CN102239752A

CN102239752A - Reflow furnace

Info

Publication number: CN102239752A
Application number: CN2009801485948A
Authority: CN
Inventors: 桧山勉; 角屋敷敏丸
Original assignee: Senju Metal Industry Co Ltd
Current assignee: Senju Metal Industry Co Ltd
Priority date: 2008-12-02
Filing date: 2009-12-02
Publication date: 2011-11-09
Also published as: WO2010064428A1; JPWO2010064428A1

Abstract

The invention provides a reflow furnace. Suitable temperature profiles are reliably applied to a plurality of different kinds of printed boards, respectively. A furnace (0) having a heater (1), and a printed board transfer path (30) arranged over above the heater (1) in the longitudinal direction of the furnace (0) inside the furnace (0) are provided. The transfer path (30) is composed of a first transfer conveyer (31) and a second transfer conveyer (32). The first transfer conveyer (31) is composed of a chain (33) and a chain (34), and the second transfer conveyer (32) is composed of a chain (35) and a chain (36). The printed board transfer speed of the first transfer conveyer (31) and the printed board transfer speed of the second transfer conveyer (32) are differently set. Thus, the suitable temperature profiles are reliably applied to the different kinds of printed boards, respectively.

Description

Reflow furnaces

Technical field

The present invention relates to a kind of reflow furnaces that makes soldering tin material fusions such as soldering paste, solder ball and solder bump carry out soldering.

Background technology

Usually, making the soldering tin material fusion come printed circuit board (PCB), electronic component etc. (below, be referred to as " printed circuit board (PCB) " in this explanation) are carried out under the situation of soldering, in reflow furnaces, carry out mostly.So-called reflow furnaces is to be made of preparation heating region, formal heating region and cooling zone in the Muffle furnace (muffle) of passage shape, is provided with heater in preparation heating region and formal heating region, is provided with cooler in the cooling zone.Utilize carrying path to carry the printed circuit board (PCB) that will carry out soldering.This carrying path is arranged on the top of heater, and the conveyer belt that is set up by the body of heater length direction along reflow furnaces constitutes.

Reflow furnaces in the past has a carrying path, but in order to boost productivity, has proposed a kind of reflow furnaces with two carrying paths.For example in patent documentation 1, disclose a kind of such technical scheme, promptly, at two side conveyer belts of both sides configuration along the center conveyer belt of the Width fixed configurations of body of heater, carry the printed circuit board (PCB) of same kind simultaneously, these two side conveyer belts the position being set changing on the body of heater Width.

In patent documentation 2, also disclose a kind of such technical scheme, promptly, at two carriages that the position can change that are provided with of both sides configuration that the carriage that the position can change is set along the body of heater Width along the body of heater Width, and, the translational speed of these two carriages can be changed, thereby different types of printed circuit board (PCB) is paid suitable Temperature Distribution respectively.

In patent documentation 3, also disclose a kind of such technical scheme, promptly, at the 1st movable track and the 2nd movable track that the position can change that be provided with along the side configuration of the trapped orbit of the Width fixed configurations of body of heater along the body of heater Width, the width of the printed circuit board (PCB) that can carry by expansion improves the transfer efficiency of printed circuit board (PCB).

On the other hand, in the heater that reflow furnaces adopted, exist infra red type heater and hot blast to blow out heater usually.For the infra red type heater, infrared ray makes the soldering paste fusion that is coated in soldering portion thoroughly to the inside of printed circuit board (PCB), electronic equipment, but because the infrared ray straightaway, therefore, existence can't be heated the soldering portion that is positioned at the electronic component shade, the such problem of soldering portion that is positioned at the gap fully.

With respect to this, blow out heater for hot blast, because hot air convection in Muffle furnace, hot blast also can enter into the position that is arranged in the electronic component shade, narrow gap, therefore, compare, have and to heat the such advantage of whole printed circuit board (PCB) equably with the infra red type heater, therefore, hot blast blows out heater and is used to a lot of reflow furnaces now.

Blow out heater for the hot blast that is arranged at this reflow furnaces, exist from the larger area blow-off outlet to blow out the heater of hot blast and blow out the heater of hot blast from many holes.It is slower that the hot blast that blows out hot blast from the larger area blow-off outlet blows out the hot blast flow velocity of heater, and therefore, when hot blast arrived printed circuit board (PCB), the efficiency of heating surface was unsatisfactory.

With respect to this, it is very fast that the hot blast that blows out hot blast from many holes blows out the hot blast flow velocity of heater, and hot blast can enter into the inboard of surface mounted component, therefore, can heat efficiently.Therefore, blow out heater, have many holes mostly as the hot blast that reflow furnaces adopted.The short of note of Shuo Ming heater afterwards, the hot blast that has many holes exactly blows out heater.

In reflow furnaces, according to the heated in sequence printed circuit board (PCB) of preparation heating, formal heating.Add in this preparation and to pine for,, heat printed circuit board (PCB) at leisure and make printed circuit board (PCB) adapt to heat by heating with the lower hot blast of temperature, and, make the solvent evaporates in the soldering paste.But, if when this preparation heating, at high temperature heat, then can cause printed circuit board (PCB) to be out of shape because of thermal shock with a large amount of hot blasts, perhaps electronic unit is dispelled.Therefore, the preparation in reflow furnaces heating is preferred lower and heat than formally heating the hot blast that lacks with temperature.

Printed circuit board (PCB) is by preparation heating and adapt to heat, the solvent evaporates in the soldering paste, and electronic component to a certain degree securely after the set, is pined for being heated in formally adding of reflow furnaces.Formally add at this and to pine for, make the solder powder fusion in the soldering paste carry out soldering by the hot blast that blows out high temperature.Formally adding the hot blast rate of pining for blowing to printed circuit board (PCB) at this can accelerated warming under more than the situation of the hot blast rate under the preparation heating.When formal heating, if the heating time under the high temperature is longer, then can make printed circuit board (PCB), electronic component fire damage, therefore heating at short notice.

Usually, reflow furnaces is provided with many hot blasts in the top and the bottom of preparation heating region and formal heating region and blows out heater.For example, if the preparation heating region is 5 zones, then upper and lower settings has 10 hot blasts to blow out heater, if formal heating region is 3 zones, then upper and lower settings has 6 hot blasts to blow out heater, and therefore, being provided with up and down in a reflow furnaces, 16 hot blasts blow out heater.

In preparation heating region and formal heating region, the flow velocity that blows out the hot blast that heater blows out from each hot blast is controlled, be set to be fit to the Temperature Distribution of printed circuit board (PCB).Control the flow velocity of this hot blast by the rotating speed that changes motor.As the motor that reflow furnaces adopted, the frequency-conversion and speed-regulation motors that are easy to control rotating speed that adopt more.

But only the hot blast speed ground of control preparation heating and formal heating evenly heats whole printed circuit board (PCB), can't eliminate that soldering is bad, the fire damage of electronic component.That is, carry on printed circuit board (PCB) sometimes as electronic component and concentrate the bigger power transistor of the high-density installation part of carrying the parts that form or thermal capacity, transformer etc., these soldering portion concentrated areas need a large amount of heats.In addition, on a slice printed circuit board (PCB), mix the soldering portion of carrying a large amount of heats of needs, the electronic component that reaches the low heat resistant that when blowing out a large amount of heat, can cause fire damage or function deterioration sometimes.Carry a printed circuit board (PCB) for such mixing, only whole printed circuit board (PCB) evenly heated, can cause soldering bad, make the electronic component fire damage.

For example, even be equipped with the printed circuit board (PCB) of high-density installation part and weak thermal endurance electronic component evenly heats whole printed circuit board (PCB) for mixing, also can't be to the high-density installation part heating fully of a large amount of heats of needs, soldering paste fusion fully, even perhaps soldering paste fusion, because the temperature of soldering portion is lower, therefore, the scolding tin of fusion can't fully moistening expansion.Therefore, when desire heated fully to high-density installation part, weak stable on heating electronic component was overheated and cause fire damage, function deterioration.

Like this, under the situation of the printed circuit board (PCB) soldering of the electronic component of the solder sections of utilizing soldering paste that mixing is equipped with to need a large amount of heats and low heat resistant, hot blast blows out the method that heater takes to enlarge the quantity of that a part of hole that the solder sections that needs a large amount of heats passes through or the hole of increasing this part, perhaps on the other hand, take to dwindle or reduce the method (patent documentation 4 and 5) in the hole of the part that weak stable on heating electronic component passed through.In addition, as other method, the method (patent documentation 6～8) in the hole of the part that stable on heating electronic component is passed through a little less than also taking to stop up.

Patent documentation 1: the real openly 3-44375 communique of Japan

Patent documentation 2: Japanese kokai publication hei 10-163623 communique

Patent documentation 3: TOHKEMY 2005-59030 communique

Patent documentation 4: Japanese kokai publication hei 10-284831 communique

Patent documentation 5: TOHKEMY 2002-43733 communique

Patent documentation 6: Japanese kokai publication hei 11-307927 communique

Patent documentation 7: TOHKEMY 2000-124593 communique

Patent documentation 8: TOHKEMY 2001-144428 communique

Employing also is difficult to make two carrying paths transporting velocity separately to be very different by patent documentation 1～3 invention disclosed.Particularly in by patent documentation 2 inventions disclosed, two shared carriages that the position can change that are provided with of carrying path along the body of heater Width, therefore, can't tackle the widely different situation of Temperature Distribution of the printed circuit board (PCB) of in two carrying paths, transferring.

In addition, in by patent documentation 4～8 inventions disclosed, printed circuit board (PCB) at the electronic component of the solder sections of utilizing soldering paste that mixing is equipped with to need a large amount of heats and low heat resistant carries out under the situation of soldering, high-density installation part is one-sided, the both sides or the central authorities of deflection printed circuit board (PCB) mostly, therefore, for such printed circuit board (PCB), only change the size in hole, the quantity in hole, can't heat the high-density installation part efficiently.As a result, the hot blast in the past blows out in the heater, causes bad or other the portion of hot damage of high-density installation part soldering sometimes.Like this, in by patent documentation 4～8 inventions disclosed, be difficult to pay reliably the Temperature Distribution that is fit to printed circuit board (PCB).Therefore, even use, also be difficult to pay the Temperature Distribution of different types of printed circuit board (PCB) to be fit to respectively of in two carrying paths, carrying by patent documentation 4～8 inventions disclosed.

Summary of the invention

The object of the present invention is to provide a kind of reflow furnaces that can pay suitable Temperature Distribution reliably to different types of multiple printed circuit board (PCB) respectively.

The inventor has carried out deep repeatedly research in order to solve above-mentioned problem, and its result draws following opinion, has finished the present invention:

(a) in reflow furnaces with the 1st conveyer belt and the 2nd conveyer belt, constitute the 1st conveyer belt by the 1st track and the 2nd track, and, constitute the 2nd conveyer belt by the 3rd track and the 4th track, the 1st conveyer belt can be set at different speed to the transporting velocity of printed circuit board (PCB) and the 2nd conveyer belt to the transporting velocity of printed circuit board (PCB), thus, can pay suitable Temperature Distribution respectively to different types of multiple printed circuit board (PCB) reliably; And

(b) hot blast in reflow furnaces blows out in the heater, in order infinitely to adjust the size that is located in a hole in the plate, make another plate of being equipped with the hole identical coincide with a plate in the mode of separately hole unanimity with the hole of a plate, during with another plate changing of the relative positions, can infinitely adjust the hole of a plate, thus, can pay suitable Temperature Distribution respectively to different types of multiple printed circuit board (PCB) more reliably.

The present invention is a kind of reflow furnaces, this reflow furnaces comprises: the body of heater with heater, and the carrying path of the printed circuit board (PCB) that sets up along the length direction of body of heater in the inside of this body of heater and above heater, it is characterized in that, carrying path is made of with 2nd conveyer belt different with the 1st conveyer belt the 1st conveyer belt that the Width along body of heater is set up in parallel, the 1st conveyer belt carries the 1st track of printed circuit board (PCB) and the 2nd track to constitute by the Width along body of heater being used to of being set up in parallel, and, the 2nd conveyer belt carries the 3rd track of printed circuit board (PCB) and the 4th track to constitute by the Width along body of heater being used to of being set up in parallel, and, the 1st conveyer belt can be set at different speed to the transporting velocity of printed circuit board (PCB) and the 2nd conveyer belt to the transporting velocity of printed circuit board (PCB).Adopt this present invention, can pay suitable Temperature Distribution respectively to different types of multiple printed circuit board (PCB) reliably.

This reflow furnaces of the present invention is preferably, the position is set on the Width of body of heater, can changes of in the 1st track and the 2nd track at least one, and, the position is set on the Width of body of heater, can changes of at least one in the 3rd track and the 4th track.

These reflow furnaces of the present invention are preferably, heater blows out at hot blast and is equipped with many holes in the plate, heat printed circuit board (PCB) by blowing out hot blast from this hole, for be arranged in hot blast and blow out identical position, the hole of plate and be equipped with the hot blast that blows out roughly the same hole, the hole of plate with hot blast and adjust plate, blow out the hole of plate and be arranged in the corresponding to mode in hole that hot blast adjusts plate and this hot blast is adjusted plate be closely attached on hot blast and blow out plate to be arranged in hot blast, and, move by making hot blast adjustment plate blow out plate, can adjust the aperture area that hot blast blows out the hole of plate along above-mentioned hot blast.Thus, can pay suitable Temperature Distribution respectively to different types of multiple printed circuit board (PCB) more reliably.

In this case, be preferably hot blast adjustment plate and be made of a plurality of member of formation, a plurality of member of formation can blow out plate with respect to above-mentioned hot blast by oneself separately and move.The hot blast that hot blast is adjusted plate cover heating wind from heater core blows out plate, and it can be 1, but also can be divided into many, and this hot blast that is divided into many adjustment plate can be moved separately independently.It is that 1 mode is suitable for carrying out each regional hot blast and regulates that hot blast is adjusted plate, and hot blast is adjusted the heating of printed circuit board (PCB) of the electronic unit of soldering portion that mode that plate is divided into many is suitable for mixing being equipped with a large amount of heats of needs and low heat resistant.

Also be desirably in to be equipped with in the hole that hot blast blows out plate and blow out nozzle.It also can only be to wear porose member that hot blast used in the present invention blows out plate, but is equipped with in advance in the hole when blowing out nozzle, and the directivity of hot blast improves, and can heat printed circuit board (PCB) efficiently.As blowing out nozzle, both can in a hole, install one and blow out nozzle, perhaps also can in many holes, plate object be installed, in this plate object, wear the ejiction opening that is communicated with the hole.Even the tabular any tabular components such as the long linearity of nozzle, short linearity, cranky shape, zigzag that blow out can both adopt.

In addition, when near hot blast blows out the hole of plate, forming the hot blast suction inlet, arrive printed circuit board (PCB) and the hot blast of temperature after descending is inhaled into from the hot blast suction inlet immediately, therefore, can not hinder the blowing out of hot blast of the high temperature that the hole of self-heating wind ejecting plate blows out.As a result, blow out in the reflow furnaces of heater, can in stove, not produce turbulent flow, can heat more efficiently at the hot blast that is provided with this structure.

When reflow furnaces turned round, hot blast was at first adjusted the hole of plate by hot blast, and afterwards, the hole arrival printed circuit board (PCB) that blows out plate by hot blast heats printed circuit board (PCB).At this moment, blow out plate and be not adjacent to, passed through hot blast that hot blast adjusts plate and gone out, can blow out to bias from other the orifice flow that hot blast blows out plate if hot blast is adjusted plate and hot blast.Therefore, when reflow furnaces turned round, hot blast was adjusted plate and hot blast and is blown out plate 14 and must be adjacent to, and when adjusting hot blast and blow out the aperture area in hole of plate, hot blast is adjusted plate and must be blown out plate along hot blast and move.

Be preferably hot blast and adjust plate screw is installed, be equipped with slotted hole with this screw consistent location place what hot blast blew out plate.Promptly, adjusting plate for hot blast when making hot blast adjust plate and hot blast to blow out plate and be adjacent to can move, therefore, adjust to erect on the plate at hot blast screw is set, be located in hot blast in advance at the position consistent that hot blast blows out plate and adjust slotted hole long on the moving direction of plate with this screw.Like this, the screw top from this screw screws in nut after the screw that hot blast is adjusted plate passes the slotted hole that hot blast blows out plate.When hot blast adjustment plate moved, nut was not firmly fastened to, and this nut is set to hot blast and adjusts the degree that plate can move.Afterwards, make hot blast adjust plate and move, when the aperture area that blows out the hole of plate when hot blast becomes the size of regulation, nut is firmly fastened to, make hot blast adjust plate and be closely attached on hot blast and blow out plate.Be adjacent in order to make hot blast adjustment plate and hot blast blow out plate, adjusting the screw of erectting setting on the plate at hot blast needs many.Blow out at hot blast under the situation of the board-like material that also is provided with other on the plate, on this plate-like piece, also wear slotted hole, after screw passes the slotted hole of plate-like piece, be threaded into nut.

In the present invention, blow out plate along hot blast and move and adjust the aperture area that hot blast blows out the hole of plate by making hot blast adjust plate, hot blast blow out plate be simple tabular component and can estimate under the situation of the aperture area of confirming the hole no problem.But, in blowing out the hole of plate, hot blast is equipped with under the situation of hot-blast spray nozzle, can't see that hot blast blows out the hole of plate, therefore, can't confirm the aperture area in hole.In this case, installation can be measured the scale that hot blast is adjusted the displacement of plate.As this scale, can be to wear slotted hole in the outstanding part of screw, indicate scale at the sidepiece of slotted hole.So, the displacement with respect to this scale of measurement screw.In addition, as scale, also can adjust on the plate to erect at hot blast stick-like is set, the part outstanding at this stick-like be equipped with slotted hole, marks scale in this slotted hole.

Hot blast is adjusted moving of plate and also can be utilized user's hand to carry out, but under the situation of carrying out with hand, can't draw displacement accurately.Therefore, move exactly, then be fit to use the rotation of screw if make hot blast adjust plate.The example that rotates as screw is adjusted to install on the plate at hot blast and is rotated screw freely, the inner thread piece that has been threaded into this screw is fixed on main body or the hot blast that hot blast blows out heater blows out on the plate.So, when hot blast adjustment plate is moved, screw is rotated, then screw moves with respect to fixing inner thread piece, and the hot blast adjustment plate that screw is installed is mobile slightly.

Adopt the present invention, owing to the 1st conveyer belt can be set at different speed to the transporting velocity of printed circuit board (PCB) and the 2nd conveyer belt to the transporting velocity of printed circuit board (PCB), therefore, can provide a kind of reflow furnaces that can pay suitable Temperature Distribution reliably to different types of multiple printed circuit board (PCB) respectively.

And, adopt the present invention, a kind of such reflow furnaces can be provided, that is, do not use the frequency-conversion and speed-regulation motor of high price, just can change the hot blast rate in each district, thereby can heat the high-density installation part efficiently, and, the operation of the size in hole can be adjusted very simply.

Reflow furnaces in the past can't be adjusted the hole that hot blast blows out plate, therefore, need prepare several hot blasts that are equipped with the hole that is fit to printed circuit board (PCB) in advance and blow out plate, each hot blast that is fit to printed circuit board (PCB) of all being replaced by blows out plate, or in order to make the hole that is fit to printed circuit board (PCB), all must carry out such operations of wasting time and energy such as plugging hole, but reflow furnaces of the present invention can easily be adjusted the aperture area that hot blast blows out the hole of plate by hot blast adjustment plate is moved slightly at every turn.Thereby, the multiple printed circuit board (PCB) of the kind that differs widely with respect to Temperature Distribution, the printed circuit board (PCB) of high-density installation part bias, the hole that the hot blast at the position that the part of desiring to pay higher Temperature Distribution is passed through blows out plate is opened greatly and is blown out a large amount of hot blasts, thereby heat fully, open lessly with other the corresponding hole of the part that does not need a large amount of heats, it is overheated to prevent.

In addition, in the preparation heating region that constitutes by a plurality of zones, by on the direct of travel of printed circuit board (PCB), changing the size in hole, can obtain to be fit to the desirable Temperature Distribution of printed circuit board (PCB), not only can obtain not having that soldering is bad, the soldering portion of fire damage, can also play widget, the path solder ball unexistent good effect of such reflow furnaces in the past of also can not dispersing.

Description of drawings

Fig. 1 extracts the major part of the body of heater of reflow furnaces of the present invention and decomposition out, with the stereogram of a part of reduced representation.

Fig. 2 is the block diagram of structure example of the control system of expression carrying path 30.

Fig. 3 is the vertical view of the structure example of expression carrying path 30.

Fig. 4 is the front view of the structure example of expression carrying path 30.

Fig. 5 is that the master that the expression hot blast blows out the structure example of heater 1 looks cutaway view.

Fig. 6 is the side view cutaway drawing that the expression hot blast blows out the structure example of heater 1.

Fig. 7 is the amplification inclinating view that expression hot blast adjustment plate 20 and hot blast blow out the configuration example of plate 14.

Fig. 8 is the upward view that the expression hot blast is adjusted the structure example of plate 20.

Fig. 9 is the key diagram of the Temperature Distribution example of expression reflow furnaces of the present invention.

Figure 10 is the key diagram of Temperature Distribution example of the reflow furnaces of expression comparative example.

Embodiment

Below, detailed description is used to implement best mode of the present invention with reference to accompanying drawing.

Fig. 1 extracts the major part of the body of heater 0 of reflow furnaces of the present invention and decomposition out, with the stereogram of a part of reduced representation.As shown in Figure 1, reflow furnaces of the present invention comprises having body of heater 0, and the carrying path 30 that hot blast blows out heater (below be called heater 1).Carrying path 30 is configured in the inside of body of heater 0 and is configured in the top of heater 1, and its upper surface from heater 1 leaves predetermined distance and sets up along the length direction of body of heater 0 (with the identical direction of throughput direction X of printed circuit board (PCB) among Fig. 1).

Carrying path 30 by as the 1st conveyer belt 31 of an example of the 1st delivery section, and constitute as the 2nd conveyer belt 32 of an example of the 2nd delivery section.As shown in Figure 1, the 1st conveyer belt 31 and the 2nd conveyer belt 32 are set up in parallel along the Width of body of heater 0 (with the direction of throughput direction X quadrature in horizontal plane of printed circuit board (PCB) among Fig. 1).In the present invention, the 1st conveyer belt 31 and the 2nd conveyer belt 32 are independent mutually.

The 1st conveyer belt 31 by as the 1st chain of an example of the 1st track (below be called chain 33), and constitute as the 2nd chain of an example of the 2nd track (below be called chain 34).Chain 33 and chain 34 are set up in parallel along the Width of body of heater 0, and chain 33 and chain 34 are carried printed circuit board (PCB) by moving at the throughput direction X of printed circuit board (PCB) with mutually the same speed.Chain 33 and chain 34 constitute and can utilize known habitual the 1st transport driving (for example driving mechanism of the ring-type that is made of chain, sprocket wheel, drive motor and control device etc.) circulation to move and get final product, and needn't use the driving mechanism of particular configuration.

As utilize shown in the four-headed arrow of representing among Fig. 1, chain 34 utilizes the 1st travel mechanism and can change it on the Width of body of heater 0 position is set.Thus, can utilize the 1st conveyer belt 31 to come the different multiple printed circuit board (PCB) of delivery size.

On the other hand, the 2nd conveyer belt 32 by as the 3rd chain of an example of the 3rd track (below be called chain 35), and constitute as the 4th chain of an example of the 4th track (below be called chain 36).Chain 35 and chain 36 are set up in parallel along the Width of body of heater 0, and chain 35 and chain 36 are carried printed circuit board (PCB) by moving at the throughput direction X of printed circuit board (PCB) with mutually the same speed.Chain 35 and chain 36 constitute can utilize with known habitual the 1st transport driving independently the 2nd transport driving (for example driving mechanism of the ring-type that constitutes by chain, sprocket wheel, drive motor and control device etc.) circulation move and get final product, needn't use the driving mechanism of particular configuration.

As utilize shown in the four-headed arrow of representing among Fig. 1, chain 36 utilizes the 2nd travel mechanism and can change it on the Width of body of heater 0 position is set.Thus, can utilize the 2nd conveyer belt 32 to come the different multiple printed circuit board (PCB) of delivery size.

Fig. 2 is the block diagram of structure example of the control system of expression carrying path 30.As shown in Figure 2, the control system of carrying path 30 is made of operating portion 80 and control part 81.Operating portion 80 for example is input units such as the LCD, keyboard of touch panel formula, for the width of the temperature of setting heater 1, the 1st conveyer belt the 31, the 2nd conveyer belt 32 and transporting velocity and operated by the user.When importing the width of temperature, the 1st conveyer belt 31 and the 2nd conveyer belt 32 of heater 1 and transporting velocity etc. by the user, operating portion 80 generates the set information D of the width of the temperature, the 1st conveyer belt 31 and the 2nd conveyer belt 32 that are used for setting respectively heater 1 and transporting velocity etc., and the set information D of this generation is outputed to control part 81.

On operating portion 80, be connected with control part 81.Control part 81 is controlled the above-mentioned the 1st and the 2nd transport driving, the 1st and the 2nd travel mechanism according to the set information D by operating portion 80 inputs.

In the 1st transport driving, be provided with the motor that is used for drive chain 33,34 (below be called motor M1), in the 2nd transport driving, be provided with the motor that is used for drive chain 35,36 (below be called motor M2), in the 1st travel mechanism, be provided with the motor that the four-headed arrow that is used for chain 34 is represented along Fig. 1 moves (below be called motor M3), in the 2nd travel mechanism, be provided with the motor that the four-headed arrow that is used for chain 36 is represented along Fig. 1 moves (below be called motor M4).

On control part 81, be connected with motor M1, M2, M3, M4.Control part 81 generates activation bit D1, D2, D3, D4 according to set information D, according to activation bit D1, D2, D3, D4 rotary driving motor M1, M2, M3, the M4 of this generation.

For example, in activation bit D1, comprise with the mode drive motor M1 of the actuating

speed drive chain

33,34 of 0.7m/min and the information that makes it to rotate.In activation bit D2, comprise with the mode drive motor M2 of the actuating speed drive chain 35,36 of 1.0m/min and the information that makes it to rotate.In activation bit D3, comprise so that the distance between chain 33 and the chain 34 and the corresponding to mode of the width of the 1st printed circuit board (PCB) drive the information that is used to make the motor M3 rotation that chain 34 moves.In activation bit D4, comprise so that the distance between chain 35 and the chain 36 and the corresponding to mode of the width of the 2nd printed circuit board (PCB) drive the information that is used to make the motor M4 rotation that chain 36 moves.

Like this, in carrying path 30, control part 81 is controlled motor M1, M2, M3, M4 respectively according to set information D, therefore, the transporting velocity of 32 pairs of printed circuit board (PCB)s of transporting velocity and the 2nd conveyer belt of 31 pairs of printed circuit board (PCB)s of the 1st conveyer belt can be set at different speed, the width that can be set at the printed circuit board (PCB) that the 1st conveyer belt 31 carried is different with the width of the printed circuit board (PCB) that the 2nd conveyer belt 32 is carried.

Fig. 3 is the vertical view of the structure example of expression carrying path 30.Fig. 4 is its front view.In this Fig. 3 and Fig. 4, motor M1, M2 have been omitted for convenience of explanation.Carrying path 30 is made of the 1st conveyer belt 31 with

chain

33,34 and the 2nd conveyer belt 32 with chain 35,36 as described above.

At first, carry printed circuit board (PCB) to describe with the 2nd conveyer belt 32 with different transporting velocities to the 1st conveyer belt 31.

As shown in Figures 3 and 4, the 1st transport driving that is used for

drive chain

33,34 by the 1st sprocket for chain (below be called the 1st sprocket wheel 37), the 2nd sprocket for chain (below be called the 2nd sprocket wheel 38), and motor M1 (not shown) constitute.Control part 81 is according to the set information D output activation bit D1 from the operating portion of representing among Fig. 2 80, thereby the 1st transport driving drive motor M1 rotation is carried printed circuit board (PCB) with targeted delivery speed thus.

Chain 33 is driven by the 1st sprocket wheel 37, and chain 34 is driven by the 2nd sprocket wheel 38.Be connected with motor M1 on the 1st and the

2nd sprocket wheel

37,38, the rotation by motor M1 drives and makes the 1st and the

2nd sprocket wheel

37,38 with identical speed rotation, and, the

mode drive chain

33,34 that is transferred along throughput direction X shown in Figure 1 with printed circuit board (PCB).

The 2nd transport driving that is used for drive chain 35,36 by the 3rd sprocket for chain (below be called the 3rd sprocket wheel 39), the 4th sprocket for chain (below be called the 4th sprocket wheel 40), and motor M2 (not shown) constitute.The 3rd transport driving control part 81 is according to the set information D output activation bit D2 from operating portion 80, thereby the 3rd transport driving drive motor M2 rotation is carried printed circuit board (PCB) with targeted delivery speed thus.

Chain 35 is driven by the 3rd sprocket wheel 39, and chain 36 is driven by the 4th sprocket wheel 40.Be connected with motor M2 on the 3rd and the

4th sprocket wheel

39,40, the rotation by motor M2 drives and makes the 3rd and the

4th sprocket wheel

39,40 with identical speed rotation, and, the mode drive chain of carrying along throughput direction X shown in Figure 1 with printed circuit board (PCB) 35,36.

Like this, the 1st conveyer belt 31 has the 1st transport driving, and the 2nd conveyer belt 32 has the 2nd transport driving, therefore, the transporting velocity of 32 pairs of printed circuit board (PCB)s of transporting velocity and the 2nd conveyer belt of 31 pairs of printed circuit board (PCB)s of the 1st conveyer belt can be set at different speed.

Thereby, at the 1st printed circuit board (PCB) that utilizes 31 heating of the 1st conveyer belt to have the 1st Temperature Distribution, and utilize the 2nd conveyer belt 32 to heat under the situation of the 2nd printed circuit board (PCB) with the 2nd Temperature Distribution different with the 1st Temperature Distribution, the transporting velocity by making the 1st conveyer belt 31 and the transporting velocity of the 2nd conveyer belt 32 are differently suitably set, can pay the 1st Temperature Distribution to the 1st printed circuit board (PCB) reliably, and reliably the 2nd printed circuit board (PCB) be paid the 2nd Temperature Distribution.

Then, carry printed circuit board (PCB) to describe to the 1st conveyer belt 31 and the 2nd conveyer belt 32 with different in width.

On chain 33, be provided with the 1st fixed head 41 abreast with the throughput direction of this chain 33.On chain 34, be provided with the 1st movable plate 42 abreast with the throughput direction of this chain 34.On chain 35, be provided with the 2nd fixed head 43 abreast with the throughput direction of this chain 35.On chain 36, be provided with the 2nd movable plate 44 abreast with the throughput direction of this chain 36.Lateral direction (being right direction among Fig. 3 and Fig. 4) at the 2nd movable plate 44 also is provided with motor fixed head 45.

Use between the fixed head 45 at the 1st fixed head 41 and motor, be provided with sliding axle 51 by the 1st movable plate 42 and the 2nd fixed head 43 ground.The 1st fixed head the 41, the 2nd fixed head 43 and motor with fixed head 45 fixedly sliding axle 51, the 1 movable plates 42 and the 2nd fixed head 44 along sliding axle 51 slips.

The carrying path 30 of the 1st conveyer belt 31 1 sides at first, is described.Use between the fixed head 45 at the 1st fixed head 41 and motor, be provided with the 1st leading screw 52 by the 1st movable plate 42.The 1st leading screw 52 has the threaded portion, and it engages with the 1st movable plate 42 by this threaded portion.The rotation when the 1st width of the distance that is used to change 34 on chain 33 and chain can change the axle rotation of the 1st leading screw 52 makes the 1st fixed head 41 move to the direction of arrow Y1.And the 1st fixed head the 41, the 2nd fixed head 43, motor run through in the mode that does not contact with the 1st leading screw 52 with the 2nd movable plate 44 with fixed head 45.

In order to make 52 rotations of the 1st leading screw, motor M3 is arranged on from the 1st fixed head 41 and extends on the fixed head 64 that is provided with.Be provided with motor on the motor M3 with belt pulley (below be called the 1st belt pulley 61).Motor M3 makes 61 rotations of the 1st belt pulley.Being provided with rotating shaft above the 1st belt pulley 61, on the 1st belt pulley 61 and the 2nd belt pulley 62, be wound with the 1st rotating band 63 with belt pulley (below be called the 2nd belt pulley 62).That is, when utilizing the driving of motor M3 to make 61 rotations of the 1st belt pulley, the 2nd belt pulley 62 is by the 1st rotating band 63 also rotation thereupon.Be provided with the 1st width at the center of the 2nd belt pulley 62 and can change axle 54.Can change axle 54 front end at the 1st width, be provided with above-mentioned the 1st leading screw 52 by the 1st fixed head 41.

Width at the printed circuit board (PCB) of desiring to be carried with the 1st conveyer belt 31 correspondingly changes under the situation of the distance between chain 33 and the chain 34, and at first, the user utilizes operating portion 80 to import the information relevant with the width of printed circuit board (PCB) (for example substrate width 70mm etc.).So to control part 81 output set information D, control part 81 outputs to motor M3 with activation bit D3 from operating portion 80.According to the activation bit D3 from control part 81 outputs, motor M3 rotates driving, 61 rotations of the 1st belt pulley, and the 2nd belt pulley 62 that links by the 1st rotating band 63 rotates.So by the rotation of the 2nd belt pulley 62, the 1st width can change axle the 54 and the 1st leading screw 52 rotation regulation number of turns.

The 1st leading screw 52 has the threaded portion as described above, and this threaded portion is sticked in the 1st movable plate 42, and therefore, in 52 rotations of the 1st leading screw, the 1st movable plate 42 is along the direction slip (move) of sliding axle 51 to arrow Y1.The amount of movement of the 1st movable plate 42 is input to the width of the printed circuit board (PCB) in the input unit based on user before.Thus, can and the width of the printed circuit board (PCB) carried of the 1st conveyer belt 31 correspondingly change distance between chain 33 and the chain 34.

The carrying path 30 of the 2nd conveyer belt 32 1 sides then, is described.Use between the fixed head 45 at the 1st fixed head 41 and motor, be provided with the 2nd leading screw 53 by the 2nd movable plate 44.The 2nd leading screw 53 has the threaded portion, and it engages with the 2nd movable plate 44 by this threaded portion.The rotation when the 2nd width of the distance that is used to change 36 on chain 35 and chain can change axle 55 rotations of the 2nd leading screw 53 makes the 2nd fixed head 44 move to the direction of arrow Y2.And the 1st fixed head the 41, the 2nd fixed head 43, motor run through in the mode that does not contact with the 2nd leading screw 53 with the 2nd movable plate 44 with fixed head 45.

In order to make 53 rotations of the 2nd leading screw, motor M4 is arranged on from motor and extends on the fixed head 74 that is provided with fixed head 45.Be provided with motor on the motor M4 with belt pulley (below be called the 3rd belt pulley 71).Motor M4 makes 71 rotations of the 3rd belt pulley.Being provided with rotating shaft below the 3rd belt pulley 71, on the 3rd belt pulley 71 and the 4th belt pulley 72, be wound with the 2nd rotating band 73 with belt pulley (below be called the 4th belt pulley 72).That is, when making 71 rotations of the 3rd belt pulley under the driving of motor M4, the 4th belt pulley 72 is rotation thereupon also.Be provided with the 2nd width at the center of the 4th belt pulley 72 and can change axle 55.Can change axle 55 front end at the 2nd width, be provided with above-mentioned the 2nd leading screw 53 with fixed head 45 by motor.

Width at the printed circuit board (PCB) of desiring to be carried with the 2nd conveyer belt 32 correspondingly changes under the situation of the distance between chain 35 and the chain 36, and at first, the user utilizes operating portion 80 to import the information relevant with the width of printed circuit board (PCB).So to control part 81 output set information D, control part 81 outputs to motor M4 with activation bit D4 from operating portion 80.According to the activation bit D4 from control part 81 outputs, motor M4 rotates driving, 71 rotations of the 3rd belt pulley, and the 4th belt pulley 72 that links by the 2nd rotating band 73 rotates.So, utilizing the rotation of the 4th belt pulley 72, the 2nd width can change axle the 55 and the 2nd leading screw 53 rotation regulation number of turns.

The 2nd leading screw 53 has the threaded portion as described above, and this threaded portion is sticked in the 2nd movable plate 44, and therefore, in 53 rotations of the 2nd leading screw, the 2nd movable plate 44 is along the direction slip (move) of sliding axle 51 to arrow Y2.The amount of movement of the 2nd movable plate 44 is input to the width of the printed circuit board (PCB) in the input unit based on user before.Thus, can and the width of the printed circuit board (PCB) carried of the 2nd conveyer belt 32 change distance between chain 35 and the chain 36 in combination.

Like this, change between chain 33 and the chain 34 can be able to be changed the distance between chain 35 and the chain 36, therefore, the width that can be set at the printed circuit board (PCB) that the 1st conveyer belt 31 carried is different with the width of the printed circuit board (PCB) that the 2nd conveyer belt 32 is carried.

Fig. 5 is that the master of the structure example of expression heater 1 looks cutaway view, and Fig. 6 is its side view cutaway drawing.As Fig. 5 and shown in Figure 6, the heater 1 that the hot blast that adopts in reflow furnaces of the present invention blows out type is arranged on the top and the bottom of the body of heater 0 of reflow furnaces, therefore, though make no distinction of rank for heater 1, but be arranged on the situation of bottom of the body of heater 0 of reflow furnaces in 1 supposition of Fig. 5 and heater illustrated in fig. 6, with such describing up and down of in Fig. 5 and Fig. 6, seeing.

Heater 1 is the case shape, its on the above-below direction from below begin to have plenum chamber 2, heating chamber 3, hot blast chamber 4 and suction chamber 5.Central configuration at plenum chamber 2 has forced draft fan 6.Forced draft fan 6 for example adopts multi blade fan, utilizes the motor 7 that is arranged on the outside to drive forced draft fan 6.Motor 7 is not the frequency-conversion and speed-regulation motor of high price, but the motor of common cheapness.As Fig. 5 and shown in Figure 6, there is partition wall 8 (one of them is not shown) in the both sides of plenum chamber 2, an end of this partition wall is an opening 9.The opening of each partition wall is not relative position, but separates to two ends.

Both sides in heating chamber 3 are formed with

stream

10,10, in the internal configurations of heating chamber 3 a plurality of electrothermal heaters 11 are arranged.In demarcation strip 12, be equipped with inlet hole 13 with heating chamber 3 and plenum chamber 2 separations.Inlet hole 13 is configured in the position directly over the forced draft fan 6, and its diameter is slightly less than the diameter as the multi blade fan of forced draft fan.

Hot blast chamber 4 is connected with the opening 9 of above-mentioned plenum chamber 2, thereby sends into hot blast from plenum chamber 2.Opening frame between hot blast chamber 4 and suction chamber 5 has hot blast to blow out plate 14, and suction chamber 5 utilizes

stream

10,10 to be connected with heating chamber 3.Constitute heater face 15 on the suction chamber 5.

Blow out at hot blast and to be equipped with many holes 16 in the plate 14, in these holes 16, be separately installed with and blow out nozzle 17.As shown in Figure 1, this example blow out tabular for sawtooth of nozzle 17, be equipped with in the nozzle 17 with hot blast in tabular blowing out and blow out the ejiction opening 18 that the hole 16 of plate communicates.Blow out nozzle 17 and erect setting highlightedly than heater face 15.The tabular nozzle 17 that blows out is arranged on the direction that the direct of travel (throughput direction X) with printed circuit board (PCB) intersects.In the tabular both sides that blow out nozzle 17, blow out nozzle along this and be formed with jagged suction inlet 19.

Fig. 7 is the amplification inclinating view that expression hot blast adjustment plate 20 and hot blast blow out the configuration example of plate 14.As shown in Figure 7, the lower surface that blows out plate 14 at hot blast is adjacent to and disposes hot blast and adjust plate 20.In hot blast is adjusted plate 20, blowing out the hole 21 that identical position, the hole 16 of plate 14 is equipped with roughly the same shape with hot blast.

Fig. 8 is the upward view that the expression hot blast is adjusted the structure example of plate 20.As shown in Figure 8, hot blast adjustment plate 20 is split into three member of formation (20A, 20B, 20C) along the direct of travel (throughput direction X) of printed circuit board (PCB), and each member of formation can constitute on arrow a, b, c direction movably.

A plurality of positions setting of adjusting on the plate 20 at hot blast is provided with screw 22 ...Blow out being in of plate 14 and heater face 15 at hot blast and be equipped with slotted

hole

23,24 in being regardless of of same position with these screws 22.Sidepiece at the slotted hole 24 of heater face 15 indicates scale.At ordinary times, screw 22 is inserted in the slotted

hole

23,24, and square thread screws in nut 26 from it.

As mentioned above, adopt reflow furnaces of the present invention, at the 1st printed circuit board (PCB) that utilizes 31 heating of the 1st conveyer belt to have the 1st Temperature Distribution, and utilize the 2nd conveyer belt 32 to heat under the situation of the 2nd printed circuit board (PCB) with the 2nd Temperature Distribution different with the 1st Temperature Distribution, the transporting velocity of the 1st conveyer belt 31 and the transporting velocity of the 2nd conveyer belt 32 are differently suitably set, therefore, can pay the 1st Temperature Distribution to the 1st printed circuit board (PCB) reliably, and reliably the 2nd printed circuit board (PCB) is paid the 2nd Temperature Distribution, but by further adjusting heater 1, can pay best Temperature Distribution respectively to the 1st printed circuit board (PCB) and the 2nd printed circuit board (PCB) respectively more reliably, therefore, this point is described.

To 11 energisings of the electrothermal heaters in the heating chamber 3 that is configured in heater 1, and, drive motor 7 and make multi blade fan rotation as forced draft fan 6.So, being in that gases in the heating chamber 3 utilize electrothermal heater 11 heating and the hot blast that becomes high temperature, it is inhaled in the plenum chamber 2 by the inlet hole 13 of forced draft fan 6 from forced draft fan.The hot blast side that blows out from forced draft fan under forced draft fan 6 drives that is drawn in the plenum chamber 2 is transported to hot blast chamber 4 by opening 9, adjusts the hole 21 of plate 20 and the hole 16 that hot blast blows out plate 14 by hot blast, and then is blown from the ejiction opening 18 that blows out nozzle 17.

The 2nd printed circuit board (PCB) that the hot blast that blows out from ejiction opening 18 is carried towards the 1st printed circuit board (PCB) of being carried by the 1st conveyer belt 31 with by the 2nd conveyer belt 32 is close, heats the 1st printed circuit board (PCB) and the 2nd printed circuit board (PCB).By the soldering paste fusion of the soldering portion that is coated in of the 1st printed circuit board (PCB) after the hot blast heating and the 2nd printed circuit board (PCB), thus between the 1st printed circuit board (PCB) or the 2nd printed circuit board (PCB) and electronic unit by soldering.

At this, be higher than in the temperature of desiring to make the 1st printed circuit board (PCB) under the situation of temperature of the 2nd printed circuit board (PCB), not only the transporting velocity of the 1st conveyer belt 31 is set to such an extent that be lower than the transporting velocity of the 2nd conveyer belt 32, and will blow out plate with the corresponding hot blast of the 1st printed circuit board (PCB), for example adjust the hole 16 that the corresponding hot blast of plate 20A blows out on the plate with hot blast shown in Figure 7 and open greatlyyer, will open lessly with the hole that the corresponding hot blast of the 2nd printed circuit board (PCB) blows out plate.

Promptly, it is enough big to make hot blast adjust the aperture area in the corresponding hole 21 of the part with a large amount of heats of needs of plate 20A, thereby make the aperture area in this hole 21 and hole 16 that hot blast blows out plate 14 in full accord, mobile slightly with corresponding hot blast adjustment plate 20B of the part that does not need a large amount of heats and 20C to arrow b, c direction, reduce the aperture area that hot blast blows out the hole 16 of plate 14.

Like this, when utilizing hot blast to adjust plate 20 to adjust hot blasts and blow out the aperture area in hole 16 of plate 14, part from a large amount of heats of needs, the aperture area that hot blast blows out the hole 16 of plate 14 becomes big, therefore, can blow out a large amount of hot blasts and the 1st printed circuit board (PCB) is heated to than the abundant high temperature of the 2nd printed circuit board (PCB).

The hot blast that blows out from tabular nozzle is seized heat by the 1st printed circuit board (PCB) and the 2nd printed circuit board (PCB), so temperature reduces.Hot blast after this temperature descends is provided with near the tabular suction inlet 19 that blows out nozzle 17 from setting and is inhaled into, and enters into heating chamber 3 by stream 10.The hot blast that enters into heating chamber 3 is heated to the temperature of regulation by electrothermal heater 11, is drawn in the plenum chamber 2 by forced draft fan 6.Then, hot blast is transported to the hot blast chamber 4 from opening 9, blows out from the ejiction opening 18 that blows out nozzle 17 once more, heats the 1st printed circuit board (PCB) and the 2nd printed circuit board (PCB).

Like this, adopt reflow furnaces of the present invention, the transporting velocity of 32 pairs of printed circuit board (PCB)s of transporting velocity and the 2nd conveyer belt of 31 pairs of printed circuit board (PCB)s of the 1st conveyer belt can be set at different speed, therefore, can pay suitable Temperature Distribution respectively to different types of multiple printed circuit board (PCB) reliably.

In addition, in the above description, Width for body of heater 0,

chain

33,35 fixed configurations that will be arranged at the 1st fixed head and the 2nd fixed head 43 have been exemplified, and will be arranged at the situation of chain 34, the 36 freedoms of movement ground configuration of the 1st movable plate 42 and the 2nd movable plate 44, but the present invention is not limited to this mode, as long as the position is set on the Width of body of heater, can changes of at least one in chain 33 and the chain 34, and, the position is set on the Width of body of heater, can changes and get final product of at least one in chain 35 and the chain 36.

For example, Width for body of heater 0, also fixed head ground fixed configurations can be set on chain 33, chain 36, and on

chain

34,35, movable plate is set and with the configuration of its freedom of movement ground, fixed head ground fixed configurations perhaps is set on chain 36, and on

chain

33,34,35, movable plate is set and the configuration of its freedom of movement ground.In addition, this movable plate utilizes drive unit such as motor as described above, the leading screw that is used to transmit transmission mechanisms such as the belt pulley of rotation of motor reel and band, rotation under transmission mechanism drives waits to move.

In addition, in the present embodiment, the mode of correspondingly utilizing motor that the 1st movable plate 42 and the 2nd movable plate 44 are moved to the width with the printed circuit board (PCB) of carrying is illustrated, but also can be that the user operates the 1st width and can change axle the 54 or the 2nd width and can change axle 55 and come manual adjustments.Thus, can remove motor M3, the 1st belt pulley the 61, the 2nd belt pulley the 62, the 1st rotating band 63, fixed head 64, motor M4, the 3rd belt pulley the 71, the 4th belt pulley the 72, the 2nd rotating band 73 and fixed head 74, reduce the manufacturing cost of carrying path.

Embodiment 1

Reference temperature(TR) distributes and specifies reflow furnaces of the present invention.

Use the reflow furnaces of the present invention of Fig. 1～shown in Figure 8 and the reflow furnaces of comparative example, the 1st printed circuit board (PCB) and the 2nd printed circuit board (PCB) with different Temperature Distribution carried out scolding tin.The reflow furnaces of comparative example is to have removed the reflow furnaces that function that the transporting velocity that makes the 1st conveyer belt 31 and the 2nd conveyer belt 32 differently sets and hot blast are adjusted plate 20 from reflow furnaces of the present invention.In addition, substrate size has changed thickness, and the thickness of the 1st printed circuit board (PCB) is 1mm, and the thickness of the 2nd printed circuit board (PCB) is 5mm.

Be coated with the soldering paste that the powder that mixes Sn-3Ag-0.5Cu (melt temperature: 217～219 ℃) forms in the soldering portion of printed circuit board (PCB).The reflow furnaces of reflow furnaces of the present invention and comparative example all is set at 150～180 ℃ in the temperature that operating portion 80 will prepare heating region, and the temperature of formal heating region is set at (peak temperature is 230～250 ℃) more than 220 ℃.Utilize operating portion 80 to set, thereby printed circuit board (PCB) was heated for 60～100 seconds in the preparation heating region, in formal heating region, heated for 30～60 seconds.Then, make thermocouple be contacted with the 1st and the 2nd printed circuit board (PCB), measure the temperature of printed circuit board (PCB).

The diameter that two hot blasts blow out the hole of plate is 4mm, in the sawtooth position that the direct of travel with printed circuit board (PCB) intersects, is equipped with 50 holes with a row zigzag.And serration is arranged with 10 row on the direct of travel of printed circuit board (PCB), and hole number adds up to 500.

In addition, in reflow furnaces of the present invention, utilize operating portion 80 that the transporting velocity of the 1st conveyer belt 31 is set at 0.7m/min, the transporting velocity of the 2nd conveyer belt 32 is set at 1.0m/min.With respect to this, in the reflow furnaces of comparative example, utilize operating portion 80 that the transporting velocity of the 1st conveyer belt 31 and the 2nd conveyer belt 32 all is set at 1.0m/min.

Hot blast blow out heater use hot blast adjust plate on the direct of travel of printed circuit board (PCB) by three members that are split to form.Make adjust the hole of plate with the one-sided hot blast at the corresponding position of the 1st printed circuit board (PCB) and hole that hot blast blows out plate consistent, the hole that makes hot blast blow out plate becomes the state of opening fully, other hot blast adjustment plate is moved, reduce to adjust the hole that the corresponding hot blast of plate blows out plate with this hot blast.

Fig. 9 is the key diagram of Temperature Distribution example of representing to set as described above the reflow furnaces of the present invention of heating-up temperature, transporting velocity.As shown in Figure 9, with the temperature of the longitudinal axis as printed circuit board (PCB), transverse axis is as the elapsed time (time of delivery) after putting into printed circuit board (PCB) in the reflow furnaces.

The 1st printed circuit board (PCB) that utilizes the 1st conveyer belt 31 to carry has the characteristic of Temperature Distribution L1.That is, the 1st printed circuit board (PCB) is at time of delivery during from about 90 (sec) to about 175 (sec), from reaching 180 ℃ as 150 ℃ of the design temperature of preparation heating region.In addition, the 1st printed circuit board (PCB) is at time of delivery during from about 205 (sec) to about 255 (sec), reaches 220 ℃ as the design temperature of formal heating region.

The 2nd printed circuit board (PCB) that utilizes the 2nd conveyer belt 32 to carry has the characteristic of Temperature Distribution L2.That is, the 2nd printed circuit board (PCB) is at time of delivery during from about 180 (sec) to about 260 (sec), from reaching 180 ℃ as 150 ℃ of the design temperature of preparation heating region.In addition, the 2nd printed circuit board (PCB) during from about 320 (sec) to about 365 (sec), reaches more than 220 ℃ of design temperature as formal heating region at time of delivery.

The all fully wet diffusion of the 1st printed circuit board (PCB) in this reflow furnaces after the soldering and the 2nd printed circuit board (PCB) do not have soldering bad, and the electronic unit of other soldering portion can not burn or variable color.

Like this, reflow furnaces of the present invention can be with the 1st printed circuit board (PCB) that utilizes the 1st conveyer belt 31 to carry and utilize the 2nd printed circuit board (PCB) that the 2nd conveyer belt 32 carries the two, in the preparation heating region,, in formal heating region, heat more than 220 ℃ with 30～60 seconds of setting-up time, design temperature with 60～100 seconds of setting-up time, 150～180 ℃ of heating of design temperature.Thus, can pay suitable Temperature Distribution respectively to different types of multiple printed circuit board (PCB) reliably, thereby can carry out soldering reliably.

Figure 10 is the key diagram of Temperature Distribution example of reflow furnaces of having represented to set as described above the comparative example of heating-up temperature, transporting velocity.As shown in figure 10, with the temperature of the longitudinal axis as printed circuit board (PCB), transverse axis is as the elapsed time (time of delivery) after putting into printed circuit board (PCB) in the reflow furnaces.

The 1st printed circuit board (PCB) that utilizes the 1st conveyer belt 31 to carry has the characteristic of Temperature Distribution L3.That is, the 1st printed circuit board (PCB) is at time of delivery during from about 90 (sec) to about 175 (sec), from reaching 180 ℃ as 150 ℃ of the design temperature of preparation heating region.In addition, the 1st printed circuit board (PCB) during from about 205 (sec) to about 255 (sec), reaches 220 ℃ (Temperature Distribution L3 and said temperature distribution L1 are roughly the same) as the design temperature of formal heating region at time of delivery.

The 2nd printed circuit board (PCB) that utilizes the 2nd conveyer belt 32 to carry has the characteristic of Temperature Distribution L4.That is, the 2nd printed circuit board (PCB) is at time of delivery during from about 150 (sec) to about 190 (sec), from reaching 180 ℃ as 150 ℃ of the design temperature of preparation heating region.In addition, the 2nd printed circuit board (PCB) can't reach more than 220 ℃ of design temperature as formal heating region.

In addition, in the 1st printed circuit board (PCB) in this reflow furnaces after the soldering, Temperature Distribution L3 is a high temperature as mentioned above, therefore, can not have bad soldering, but in the 2nd printed circuit board (PCB), in formal heating region, do not reach 220 ℃, therefore, scolding tin is fusion not, can't carry out soldering.

Like this, in the reflow furnaces of comparative example, can pay suitable Temperature Distribution, but can't pay suitable Temperature Distribution the 2nd printed circuit board (PCB) to the 1st printed circuit board (PCB).

Description of reference numerals

0, the body of heater of reflow furnaces;

1, hot blast blows out heater;

14, hot blast blows out plate;

15, heater face;

16, hot blast blows out the hole of plate;

17, blow out nozzle;

18, ejiction opening;

19, suction inlet;

20, hot blast is adjusted plate;

21, hot blast is adjusted the hole of plate;

22, screw;

23,24, slotted hole;

25, scale;

26, nut;

30, carrying path;

31, the 1st conveyer belt;

32, the 2nd conveyer belt;

33, the 1st chain;

34, the 2nd chain;

35, the 3rd chain;

36, the 4th chain;

37, the 1st sprocket for chain;

38, the 2nd sprocket for chain;

39, the 3rd sprocket for chain;

40, the 4th sprocket for chain;

41, the 1st fixed head;

42, the 1st movable plate;

43, the 2nd fixed head;

44, the 2nd movable plate;

45, side panel;

51, the 1st sliding axle;

52, the 2nd sliding axle;

53, the 1st leading screw;

54, the 2nd leading screw;

61, the 1st motor belt pulley;

62, the 1st leading screw belt pulley;

63, the 1st rotating band;

71, the 2nd motor belt pulley;

72, the 2nd leading screw belt pulley;

73, the 2nd rotating band;

80, operating portion;

81, control part.

Claims

1. reflow furnaces, this reflow furnaces comprise body of heater with heater, and the carrying path of the printed circuit board (PCB) that sets up along the length direction of above-mentioned body of heater in the inside of this body of heater and above above-mentioned heater, it is characterized in that,

Above-mentioned carrying path is made of with 2nd conveyer belt different with the 1st conveyer belt the 1st conveyer belt that the Width along above-mentioned body of heater is set up in parallel;

Above-mentioned the 1st conveyer belt is set up in parallel by the Width along above-mentioned body of heater and is used to carry the 1st track of printed circuit board (PCB) and the 2nd track to constitute, and above-mentioned the 2nd conveyer belt is set up in parallel by the Width along above-mentioned body of heater and is used to carry the 3rd track of printed circuit board (PCB) and the 4th track to constitute;

And, above-mentioned the 1st conveyer belt can be set at different speed to the transporting velocity of printed circuit board (PCB) and above-mentioned the 2nd conveyer belt to the transporting velocity of printed circuit board (PCB).

2. reflow furnaces according to claim 1, wherein,

The position is set on the Width of above-mentioned body of heater, can changes of in above-mentioned the 1st track and the 2nd track at least one, and, the position is set on the Width of above-mentioned body of heater, can changes of at least one in above-mentioned the 3rd track and the 4th track.

3. a reflow furnaces is characterized in that,

Comprise:

Body of heater, it has the heater that is used to heat printed circuit board (PCB);

The the 1st and the 2nd delivery section, it is arranged in the above-mentioned body of heater, and is set up in parallel on the throughput direction of printed circuit board (PCB), is used for carrying printed circuit board (PCB) with the transporting velocity of regulation;

Operating portion, its generation are used for setting respectively the set information of the transporting velocity of above-mentioned the 1st delivery section and the 2nd delivery section;

Control part, it receives the above-mentioned set information that is generated by aforesaid operations portion, drives the above-mentioned the 1st and the 2nd delivery section respectively according to this above-mentioned set information that receives.

4. reflow furnaces according to claim 3, wherein,

Above-mentioned the 1st delivery section has the 1st track and the 2nd track that is set up in parallel and is used to carry printed circuit board (PCB) along the Width of above-mentioned body of heater;

Above-mentioned the 2nd delivery section has the 3rd track and the 4th track that is set up in parallel and is used to carry printed circuit board (PCB) along the Width of above-mentioned body of heater;

5. according to each described reflow furnaces in the claim 1～4, it is characterized in that,

Above-mentioned heater blows out at hot blast and is equipped with many holes on the plate, utilization blows out hot blast from this hole and heats above-mentioned printed circuit board (PCB), for be arranged in above-mentioned hot blast and blow out identical position, the hole of plate and be equipped with the hot blast that blows out roughly the same hole, the hole of plate with hot blast and adjust plate, blow out the hole of plate and be arranged in the corresponding to mode in hole that above-mentioned hot blast adjusts plate and this hot blast is adjusted plate be closely attached on above-mentioned hot blast and blow out plate to be arranged in above-mentioned hot blast, and, move by making above-mentioned hot blast adjustment plate blow out plate, can adjust the aperture area that above-mentioned hot blast blows out the hole of plate along above-mentioned hot blast.

6. reflow furnaces according to claim 5 is characterized in that,

Above-mentioned hot blast is adjusted plate and is made of a plurality of member of formation, and these a plurality of member of formation can blow out plate with respect to above-mentioned hot blast by oneself separately and move.

7. according to claim 5 or 6 described reflow furnaces, it is characterized in that,

In above-mentioned hot blast blows out the hole of plate, be equipped with and blow out nozzle.

8. according to each described reflow furnaces in the claim 5～7, it is characterized in that,

Adjust on the plate at above-mentioned hot blast screw is installed, and, be equipped with slotted hole what hot blast blew out plate with this screw consistent location place.