CN102310265A - Method and device for detecting error for laser cutting processing system - Google Patents
Method and device for detecting error for laser cutting processing system Download PDFInfo
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- CN102310265A CN102310265A CN2010102211992A CN201010221199A CN102310265A CN 102310265 A CN102310265 A CN 102310265A CN 2010102211992 A CN2010102211992 A CN 2010102211992A CN 201010221199 A CN201010221199 A CN 201010221199A CN 102310265 A CN102310265 A CN 102310265A
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Abstract
The invention relates to a method for detecting an error for a laser cutting processing system. The laser cutting processing system is provided with a machine station, a laser transmitter positioned on the machine station and a glass substrate which is positioned on the machine station and is coated with a coating layer. The laser transmitter can emit laser to cut the coating layer by the glass substrate. The method for detecting the error comprises the following steps of: a sensing step of sensing the laser passing through the glass substrate and the coating layer by a laser sensor; and a comparing step of recording a terminal waveform of the laser after the laser passes through the glass substrate and the coating layer by a waveform comparing device connected to the laser sensor, comparing the terminal waveform with a standard waveform of the laser when the laser passes through a normal glass substrate and the coating layer, and searching corresponding defects on the glass substrate and the coating layer to maintain if the waveform is changed.
Description
Technical field
The invention belongs to a kind of error-detecting method; Especially the error-detecting method and the device thereof that refer to a kind of Laser cutting system; This method detecting laser passes through the waveform behind glass and the dope layer, and compares with reference waveform, has judged whether wave form varies; Defectiveness whether on glass that laser for confirmation passed through and the dope layer, and then supply the processing personnel to carry out subsequent treatment.
Background technology
The Laser cutting technology is the technology that widespread usage is gone up in industry; It sees through generating laser and sends high power laser light so that the coating of coating on the glass substrate is cut; Add man-hour; Part coatings with laser contact on the dope layer suffers fusing, burning or gasification, and cooperation removes device such as high-pressure jet device or the like and removes the waste material that suffers Laser Processing on the dope layer and come off again.
Add man-hour, coating is coated on the transparent glass substrate usually, and laser cuts coating through glass substrate.
Yet; When leaving impurity or having rough defective in glass substrate or coating one place; Laser through this place often receives improperly and reflects, reflects or consume thereby can't cut coating smoothly, because these impurity or defective can't be discovered easily, causes the dope layer after the processing to have flaw; Cause dope layer to carry out Laser Processing again, waste time and energy.This glass substrate of leaving carries out subsequent technique if the processing personnel find also that the coating after the processing has flaw, and the finished product of then being accomplished often can't be repaired and become scrap.
Summary of the invention
The inventor is difficult to detect impurity or the defective on glass substrate or the coating and causes processed workpiece to produce shortcomings such as flaw in view of present Laser cutting technology; Improve its deficiency and defective, thereby invent out the error-detecting method and the device thereof of a kind of Laser cutting system.
Main purpose of the present invention provides a kind of Laser cutting system error-detecting method; This method detecting laser passes through the waveform behind glass and the dope layer; And compare with reference waveform; Judged whether wave form varies, defectiveness whether on glass that laser for confirmation passed through and the dope layer, and then supply the processing personnel to carry out subsequent treatment.
For reaching above-mentioned purpose; Make above-mentioned error-detecting method be applicable to the Laser cutting system; This Laser cutting system has board, be positioned at generating laser on the board, be positioned on the board and be coated with the glass substrate of dope layer; Generating laser can send laser to cut through glass substrate and to dope layer, and this error-detecting method comprises:
The sensing step is with the laser of laser sensor sensing through glass substrate and dope layer; And
The comparison step; With the waveform comparison device recording laser that the is connected to laser sensor terminal waveform after through glass substrate and dope layer; And the reference waveform with terminal waveform and laser during through normal glass substrate and dope layer is compared, to draw whether wave form varies is arranged, wherein
If the terminal waveform is compared the calm deformationization of reference waveform, then continue processing; And
If the terminal waveform is compared reference waveform wave form varies is arranged, then find out and the position of the mark pairing glass substrate of this terminal waveform and dope layer among the waveform comparison device.
By above-mentioned technological means; See through laser sensor and waveform comparison device and compare laser through the wave form varies before and after glass substrate and the dope layer; And judge whether the terminal waveform has unusual decline or distortion; Thereby can find out defectives such as impurity on glass substrate and the dope layer, concavo-convex, blocked up, slight crack; The processing personnel also can monitor the glass substrate that write down in the waveform comparison device and the defective locations of dope layer in real time, and decision at any time whether stops procedure so that inspection, rebuild or replace problematic glass substrate or dope layer.By this, can promote the yield of laser cutting program, the problem of avoiding the subsequent technique failure or the article of completion to scrap.
In the above-mentioned comparison step; Be preset with the threshold value of wave form varies degree in the waveform comparison device, wave form varies arranged between the reference waveform, then compare the intensity of variation that the terminal waveform is compared reference waveform if waveform comparison device discovery terminal waveform is compared; And if intensity of variation is lower than this preset threshold value; Then the opposite position of making glass substrate and dope layer not if be higher than preset threshold value, then carries out mark.
In the above-mentioned comparison step; Be preset with the numerical value of the different wave form varies degree of plural number height in the waveform comparison device, and one of them numerical value is minimum threshold value, compares wave form varies is arranged between the reference waveform if the waveform comparison device is found the terminal waveform; Then compare the terminal waveform and compare the intensity of variation of reference waveform; And if intensity of variation is lower than this preset threshold value, the opposite position of making glass substrate and dope layer not then is if be higher than preset threshold value; Which then with further compare, to draw this intensity of variation between numerical value with other numerical value.
Above-mentioned intensity of variation refers to the amplitude variations degree of waveform.
Above-mentioned intensity of variation refers to the duration of wave form varies.
Above-mentioned intensity of variation is considered the duration that the amplitude variations degree of waveform changes simultaneously.
Another purpose of the present invention provides the Error Detection Unit of a kind of Laser cutting system; This Laser cutting system has board, be positioned at generating laser on the board, be positioned on the board and be coated with the glass substrate of dope layer; Generating laser can send laser to cut through glass substrate and to workpiece, and this Error Detection Unit comprises:
Laser sensor, it is arranged on the board, but its sensing is through the laser of glass substrate and dope layer; And
The waveform comparison device; Be connected with laser sensing apparatus and board; But recording laser is through the terminal waveform behind glass substrate and the dope layer, and the reference waveform during through normal glass substrate and dope layer is compared with terminal waveform and laser, to draw whether wave form varies is arranged.
Above-mentioned Error Detection Unit further comprises the aperture that is positioned at laser sensor the place ahead, and this aperture is positioned on the Laser emission path, and can control the light quantity that laser gets into laser sensor.
Be preset with the threshold value of wave form varies degree in the above-mentioned waveform comparison device.
Be preset with the numerical value of the different wave form varies degree of plural number height in the above-mentioned waveform comparison device.
Description of drawings
Above-mentioned and/or additional aspect of the present invention and advantage are from obviously with easily understanding becoming the description of embodiment below in conjunction with accompanying drawing, wherein:
Fig. 1 is a side schematic view of the present invention.
Fig. 2 is a schematic top plan view of the present invention.
Fig. 3 is the sketch map of flawless glass substrate of laser penetration of the present invention and dope layer.
Fig. 4 A is according to the initial oscillogram of the laser of Fig. 3.
Fig. 4 B is laser terminal waveform (reference waveform) figure according to Fig. 3.
Fig. 5 is laser penetration glass substrate of the present invention and sketch map with dope layer of defective.
Fig. 6 A is the laser reference waveform figure according to Fig. 5.
Fig. 6 B figure is the laser terminal oscillogram according to Fig. 5.
Fig. 7 has the glass substrate of defective and the sketch map of dope layer for laser penetration of the present invention.
Fig. 8 A is the laser reference waveform figure according to Fig. 7.
Fig. 8 B is the laser terminal oscillogram according to Fig. 7.
[main element symbol description]
(1) board (10) generating laser
(20) speculum (30) condenser lens
(40) laser sensor (41) aperture
(50) the vertical slide rail of waveform comparison device (60)
(70) the horizontal slide rail of slide unit (71)
(72) sliding clamp
(80) glass substrate (81) defective
(90) dope layer (91) defective
The specific embodiment
Please scheme referring to figs. 1 through Fig. 4 B; The present invention is the error-detecting method of a kind of Laser cutting system; Wherein, this Laser cutting system has board 1, generating laser 10, speculum 20, condenser lens 30, glass substrate 80 and is coated on the dope layer 90 on the glass substrate 80.This board 1 is provided with vertical slide rail 60, vertically slidably is being provided with slide unit 70 on the slide rail 60, and this slide unit 70 is provided with horizontal slide rail 71, laterally slidably is being provided with sliding clamp 72 on the slide rail 71.Board 1 can be connected to main control computer so that the slip of control slide unit 70 and sliding clamp 72.Generating laser 10 is arranged in the board 1, can send laser to cut through glass substrate 80 and to dope layer 90.Speculum 20 is arranged in the board 1 and can reflects guiding laser to suitable path.Condenser lens 30 is arranged in the board 1 and is positioned on the path of laser, can laser be focused on above-mentioned coating layer 90.Glass substrate 80 is fixed on the sliding clamp 72.90 of dope layers are arranged on the glass substrate 80.
In addition, the initial waveform of the laser that sent of generating laser 10 is shown in Fig. 4 A; Behind the glass substrate and dope layer of laser penetration normal and free from admixture or concavo-convex defective, its waveform promptly is a reference waveform, shown in Fig. 4 B, compares down with initial waveform, and reference waveform presents uniform wave amplitude and fails, and almost has no difference between ripple and the ripple.
The error-detecting method of Laser cutting of the present invention system comprises: sensing step and comparison step.
This sensing step is with the laser of laser sensor 40 sensings through glass substrate 80 and dope layer 90.Wherein, this laser sensor 40 is arranged on the board 1 and is positioned on the path of laser, and when adding man-hour, laser can then just can arrive laser sensor 40 through glass substrate 80 and dope layer 90 earlier.Laser sensor 40 can have CCD, CMOS or other photosensory assembly, and has analog/digital converter (A/D Converter) and convert digital signal into for follow-up waveform analysis program.Moreover; Can be provided with the aperture 41 that is positioned on the Laser emission path before the laser sensor 40; The degree of rotation that this aperture 41 can see through the control aperture blades as having plural aperture blades as the aperture in the conventional lenses increase and decrease the opening diameter of aperture 41; Control laser by this and inject the light quantity of laser sensor 40,, and be unlikely to be influenced by the brightness of external environment condition no matter make laser sensor 40 all can correctly respond to the waveform of laser at light or dark environment.This aperture 41 can be connected to above-mentioned main control computer and carry out the control of aperture so that see through main control computer.
This comparison step is passed through glass substrate 80 and dope layer terminal waveform after 90s with waveform comparison device 50 recording lasers that are connected to laser sensor 40; And the reference waveform during with dope layer 90 is compared through normal glass substrate 80 with terminal waveform and laser, to draw whether wave form varies is arranged.This waveform comparison device 50 can be a kind of computer installation, can be above-mentioned main control computer, perhaps with the self-existent each other device of main control computer.The waveform comparison device 50 main signals that receive from laser sensor 40 are mounted with waveform comparison software so that analyze these signals in waveform comparison device 50.When waveform comparison device 50 is main control computer, can be mounted with soft, the hardware of CNC and be connected to board 1 and drive slide unit 70 and sliding clamp 72 carries out vertically and laterally slides, make dope layer 90 can receive cut by this.
If above-mentioned terminal waveform is compared the calm deformationization of reference waveform, then continue processing.
If above-mentioned terminal waveform is compared reference waveform wave form varies is arranged, then find out and the position of the pairing glass substrate 80 of this terminal waveform of mark and dope layer 90 among waveform comparison device 50.
Please with reference to Fig. 5, Fig. 6 A and Fig. 6 B, this is dope layer 90 situations that laser passes glass substrate 80 and has defective 91.That this defective 91 can be is uneven, blocked up, impurity etc. makes laser suffer improper reflection, refraction or the violent anomaly sxtructure that consumes decay.Fig. 6 A shows the reference waveform of laser, and Fig. 6 B shows laser penetration glass substrate 80 and dope layer terminal waveform after 90s, and some compares the violent wave amplitude decline of remainder generation this terminal waveform, and in brief, terminal waveform relative standard waveform generation changes.
Please with reference to Fig. 7, Fig. 8 A and Fig. 8 B, this has the glass substrate 80 and dope layer 90 situations of defective 81 for laser passes.That this defective 81 can be is uneven, blocked up, impurity etc. makes laser suffer improper reflection, refraction or the violent anomaly sxtructure that consumes decay.Fig. 8 A shows the reference waveform of laser; Fig. 8 B figure shows laser penetration glass substrate 80 and dope layer terminal waveform after 90s; Some compares the violent wave amplitude decline of remainder generation this terminal waveform, and in brief, terminal waveform relative standard waveform generation changes.
Among preferred embodiment, in the comparison step, be preset with the threshold value of wave form varies degree in the waveform comparison device 50; If waveform comparison device 50 discovery terminal waveforms are compared wave form varies are arranged between the reference waveform; Then compare the terminal waveform and compare the intensity of variation of reference waveform, and if intensity of variation is lower than this preset threshold value, then the opposite position of making glass substrate 80 and dope layer 90 not; If be higher than preset threshold value, then carry out mark.Intensity of variation and threshold value can percentages (%) or the unit (for example nm) of wave amplitude, wavelength representes and the duration of wave form varies.Here the duration of indication is directly proportional with the size of defective; And it is relevant with the vertical and horizontal sliding speed that drives slide unit 70 and sliding clamp 72; For example, when defective in 30 μ m and sliding speed during at 1000mm/s, the duration is 0.030/1000=0.000030s=30 μ s; Generally speaking, promptly need get rid of greater than the defective of 30 μ m.
Among another preferred embodiment; In the comparison step, be preset with the numerical value of the different wave form varies degree of plural number height in the waveform comparison device 50, and wherein a numerical value is minimum threshold value; If waveform comparison device 50 discovery terminal waveforms are compared wave form varies are arranged between the reference waveform; Then compare the terminal waveform and compare the intensity of variation of reference waveform, and if intensity of variation is lower than this preset threshold value, then the opposite position of making glass substrate 80 and dope layer 90 not; If be higher than preset threshold value, then and further and other numerical value compare to draw this intensity of variation between which numerical value.The processing personnel can take the various level maintenance procedure between number range to intensity of variation.
Moreover above-mentioned wave form varies degree can refer to that the wavelength variations of the amplitude variations degree of waveform, waveform continues degree or both all consider.
By above-mentioned technological means; See through laser sensor 40 and waveform comparison device 50 and compare laser through the wave form varies of glass substrate 80 with dope layer 90 front and back; And judge whether the terminal waveform has unusual decline or distortion; Thereby can find out defectives such as impurity on glass substrate 80 and the dope layer 90, concavo-convex, blocked up, slight crack; The processing personnel also can monitor the defective locations of the glass substrate that write down in the waveform comparison device 50 80 and dope layer 90 in real time, and decision at any time whether stops procedure so that inspection, rebuild or replace problematic glass substrate 80 or dope layer 90.By this, can promote the yield of laser cutting program, the problem of avoiding the subsequent technique failure or the article of completion to scrap.
Claims (10)
1. the error-detecting method of a Laser cutting system; This Laser cutting system has board, be positioned at generating laser on the board, be positioned on the board and be coated with the glass substrate of dope layer; Generating laser can send laser to cut through glass substrate and to dope layer, and this error-detecting method comprises:
The sensing step is with the laser of laser sensor sensing through glass substrate and dope layer; And
The comparison step; With the waveform comparison device recording laser that the is connected to laser sensor terminal waveform after through glass substrate and dope layer; And the reference waveform with terminal waveform and laser during through normal glass substrate and dope layer is compared, to draw whether wave form varies is arranged, wherein
If the terminal waveform is compared the calm deformationization of reference waveform, then continue processing; And
If the terminal waveform is compared reference waveform wave form varies is arranged, then find out and the position of the mark pairing glass substrate of this terminal waveform and dope layer among the waveform comparison device.
2. the error-detecting method of Laser cutting as claimed in claim 1 system is wherein compared in the step, is preset with the threshold value of wave form varies degree in the waveform comparison device; If waveform comparison device discovery terminal waveform is compared wave form varies is arranged between the reference waveform; Then compare the terminal waveform and compare the intensity of variation of reference waveform, and if intensity of variation is lower than this preset threshold value, then the opposite position of making glass substrate and dope layer not; If be higher than preset threshold value, then carry out mark.
3. the error-detecting method of Laser cutting as claimed in claim 1 system; Wherein compare in the step, be preset with the numerical value of the different wave form varies degree of plural number height in the waveform comparison device, and one of them numerical value is minimum threshold value; If waveform comparison device discovery terminal waveform is compared wave form varies is arranged between the reference waveform; Then compare the terminal waveform and compare the intensity of variation of reference waveform, and if intensity of variation is lower than this preset threshold value, then the opposite position of making glass substrate and dope layer not; If be higher than preset threshold value, then and further and other numerical value compare to draw this intensity of variation between which numerical value.
4. like the error-detecting method of claim 2 or 3 described Laser cutting systems, wherein intensity of variation refers to that the amplitude variations of waveform continues degree.
5. like the error-detecting method of claim 2 or 3 described Laser cutting systems, wherein intensity of variation refers to that the wavelength variations of waveform continues degree.
6. like the error-detecting method of claim 2 or 3 described Laser cutting systems, wherein intensity of variation considers that simultaneously the amplitude variations degree of waveform and wavelength variations continue degree.
7. the Error Detection Unit of a Laser cutting system; This Laser cutting system has board, be positioned at generating laser on the board, be positioned on the board and be coated with the glass substrate of dope layer; Generating laser can send laser to cut through glass substrate and to dope layer, and this Error Detection Unit comprises:
Laser sensor, it is arranged on the board, but its sensing is through the laser of glass substrate and dope layer; And
The waveform comparison device; Be connected with laser sensing apparatus and board; But recording laser is through the terminal waveform behind glass substrate and the dope layer, and the reference waveform during through normal glass substrate and dope layer is compared with terminal waveform and laser, to draw whether wave form varies is arranged.
8. the Error Detection Unit of Laser cutting as claimed in claim 7 system, it further comprises the aperture that is positioned at laser sensor the place ahead, this aperture is positioned on the Laser emission path, and can control the light quantity that laser gets into laser sensor.
9. the Error Detection Unit of Laser cutting as claimed in claim 7 system is preset with the threshold value of wave form varies degree in its waveform comparison device.
10. the Error Detection Unit of Laser cutting as claimed in claim 7 system is preset with the numerical value that the different wave form varies of plural number height continues degree in its waveform comparison device.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010221199 CN102310265B (en) | 2010-07-01 | 2010-07-01 | Method and device for detecting error for laser cutting processing system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010221199 CN102310265B (en) | 2010-07-01 | 2010-07-01 | Method and device for detecting error for laser cutting processing system |
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| Publication Number | Publication Date |
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| CN102310265A true CN102310265A (en) | 2012-01-11 |
| CN102310265B CN102310265B (en) | 2013-11-06 |
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| CN 201010221199 Expired - Fee Related CN102310265B (en) | 2010-07-01 | 2010-07-01 | Method and device for detecting error for laser cutting processing system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110202274A (en) * | 2015-11-06 | 2019-09-06 | 索若德国两合股份有限公司 | Method and apparatus for cutting the yarn advanced |
| CN112444561A (en) * | 2020-11-04 | 2021-03-05 | 武汉联开检测科技有限公司 | Gas production tree/Christmas tree phase array ultrasonic detection method and system |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS589783A (en) * | 1981-07-08 | 1983-01-20 | Agency Of Ind Science & Technol | Method of inspection for laser working |
| JP2737472B2 (en) * | 1991-09-09 | 1998-04-08 | 日産自動車株式会社 | Welding condition detector |
| JPH11147189A (en) * | 1997-11-13 | 1999-06-02 | Sumitomo Heavy Ind Ltd | Instrument for detecting defect in laser beam welding |
| WO2008026299A1 (en) * | 2006-08-29 | 2008-03-06 | Tokyu Car Corporation | Laser-welding evaluating method, and laser-welded portion forming method |
| CN101471272A (en) * | 2007-12-29 | 2009-07-01 | 财团法人工业技术研究院 | Automatic flaw detection device and method for substrate laser repairing device |
-
2010
- 2010-07-01 CN CN 201010221199 patent/CN102310265B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS589783A (en) * | 1981-07-08 | 1983-01-20 | Agency Of Ind Science & Technol | Method of inspection for laser working |
| JP2737472B2 (en) * | 1991-09-09 | 1998-04-08 | 日産自動車株式会社 | Welding condition detector |
| JPH11147189A (en) * | 1997-11-13 | 1999-06-02 | Sumitomo Heavy Ind Ltd | Instrument for detecting defect in laser beam welding |
| WO2008026299A1 (en) * | 2006-08-29 | 2008-03-06 | Tokyu Car Corporation | Laser-welding evaluating method, and laser-welded portion forming method |
| CN101471272A (en) * | 2007-12-29 | 2009-07-01 | 财团法人工业技术研究院 | Automatic flaw detection device and method for substrate laser repairing device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110202274A (en) * | 2015-11-06 | 2019-09-06 | 索若德国两合股份有限公司 | Method and apparatus for cutting the yarn advanced |
| CN112444561A (en) * | 2020-11-04 | 2021-03-05 | 武汉联开检测科技有限公司 | Gas production tree/Christmas tree phase array ultrasonic detection method and system |
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| CN102310265B (en) | 2013-11-06 |
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