CN102301436B - Electronic component and method of manufacturing same - Google Patents
Electronic component and method of manufacturing same Download PDFInfo
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- CN102301436B CN102301436B CN2010800057457A CN201080005745A CN102301436B CN 102301436 B CN102301436 B CN 102301436B CN 2010800057457 A CN2010800057457 A CN 2010800057457A CN 201080005745 A CN201080005745 A CN 201080005745A CN 102301436 B CN102301436 B CN 102301436B
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- 230000005294 ferromagnetic effect Effects 0.000 description 3
- 239000012467 final product Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
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- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
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- BGOFCVIGEYGEOF-UJPOAAIJSA-N helicin Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OC1=CC=CC=C1C=O BGOFCVIGEYGEOF-UJPOAAIJSA-N 0.000 description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
A multilayer electronic component wherein disconnection between a via hole conductor and coil electrodes can be prevented; and a method of manufacturing the same. The via hole conductor (B) is connected to a plurality of coil electrodes (18) and has a shape in which the area of one end part (t1) is larger than the area of the other end part (t2). A coil electrode (18a) is defined as a start electrode, a coil conductor (20) is defined as an end electrode, and coil electrodes (18b to 18e) other than the start electrode and end electrode are defined as intermediate electrodes. The start electrode is connected to the via hole conductor (B4), which is connected to the intermediate electrodes, by the larger end part (t1) of the same.
Description
Technical field
The present invention relates to electronic unit and manufacture method thereof, especially relate to insulating barrier and coil electrode stacked and the electronic unit and the manufacture method thereof that form.
Background technology
With reference to the accompanying drawings the structure of the existing electronic unit that is built-in with coil described.Figure 10 is the perspective view of existing electronic unit 200.Figure 11 is the exploded perspective view of the duplexer 202 of existing electronic unit 200.
As shown in figure 10, electronic unit 200 possesses: the duplexer 202 of the rectangular shape that coil is contained in inside, two outer electrode 212a, 212b on the opposed side of duplexer 202, forming.
Coil electrode 208a～208f has the shape that is " コ " font the electrode with length of 3/4 circle.Via hole conductor B51～B55 is arranged at respectively the end of each coil electrode 208a～208e and connects magnetic layer 204a～204e on above-below direction.Coil electrode 208a～208f interconnects by via hole conductor B51～B55, thereby forms spiral helicine coil.And, be respectively arranged with extraction electrode 210a, 210b at the top and bottom coil electrode 208a, the 208f formed of stacked direction.This extraction electrode 210a, 210b have realized the effect that coil is connected with outer electrode 212a, 212b.
In the existing electronic unit 200 formed as mentioned above, following described problem is arranged,, easily break between coil electrode 208f and via hole conductor B55.
As shown in figure 11, the length of the Length Ratio coil electrode 208a of coil electrode 208f is also long.Therefore, in coil, by the situation of electric current, the caloric value on coil electrode 208f is more than the caloric value on coil electrode 208a.And the end of the side that the area of via hole conductor B55 is little is connected with coil electrode 208f.Therefore, particularly in the heating of the concentrated area, coupling part of coil electrode 208f and via hole conductor B55.Its result easily breaks between coil electrode 208f and via hole conductor B55.
In addition, coil-conductor and the undermost coil-conductor of having put down in writing the superiors in patent documentation 1 have identical shaped laminated electronic component.Yet, in patent documentation 1 and the not mentioned problem of the broken string about the coupling part at via hole conductor and coil-conductor.
Patent documentation 1: Japanese Patent Laid-Open 2005-167130 communique
Summary of the invention
Therefore, the object of the present invention is to provide a kind of electronic unit and manufacture method thereof that can prevent the broken string between via hole conductor and coil electrode.
The electronic unit that one embodiment of the present invention are related is characterized in that:
Possess:
Form a plurality of coil electrodes of coil;
A plurality of insulating barriers, it is stacked and form duplexer together with above-mentioned a plurality of coil electrodes;
Two outer electrodes, it is arranged at the surface of above-mentioned duplexer;
Two connecting portions, it connects above-mentioned coil and above-mentioned two outer electrodes; And
The via hole conductor, it connects above-mentioned a plurality of coil electrodes, and has the large shape of area of Area Ratio the other end of an end,
In the above-mentioned coil electrode at the two ends that are arranged at stacked direction, connected above-mentioned via hole conductor is defined as to the initiating terminal electrode with the relative large above-mentioned coil electrode of DC resistance between above-mentioned connecting portion, connected above-mentioned via hole conductor is defined as to end electrodes with the relative little above-mentioned coil electrode of DC resistance between above-mentioned connecting portion, when the above-mentioned coil electrode beyond above-mentioned initiating terminal electrode and above-mentioned end electrode is defined as to target
Above-mentioned initiating terminal electrode is connected with the above-mentioned via hole conductor that is connected in above-mentioned target by an above-mentioned end.
In above-mentioned electronic unit, can be also that the above-mentioned end electrode has the length more than the number of turns that deducts the number of turns of above-mentioned target and obtain from a circle, and is connected with the above-mentioned via hole conductor that is connected in above-mentioned target by above-mentioned the other end.
In above-mentioned electronic unit, can be also that the above-mentioned via hole conductor that connects above-mentioned end electrode and above-mentioned target forms at above-mentioned insulating barrier and above-mentioned end electrode.
In above-mentioned electronic unit, can be also that, while overlooking from stacked direction, the above-mentioned end electrode is overlapping with the above-mentioned via hole conductor that is connected in above-mentioned target.
In above-mentioned electronic unit, can be also that the above-mentioned via hole conductor that connects above-mentioned initiating terminal electrode and above-mentioned target forms at above-mentioned insulating barrier and this initiating terminal electrode.
In above-mentioned electronic unit, can be also that, in the situation that will be defined as first direction towards the direction of above-mentioned initiating terminal electrode from the above-mentioned end electrode, in above-mentioned each via hole conductor, an above-mentioned end is positioned at than more close first direction one side in above-mentioned the other end.
In above-mentioned electronic unit, can be also that the above-mentioned end electrode is configured to and can be connected with above-mentioned via hole conductor in many places.
In above-mentioned electronic unit, can be also that the above-mentioned end electrode has the part shape thicker than other parts that can be connected with above-mentioned via hole conductor.
In above-mentioned electronic unit, can be also to connect the above-mentioned end electrode and be connected with the two ends part in addition of this end electrodes with the via hole conductor of above-mentioned target.
In above-mentioned electronic unit, above-mentioned connecting portion can be also the via hole conductor.
In above-mentioned electronic unit, can be also that above-mentioned connecting portion is the extraction electrode that is arranged on above-mentioned insulator and is connected with above-mentioned initiating terminal electrode or above-mentioned end electrode respectively.
The manufacture method of above-mentioned electronic unit is characterised in that, comprises:
Form the operation of above-mentioned via hole conductor on above-mentioned insulating barrier;
Form the operation of above-mentioned connecting portion on above-mentioned insulating barrier;
Form the operation of above-mentioned initiating terminal electrode and above-mentioned target on above-mentioned insulating barrier;
Form the operation of above-mentioned end electrode on above-mentioned insulating barrier; And
To be formed with above-mentioned initiating terminal electrode above-mentioned insulating barrier, be formed with the above-mentioned insulating barrier of above-mentioned end electrode and be formed with the above-mentioned insulating barrier of above-mentioned target stacked and form duplexer so that the operation of above-mentioned target between above-mentioned initiating terminal electrode and above-mentioned end electrode.
In the manufacture method of above-mentioned electronic unit, can be also that the operation that forms above-mentioned via hole conductor is carried out with the operation that forms above-mentioned initiating terminal electrode and above-mentioned target simultaneously.
The invention effect
According to the present invention, can prevent the broken string between via hole conductor and coil electrode.
The accompanying drawing explanation
Fig. 1 is the stereoscopic figure of the related electronic unit of one embodiment of the present invention.
Fig. 2 is the exploded perspective view of the duplexer of the electronic unit in Fig. 1.
Fig. 3 is the exploded perspective view of the duplexer of the electronic unit in the number of turns of coil situation about changing.
Fig. 4 is the perspective view of the electronic unit from y direction of principal axis perspective view 1.
Fig. 5 is the exploded perspective view of the duplexer of existing electronic unit.
Fig. 6 is the exploded perspective view of the duplexer of existing electronic unit.
Fig. 7 has an X-rayed the perspective view of existing electronic unit from the y direction of principal axis.
Fig. 8 means the figure of the coil electrode of above making at ceramic green sheet (green sheet) in experiment.
Fig. 9 means the figure of the variation of coil electrode.
Figure 10 is the perspective view of existing electronic unit.
Figure 11 is the exploded perspective view of the duplexer of existing electronic unit.
Embodiment
Below, electronic unit and the manufacture method thereof related to one embodiment of the present invention describe.This electronic unit is applied to for example inductor, impedor, LC filter, LC filter array.
(formation of electronic unit)
At first, with reference to accompanying drawing, the formation of the electronic unit related to one embodiment of the present invention describes.Fig. 1 is the stereoscopic figure of the related electronic unit of one embodiment of the present invention 10.Fig. 2 is the exploded perspective view of the duplexer 12 of the electronic unit 10 in Fig. 1.Below, by the stacked direction of duplexer 12 be defined as the z direction of principal axis, the direction vertical with the z direction of principal axis is defined as x direction of principal axis and y direction of principal axis.X direction of principal axis and y direction of principal axis are parallel with the limit of duplexer 12.
As shown in Figure 1, electronic unit 10 possesses duplexer 12 and outer electrode 14a, 14b.Duplexer 12 is rectangular shape, and coil L is contained in inside. Outer electrode 14a, 14b are arranged on the face at the axial two ends of z of duplexer 12, and are connected with coil L.
Each coil electrode the 18, the 20th, the conductive material of being made by Ag, have the shape of a circular resection part.In the present embodiment, coil electrode 18,20 is " コ " font.Thus, each coil electrode 18,20 forms the electrode of the length with 3/4 circle.In addition, coil electrode 18,20 also can be made for the conductive materials such as alloy of the noble metal of main component or these metals by Pd, Au, Pt etc.In addition, coil electrode 18,20 can be also by the circular or oval shape cut after a part.Below, coil electrode 18a～18e, 20 formation are separately described.
Coil electrode 18a is arranged on the magnetic layer 16d that is disposed at the most close positive direction side on the z direction of principal axis in magnetic layer 16d～16i, and is called the initiating terminal electrode.Coil electrode 18a has the number of turns identical with coil electrode 18b～18e.The end of this coil electrode 18a is provided with contact site C1 and the other end of this coil electrode 18a is provided with contact site C2.Contact site C1 is electrically connected to outer electrode 14a via via hole conductor B1～B3.Thereby, when the z direction of principal axis is overlooked, contact site C1 is arranged on the position overlapping with via hole conductor B1～B3.In addition, in order to make contact site C1, with via hole conductor B3, easily be connected, contact site C1 forms thicker than other parts of coil electrode 18a.For contact site C2 easily is connected with via hole conductor B4, contact site C2 forms thicker than other parts of coil electrode 18a, and forms with via hole conductor B4.
It is upper that coil electrode 18b is arranged at magnetic layer 16e, and be called target.Be provided with contact site C3 and be provided with contact site C4 at the other end of this coil electrode 18b at the end of this coil electrode 18b.In order at magnetic layer 16d and magnetic layer 16e, when stacked, contact site C3 easily to be connected with via hole conductor B4, contact site C3 forms thicker than other parts of coil electrode 18b.In addition, in order to make contact site C4, with via hole conductor B5, easily be connected, contact site C4 forms thicker than other parts of coil electrode 18b, and forms with via hole conductor B5.
It is upper that coil electrode 18c is arranged at magnetic layer 16f, and be called target.Be provided with contact site C5 and be provided with contact site C6 at the other end of this coil electrode 18c at the end of this coil electrode 18c.In order at magnetic layer 16e and magnetic layer 16f, when stacked, contact site C5 easily to be connected with via hole conductor B5, contact site C5 forms thicker than other parts of coil electrode 18c.In addition, in order to make contact site C6, with via hole conductor B6, easily be connected, contact site C6 forms thicker than other parts of coil electrode 18c, and forms with via hole conductor B6.
It is upper that coil electrode 18d is arranged at magnetic layer 16g, and be called target.Be provided with contact site C7 and be provided with contact site C8 at the other end of this coil electrode 18d at the end of this coil electrode 18d.In order at magnetic layer 16f and magnetic layer 16g, when stacked, contact site C7 easily to be connected with via hole conductor B6, contact site C7 forms thicker than other parts of coil electrode 18d.In addition, in order to make contact site C8, with via hole conductor B7, easily be connected, contact site C8 forms thicker than other parts of coil electrode 18d, and forms with via hole conductor B7.
It is upper that coil electrode 18e is arranged at magnetic layer 16h, and be called target.Be provided with contact site C9 and be provided with contact site C10 at the other end of this coil electrode 18e at the end of this coil electrode 18e.In order at magnetic layer 16g and magnetic layer 16h, when stacked, contact site C9 easily to be connected with via hole conductor B7, contact site C9 forms thicker than other parts of coil electrode 18e.In addition, in order to make contact site C10, with via hole conductor B8, easily be connected, contact site C10 forms thicker than other parts of coil electrode 18e, and forms with via hole conductor B8.
In order at magnetic layer 16h and magnetic layer 16i, when stacked, contact site C13 easily to be connected with via hole conductor B8, contact site C13 forms thicker than other parts of coil electrode 20.Contact site C14 is electrically connected to outer electrode 14b via via hole conductor B9～B12.Thereby, when the z direction of principal axis is overlooked, contact site C14 is arranged on the position overlapping with via hole conductor B9～B12.In addition, in order to make contact site C14, with via hole conductor B9, easily be connected, contact site C14 forms thicker than other parts of coil electrode 20, and forms with via hole conductor B9.In addition, in order to make contact site C11, C12, with via hole conductor B, easily be connected, contact site C11, C12 form thicker than other parts of coil electrode 20.Below, when meaning other contact site C1～C14, subsidiary numeral C after, during and general designation contact site C1～C14, be omitted in C numeral afterwards.
As mentioned above, form coil L by following electrode in electronic unit 10,, be positioned at an end of the axial positive direction side of z initiating terminal electrode (coil electrode 18a), be positioned at the end electrodes (coil electrode 20) of an end of the axial negative direction side of z and the four kinds of targets (coil electrode 18b～18e) except initiating terminal electrode and end electrodes.And, in the time will adjusting the number of turns of coil L, between electrode that is coil electrode 20 and target that is coil electrode 18e, the suitable coil electrode 18 among insertion target that is coil electrode 18b～18e gets final product endways.Specifically, as described below.Fig. 3 is the exploded perspective view that changes the duplexer 12 of electronic unit 10 in the situation of the number of turns of coil L.
For example, wish only increases the number of turns of the coil L of the duplexer 12 shown in Fig. 2 in the situation of one circle, as shown in Figure 3, as long as the magnetic layer 16m that inserts coil electrode 18f and be provided with via hole conductor B13 between magnetic layer 16h and magnetic layer 16i.Magnetic layer 16m, coil electrode 18f and via hole conductor B13 have the structure identical with magnetic layer 16e, coil electrode 18b and via hole conductor B5.Thus, can change the number of turns of coil.
In the situation that as shown in Figure 2 do not insert magnetic layer 16m, contact site C13 is for the connection with via hole conductor B8.In the situation that insertion magnetic layer 16m as shown in Figure 3, contact site C12 is for the connection with via hole conductor B13.Like this, when the z direction of principal axis is overlooked, coil electrode 20 is overlapping with the via hole conductor B be connected with target that is coil electrode 18e, 18f, thus coil electrode 20 have can with any one formation be connected of coil electrode 18e, 18f.And, when the z direction of principal axis is overlooked, coil electrode 20 is overlapping with the via hole conductor B be connected with target that is coil electrode 18c, thereby coil electrode 20 also has the formation that can be connected with coil electrode 18c.
Secondly, to the via hole conductor, B describes.Fig. 4 is the perspective view from y direction of principal axis perspective electronic unit 10.As shown in Figure 2, via hole conductor B is set to connect magnetic layer 16 at the z direction of principal axis, and as shown in Figure 4, when seeing from the y direction of principal axis, via hole conductor B has the large shape of area of end t2 of Area Ratio opposite side of the end t1 of a side.Be exactly that the Area Ratio that is positioned at the end t1 of the axial positive direction side of z is positioned at the area of the end t2 of the axial negative direction side of z and wants large in more detail.The annexation of each via hole conductor B below is described.
Via hole conductor B1～B3 connects in the mode be arranged on straight line on the z direction of principal axis.The end t2 of via hole conductor B 3 is connected with coil electrode 18a.The end t1 of via hole conductor B4 is connected with coil electrode 18a, and the end t2 of via hole conductor B4 is connected with coil electrode 18b.The end t1 of via hole conductor B5 is connected with coil electrode 18b, and the end t2 of via hole conductor B5 is connected with coil electrode 18c.The end t1 of via hole conductor B6 is connected with coil electrode 18c, and the end t2 of via hole conductor B6 is connected with coil electrode 18d.The end t1 of via hole conductor B7 is connected with coil electrode 18d, and the end t2 of via hole conductor B7 is connected with coil electrode 18e.The end t1 of via hole conductor B8 is connected with coil electrode 18e, and the end t2 of via hole conductor B8 is connected with coil electrode 20.Via hole conductor B9～B12 connects in the mode be arranged on straight line on the z direction of principal axis.The end t1 of via hole conductor B9 is connected with coil electrode 20.Thus, the end t1 in all via hole conductor B1～B12 is positioned at than end t2 near the axial positive direction side of z.
In the electronic unit 10 with above-mentioned formation, as shown in FIG. 2 and 3, coil electrode 20 is connected with via hole conductor B8, B13 that each is connected in target that is coil electrode 18e, 18f via different contact site C12, C13.So, if the number of turns of coil L changes, the distance between two via hole conductor B that are connected with coil electrode 20 also changes.Be exactly in more detail, under state as shown in Figure 2, distance between two via hole conductor B8, B9 that are connected with coil electrode 20 is relatively short, and, under state as shown in Figure 3, the distance between two via hole conductor B8, B9 that are connected with coil electrode 20 is relatively long.And, because coil electrode 18a and coil electrode 20 all have the length of 3/4 circle, so the DC resistance less between two via hole conductor B that are connected with end electrodes that is coil electrode 20, and the DC resistance between two via hole conductor B that are connected with initiating terminal electrode that is coil electrode 18a is relatively large.
(manufacture method of electronic unit)
Below with reference to Fig. 1 and Fig. 2, the manufacture method of electronic unit 10 is described.Below said manufacture method be to make an electronic unit 10 by the sheet material layered manner.But, also can make female duplexer with the ceramic green sheet of large in this manufacture method, then be divided into single duplexer 12.
At first, method is as described below made the ceramic green sheet as magnetic layer 16.According to iron oxide (Fe
2o
3) the various materials of ratio weighing of 48.0mol%, zinc oxide (ZnO) 25.0mol%, nickel oxide (NiO) 18.0mol%, cupric oxide (CuO) 9.0mol% drop in ball mill and carry out the wet type mediation as raw material.By the mixture crushed after being dried obtained, then by the roasting in advance 1 hour under 750 ℃ of the powder that obtains.After in ball mill, the powders calcined obtained being carried out to case of wet attrition, then drying is pulverized, and obtains the ferrite ceramics powder.
Add bond (vinyl acetate resin, water soluble propene etc.), plasticizer, moistening material and dispersant in this ferrite ceramics powder, and, after being mixed, by decompression, carry out deaeration in ball mill.The scraping blade method for ceramic slurry (doctor-blading) obtained is made to sheet dry, make the ceramic green sheet of expectation thickness (for example 35 μ m).
Form via hole conductor B in the ceramic green sheet that forms magnetic layer 16.Specifically, use laser beam to form through hole on ceramic green sheet.Herein, while laser beam decay by the inside of ceramic green sheet.Therefore, through hole has at the area of the peristome of a side of laser beam irradiation large, and the little conical in shape of the area of the peristome of opposition side.Then, the conductive paste of Ag, Pd, Cu, Au or these alloys etc. is filled in this through hole by methods such as printing apply.Thus, as shown in Figure 4, while seeing from the y direction of principal axis, formed the via hole conductor B of the shape that the area of end t2 of Area Ratio opposite side of the end t1 with a side is large.
Secondly, conductive paste using Ag, Pd, Cu, Au or these alloys etc. as main component is coated on the ceramic green sheet that forms magnetic layer 16d～16h by methods such as silk screen print method or photoetching processes, thereby forms initiating terminal electrode and target that is coil electrode 18a～18e.Specifically, on the ceramic green sheet that forms magnetic layer 16d～16h, form coil electrode 18 on the interarea of the end t1 side of via hole conductor B, make contact site C and via hole conductor B overlapping.In addition, also coil electrode 18 and via hole conductor B can be formed on ceramic green sheet simultaneously.
Secondly, the conductive paste using Ag, Pd, Cu, Au or these alloys etc. as main component is coated on the ceramic green sheet that forms magnetic layer 16i by methods such as silk screen print method or photoetching processes, thereby forms end electrodes that is coil electrode 20.Specifically, in the ceramic green sheet that forms magnetic layer 16i, the interarea formation coil electrode 20 in the end of via hole conductor B9 t1 side, make contact site C14 and via hole conductor B9 overlapping.In addition, coil electrode 20 and via hole conductor B9 also can be formed on ceramic green sheet simultaneously.
Then, each ceramic green sheet is stacked and form the duplexer 12 of not roasting.Now, duplexer 12 forms, coil electrode 18b～18e (target) is positioned between coil electrode 18a (initiating terminal electrode) and coil electrode 20 (end electrodes), and coil electrode 20 is connected with the via hole conductor B8 that is connected in coil electrode 18e via end t2, and the DC resistance be connected between via hole conductor B3, the B4 of coil electrode 18a is larger than the DC resistance between the via hole conductor B8, the B9 that are connected in coil electrode 20.Specifically, first configuration forms the ceramic green sheet of magnetic layer 16l.Then, carry out configuration and the temporary transient crimping of the ceramic green sheet to forming magnetic layer 16k on the ceramic green sheet that forms magnetic layer 16l.Afterwards, the ceramic green sheet that forms magnetic layer 16j, 16i, 16h, 16g, 16f, 16e, 16d, 16c, 16b, 16a is carried out to temporary transient crimping according to identical order.Thus, form the duplexer 12 of not roasting.By isostatic pressing machine etc. to this not the duplexer 12 of roasting implement formal crimping.
Then, duplexer 12 being taken off to binder processes and roasting.For example, sintering temperature is 900 ℃.Thus, can obtain the duplexer 12 after roasting.Such as apply main component on the surface of duplexer 12 by methods such as infusion processes be silver-colored electrode cream and carry out roasting, thereby form the silver electrode as outer electrode 14a, 14b.
Finally, implement nickel plating/zinc-plated on the surface of the silver electrode as outer electrode 14a, 14b.By above operation, complete the electronic unit 10 shown in Fig. 1.
(effect)
Can prevent the broken string between via hole conductor B4 and coil electrode 18a according to electronic unit 10.Specifically, in electronic unit 10, longer than coil electrode 20 because coil electrode 18a forms, in coil L, by the situation of electric current, coil electrode 18a generates heat more strongly than coil electrode 20.Particularly in the coupling part of coil electrode 18a and via hole conductor B4, concentrate heating.
Therefore, as shown in Figure 4, in electronic unit 10, the end t1 of via hole conductor B4 is connected with coil electrode 18a.This end t1 has the area larger than end t2.Therefore, in electronic unit 10, the DC resistance of the coupling part of coil electrode 18a and via hole conductor B4 reduces, and has suppressed to concentrate in this coupling part heating.Its result, suppressed to break at the boundary member of coil electrode 18a and via hole electrode B 4.
The application's inventor, in order to make above-mentioned effect clearer and more definite, carries out following static gas discharge test and estimates the broken string incidence.In test, use the 1st trial target and the 2nd trial target.The 1st trial target is equivalent to the related electronic unit of present embodiment 10.Specifically, use electronic unit 10 as shown in FIG. 2 and 3.In addition, the 2nd trial target is used the via hole conductor B in electronic unit 10 as shown in FIG. 2 and 3 at the axial parts towards upset of z.In addition, the details of the 1st trial target and the 2nd trial target is as described below.
Size: 1.00mm * 0.50mm * 0.50mm
The material of magnetic layer: Ni-Cu-Zn based ferrite
The material of outer electrode: plate Ni-Sn on silver electrode
The material of coil electrode: silver
The length of coil electrode: 3/4 circle
The number of turns of coil: 10 circles
Manufacture method: sheet material layered manner
Make respectively a plurality of the 1st trial targets and the 2nd trial target, wherein meet the condition of Rdc >=average+3 σ (wherein, so-called is on average the mean value of a plurality of Rdc) 10 of extractions respectively, to being respectively the 1st trial target and the 2nd trial target of 100, on positive negative direction, interval respectively applies the voltage 30 times of 30kV in 0.1 second.The result obtained thus is as shown in table 1.
[table 1]
| The 1st trial target | The 2nd trial target | |
| The broken string incidence | 0％(0/200) | 11％(22/200) |
As mentioned above, broken string has occurred and has not broken fully in the 1st trial target in the part in the 2nd trial target.Thereby be appreciated that the situation that can suppress the broken string generation in the related electronic unit of present embodiment 10.
In addition, in electronic unit 10, the via hole conductor B4 that connects initiating terminal electrode that is coil electrode 18a and target that is coil electrode 18b forms with coil electrode 18a in manufacturing process simultaneously, thereby forms with coil electrode 18a.Therefore, coil electrode 18a and being connected of via hole conductor B4 are become firmly, thereby be not easy to break in the coupling part of coil electrode 18a and via hole conductor B4.
In addition, according to electronic unit 10 and manufacture method thereof, as described below, without the position that redesigns via hole conductor B, also can change the number of turns of coil L.Fig. 5 and Fig. 6 are the exploded perspective views of the duplexer 112 of existing electronic unit 110.Fig. 7 is the perspective view at y direction of principal axis perspective electronic unit 110.Below, the stacked direction of duplexer 112 is defined as to the z axle, the direction vertical with the z direction of principal axis is defined as x direction of principal axis and y direction of principal axis.X direction of principal axis and y direction of principal axis are parallel with the limit of duplexer 112.
As shown in Figure 1, electronic unit 110 possesses the duplexer 112 of the rectangular shape that contains coil in inside and is arranged on two outer electrode 114a, 114b on the axial both ends of the surface of z of duplexer 112.
Coil electrode 118a～118e, 120 is " コ " font, is the wire electrode with 3/4 circle length.Via hole conductor b5～b8 is set to respectively the end at each coil electrode 118b～118e, connects magnetic layer 116e～116h on the z direction of principal axis.In addition, via hole conductor b9 is set in the bight of the lower left that is positioned at coil electrode 120, connects magnetic layer 116i on the z direction of principal axis.Thus, coil electrode 118a～118e, 120 is interconnected by via hole conductor b5～b9, thereby forms spiral helicine coil.
And via hole conductor b1～b4 is set to respectively connect magnetic layer 116a～116d on the z direction of principal axis, and coil electrode 118a is electrically connected to outer electrode 114a.In addition, via hole conductor b10～b12 is set to respectively connect magnetic layer 116j～116l on the z direction of principal axis, and coil electrode 120 and outer electrode 114b are electrically connected to.
In the existing electronic unit 110 formed as mentioned above, as described below, can change the number of turns of coil.Fig. 6 is the exploded perspective view of the duplexer 112 when changing the number of turns of coil.
Wish increases the number of turns of the coil of the duplexer 112 shown in Fig. 5 in the situation of 1 circle, as shown in Figure 6, inserts the magnetic layer 116m that is provided with coil electrode 118f and via hole conductor b13 and get final product between magnetic layer 116h and magnetic layer 116i.Coil electrode 118f and via hole conductor b13 have the structure identical with coil electrode 118b and via hole conductor b5.Thus, can change the number of turns of coil.In addition, wish increases the number of turns of the coil of duplexer 112 situation of 1 circle from the state of Fig. 6 again, as long as insert the magnetic layer 116 had with magnetic layer 116f same configuration between magnetic layer 116m and magnetic layer 116i.
But, as shown in Fig. 5 and Fig. 6, in electronic unit 110, if change the number of turns of coil, the position of end of coil electrode 118 that is positioned at the axial negative direction side of z of coil electrode 120 changes.Thereby, for coil electrode 118 and the coil electrode 120 that connects the axial negative direction side of the z that is positioned at coil electrode 120, must change the position of via hole conductor b9., while changing the number of turns of coil in electronic unit 110, need the position of redesign via hole conductor b9.
To this, in electronic unit 10 as shown in Figure 2, end electrodes that is coil electrode 20 are arranged at the lower side of stacked direction.The coil electrode 18 arranged directly over this coil electrode 20 changes according to the number of turns of coil L.Therefore, if the number of turns of coil L changes, the position of the end of this coil electrode 18 changes.
Yet coil electrode 18 is connected by the via hole conductor B formed with coil electrode 18 with coil electrode 20.Therefore, thus in the situation that the number of turns of coil L changes the change in location of the end that makes coil electrode 18, the position of via hole conductor B also changes with together with the position of the end of coil electrode 18.But, be arranged at coil electrode 20 directly over coil electrode 18 there is the structure identical with coil electrode 18b～18e.Therefore, in electronic unit 10, even the position of the position of the end of coil electrode 18 and via hole conductor B changes, also without the position that redesigns via hole conductor B.In addition, via hole conductor B and coil electrode 18 form and refer to, in manufacturing process, and the state that via hole conductor B8 and coil electrode 18e form simultaneously.
And then, in electronic unit 10, when the z direction of principal axis is overlooked, end electrodes that is coil electrode 20 are overlapping with the via hole conductor B be connected with target that is coil electrode 18b～18e.Therefore, even make the change in location of the via hole conductor B that is connected with coil electrode 20 because the number of turns of coil L changes, also can any one come connecting coil electrode 20 and via hole conductor B with contact site C11～C14.Its result, in electronic unit 10, while changing the number of turns of coil L, without redesign coil electrode 20., in electronic unit 10,20 of end electrodes that is coil electrodes are prepared a kind of getting final product.
But as shown in Figure 2, coil electrode 20 there is no need necessarily have the length overlapping with the via hole conductor B that is connected in coil electrode 18b～18e on (3/4 circle).As long as having from 1 circle, coil electrode 20 deducts the number of turns of target that is coil electrode 18a～18e and length more than the number of turns that obtains.Thus, coil electrode 20 at least can be connected with via hole conductor B at 2 places.More specifically, in the situation that coil electrode 20 has 1/4 circle length, as shown in Figure 2, coil electrode 20 can be connected with via hole conductor B8, B9.In addition, in the situation that coil electrode 20 has 1/2 circle length, as shown in Figure 3, coil electrode 20 can be connected with via hole conductor B9, B13.But in this case,, if change the length of coil L, need to redesign coil electrode 20.
In addition, according to electronic unit involved in the present invention 10, as described below, the via hole conductor B9 that can suppress to be connected with coil electrode 20 forms bad generation.In more detail, in the existing electronic unit 110 shown in Fig. 5 and Fig. 6, at coil electrode 120, be provided with via hole conductor b9 midway.
Yet, in the coil-conductor 120 that is provided with via hole conductor b9 midway of the coil electrode 120 as shown in Fig. 5 and Fig. 6, the formation that may produce via hole conductor b9 is bad.Specifically, in the coil-conductor 120 as shown in Fig. 5 and Fig. 6, because via hole conductor b9 is the formation midway at coil electrode 120, the wiring of coil electrode 120 is extended to both direction from via hole conductor b9.Therefore, in the situation that form coil-conductor 120 by silk screen print method, the wiring that conductive paste is used to coil electrode 120 forms, and can't supply with enough conductive pastes for via hole conductor b9.Its result, in the coil-conductor 120 as shown in Fig. 5 and Fig. 6, it is bad that via hole conductor b9 likely produces formation.
To this, in present embodiment, in related electronic unit 10, as shown in Figure 2, because via hole conductor B9 is formed at the end of coil electrode 20, the wiring of coil electrode 20 is only extended to a direction from via hole conductor B9.Therefore, in the situation that form coil electrode 20 by silk screen print method, conductive paste is used to the formation of the wiring of coil electrode 20, also is used to the formation of via hole conductor B9.Its result, in electronic unit 10, be difficult for occurring via hole conductor B9 and form bad problem.
The application's inventor, in order to make above-mentioned effect clearer and more definite, carries out the formation fraction defective that the via hole conductor is estimated in following experiment.Fig. 8 means the figure of the coil electrode 20 of making on ceramic green sheet in test.
As shown in Figure 8, in experiment, on the ceramic green sheet of 90mm * 90mm, by silk screen printing, formed 19044 coil electrodes, this ceramic green sheet has respectively through hole on the position of via hole conductor Ba～Bd.And, in 19044 coil electrodes, there is a via hole conductor that formation occurs bad, just think to occur the via hole conductor and form bad on this ceramic green sheet.200 ceramic green sheets are carried out to this operation.Experimental result is as shown in table 2.
[table 2]
| The position of via hole conductor | Ba | Bb |
| The formation fraction defective of via hole conductor | 0％(0/200) | 15％(30/200) |
| Bc | Bd |
| 17％(34/200) | 0％(0/200) |
As shown in table 2, the formation fraction defective of via hole conductor Ba, Bd that is positioned at the end of coil electrode 20 is 0%.The formation fraction defective that is positioned at via hole conductor Bb, the Bc midway of coil electrode 20 is 15% and 17%.Thereby, can be understood as in the situation that the end that the via hole conductor is arranged at coil electrode than the formation fraction defective that is arranged at coil electrode and can reduces the via hole conductor midway., in electronic unit 10, can be understood as because via hole conductor B9 is arranged at the end of coil electrode 20, so it is bad to be difficult for occurring the formation of via hole conductor B9.
(other execution mode)
In addition, electronic unit involved in the present invention is not limited to above-mentioned each execution mode, can in its main idea scope, change.Although for example, in Fig. 2, contact site C forms thicker than other parts of coil electrode 18,20, it is thick that contact site C might not want.For example, in the situation that the live width of coil electrode 18,20 is enough wide, contact site C also can form thick unlike other parts of coil electrode 18,20.
Herein, the situation of the coil electrode 20 that uses Fig. 9 described.The coil electrode 20 of Fig. 9 is different from the coil electrode 20 of Fig. 2, there is no clear and definite contact site C.Therefore, be difficult to only to see that coil electrode 20 monomers differentiate coil electrode 20 and be configured to and can be connected in many places with via hole conductor B8.
But, for example can say, in the situation that the part (some M, the N of Fig. 9) beyond the end of the reverse side of the end that is connected with via hole conductor B9 of coil electrode 20 connects via hole conductor B8, from the point that is connected with via hole conductor B8, to the end of a side that does not connect via hole conductor B9, can connect via hole conductor B8.Therefore, in the situation that stay the end of a side that does not connect via hole conductor B9, via hole conductor B8 is connected to coil electrode 20, thinks that coil electrode 20 is configured to can be connected with via hole conductor B8 in many places.
In addition, in electronic unit 10, although use the coil electrode 18 of 3/4 circle, also can use for example coil electrode 18 or 7/8 coil electrode 18 enclosed of 5/6 circle.
In addition, in the manufacture method of electronic unit 10, although make electronic unit 10 by the sheet material layered manner, the manufacture method of this electronic unit 10 is not limited to this.For example, electronic unit 10 also can adopt print process to make.
In addition, as shown in Figure 2, in electronic unit 10, long than coil electrode 20 by coil electrode 18a is formed, thus make the 1st D.C. resistance from via hole conductor B3 to via hole conductor B4 larger than the 2nd D.C. resistance from via hole conductor B8 to via hole conductor B9.But, make the 1st D.C. resistance be not limited to this than the large method of the 2nd D.C. resistance.For example, also can realize by live width or the thickness of adjusting coil electrode 18a and coil electrode 20.
In addition, in electronic unit 10, the two ends of coil L are connected with outer electrode 14a, 14b by via hole conductor B respectively.But the end of any side of coil L also can be connected with outer electrode 14a or outer electrode 14b by the lead division be connected with coil-conductor 18 on magnetic layer 16.
The possibility of applying on industry
The present invention can be used for electronic unit and manufacture method thereof, particularly prevent broken string between via hole conductor and coil electrode aspect on particularly good.Symbol description:
B1～B3... via hole conductor
C1～C16... contact site
L... coil
T1, t2... end
10... electronic unit
12... duplexer
14a, 14b... outer electrode
16a～16m... magnetic layer
18a～18f, 20... coil electrode
Claims (26)
1. an electronic unit is characterized in that:
Possess:
Form a plurality of coil electrodes of coil;
A plurality of insulating barriers, it is stacked and form duplexer together with above-mentioned a plurality of coil electrodes;
Two outer electrodes, it is arranged at the surface of above-mentioned duplexer;
Two connecting portions, it connects above-mentioned coil and above-mentioned two outer electrodes; And
The via hole conductor, it connects above-mentioned a plurality of coil electrodes, and has the large shape of area of Area Ratio the other end of an end,
In the above-mentioned coil electrode at the two ends that are arranged at stacked direction, connected above-mentioned via hole conductor is defined as to the initiating terminal electrode with the relative large above-mentioned coil electrode of DC resistance between above-mentioned connecting portion, connected above-mentioned via hole conductor is defined as to end electrodes with the relative little above-mentioned coil electrode of DC resistance between above-mentioned connecting portion, when the above-mentioned coil electrode beyond above-mentioned initiating terminal electrode and above-mentioned end electrode is defined as to target
Above-mentioned initiating terminal electrode is connected with the above-mentioned via hole conductor that is connected in above-mentioned target by an above-mentioned end.
2. electronic unit according to claim 1 is characterized in that:
The above-mentioned end electrode has the length more than the number of turns that deducts the number of turns of above-mentioned target and obtain from a circle, and is connected with the above-mentioned via hole conductor that is connected in above-mentioned target by above-mentioned the other end.
3. electronic unit according to claim 1 and 2 is characterized in that:
The above-mentioned via hole conductor that connects above-mentioned end electrode and above-mentioned target forms at above-mentioned insulating barrier and above-mentioned end electrode.
4. electronic unit according to claim 1 and 2 is characterized in that:
While overlooking from stacked direction, the above-mentioned end electrode is overlapping with the above-mentioned via hole conductor that is connected in above-mentioned target.
5. electronic unit according to claim 1 and 2 is characterized in that:
The above-mentioned via hole conductor that connects above-mentioned initiating terminal electrode and above-mentioned target forms at above-mentioned insulating barrier and this initiating terminal electrode.
6. electronic unit according to claim 1 and 2 is characterized in that:
In the situation that will be defined as first direction towards the direction of above-mentioned initiating terminal electrode from the above-mentioned end electrode, in above-mentioned each via hole conductor, an above-mentioned end is positioned at than more close first direction one side in above-mentioned the other end.
7. electronic unit according to claim 1 and 2 is characterized in that:
The above-mentioned end electrode is configured to and can be connected with above-mentioned via hole conductor in many places.
8. electronic unit according to claim 5 is characterized in that:
The above-mentioned end electrode is configured to and can be connected with above-mentioned via hole conductor in many places.
9. electronic unit according to claim 7 is characterized in that:
The above-mentioned end electrode has the part shape thicker than other parts that can be connected with above-mentioned via hole conductor.
10. electronic unit according to claim 8 is characterized in that:
The above-mentioned end electrode has the part shape thicker than other parts that can be connected with above-mentioned via hole conductor.
11. electronic unit according to claim 7 is characterized in that:
Connecting the above-mentioned end electrode is connected with the two ends part in addition of this end electrodes with the via hole conductor of above-mentioned target.
12. electronic unit according to claim 8 is characterized in that:
Connecting the above-mentioned end electrode is connected with the two ends part in addition of this end electrodes with the via hole conductor of above-mentioned target.
13. electronic unit according to claim 9 is characterized in that:
Connecting the above-mentioned end electrode is connected with the two ends part in addition of this end electrodes with the via hole conductor of above-mentioned target.
14. electronic unit according to claim 10 is characterized in that:
Connecting the above-mentioned end electrode is connected with the two ends part in addition of this end electrodes with the via hole conductor of above-mentioned target.
15. electronic unit according to claim 1 and 2 is characterized in that:
Above-mentioned connecting portion is the via hole conductor.
16. electronic unit according to claim 11 is characterized in that:
Above-mentioned connecting portion is the via hole conductor.
17. electronic unit according to claim 12 is characterized in that:
Above-mentioned connecting portion is the via hole conductor.
18. electronic unit according to claim 13 is characterized in that:
Above-mentioned connecting portion is the via hole conductor.
19. electronic unit according to claim 14 is characterized in that:
Above-mentioned connecting portion is the via hole conductor.
20. electronic unit according to claim 1 and 2 is characterized in that:
Above-mentioned connecting portion is the extraction electrode that is arranged on above-mentioned insulating barrier and is connected with above-mentioned initiating terminal electrode or above-mentioned end electrode respectively.
21. electronic unit according to claim 11 is characterized in that:
Above-mentioned connecting portion is the extraction electrode that is arranged on above-mentioned insulating barrier and is connected with above-mentioned initiating terminal electrode or above-mentioned end electrode respectively.
22. electronic unit according to claim 12 is characterized in that:
Above-mentioned connecting portion is the extraction electrode that is arranged on above-mentioned insulating barrier and is connected with above-mentioned initiating terminal electrode or above-mentioned end electrode respectively.
23. electronic unit according to claim 13 is characterized in that:
Above-mentioned connecting portion is the extraction electrode that is arranged on above-mentioned insulating barrier and is connected with above-mentioned initiating terminal electrode or above-mentioned end electrode respectively.
24. electronic unit according to claim 14 is characterized in that:
Above-mentioned connecting portion is the extraction electrode that is arranged on above-mentioned insulating barrier and is connected with above-mentioned initiating terminal electrode or above-mentioned end electrode respectively.
25. the manufacture method of an electronic unit, be the manufacture method of electronic unit claimed in claim 1, it is characterized in that:
Comprise:
Form the operation of above-mentioned via hole conductor on above-mentioned insulating barrier;
Form the operation of above-mentioned connecting portion on above-mentioned insulating barrier;
Form the operation of above-mentioned initiating terminal electrode and above-mentioned target on above-mentioned insulating barrier;
Form the operation of above-mentioned end electrode on above-mentioned insulating barrier; And
To be formed with above-mentioned initiating terminal electrode above-mentioned insulating barrier, be formed with the above-mentioned insulating barrier of above-mentioned end electrode and be formed with the above-mentioned insulating barrier of above-mentioned target stacked and form duplexer so that the operation of above-mentioned target between above-mentioned initiating terminal electrode and above-mentioned end electrode.
26. the manufacture method of electronic unit according to claim 25 is characterized in that:
The operation that forms above-mentioned via hole conductor is carried out with the operation that forms above-mentioned initiating terminal electrode and above-mentioned target simultaneously.
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| JPH0799116A (en) * | 1993-09-29 | 1995-04-11 | Matsushita Electric Ind Co Ltd | Multilayer ceramic electronic component, and its manufacture |
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