CN102271463B - 电路板制作方法 - Google Patents
电路板制作方法 Download PDFInfo
- Publication number
- CN102271463B CN102271463B CN201010193434.XA CN201010193434A CN102271463B CN 102271463 B CN102271463 B CN 102271463B CN 201010193434 A CN201010193434 A CN 201010193434A CN 102271463 B CN102271463 B CN 102271463B
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- CN
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- Prior art keywords
- layer
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- grooved area
- outer conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 239000007788 liquid Substances 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 172
- 239000011241 protective layer Substances 0.000 claims description 39
- 238000007639 printing Methods 0.000 claims description 24
- 238000003466 welding Methods 0.000 claims description 23
- 238000003825 pressing Methods 0.000 claims description 17
- 230000015572 biosynthetic process Effects 0.000 claims description 14
- 230000004888 barrier function Effects 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 5
- 239000003814 drug Substances 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 208000003351 Melanosis Diseases 0.000 description 1
- 238000003854 Surface Print Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000009422 external insulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
Claims (11)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010193434.XA CN102271463B (zh) | 2010-06-07 | 2010-06-07 | 电路板制作方法 |
US13/091,152 US8516694B2 (en) | 2010-06-07 | 2011-04-21 | Method for manufacturing printed circuit board with cavity |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010193434.XA CN102271463B (zh) | 2010-06-07 | 2010-06-07 | 电路板制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102271463A CN102271463A (zh) | 2011-12-07 |
CN102271463B true CN102271463B (zh) | 2013-03-20 |
Family
ID=45053584
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010193434.XA Active CN102271463B (zh) | 2010-06-07 | 2010-06-07 | 电路板制作方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8516694B2 (zh) |
CN (1) | CN102271463B (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103270819B (zh) * | 2010-10-20 | 2016-12-07 | Lg伊诺特有限公司 | 印刷电路板及其制造方法 |
CN102548253B (zh) * | 2010-12-28 | 2013-11-06 | 富葵精密组件(深圳)有限公司 | 多层电路板的制作方法 |
CN103730374A (zh) * | 2012-10-15 | 2014-04-16 | 深南电路有限公司 | 封装基板腔体的制作工艺 |
KR101814113B1 (ko) * | 2012-11-02 | 2018-01-02 | 삼성전기주식회사 | 인쇄회로기판의 제조방법 |
KR101307163B1 (ko) * | 2012-11-29 | 2013-09-11 | 주식회사 에스아이 플렉스 | 인쇄회로기판의 내층회로 보호공법 |
US20140158414A1 (en) * | 2012-12-11 | 2014-06-12 | Chris Baldwin | Recessed discrete component mounting on organic substrate |
CN104684240A (zh) * | 2013-11-27 | 2015-06-03 | 富葵精密组件(深圳)有限公司 | 电路板及电路板制作方法 |
US9433091B1 (en) | 2015-10-21 | 2016-08-30 | International Business Machines Corporation | Customizing connections of conductors of a printed circuit board |
CN106094366B (zh) * | 2016-08-23 | 2019-02-01 | 深圳市华星光电技术有限公司 | Ips型阵列基板的制作方法及ips型阵列基板 |
CN107666775B (zh) * | 2017-10-09 | 2020-07-31 | 台山市精诚达电路有限公司 | 多层软板的制作方法 |
CN109041459B (zh) * | 2018-08-31 | 2020-01-17 | 生益电子股份有限公司 | 一种槽底图形阶梯槽的制作方法及pcb |
CN109618509B (zh) * | 2019-01-31 | 2021-10-01 | 生益电子股份有限公司 | 一种pcb的制造方法 |
CN110691476B (zh) * | 2019-08-27 | 2021-05-04 | 东莞康源电子有限公司 | 采用湿膜保护pcb内层线路的开腔加工方法 |
CN110708897A (zh) * | 2019-10-21 | 2020-01-17 | 北大方正集团有限公司 | 电路板的制作方法及电路板 |
CN111479401B (zh) * | 2020-04-28 | 2022-12-02 | 景德镇市宏亿电子科技有限公司 | 一种厚铜印制电路板的制作方法 |
CN114501840B (zh) * | 2020-10-26 | 2024-07-05 | 鹏鼎控股(深圳)股份有限公司 | 电路板组件的制作方法及电路板组件 |
CN115311938B (zh) * | 2022-08-22 | 2024-06-18 | 北京京东方显示技术有限公司 | 一种显示模组 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1392755A (zh) * | 2001-04-27 | 2003-01-22 | 日本电气株式会社 | 高频电路基板及其制造方法 |
CN1457224A (zh) * | 2003-03-26 | 2003-11-19 | 张弘 | 铜及其合金表面有机抗腐蚀剂和印刷电路板制作方法 |
US7174628B1 (en) * | 2005-03-03 | 2007-02-13 | Super Talent Electronics, Inc. | Memory card production using prefabricated cover and molded casing portion |
CN1960604A (zh) * | 2005-11-02 | 2007-05-09 | 何建汉 | 导电线路的制作方法与结构 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102017821A (zh) | 2008-02-04 | 2011-04-13 | 索尼化学&信息部件株式会社 | 抗蚀油墨及多层印刷配线板的制造方法 |
JP2009239247A (ja) * | 2008-03-27 | 2009-10-15 | Ibiden Co Ltd | 多層プリント配線板の製造方法 |
TWI358976B (en) | 2008-04-18 | 2012-02-21 | Zhen Ding Technology Co Ltd | Substrate of printed circuit board and method for |
TWI388043B (zh) * | 2008-12-15 | 2013-03-01 | Unimicron Technology Corp | 線路板及其製作方法 |
-
2010
- 2010-06-07 CN CN201010193434.XA patent/CN102271463B/zh active Active
-
2011
- 2011-04-21 US US13/091,152 patent/US8516694B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1392755A (zh) * | 2001-04-27 | 2003-01-22 | 日本电气株式会社 | 高频电路基板及其制造方法 |
CN1457224A (zh) * | 2003-03-26 | 2003-11-19 | 张弘 | 铜及其合金表面有机抗腐蚀剂和印刷电路板制作方法 |
US7174628B1 (en) * | 2005-03-03 | 2007-02-13 | Super Talent Electronics, Inc. | Memory card production using prefabricated cover and molded casing portion |
CN1960604A (zh) * | 2005-11-02 | 2007-05-09 | 何建汉 | 导电线路的制作方法与结构 |
Also Published As
Publication number | Publication date |
---|---|
US8516694B2 (en) | 2013-08-27 |
US20110297644A1 (en) | 2011-12-08 |
CN102271463A (zh) | 2011-12-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant after: Zhending Technology Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant before: Honsentech Co., Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO Free format text: FORMER OWNER: FUKUI PRECISION ASSEMBLY (SHENZHEN) CO., LTD. Effective date: 20140829 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518103 SHENZHEN, GUANGDONG PROVINCE TO: 066000 QINHUANGDAO, HEBEI PROVINCE |
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TR01 | Transfer of patent right |
Effective date of registration: 20140829 Address after: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Patentee after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Patentee after: Zhending Technology Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20170628 Address after: 066000 No. 18 Tengfei Road, Qinhuangdao Economic Development Zone, Hebei, China Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Address before: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Co-patentee before: Zhending Technology Co., Ltd. Patentee before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. |
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TR01 | Transfer of patent right |