CN102310265B - Method and device for detecting error for laser cutting processing system - Google Patents
Method and device for detecting error for laser cutting processing system Download PDFInfo
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- CN102310265B CN102310265B CN 201010221199 CN201010221199A CN102310265B CN 102310265 B CN102310265 B CN 102310265B CN 201010221199 CN201010221199 CN 201010221199 CN 201010221199 A CN201010221199 A CN 201010221199A CN 102310265 B CN102310265 B CN 102310265B
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Abstract
The invention relates to a method for detecting an error for a laser cutting processing system. The laser cutting processing system is provided with a machine station, a laser transmitter positioned on the machine station and a glass substrate which is positioned on the machine station and is coated with a coating layer. The laser transmitter can emit laser to cut the coating layer by the glass substrate. The method for detecting the error comprises the following steps of: a sensing step of sensing the laser passing through the glass substrate and the coating layer by a laser sensor; and a comparing step of recording a terminal waveform of the laser after the laser passes through the glass substrate and the coating layer by a waveform comparing device connected to the laser sensor, comparing the terminal waveform with a standard waveform of the laser when the laser passes through a normal glass substrate and the coating layer, and searching corresponding defects on the glass substrate and the coating layer to maintain if the waveform is changed.
Description
Technical field
The invention belongs to a kind of error-detecting method, especially the error-detecting method and the device thereof that refer to a kind of Laser cutting system, the waveform of the method detecting laser after by glass and dope layer, and compare with reference waveform, judged whether wave form varies, defectiveness whether on the glass that laser for confirmation passes through and dope layer, and then carry out subsequent treatment for the processing personnel.
Background technology
The Laser cutting technology is the industrial technology of generally using, it sees through generating laser and sends high power laser light so that the coating of coating on glass substrate is cut, add man-hour, part coatings with laser contact on dope layer suffers fusing, burning or gasification, then coordinates apparatus for removing such as high-pressure jet device etc. to remove the waste material that suffers Laser Processing on dope layer and come off.
Add man-hour, coating is coated on transparent glass substrate usually, and laser cuts coating by glass substrate.
Yet, when leaving impurity or having rough defective in glass substrate or coating one place, laser by this place is often reflected improperly, is reflected or consumed thereby can't be cut coating smoothly, because these impurity or defective can't be discovered easily, cause the dope layer after processing to have flaw, cause dope layer must re-start Laser Processing, waste time and energy.This glass substrate of leaving carries out subsequent technique if the processing personnel find also that the coating after processing has flaw, and the finished product of completing often can't be repaired and become scrap.
Summary of the invention
The inventor is difficult to detect impurity on glass substrate or coating or defective in view of present Laser cutting technology and causes the workpiece after processing to produce the shortcomings such as flaw, improve its deficiency and defective, thereby invent out error-detecting method and the device thereof of a kind of Laser cutting system.
Main purpose of the present invention provides a kind of Laser cutting system error-detecting method, the waveform of the method detecting laser after by glass and dope layer, and compare with reference waveform, judged whether wave form varies, defectiveness whether on the glass that laser for confirmation passes through and dope layer, and then carry out subsequent treatment for the processing personnel.
For reaching above-mentioned purpose, make above-mentioned error-detecting method be applicable to the Laser cutting system, this Laser cutting system has board, be positioned at generating laser on board, be positioned on board and be coated with the glass substrate of dope layer, generating laser can send laser to cut by glass substrate and to dope layer, and this error-detecting method comprises:
The sensing step is with the laser of laser sensor sensing by glass substrate and dope layer; And
The comparison step, terminal waveform with the waveform comparison device recording laser that is connected to laser sensor after by glass substrate and dope layer, and the reference waveform with terminal waveform and laser during by normal glass substrate and dope layer is compared, to draw whether wave form varies is arranged, wherein
If the terminal waveform is compared reference waveform without wave form varies, continue processing; And
If the terminal waveform is compared reference waveform, wave form varies is arranged, find out and the position of the mark corresponding glass substrate of this terminal waveform and dope layer among the waveform comparison device.
By above-mentioned technological means, see through laser sensor and waveform comparison device and compare laser by the wave form varies before and after glass substrate and dope layer, and judge whether the terminal waveform has abnormal decline or distortion, thereby can find out the defectives such as impurity on glass substrate and dope layer, concavo-convex, blocked up, slight crack, the glass substrate that the processing personnel record in also can Real Time Monitoring waveform comparison device and the defective locations of dope layer, and determine at any time whether to stop procedure in order to check, rebuild or replace problematic glass substrate or dope layer.By this, can promote the yield of laser cutting program, the problem of avoiding subsequent technique failure or the product of completing to scrap.
In above-mentioned comparison step, be preset with the threshold value of wave form varies degree in the waveform comparison device, if waveform comparison device discovery terminal waveform is compared, wave form varies is arranged between reference waveform, compare the terminal waveform and compare the intensity of variation of reference waveform, if and intensity of variation is lower than this default threshold value, the opposite position of making glass substrate and dope layer not is if higher than default threshold value, carry out mark.
in above-mentioned comparison step, be preset with the numerical value of the different wave form varies degree of plural number height in the waveform comparison device, and one of them numerical value is minimum threshold value, if waveform comparison device discovery terminal waveform is compared, wave form varies is arranged between reference waveform, compare the terminal waveform and compare the intensity of variation of reference waveform, if and intensity of variation is lower than this default threshold value, the opposite position of making glass substrate and dope layer not, if higher than default threshold value, with further compare with other numerical value, to draw this intensity of variation between which numerical value.
Above-mentioned intensity of variation refers to the amplitude variations degree of waveform.
Above-mentioned intensity of variation refers to the duration of wave form varies.
Above-mentioned intensity of variation is considered the duration that the amplitude variations degree of waveform changes simultaneously.
Another purpose of the present invention provides the Error Detection Unit of a kind of Laser cutting system, this Laser cutting system has board, be positioned at generating laser on board, be positioned on board and be coated with the glass substrate of dope layer, generating laser can send laser to cut by glass substrate and to workpiece, and this Error Detection Unit comprises:
Laser sensor, it is arranged on board, but its sensing is by the laser of glass substrate and dope layer; And
The waveform comparison device, be connected with laser sensing apparatus and board, but the terminal waveform of recording laser after by glass substrate and dope layer, and the reference waveform during by normal glass substrate and dope layer is compared with terminal waveform and laser, to draw whether wave form varies is arranged.
Above-mentioned Error Detection Unit further comprises the aperture that is positioned at laser sensor the place ahead, and this aperture is positioned on the Laser emission path, and can control the light quantity that laser enters laser sensor.
Be preset with the threshold value of wave form varies degree in above-mentioned waveform comparison device.
Be preset with the numerical value of the different wave form varies degree of plural number height in above-mentioned waveform comparison device.
Description of drawings
Above-mentioned and/or additional aspect of the present invention and advantage will become from the following description of the accompanying drawings of embodiments and obviously and easily understand, wherein:
Fig. 1 is side schematic view of the present invention.
Fig. 2 is schematic top plan view of the present invention.
Fig. 3 is the schematic diagram of the flawless glass substrate of laser penetration of the present invention and dope layer.
Fig. 4 A is the laser onset wave figure according to Fig. 3.
Fig. 4 B is laser terminal waveform (reference waveform) figure according to Fig. 3.
Fig. 5 is the schematic diagram of laser penetration glass substrate of the present invention and the defective dope layer of tool.
Fig. 6 A is the laser reference waveform figure according to Fig. 5.
Fig. 6 B figure is the laser terminal oscillogram according to Fig. 5.
Fig. 7 is the schematic diagram of the defective glass substrate of laser penetration tool of the present invention and dope layer.
Fig. 8 A is the laser reference waveform figure according to Fig. 7.
Fig. 8 B is the laser terminal oscillogram according to Fig. 7.
[main element symbol description]
(1) board (10) generating laser
(20) speculum (30) condenser lens
(40) laser sensor (41) aperture
(50) the vertical slide rail of waveform comparison device (60)
(70) the horizontal slide rail of slide unit (71)
(72) sliding clamp
(80) glass substrate (81) defective
(90) dope layer (91) defective
The specific embodiment
Please refer to Fig. 1 schemes to Fig. 4 B, the present invention is the error-detecting method of a kind of Laser cutting system, wherein, this Laser cutting system has board 1, generating laser 10, speculum 20, condenser lens 30, glass substrate 80 and is coated on dope layer 90 on glass substrate 80.Be provided with vertical slide rail 60 on this board 1, vertically slidably being provided with slide unit 70 on slide rail 60, be provided with horizontal slide rail 71 on this slide unit 70, laterally slidably be provided with sliding clamp 72 on slide rail 71.Board 1 can be connected to main control computer in order to control the slip of slide unit 70 and sliding clamp 72.Generating laser 10 is arranged in board 1, can send laser to cut by glass substrate 80 and to dope layer 90.Speculum 20 is arranged in board 1 and can reflects guide laser to suitable path.Condenser lens 30 is arranged in board 1 and is positioned on the path of laser, can be with Laser Focusing to above-mentioned coating layer 90.Glass substrate 80 is fixed on sliding clamp 72.90 of dope layers are arranged on glass substrate 80.
In addition, the onset wave of the laser that sends of generating laser 10 is as shown in Fig. 4 A; After the glass substrate and dope layer of laser penetration normal and free from admixture or concavo-convex defective, its waveform is namely reference waveform, as shown in Figure 4 B, compares down with onset wave, and reference waveform presents uniform wave amplitude decline, and between ripple and ripple almost without any difference.
The error-detecting method of Laser cutting of the present invention system comprises: sensing step and comparison step.
This sensing step is with the laser of laser sensor 40 sensings by glass substrate 80 and dope layer 90.Wherein, this laser sensor 40 is arranged on board 1 and is positioned on the path of laser, and when adding man-hour, laser can first then just can arrive laser sensor 40 by glass substrate 80 and dope layer 90.Laser sensor 40 can have CCD, CMOS or other photosensory assembly, and has analog/digital converter (A/D Converter) and be converted to digital signal for follow-up waveform analysis program.Moreover, can be provided with the aperture 41 that is positioned on the Laser emission path before laser sensor 40, this aperture 41 can see through the opening diameter that the degree of rotation of controlling aperture blades increase and decrease aperture 41 as having plural aperture blades as the aperture in conventional lenses, control by this laser and inject the light quantity of laser sensor 40, no matter make laser sensor 40 all can correctly respond to the waveform of laser at light or dark environment, and be unlikely to be affected by the brightness of external environment condition.This aperture 41 can be connected to above-mentioned main control computer and carry out the control of aperture in order to see through main control computer.
This comparison step with waveform comparison device 50 recording lasers that are connected to laser sensor 40 by glass substrate 80 and dope layer terminal waveform after 90s, and the reference waveform during with dope layer 90 is compared by normal glass substrate 80 with terminal waveform and laser, to draw whether wave form varies is arranged.This waveform comparison device 50 can be a kind of computer installation, can be above-mentioned main control computer, perhaps with main control computer self-existent device each other.The main signal that receives from laser sensor 40 of waveform comparison device 50 is mounted with waveform comparison software in order to analyze these signals in waveform comparison device 50.When waveform comparison device 50 is main control computer, can be mounted with the soft and hardware of CNC and be connected to board 1 and drive slide unit 70 and sliding clamp 72 carries out vertically and laterally slides, make by this dope layer 90 can be subject to laser cutting.
If above-mentioned terminal waveform is compared reference waveform without wave form varies, continue processing.
If above-mentioned terminal waveform is compared reference waveform, wave form varies is arranged, find out and the position of the corresponding glass substrate of this terminal waveform of mark 80 and dope layer 90 among waveform comparison device 50.
Please refer to Fig. 5, Fig. 6 A and Fig. 6 B, this is dope layer 90 situations that laser passes glass substrate 80 and has defective 91.That this defective 91 can be is uneven, blocked up, impurity etc. makes laser suffer improper reflection, refraction or the violent anomaly sxtructure that consumes decay.Fig. 6 A shows the reference waveform of laser, and Fig. 6 B shows the terminal waveform that laser penetration glass substrate 80 and dope layer are after 90s, and some compares the violent wave amplitude decline of remainder generation this terminal waveform, and in brief, terminal waveform relative standard waveform generation changes.
Please refer to Fig. 7, Fig. 8 A and Fig. 8 B, this has glass substrate 80 and dope layer 90 situations of defective 81 for laser passes.That this defective 81 can be is uneven, blocked up, impurity etc. makes laser suffer improper reflection, refraction or the violent anomaly sxtructure that consumes decay.Fig. 8 A shows the reference waveform of laser, Fig. 8 B figure shows the terminal waveform that laser penetration glass substrate 80 and dope layer are after 90s, some compares the violent wave amplitude decline of remainder generation this terminal waveform, and in brief, terminal waveform relative standard waveform generation changes.
Among preferred embodiment, in the comparison step, be preset with the threshold value of wave form varies degree in waveform comparison device 50, if waveform comparison device 50 discovery terminal waveforms are compared, wave form varies is arranged between reference waveform, compare the terminal waveform and compare the intensity of variation of reference waveform, and if intensity of variation lower than this default threshold value, the opposite position of making glass substrate 80 and dope layer 90 not, if the threshold value higher than default carries out mark.Intensity of variation and threshold value can percentages (%) or the unit (for example nm) of wave amplitude, wavelength represents and the duration of wave form varies.Here the duration of indication is directly proportional to the size of defective, and relevant with the vertical and horizontal sliding speed that drives slide unit 70 and sliding clamp 72, for example, when defective in 30 μ m and sliding speed during at 1000mm/s, duration is 0.030/1000=0.000030s=30 μ s, generally speaking, the defective greater than 30 μ m namely needs to get rid of.
among another preferred embodiment, in the comparison step, be preset with the numerical value of the different wave form varies degree of plural number height in waveform comparison device 50, and wherein a numerical value is minimum threshold value, if waveform comparison device 50 discovery terminal waveforms are compared, wave form varies is arranged between reference waveform, compare the terminal waveform and compare the intensity of variation of reference waveform, if and intensity of variation is lower than this default threshold value, the opposite position of making glass substrate 80 and dope layer 90 not, if higher than default threshold value, and further and other numerical value compare to draw this intensity of variation between which numerical value.The processing personnel can take the various level maintenance procedure between number range for intensity of variation.
Moreover above-mentioned wave form varies degree can refer to that the wavelength variations of the amplitude variations degree of waveform, waveform continues degree or both all consider.
by above-mentioned technological means, see through laser sensor 40 and waveform comparison device 50 and compare laser by the wave form varies of glass substrate 80 with dope layer 90 front and back, and judge whether the terminal waveform has abnormal decline or distortion, thereby can find out the impurity on glass substrate 80 and dope layer 90, concavo-convex, blocked up, the defectives such as slight crack, but the glass substrate 80 that the processing personnel also record in Real Time Monitoring waveform comparison device 50 and the defective locations of dope layer 90, and determine at any time whether stop procedure in order to check, rebuild or replace problematic glass substrate 80 or dope layer 90.By this, can promote the yield of laser cutting program, the problem of avoiding subsequent technique failure or the product of completing to scrap.
Claims (10)
1. the error-detecting method of a Laser cutting system, this Laser cutting system has board, be positioned at generating laser on board, be positioned on board and be coated with the glass substrate of dope layer, generating laser can send laser to cut by glass substrate and to dope layer, and this error-detecting method comprises:
The sensing step is with the laser of laser sensor sensing by glass substrate and dope layer; And
The comparison step, terminal waveform with the waveform comparison device recording laser that is connected to laser sensor after by glass substrate and dope layer, and the reference waveform with terminal waveform and laser during by normal glass substrate and dope layer is compared, to draw whether wave form varies is arranged, wherein
If the terminal waveform is compared reference waveform without wave form varies, continue processing; And
If the terminal waveform is compared reference waveform, wave form varies is arranged, find out and the position of the mark corresponding glass substrate of this terminal waveform and dope layer among the waveform comparison device.
2. the error-detecting method of Laser cutting as claimed in claim 1 system, wherein compare in step, be preset with the threshold value of wave form varies degree in the waveform comparison device, if waveform comparison device discovery terminal waveform is compared, wave form varies is arranged between reference waveform, compare the terminal waveform and compare the intensity of variation of reference waveform, and if intensity of variation lower than this default threshold value, the opposite position of making glass substrate and dope layer not, if the threshold value higher than default carries out mark.
3. the error-detecting method of Laser cutting as claimed in claim 1 system, wherein compare in step, be preset with the numerical value of the different wave form varies degree of plural number height in the waveform comparison device, and one of them numerical value is minimum threshold value, if waveform comparison device discovery terminal waveform is compared, wave form varies is arranged between reference waveform, compare the terminal waveform and compare the intensity of variation of reference waveform, if and intensity of variation is lower than this default threshold value, the opposite position of making glass substrate and dope layer not, if higher than default threshold value, further and other numerical value compare to draw this intensity of variation between which numerical value.
4. the error-detecting method of Laser cutting system as claimed in claim 2 or claim 3, wherein intensity of variation refers to that the amplitude variations of waveform continues degree.
5. the error-detecting method of Laser cutting system as claimed in claim 2 or claim 3, wherein intensity of variation refers to that the wavelength variations of waveform continues degree.
6. the error-detecting method of Laser cutting system as claimed in claim 2 or claim 3, wherein intensity of variation considers that simultaneously the amplitude variations of waveform continues degree and the lasting degree of wavelength variations.
7. the Error Detection Unit of a Laser cutting system, this Laser cutting system has board, be positioned at generating laser on board, be positioned on board and be coated with the glass substrate of dope layer, generating laser can send laser to cut by glass substrate and to dope layer, and this Error Detection Unit comprises:
Laser sensor, it is arranged on board, but its sensing is by the laser of glass substrate and dope layer; And
The waveform comparison device, be connected with laser sensing apparatus and board, but the terminal waveform of recording laser after by glass substrate and dope layer, and the reference waveform during by normal glass substrate and dope layer is compared with terminal waveform and laser, to draw whether wave form varies is arranged.
8. the Error Detection Unit of Laser cutting as claimed in claim 7 system, it further comprises the aperture that is positioned at laser sensor the place ahead, this aperture is positioned on the Laser emission path, and can control the light quantity that laser enters laser sensor.
9. the Error Detection Unit of Laser cutting as claimed in claim 7 system is preset with the threshold value of wave form varies degree in its waveform comparison device.
10. the Error Detection Unit of Laser cutting as claimed in claim 7 system, be preset with the numerical value that the different wave form varies of plural number height continues degree in its waveform comparison device.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010221199 CN102310265B (en) | 2010-07-01 | 2010-07-01 | Method and device for detecting error for laser cutting processing system |
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| CN 201010221199 CN102310265B (en) | 2010-07-01 | 2010-07-01 | Method and device for detecting error for laser cutting processing system |
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| CN102310265B true CN102310265B (en) | 2013-11-06 |
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| DE102015014297A1 (en) * | 2015-11-06 | 2017-05-11 | Saurer Germany Gmbh & Co. Kg | Method and device for cutting a running thread |
| CN112444561B (en) * | 2020-11-04 | 2023-05-16 | 武汉联开检测科技有限公司 | Gas production tree/christmas tree phased array ultrasonic detection method and system |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2737472B2 (en) * | 1991-09-09 | 1998-04-08 | 日産自動車株式会社 | Welding condition detector |
| CN101471272A (en) * | 2007-12-29 | 2009-07-01 | 财团法人工业技术研究院 | Automatic flaw detection device and method for substrate laser repairing device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS589783A (en) * | 1981-07-08 | 1983-01-20 | Agency Of Ind Science & Technol | Method of inspection for laser working |
| JPH11147189A (en) * | 1997-11-13 | 1999-06-02 | Sumitomo Heavy Ind Ltd | Instrument for detecting defect in laser beam welding |
| JP4818029B2 (en) * | 2006-08-29 | 2011-11-16 | 東急車輛製造株式会社 | Laser welding evaluation method |
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2010
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2737472B2 (en) * | 1991-09-09 | 1998-04-08 | 日産自動車株式会社 | Welding condition detector |
| CN101471272A (en) * | 2007-12-29 | 2009-07-01 | 财团法人工业技术研究院 | Automatic flaw detection device and method for substrate laser repairing device |
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