Status (9)
| Country | Link |
|---|---|
| EP (1) | EP2406835A4 (en) |
| JP (1) | JP2012520565A (en) |
| KR (1) | KR101111256B1 (en) |
| CN (1) | CN102318091A (en) |
| AU (1) | AU2010221920A1 (en) |
| RU (1) | RU2488195C2 (en) |
| SG (1) | SG173518A1 (en) |
| TW (1) | TW201044646A (en) |
| WO (1) | WO2010104276A2 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| RU2011134604A (en) | 2013-04-20 |
| WO2010104276A2 (en) | 2010-09-16 |
| JP2012520565A (en) | 2012-09-06 |
| KR101111256B1 (en) | 2012-02-22 |
| TW201044646A (en) | 2010-12-16 |
| KR20100106297A (en) | 2010-10-01 |
| SG173518A1 (en) | 2011-09-29 |
| RU2488195C2 (en) | 2013-07-20 |
| AU2010221920A1 (en) | 2011-09-29 |
| WO2010104276A3 (en) | 2010-11-25 |
| EP2406835A4 (en) | 2013-09-18 |
| EP2406835A2 (en) | 2012-01-18 |
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Application publication date: 20120111 |