CN102301436A - Electronic component and method of manufacturing same - Google Patents
Electronic component and method of manufacturing same Download PDFInfo
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- CN102301436A CN102301436A CN2010800057457A CN201080005745A CN102301436A CN 102301436 A CN102301436 A CN 102301436A CN 2010800057457 A CN2010800057457 A CN 2010800057457A CN 201080005745 A CN201080005745 A CN 201080005745A CN 102301436 A CN102301436 A CN 102301436A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 239000004020 conductor Substances 0.000 claims abstract description 200
- 238000000034 method Methods 0.000 claims description 34
- 230000000977 initiatory effect Effects 0.000 claims description 29
- 230000004888 barrier function Effects 0.000 claims description 24
- 238000000605 extraction Methods 0.000 claims description 5
- 230000005291 magnetic effect Effects 0.000 description 66
- 239000000919 ceramic Substances 0.000 description 26
- 230000015572 biosynthetic process Effects 0.000 description 17
- 229910000859 α-Fe Inorganic materials 0.000 description 13
- 239000000463 material Substances 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 4
- 230000002950 deficient Effects 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229910018605 Ni—Zn Inorganic materials 0.000 description 3
- 229910007565 Zn—Cu Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000002788 crimping Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 230000005294 ferromagnetic effect Effects 0.000 description 3
- 239000012467 final product Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N Propene Chemical compound CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 229960004643 cupric oxide Drugs 0.000 description 2
- BGOFCVIGEYGEOF-UJPOAAIJSA-N helicin Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OC1=CC=CC=C1C=O BGOFCVIGEYGEOF-UJPOAAIJSA-N 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229910000480 nickel oxide Inorganic materials 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 230000001052 transient effect Effects 0.000 description 2
- 229910000967 As alloy Inorganic materials 0.000 description 1
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- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
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- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
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- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
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- 239000011347 resin Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
A multilayer electronic component wherein disconnection between a via hole conductor and coil electrodes can be prevented; and a method of manufacturing the same. The via hole conductor (B) is connected to a plurality of coil electrodes (18) and has a shape in which the area of one end part (t1) is larger than the area of the other end part (t2). A coil electrode (18a) is defined as a start electrode, a coil conductor (20) is defined as an end electrode, and coil electrodes (18b to 18e) other than the start electrode and end electrode are defined as intermediate electrodes. The start electrode is connected to the via hole conductor (B4), which is connected to the intermediate electrodes, by the larger end part (t1) of the same.
Description
Technical field
The present invention relates to electronic unit and manufacture method thereof, especially relate to insulating barrier and coil electrode is stacked and electronic unit and manufacture method thereof that constitute.
Background technology
Structure to the existing electronic unit that is built-in with coil describes with reference to the accompanying drawings.Figure 10 is the perspective view of existing electronic unit 200.Figure 11 is the exploded perspective view of the duplexer 202 of existing electronic unit 200.
As shown in figure 10, electronic unit 200 possesses: two outer electrode 212a, 212b that inside is contained the duplexer 202 of the rectangular shape of coil, formed on the opposed side of duplexer 202.
Coil electrode 208a～208f is the electrode that has the shape that is " コ " font and have the length of 3/4 circle.Via hole conductor B51～B55 is arranged at the end of each coil electrode 208a～208e respectively and connects magnetic layer 204a～204e on above-below direction.Coil electrode 208a～208f interconnects by via hole conductor B51～B55, thereby constitutes spiral helicine coil.And, be respectively arranged with extraction electrode 210a, 210b at the top and bottom coil electrode 208a, the 208f that forms of stacked direction.This extraction electrode 210a, 210b have realized effect that coil is connected with outer electrode 212a, 212b.
In the existing electronic unit 200 of Gou Chenging, following described problem is arranged as mentioned above, promptly, break easily between coil electrode 208f and the via hole conductor B55.
As shown in figure 11, the length of coil electrode 208f is also longer than the length of coil electrode 208a.Therefore, by under the situation of electric current, the caloric value on the coil electrode 208f is more than the caloric value on the coil electrode 208a in the coil.And the end of the side that the area of via hole conductor B55 is little is connected with coil electrode 208f.Therefore, particularly in the heating of the concentrated area, coupling part of coil electrode 208f and via hole conductor B55.Its result breaks between coil electrode 208f and via hole conductor B55 easily.
In addition, coil-conductor and the undermost coil-conductor of having put down in writing the superiors in patent documentation 1 has identical shaped laminated electronic component.Yet, in patent documentation 1 and not mentioned about broken string problem in the coupling part of via hole conductor and coil-conductor.
Patent documentation 1: the Japan Patent spy opens the 2005-167130 communique
Summary of the invention
Therefore, the object of the present invention is to provide a kind of electronic unit and manufacture method thereof that can prevent the broken string between via hole conductor and the coil electrode.
The electronic unit that one embodiment of the present invention are related is characterized in that:
Possess:
Constitute a plurality of coil electrodes of coil;
A plurality of insulating barriers, it is stacked and constitute duplexer with above-mentioned a plurality of coil electrodes;
Two outer electrodes, it is set at the surface of above-mentioned duplexer;
Two connecting portions, it connects above-mentioned coil and above-mentioned two outer electrodes; And
The via hole conductor, it connects above-mentioned a plurality of coil electrode, and has the area shape bigger than the area of the other end of an end,
In the above-mentioned coil electrode at the two ends that are arranged at stacked direction, the above-mentioned via hole conductor that connected is defined as the initiating terminal electrode with the relative big above-mentioned coil electrode of dc resistance between the above-mentioned connecting portion, the above-mentioned via hole conductor that connected is defined as end electrodes with the relative little above-mentioned coil electrode of dc resistance between the above-mentioned connecting portion, when the above-mentioned coil electrode beyond above-mentioned initiating terminal electrode and the above-mentioned end electrode is defined as target
Above-mentioned initiating terminal electrode is connected with the above-mentioned via hole conductor that is connected in above-mentioned target by an above-mentioned end.
In above-mentioned electronic unit also can be, the above-mentioned end electrode has the length more than the number of turns that deducts the number of turns of above-mentioned target and obtain from a circle, and is connected with the above-mentioned via hole conductor that is connected in above-mentioned target by above-mentioned the other end.
Also can be that the above-mentioned via hole conductor that connects above-mentioned end electrode and above-mentioned target forms at above-mentioned insulating barrier and above-mentioned end electrode in above-mentioned electronic unit.
Also can be that when stacked direction was overlooked, the above-mentioned end electrode was overlapping with the above-mentioned via hole conductor that is connected in above-mentioned target in above-mentioned electronic unit.
Also can be that the above-mentioned via hole conductor that connects above-mentioned initiating terminal electrode and above-mentioned target forms at above-mentioned insulating barrier and this initiating terminal electrode in above-mentioned electronic unit.
Also can be that being defined as under the situation of first direction from the direction of above-mentioned end electrode towards above-mentioned initiating terminal electrode, in above-mentioned each via hole conductor, an above-mentioned end is positioned at than more close first direction one side in above-mentioned the other end in above-mentioned electronic unit.
Also can be that the above-mentioned end electrode constitutes and can be connected with above-mentioned via hole conductor in many places in above-mentioned electronic unit.
In above-mentioned electronic unit also can be, the above-mentioned end electrode have can be wideer than other parts with the part that above-mentioned via hole conductor is connected shape.
Also can be to connect the above-mentioned end electrode and be connected with the two ends part in addition of this end electrodes in above-mentioned electronic unit with the via hole conductor of above-mentioned target.
In above-mentioned electronic unit, above-mentioned connecting portion also can be the via hole conductor.
Also can be that above-mentioned connecting portion is the extraction electrode that is set on the above-mentioned insulator and is connected with above-mentioned initiating terminal electrode or above-mentioned end electrode respectively in above-mentioned electronic unit.
The manufacture method of above-mentioned electronic unit is characterised in that, comprises:
On above-mentioned insulating barrier, form the operation of above-mentioned via hole conductor;
On above-mentioned insulating barrier, form the operation of above-mentioned connecting portion;
On above-mentioned insulating barrier, form the operation of above-mentioned initiating terminal electrode and above-mentioned target;
On above-mentioned insulating barrier, form the operation of above-mentioned end electrode; And
To be formed with above-mentioned initiating terminal electrode above-mentioned insulating barrier, be formed with the above-mentioned insulating barrier of above-mentioned end electrode and be formed with the above-mentioned insulating barrier of above-mentioned target stacked and form duplexer so that the operation of above-mentioned target between above-mentioned initiating terminal electrode and above-mentioned end electrode.
Also can be that the operation that forms above-mentioned via hole conductor is carried out simultaneously with the operation that forms above-mentioned initiating terminal electrode and above-mentioned target in the manufacture method of above-mentioned electronic unit.
The invention effect
According to the present invention, can prevent the broken string between via hole conductor and the coil electrode.
Description of drawings
Fig. 1 is the stereoscopic figure of the related electronic unit of one embodiment of the present invention.
Fig. 2 is the exploded perspective view of the duplexer of the electronic unit among Fig. 1.
Fig. 3 is the exploded perspective view of the duplexer of the electronic unit under the number of turns of the coil situation about changing.
Fig. 4 is the perspective view of the electronic unit from y direction of principal axis perspective view 1.
Fig. 5 is the exploded perspective view of the duplexer of existing electronic unit.
Fig. 6 is the exploded perspective view of the duplexer of existing electronic unit.
Fig. 7 is a perspective view of having an X-rayed existing electronic unit from the y direction of principal axis.
Fig. 8 is the figure that goes up the coil electrode of making in the expression experiment at ceramic green sheet (green sheet).
Fig. 9 is the figure of the variation of expression coil electrode.
Figure 10 is the perspective view of existing electronic unit.
Figure 11 is the exploded perspective view of the duplexer of existing electronic unit.
Embodiment
Below, electronic unit and the manufacture method thereof related to one embodiment of the present invention describe.This electronic unit is applied to for example inductor, impedor, LC filter, LC filter array.
(formation of electronic unit)
At first, come the formation of the related electronic unit of one embodiment of the present invention is described with reference to accompanying drawing.Fig. 1 is the stereoscopic figure of the related electronic unit of one embodiment of the present invention 10.Fig. 2 is the exploded perspective view of the duplexer 12 of the electronic unit 10 among Fig. 1.Below, with the stacked direction of duplexer 12 be defined as the z direction of principal axis, the direction vertical with the z direction of principal axis is defined as x direction of principal axis and y direction of principal axis.X direction of principal axis and y direction of principal axis are parallel with the limit of duplexer 12.
As shown in Figure 1, electronic unit 10 possesses duplexer 12 and outer electrode 14a, 14b.Duplexer 12 is rectangular shape, and coil L is contained in inside.Outer electrode 14a, 14b are arranged on the face at the axial two ends of z of duplexer 12, and are connected with coil L.
Each coil electrode the 18, the 20th by the conductive material that Ag makes, has the shape with a circular resection part.In the present embodiment, coil electrode 18,20 is " コ " font.Thus, each coil electrode 18,20 constitutes the electrode of the length with 3/4 circle.In addition, coil electrode 18,20 also can be made for the conductive materials such as alloy of the noble metal of main component or these metals by Pd, Au, Pt etc.In addition, coil electrode 18,20 also can be with the circular or oval shape that cuts after the part.Below, coil electrode 18a～18e, 20 formation are separately described.
Coil electrode 18a is arranged on the magnetic layer 16d that is disposed at the most close positive direction side on the z direction of principal axis in magnetic layer 16d～16i, and is called the initiating terminal electrode.Coil electrode 18a has the number of turns identical with coil electrode 18b～18e.The end of this coil electrode 18a is provided with contact site C1 and the other end of this coil electrode 18a is provided with contact site C2.Contact site C1 is electrically connected with outer electrode 14a via via hole conductor B1～B3.Thereby when the z direction of principal axis was overlooked, contact site C1 was arranged on and via hole conductor B1～B3 position overlapped.In addition, be connected easily with via hole conductor B3 in order to make contact site C1, contact site C1 forms wideer than other parts of coil electrode 18a.For contact site C2 is connected easily with via hole conductor B4, contact site C2 forms wideer than other parts of coil electrode 18a, and forms with via hole conductor B4.
Coil electrode 18c is arranged on the magnetic layer 16f, and is called target.Be provided with contact site C5 at the end of this coil electrode 18c and be provided with contact site C6 at the other end of this coil electrode 18c.For when magnetic layer 16e and magnetic layer 16f are stacked, contact site C5 is connected easily with via hole conductor B5, contact site C5 forms wideer than other parts of coil electrode 18c.In addition, be connected easily with via hole conductor B6 in order to make contact site C6, contact site C6 forms wideer than other parts of coil electrode 18c, and forms with via hole conductor B6.
Coil electrode 18e is arranged on the magnetic layer 16h, and is called target.Be provided with contact site C9 at the end of this coil electrode 18e and be provided with contact site C10 at the other end of this coil electrode 18e.For when magnetic layer 16g and magnetic layer 16h are stacked, contact site C9 is connected easily with via hole conductor B7, contact site C9 forms wideer than other parts of coil electrode 18e.In addition, be connected easily with via hole conductor B8 in order to make contact site C10, contact site C10 forms wideer than other parts of coil electrode 18e, and forms with via hole conductor B8.
For when magnetic layer 16h and magnetic layer 16i are stacked, contact site C13 is connected easily with via hole conductor B8, contact site C13 forms wideer than other parts of coil electrode 20.Contact site C14 is electrically connected with outer electrode 14b via via hole conductor B9～B12.Thereby when the z direction of principal axis was overlooked, contact site C14 was arranged on and via hole conductor B9～B12 position overlapped.In addition, be connected easily with via hole conductor B9 in order to make contact site C14, contact site C14 forms wideer than other parts of coil electrode 20, and forms with via hole conductor B9.In addition, be connected easily with via hole conductor B in order to make contact site C11, C12, contact site C11, C12 form wideer than other parts of coil electrode 20.Below, when expression other contact site C1～C14, subsidiary numeral C after during and general designation contact site C1～C14, is omitted in C numeral afterwards.
As mentioned above, in electronic unit 10, constitute coil L, promptly, be positioned at the initiating terminal electrode (coil electrode 18a) of an end of the axial positive direction side of z, the end electrodes (coil electrode 20) that is positioned at an end of the axial negative direction side of z and four kinds of targets except initiating terminal electrode and end electrodes (coil electrode 18b～18e) by following electrode.And in the time will adjusting the number of turns of coil L, the suitable coil electrode 18 among insertion target that is the coil electrode 18b～18e gets final product between electrode that is coil electrode 20 and target that is the coil electrode 18e endways.Specifically, as described below.Fig. 3 is the exploded perspective view that changes the duplexer 12 of electronic unit 10 under the situation of the number of turns of coil L.
For example, desire only increases the number of turns of the coil L of duplexer shown in Figure 2 12 under the situation of one circle, as shown in Figure 3, as long as the magnetic layer 16m that between magnetic layer 16h and magnetic layer 16i, inserts coil electrode 18f and be provided with via hole conductor B13.Magnetic layer 16m, coil electrode 18f and via hole conductor B13 have and magnetic layer 16e, coil electrode 18b and via hole conductor B5 identical construction.Thus, can change the number of turns of coil.
Under the situation of not inserting magnetic layer 16m as shown in Figure 2, contact site C13 is used for the connection with via hole conductor B8.Under the situation of as shown in Figure 3 insertion magnetic layer 16m, contact site C12 is used for the connection with via hole conductor B13.Like this, when the z direction of principal axis was overlooked, coil electrode 20 was overlapping with the via hole conductor B that is connected with target that is coil electrode 18e, 18f, thus coil electrode 20 have can with any one formation that is connected of coil electrode 18e, 18f.And when the z direction of principal axis was overlooked, coil electrode 20 was overlapping with the via hole conductor B that is connected with target that is coil electrode 18c, thereby coil electrode 20 also has the formation that can be connected with coil electrode 18c.
Secondly, B describes to the via hole conductor.Fig. 4 is the perspective view from y direction of principal axis perspective electronic unit 10.As shown in Figure 2, via hole conductor B is set to connect magnetic layer 16 at the z direction of principal axis, and as shown in Figure 4, when the y direction of principal axis is seen, via hole conductor B has the area of end t1 of a side than the big shape of area of the end t2 of opposite side.Be exactly that the area of end t1 that is positioned at the axial positive direction side of z is bigger than the area of the end t2 that is positioned at the axial negative direction side of z in more detail.The annexation of each via hole conductor B below is described.
Via hole conductor B1～B3 connects in the mode that is arranged on the straight line on the z direction of principal axis.The end t2 of via hole conductor B3 is connected with coil electrode 18a.The end t1 of via hole conductor B4 is connected with coil electrode 18a, and the end t2 of via hole conductor B4 is connected with coil electrode 18b.The end t1 of via hole conductor B5 is connected with coil electrode 18b, and the end t2 of via hole conductor B5 is connected with coil electrode 18c.The end t1 of via hole conductor B6 is connected with coil electrode 18c, and the end t2 of via hole conductor B6 is connected with coil electrode 18d.The end t1 of via hole conductor B7 is connected with coil electrode 18d, and the end t2 of via hole conductor B7 is connected with coil electrode 18e.The end t1 of via hole conductor B8 is connected with coil electrode 18e, and the end t2 of via hole conductor B8 is connected with coil electrode 20.Via hole conductor B9～B12 connects in the mode that is arranged on the straight line on the z direction of principal axis.The end t1 of via hole conductor B9 is connected with coil electrode 20.Thus, the end t1 among all via hole conductor B1～B12 is positioned at than end t2 near the axial positive direction side of z.
In the electronic unit 10 with above-mentioned formation, as Fig. 2 and shown in Figure 3, coil electrode 20 is connected with via hole conductor B8, the B13 that each is connected in target that is coil electrode 18e, 18f via different contact site C12, C13.So if the number of turns of coil L changes, the distance between two via hole conductor B that then are connected with coil electrode 20 also changes.Be exactly in more detail, under state as shown in Figure 2, distance between two via hole conductor B8, the B9 that are connected with coil electrode 20 is relatively short, and under state as shown in Figure 3, the distance between two via hole conductor B8, the B9 that are connected with coil electrode 20 is relatively long.And, because coil electrode 18a and coil electrode 20 all have the length of 3/4 circle, so relative less with the dc resistance between two via hole conductor B that end electrodes that is coil electrode 20 connects, and the dc resistance between two via hole conductor B that are connected with initiating terminal electrode that is coil electrode 18a is relatively large.
(manufacture method of electronic unit)
Below with reference to Fig. 1 and Fig. 2 the manufacture method of electronic unit 10 is described.Below said manufacture method be to make an electronic unit 10 by the sheet material layered manner.But, in this manufacture method, also can use the big ceramic green sheet of opening to make female duplexer, be divided into single duplexer 12 again.
Method at first, is as described below made the ceramic green sheet as magnetic layer 16.According to iron oxide (Fe
2O
3) the various materials of ratio weighing of 48.0mol%, zinc oxide (ZnO) 25.0mol%, nickel oxide (NiO) 18.0mol%, cupric oxide (CuO) 9.0mol% drop into as raw material and carry out wet type in the ball mill and be in harmonious proportion.With the mixture crushed after being dried that obtains, again with the roasting in advance 1 hour under 750 ℃ of the powder that obtains.After in ball mill the powders calcined that obtains being carried out case of wet attrition, drying is pulverized then, obtains the ferrite ceramics powder.
In this ferrite ceramics powder, add bond (vinyl acetate resin, water soluble propene etc.), plasticizer, moistening material and dispersant, and after in ball mill, mixing, carry out deaeration by decompression.The ceramic slurry that obtains is made sheet and dry with scraping blade method (doctor-blading), make the ceramic green sheet of expectation thickness (for example 35 μ m).
In the ceramic green sheet that constitutes magnetic layer 16, form via hole conductor B.Specifically, use laser beam on ceramic green sheet, to form through hole.Herein, while laser beam decay by the inside of ceramic green sheet.Therefore, through hole has at the area of the peristome of a side of laser beam irradiation big, and the little conical in shape of the area of the peristome of opposition side.Then, the conductive paste with Ag, Pd, Cu, Au or these alloys etc. is filled in this through hole by methods such as printing coatings.Thus, as shown in Figure 4, when the y direction of principal axis is seen, formed the via hole conductor B of the area of the end t1 with the side shape bigger than the area of the end t2 of opposite side.
Secondly, conductive paste as main component such as Ag, Pd, Cu, Au or these alloys is coated on the ceramic green sheet that constitutes magnetic layer 16d～16h by methods such as silk screen print method or photoetching processes, thereby forms initiating terminal electrode and target that is coil electrode 18a～18e.Specifically, on the ceramic green sheet that constitutes magnetic layer 16d～16h, form coil electrode 18 on the interarea of the end t1 side of via hole conductor B, make that contact site C and via hole conductor B are overlapping.In addition, also coil electrode 18 and via hole conductor B can be formed on the ceramic green sheet simultaneously.
Secondly, the conductive paste as main component such as Ag, Pd, Cu, Au or these alloys is coated on the ceramic green sheet that constitutes magnetic layer 16i by methods such as silk screen print method or photoetching processes, thereby forms end electrodes that is coil electrode 20.Specifically, in the ceramic green sheet that constitutes magnetic layer 16i, the interarea formation coil electrode 20 in the end of via hole conductor B9 t1 side makes that contact site C14 and via hole conductor B9 are overlapping.In addition, coil electrode 20 and via hole conductor B9 also can be formed on the ceramic green sheet simultaneously.
Then, each ceramic green sheet is stacked and form the duplexer 12 of not roasting.At this moment, duplexer 12 forms, coil electrode 18b～18e (target) is positioned between coil electrode 18a (initiating terminal electrode) and the coil electrode 20 (end electrodes), and coil electrode 20 is connected with the via hole conductor B8 that is connected in coil electrode 18e via end t2, and the dc resistance that is connected between via hole conductor B3, the B4 of coil electrode 18a is bigger than the dc resistance between the via hole conductor B8, the B9 that are connected in coil electrode 20.Specifically, configuration earlier constitutes the ceramic green sheet of magnetic layer 16l.Then, on the ceramic green sheet that constitutes magnetic layer 16l, carry out configuration and temporary transient crimping to the ceramic green sheet that constitutes magnetic layer 16k.Afterwards, the ceramic green sheet that constitutes magnetic layer 16j, 16i, 16h, 16g, 16f, 16e, 16d, 16c, 16b, 16a is carried out temporary transient crimping according to identical order.Thus, form the duplexer 12 of not roasting.By isostatic pressing machine etc. to this not the duplexer 12 of roasting implement formal crimping.
Then, duplexer 12 being taken off binder handles and roasting.For example, sintering temperature is 900 ℃.Thus, can obtain duplexer 12 after the roasting.For example on the surface of duplexer 12, apply main component for the electrode cream of silver and carry out roasting, thereby form silver electrode as outer electrode 14a, 14b by methods such as infusion processes.
At last, on surface, implement nickel plating/zinc-plated as the silver electrode of outer electrode 14a, 14b.By above operation, finish electronic unit shown in Figure 1 10.
(effect)
Can prevent broken string between via hole conductor B4 and the coil electrode 18a according to electronic unit 10.Specifically, in electronic unit 10, longer than coil electrode 20 because coil electrode 18a forms, by under the situation of electric current, coil electrode 18a generates heat more strongly than coil electrode 20 among the coil L.Particularly concentrate heating in the coupling part of coil electrode 18a and via hole conductor B4.
Therefore, as shown in Figure 4, in electronic unit 10, the end t1 of via hole conductor B4 is connected with coil electrode 18a.This end t1 has the area bigger than end t2.Therefore, in electronic unit 10, the dc resistance of the coupling part of coil electrode 18a and via hole conductor B4 reduces, and has suppressed the concentrated heating in this coupling part.Its result has suppressed to break at the boundary member of coil electrode 18a and via hole electrode B 4.
The application's inventor carries out following static gas discharge test and estimates the broken string incidence in order to make above-mentioned effect clearer and more definite.In the test, use the 1st trial target and the 2nd trial target.The 1st trial target is equivalent to the related electronic unit of present embodiment 10.Specifically, use as Fig. 2 and electronic unit 10 shown in Figure 3.In addition, use will be as the via hole conductor B in Fig. 2 and the electronic unit 10 shown in Figure 3 at the axial parts towards upset of z for the 2nd trial target.In addition, the details of the 1st trial target and the 2nd trial target is as described below.
Size: 1.00mm * 0.50mm * 0.50mm
The material of magnetic layer: Ni-Cu-Zn based ferrite
The material of outer electrode: on silver electrode, plate Ni-Sn
The material of coil electrode: silver
The length of coil electrode: 3/4 circle
The number of turns of coil: 10 circles
Manufacture method: sheet material layered manner
Make a plurality of the 1st trial targets and the 2nd trial target respectively, the condition that wherein satisfies Rdc 〉=average+3 σ (wherein, so-called on average is the mean value of a plurality of Rdc) 10 of extractions respectively, to being respectively 100 the 1st trial target and the 2nd trial target, on positive negative direction, respectively applied the voltage 30 times of 30kV at interval in 0.1 second.The result who obtains thus is as shown in table 1.
[table 1]
| The 1st trial target | The 2nd trial target | |
| The |
0％(0/200) | 11％(22/200) |
As mentioned above, broken string has taken place and has not broken fully in the 1st trial target in the part in the 2nd trial target.Thereby be appreciated that the situation that can suppress in the related electronic unit of present embodiment 10 breaks and take place.
In addition, in electronic unit 10, the via hole conductor B4 that connects initiating terminal electrode that is coil electrode 18a and target that is coil electrode 18b forms simultaneously with coil electrode 18a in manufacturing process, thereby forms with coil electrode 18a.Therefore, coil electrode 18a and being connected of via hole conductor B4 are become firmly, thereby be not easy to break in the coupling part of coil electrode 18a and via hole conductor B4.
In addition, according to electronic unit 10 and manufacture method thereof, as described below, the position that need not to redesign via hole conductor B also can change the number of turns of coil L.Fig. 5 and Fig. 6 are the exploded perspective views of the duplexer 112 of existing electronic unit 110.Fig. 7 is the perspective view at y direction of principal axis perspective electronic unit 110.Below, the stacked direction of duplexer 112 is defined as the z axle, the direction vertical with the z direction of principal axis is defined as x direction of principal axis and y direction of principal axis.X direction of principal axis and y direction of principal axis are parallel with the limit of duplexer 112.
As shown in Figure 1, electronic unit 110 possess inside contain coil rectangular shape duplexer 112 and be arranged on two outer electrode 114a, 114b on the axial both ends of the surface of z of duplexer 112.
Coil electrode 118a～118e, 120 is " コ " font, is the wire electrode with 3/4 circle length.Via hole conductor b5～b8 is set to the end at each coil electrode 118b～118e respectively, connects magnetic layer 116e～116h on the z direction of principal axis.In addition, via hole conductor b9 is set in the bight of the lower left that is positioned at coil electrode 120, connects magnetic layer 116i on the z direction of principal axis.Thus, coil electrode 118a～118e, 120 is interconnected by via hole conductor b5～b9, thereby constitutes spiral helicine coil.
And via hole conductor b1～b4 is set to respectively connect magnetic layer 116a～116d on the z direction of principal axis, and coil electrode 118a is electrically connected with outer electrode 114a.In addition, via hole conductor b10～b12 is set to respectively connect magnetic layer 116j～116l on the z direction of principal axis, and coil electrode 120 and outer electrode 114b are electrically connected.
In the existing electronic unit 110 of Gou Chenging, as described below as mentioned above, can change the number of turns of coil.Fig. 6 is the exploded perspective view of the duplexer 112 when changing the number of turns of coil.
Desire increases the number of turns of the coil of duplexer shown in Figure 5 112 under the situation of 1 circle, as shown in Figure 6, inserts the magnetic layer 116m that is provided with coil electrode 118f and via hole conductor b13 and get final product between magnetic layer 116h and magnetic layer 116i.Coil electrode 118f and via hole conductor b13 have and coil electrode 118b and via hole conductor b5 identical construction.Thus, can change the number of turns of coil.In addition, desire increases the number of turns of the coil of duplexer 112 state from Fig. 6 under the situation of 1 circle again, as long as insertion has magnetic layer 116 with magnetic layer 116f same configuration between magnetic layer 116m and magnetic layer 116i.
But as Fig. 5 and shown in Figure 6, in electronic unit 110, if change the number of turns of coil, the position of end of coil electrode 118 that then is positioned at the axial negative direction side of z of coil electrode 120 changes.Thereby,, must change the position of via hole conductor b9 for coil electrode 118 and the coil electrode 120 that connects the axial negative direction side of the z that is positioned at coil electrode 120.Promptly, when in electronic unit 110, changing the number of turns of coil, need the position of redesign via hole conductor b9.
To this, in electronic unit 10 as shown in Figure 2, end electrodes that is coil electrode 20 are arranged at the lower side of stacked direction.The coil electrode 18 that is provided with directly over this coil electrode 20 changes according to the number of turns of coil L.Therefore, if the number of turns of coil L changes, then the position of the end of this coil electrode 18 changes.
Yet coil electrode 18 and coil electrode 20 are by being connected with via hole conductor B that coil electrode 18 forms.Therefore, thus under the number of turns of coil L changed the situation of change in location of the end that makes coil electrode 18, the position of via hole conductor B also changed together with the position of the end of coil electrode 18.But, be arranged at coil electrode 20 directly over coil electrode 18 have and coil electrode 18b～18e identical construction.Therefore, in electronic unit 10,, also need not to redesign the position of via hole conductor B even the position of the position of the end of coil electrode 18 and via hole conductor B changes.In addition, via hole conductor B and coil electrode 18 form and are meant, in manufacturing process, and the state that via hole conductor B8 and coil electrode 18e form simultaneously.
And then in electronic unit 10, when the z direction of principal axis was overlooked, end electrodes that is coil electrode 20 were overlapping with the via hole conductor B that is connected with target that is coil electrode 18b～18e.Therefore, even make the change in location of the via hole conductor B that is connected with coil electrode 20 because of the number of turns of coil L changes, any one comes connecting coil electrode 20 and via hole conductor B also can to use contact site C11～C14.Its result in electronic unit 10, when changing the number of turns of coil L, need not to redesign coil electrode 20.Promptly, in electronic unit 10,20 of end electrodes that is coil electrodes are prepared a kind of getting final product.
But as shown in Figure 2, coil electrode 20 there is no need necessarily have the length overlapping with the via hole conductor B that is connected in coil electrode 18b～18e on (3/4 circle).As long as coil electrode 20 has the length of enclosing more than the number of turns that deducts the number of turns of target that is coil electrode 18a～18e and obtain from 1.Thus, coil electrode 20 can be connected with via hole conductor B at 2 places at least.More specifically, have at coil electrode 20 under the situation of 1/4 circle length, as shown in Figure 2, coil electrode 20 can be connected with via hole conductor B8, B9.In addition, have at coil electrode 20 under the situation of 1/2 circle length, as shown in Figure 3, coil electrode 20 can be connected with via hole conductor B9, B13.But in this case,, then need to redesign coil electrode 20 if change the length of coil L.
In addition, as described below according to electronic unit involved in the present invention 10, the via hole conductor B9 that can suppress to be connected with coil electrode 20 forms bad generation.In more detail, in Fig. 5 and existing electronic unit 110 shown in Figure 6, be provided with via hole conductor b9 midway at coil electrode 120.
Yet in the coil-conductor 120 that is provided with via hole conductor b9 midway as Fig. 5 and coil electrode 120 shown in Figure 6, the formation that may produce via hole conductor b9 is bad.Specifically, in as Fig. 5 and coil-conductor 120 shown in Figure 6, because via hole conductor b9 is the formation midway at coil electrode 120, the wiring of coil electrode 120 is extended to both direction from via hole conductor b9.Therefore, forming by silk screen print method under the situation of coil-conductor 120, the wiring that conductive paste is used to coil electrode 120 forms, and can't supply with enough conductive pastes for via hole conductor b9.Its result, in as Fig. 5 and coil-conductor 120 shown in Figure 6, via hole conductor b9 might produce form bad.
To this, in the related electronic unit 10 of present embodiment, as shown in Figure 2, because via hole conductor B9 is formed at the end of coil electrode 20, the wiring of coil electrode 20 is only extended to a direction from via hole conductor B9.Therefore, forming by silk screen print method under the situation of coil electrode 20, conductive paste is used to the formation of the wiring of coil electrode 20, also is used to the formation of via hole conductor B9.Its result in electronic unit 10, is difficult for taking place via hole conductor B9 and forms bad problem.
The application's inventor carries out the formation fraction defective that the via hole conductor is estimated in following experiment in order to make above-mentioned effect clearer and more definite.Fig. 8 is the figure of the coil electrode 20 made on the ceramic green sheet of representing in test.
As shown in Figure 8, in experiment, formed 19044 coil electrodes by silk screen printing on the ceramic green sheet of 90mm * 90mm, this ceramic green sheet has through hole respectively on the position of via hole conductor Ba～Bd.And there have a via hole conductor that formation takes place in 19044 coil electrodes to be bad, just thinks to take place the via hole conductor and form bad on this ceramic green sheet.200 ceramic green sheets are carried out this operation.Experimental result is as shown in table 2.
[table 2]
As shown in table 2, the formation fraction defective of via hole conductor Ba, Bd that is positioned at the end of coil electrode 20 is 0%.The formation fraction defective that is positioned at midway via hole conductor Bb, the Bc of coil electrode 20 is 15% and 17%.Thereby, can be understood as at the via hole conductor and be arranged under the situation of end of coil electrode than being arranged at the formation fraction defective that can reduce the via hole conductor under the coil electrode situation midway.Promptly, in electronic unit 10, can be understood as because via hole conductor B9 is arranged at the end of coil electrode 20, so it is bad to be difficult for taking place the formation of via hole conductor B9.
(other execution mode)
In addition, electronic unit involved in the present invention is not limited to above-mentioned each execution mode, can change in its main idea scope.Though for example in Fig. 2, contact site C forms wideer than other parts of coil electrode 18,20, contact site C might not be wide.For example, under the enough wide situation of the live width of coil electrode 18,20, contact site C also can form wide unlike other parts of coil electrode 18,20.
Herein, the situation to the coil electrode 20 that uses Fig. 9 describes.The coil electrode 20 of Fig. 9 is different with the coil electrode 20 of Fig. 2, does not have clear and definite contact site C.Therefore, very difficult coil electrode 20 monomers of only seeing are differentiated coil electrode 20 and are constituted and can be connected in many places with via hole conductor B8.
But, we can say that the part (for example some M, the N of Fig. 9) beyond the end of the reverse side of the end that is connected with via hole conductor B9 of coil electrode 20 connects under the situation of via hole conductor B8, can connect via hole conductor B8 from the point that is connected with via hole conductor B8 to the end of a side that does not connect via hole conductor B9.Therefore, via hole conductor B8 is connected under the situation of coil electrode 20, thinks that coil electrode 20 constitutes to be connected with via hole conductor B8 in many places in the end that stays a side that does not connect via hole conductor B9.
In addition, in electronic unit 10,, also can use for example coil electrode 18 or 7/8 coil electrode 18 that encloses of 5/6 circle though use the coil electrode 18 of 3/4 circle.
In addition, in the manufacture method of electronic unit 10, though make electronic unit 10 by the sheet material layered manner, the manufacture method of this electronic unit 10 is not limited thereto.For example, electronic unit 10 also can adopt print process to make.
In addition, longer by coil electrode 18a is formed in electronic unit 10 as shown in Figure 2 than coil electrode 20, thus make the 1st D.C. resistance bigger than the 2nd D.C. resistance from via hole conductor B8 to via hole conductor B9 from via hole conductor B3 to via hole conductor B4.But, the 1st D.C. resistance method bigger than the 2nd D.C. resistance is not limited thereto.For example, also can realize by live width or the thickness of adjusting coil electrode 18a and coil electrode 20.
In addition, in electronic unit 10, the two ends of coil L are connected with outer electrode 14a, 14b by via hole conductor B respectively.But the end of any side of coil L also can be connected with outer electrode 14a or outer electrode 14b by the lead division that is connected with coil-conductor 18 on magnetic layer 16.
Possibility of its application on the industry
The present invention can be used for electronic unit and manufacture method thereof, particularly prevent between via hole conductor and the coil electrode broken string aspect on particularly good.
Symbol description:
B1～B3... via hole conductor
C1～C16... contact site
L... coil
T1, t2... end
10... electronic unit
12... duplexer
14a, 14b... outer electrode
16a～16m... magnetic layer
18a～18f, 20... coil electrode
Claims (13)
1. electronic unit is characterized in that:
Possess:
Constitute a plurality of coil electrodes of coil;
A plurality of insulating barriers, it is stacked and constitute duplexer with above-mentioned a plurality of coil electrodes;
Two outer electrodes, it is set at the surface of above-mentioned duplexer;
Two connecting portions, it connects above-mentioned coil and above-mentioned two outer electrodes; And
The via hole conductor, it connects above-mentioned a plurality of coil electrode, and has the area shape bigger than the area of the other end of an end,
In the above-mentioned coil electrode at the two ends that are arranged at stacked direction, the above-mentioned via hole conductor that connected is defined as the initiating terminal electrode with the relative big above-mentioned coil electrode of dc resistance between the above-mentioned connecting portion, the above-mentioned via hole conductor that connected is defined as end electrodes with the relative little above-mentioned coil electrode of dc resistance between the above-mentioned connecting portion, when the above-mentioned coil electrode beyond above-mentioned initiating terminal electrode and the above-mentioned end electrode is defined as target
Above-mentioned initiating terminal electrode is connected with the above-mentioned via hole conductor that is connected in above-mentioned target by an above-mentioned end.
2. electronic unit according to claim 1 is characterized in that:
The above-mentioned end electrode has the length more than the number of turns that deducts the number of turns of above-mentioned target and obtain from a circle, and is connected with the above-mentioned via hole conductor that is connected in above-mentioned target by above-mentioned the other end.
3. electronic unit according to claim 1 and 2 is characterized in that:
The above-mentioned via hole conductor that connects above-mentioned end electrode and above-mentioned target forms at above-mentioned insulating barrier and above-mentioned end electrode.
4. according to any described electronic unit in the claim 1 to 3, it is characterized in that:
When stacked direction was overlooked, the above-mentioned end electrode was overlapping with the above-mentioned via hole conductor that is connected in above-mentioned target.
5. according to any described electronic unit in the claim 1 to 4, it is characterized in that:
The above-mentioned via hole conductor that connects above-mentioned initiating terminal electrode and above-mentioned target forms at above-mentioned insulating barrier and this initiating terminal electrode.
6. according to any described electronic unit in the claim 1 to 5, it is characterized in that:
Being defined as under the situation of first direction from the direction of above-mentioned end electrode towards above-mentioned initiating terminal electrode, in above-mentioned each via hole conductor, an above-mentioned end is positioned at than more close first direction one side in above-mentioned the other end.
7. according to any described electronic unit in the claim 1 to 6, it is characterized in that:
The above-mentioned end electrode constitutes and can be connected with above-mentioned via hole conductor in many places.
8. electronic unit according to claim 7 is characterized in that:
The above-mentioned end electrode have can be wideer than other parts with the part that above-mentioned via hole conductor is connected shape.
9. according to claim 7 or 8 described electronic units, it is characterized in that:
Connecting the above-mentioned end electrode is connected with the two ends part in addition of this end electrodes with the via hole conductor of above-mentioned target.
10. according to any described electronic unit in the claim 1 to 9, it is characterized in that:
Above-mentioned connecting portion is the via hole conductor.
11., it is characterized in that according to any described electronic unit in the claim 1 to 9:
Above-mentioned connecting portion is the extraction electrode that is set on the above-mentioned insulating barrier and is connected with above-mentioned initiating terminal electrode or above-mentioned end electrode respectively.
12. the manufacture method of an electronic unit is the manufacture method of the described electronic unit of claim 1, it is characterized in that:
Comprise:
On above-mentioned insulating barrier, form the operation of above-mentioned via hole conductor;
On above-mentioned insulating barrier, form the operation of above-mentioned connecting portion;
On above-mentioned insulating barrier, form the operation of above-mentioned initiating terminal electrode and above-mentioned target;
On above-mentioned insulating barrier, form the operation of above-mentioned end electrode; And
To be formed with above-mentioned initiating terminal electrode above-mentioned insulating barrier, be formed with the above-mentioned insulating barrier of above-mentioned end electrode and be formed with the above-mentioned insulating barrier of above-mentioned target stacked and form duplexer so that the operation of above-mentioned target between above-mentioned initiating terminal electrode and above-mentioned end electrode.
13. the manufacture method of electronic unit according to claim 12 is characterized in that:
The operation that forms above-mentioned via hole conductor is carried out simultaneously with the operation that forms above-mentioned initiating terminal electrode and above-mentioned target.
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| PCT/JP2010/050143 WO2010087220A1 (en) | 2009-01-30 | 2010-01-08 | Electronic component and method of manufacturing same |
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| CN105976995A (en) * | 2015-03-11 | 2016-09-28 | 胜美达集团株式会社 | Magnetic element and manufacturing method of the magnetic element |
| CN111986878A (en) * | 2019-05-24 | 2020-11-24 | 株式会社村田制作所 | Laminated coil component |
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| JP5195876B2 (en) * | 2010-11-10 | 2013-05-15 | Ｔｄｋ株式会社 | Coil component and manufacturing method thereof |
| JP5206775B2 (en) * | 2010-11-26 | 2013-06-12 | Ｔｄｋ株式会社 | Electronic components |
| JP7215327B2 (en) | 2019-05-24 | 2023-01-31 | 株式会社村田製作所 | Laminated coil parts |
| JP7475946B2 (en) * | 2020-04-21 | 2024-04-30 | 株式会社村田製作所 | Multilayer coil parts |
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| JP3209514B2 (en) * | 1991-12-28 | 2001-09-17 | 太陽誘電株式会社 | Manufacturing method of multilayer chip inductor |
| JPH0799116A (en) * | 1993-09-29 | 1995-04-11 | Matsushita Electric Ind Co Ltd | Multilayer ceramic electronic component, and its manufacture |
| JP3788074B2 (en) * | 1998-11-10 | 2006-06-21 | 株式会社村田製作所 | Chip coil and manufacturing method thereof |
| JP3571247B2 (en) * | 1999-03-31 | 2004-09-29 | 太陽誘電株式会社 | Multilayer electronic components |
| JP2002064274A (en) * | 2000-08-21 | 2002-02-28 | Toppan Printing Co Ltd | Via hole structure, forming method therefor and multilayer wiring board using the same |
| JP2002305123A (en) * | 2001-04-06 | 2002-10-18 | Murata Mfg Co Ltd | Method of manufacturing monolithic ceramic electronic component, and method of manufacturing laminated inductor |
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| CN105976995A (en) * | 2015-03-11 | 2016-09-28 | 胜美达集团株式会社 | Magnetic element and manufacturing method of the magnetic element |
| CN111986878A (en) * | 2019-05-24 | 2020-11-24 | 株式会社村田制作所 | Laminated coil component |
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| JP5703754B2 (en) | 2015-04-22 |
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