CN102237481A - Surface mounted type power light-emitting diode (LED) bracket manufacturing method and product manufactured thereby - Google Patents
Surface mounted type power light-emitting diode (LED) bracket manufacturing method and product manufactured thereby Download PDFInfo
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- CN102237481A CN102237481A CN 201010165442 CN201010165442A CN102237481A CN 102237481 A CN102237481 A CN 102237481A CN 201010165442 CN201010165442 CN 201010165442 CN 201010165442 A CN201010165442 A CN 201010165442A CN 102237481 A CN102237481 A CN 102237481A
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Abstract
The invention relates to a surface mounted type power light-emitting diode (LED) bracket manufacturing method and a product manufactured thereby. The method comprises the following steps of: 1) preparing a copper-clad printed circuit board (PCB) single-sided board of which the glass transition temperature Tg ranges from 140 to 165 DEG C and the thermal degradation temperature Td is not less than 300 DEG C; 2) forming at least one through hole passing through the single-sided board through a mechanical or laser process; 3) adhering and covering a metal sheet on the lower surface of the single-sided board, and sealing the bottom of the through hole; 4) forming a line layer I on a copper layer of the single-sided board and a line layer II on the metal sheet so as to form an LED bracket; and 5) cutting the LED bracket to separate independent LED bracket units. The invention also provides the surface mounted type power LED bracket manufactured by the method. By the invention, the prejudice in the prior art is overcome; a common PCB is used as a substrate for manufacturing a power LED bracket; furthermore, the process method is simple, the structural design is unique, the product cost is low, the universality is high, the heat dissipation effect is good, the application range is wide and the invention is suitable for industrial batch production.
Description
Technical field
The present invention relates to a kind of manufacture method and products thereof of led support of the LED of being applied to device, be specifically related to be used to manufacture method of making on surface attaching type power LED device support and products thereof.
Background technology
Semiconductor lighting be described as the 4th generation lighting source, popularization and application is to the general illumination field gradually.Wherein, power led (power LED) is received by the market with high brightness, high power.The support that conventional power LED is used has two kinds: PLCC type (plastic leaded chip carrier, plastic packaging band lead-in wire chip carrier) and ceramic substrate.
Be the PLCC type supporting structure schematic diagram of prior art as shown in Figure 1.PLCC type support is the plastic casing 01 coated metal lead frame 02 with reflection cavity structure, and this metal lead wire frame 02 has the pin 05 that the chip mount portion 03 of carrying led chip 04 and electrode are used; This chip mount portion 03 is into a single integrated structure with one of positive and negative electrode.Because PLCC type support has reflection cavity and compact conformation, is particularly suitable for being applied to the light distribution requirements height, mounts the high field of density.Produce the problem of high heat energy when there is work in great power LED, need to adopt technological means that the heat energy that is produced is well distributed, otherwise can influence its life-span and go out light effect.Therefore the typical package structure of the PLCC type support used of great power LED is: the plastic casing with reflection cavity structure is except the coated metal lead frame, also parcel places led chip bottom and is exposed to heat sink outside the support, the material that this is heat sink is generally selected radiating effect good metal material for use, for example copper is beneficial to distribute the high heat energy that produces when LED works.Because radiating effect is good, PLCC type great power LED is one of at present the most frequently used high-power LED encapsulation structure.
The support that another kind of conventional power LED is used is a ceramic substrate, its typical package structure as shown in Figure 2: the substrate 06 of carrying led chip with place the reflection cavity 07 on this substrate 06 all to adopt ceramic material; For great power LED device situation, the chip mount place of substrate 06 also has the through hole 08 of at least one, fills Heat Conduction Material in the through hole 08, strengthens radiating effect, satisfies the heat radiation requirement of great power LED device.Because ceramic substrate has good insulation performance and thermal diffusivity, so such substrate is widely used in the great power LED field, occupies whole great power LED market in the lump with PLCC type support.
However, still there are some shortcomings in PLCC type support and ceramic substrate.With regard to PLCC type support, its manufacturing process complexity, the required precision height has had a lot of relevant patent applications, and its core key technology is still grasped abroad in enterprise's hand, and technology is ripe relatively, and room for improvement is limited.Particularly the PLCC type support used of power LED also needs in conjunction with heat sink heat radiation of assembling, owing to added heat sinkly, needs preparation counterbore and assembling heat sink, so its structure is complicated more, causes the support packaging technology more loaded down with trivial details.Simultaneously, the great power LED volume of PLCC type is big, and its encapsulating structure can not be applied to solder reflow process, is not suitable for the test and the Tape Technology of automatic lotization, the mass welded and installed that yet is unfavorable for downstream product especially is not suitable for the surface mount process that follow-up LED product is made.As seen the complex structure of existing P LCC type support, make its manufacturing process relative complex, the processing cost of product is also higher relatively, and the subsequent machining technology of product is limited, increased follow-up LED production cost of products and reduced production efficiency, and respective limits the range of application of PLCC type support power LED.
Though ceramic substrate can overcome the major defect of PLCC type support, a common problem of ceramic substrate is that the manufacturing process difficulty is big, and cost is high and material is crisp.This also is to limit the key factor that ceramic substrate can not replace PLCC type support fully at present.
In sum, need to seek led support structure and the manufacturing process thereof that a kind of manufacturing process is simple, the product bright dipping is respond well, processing cost is lower, compare with ceramic substrate with aforementioned PLCC type support, can overcome the technical disadvantages of above-mentioned existing PLCC type support and ceramic substrate.In the existing technological improvement, those skilled in the art are attempting aspect manufactured materials, the manufacture craft, but all well do not solve and overcome above-mentioned technological deficiency.
Summary of the invention
The technological innovation that purpose of the present invention is carried out at above-mentioned technological deficiency just provides a kind of surface attaching type power LED support method and products thereof.The present invention is different from the support manufacturing method of above-mentioned prior art and structure thereof, technical scheme of the present invention is innovated on manufacturing process and product structure, adopt common pcb board as the substrate of making support, so the present invention is a kind of manufacture method and product of the surface attaching type power LED support based on common pcb board.
Compare with PLCC type support with aforementioned ceramic substrate, common pcb board price is lower, and ripe relatively for the processing technology of pcb board.Yet radiating effect is poor, the shortcoming of poor heat resistance because common pcb board exists, and those skilled in the art it has been generally acknowledged that common pcb board is not suitable for the requirement of the high-cooling property of power-type LED device, can only be used for low power LED device, so versatility is relatively poor.In addition, because the poor heat resistance of common pcb board problems such as layering and distortion can occur in LED packaging and die bonding technology, rate of finished products is lower, and those skilled in the art generally believe that common pcb board is not suitable as the encapsulating material of power LED.
The present invention overcomes the prejudice of prior art, adopt common pcb board as the substrate of making the power LED support, a kind of surface attaching type power LED rack making method is provided, select to cover copper PCB single sided board and be the insulation single sided board, the glass transition temperature Tg that requires this insulation single sided board is not less than 300 ℃ between 140～165 ℃, thermal cracking temperature T d, promptly belongs to low price, the common pcb board material of (middle Tg) characteristic that has middle glass transition temperature.Newly design for the heat radiation of supporting structure by the present invention, make led support can satisfy the high heat-resisting requirement of power LED with common PCB manufacturing.By evidence, this led support of pcb board manufacturing that covers the middle Tg of copper has the better heat-resisting performance, problems such as layering and cracking can not occur in the solid crystalline substance of silver slurry of LED encapsulation.The present invention has overcome in the prior art, and those skilled in the art generally believe that common pcb board can not be used to make the technology prejudice of power LED support, dexterously pcb board is applied to the manufacturing of led support, technology of the present invention is simple, with low cost, product good heat dissipation effect, range of application are wide, have obtained very outstanding technique effect.
According to the technical scheme of surface attaching type power LED manufacture method of the present invention, concrete steps are as follows:
Step 1) is prepared one and is covered the copper single sided board by what the common PCB insulated substrate of copper layer and this copper layer of carrying was formed, and the described glass transition temperature Tg that covers the copper single sided board is not less than 300 ℃ between 140 ℃～165 ℃, thermal cracking temperature T d; Step 2) forms at least one by mechanical technology or laser technology and run through the described through hole that covers copper PCB single sided board; Step 3) covers the described lower surface that covers copper PCB single sided board by jointing material with a sheet metal, and can seal the bottom of described through hole; Step 4) is by forming line layer one, forming line layer two on described sheet metal, to constitute led support on the described copper layer that covers copper PCB single sided board; 5) the cutting led support is isolated independently led support unit.
Technical scheme according to surface attaching type power LED support of the present invention, its structure is: with the copper PCB single sided board that covers formed of common PCB insulated substrate by copper layer and this copper layer of carrying is stent substrate, the described copper PCB single sided board that covers is provided with through hole, and described through-hole wall is coated with metal level and plays reflex; The described copper PCB single sided board lower surface that covers is provided with the sheet metal of the described via bottoms of sealing as chip mount portion; The described copper PCB single sided board that covers is provided with line layer, described line layer comprises the positive and negative electrode that is positioned at around the through hole, is used for the lead-in wire connecting portion of welded wire and is positioned at two ends, led support unit, electrically connects with described lead-in wire connecting portion respectively, described plus or minus electrode comprises that also at least one runs through the described small through hole that covers copper PCB single sided board and line layer, conductive layer being set or inserting electric conducting material, described conductive layer or described electric conducting material and the electric connection of described line layer at described small through hole inwall.In said structure of the present invention, the chip mount portion of carrying led chip combines a part that constitutes two-sided line layer with pcb board, feasible cover copper PCB single sided board and line layer into a single integrated structure.
According to a kind of surface attaching type power LED support manufacturing method provided by the invention, because its key step is to adopt the pcb board processing technology, so manufacture method is simple, cost of manufacture is low, popularization is strong, uses common pcb board, has largely reduced product cost.In contrast, the manufacture craft of PLCC type support needs many molds, die cost height, and complex process; The ceramic substrate technology difficulty is big, the required precision height.Therefore, the related process of prior art is improved and simplified to led support manufacture method provided by the invention greatly, help breaking through foreign enterprise monopolized, avoids high-power LED bracket making commonly used to the core technology of PLCC type support technological difficulties, further reduce the production and the manufacturing cost of high-power LED bracket, finally promote LED and be popularized for the general illumination field.
According to surface attaching type power LED support provided by the invention because its special structure design, have simple in structure, cost is low, radiating effect is good, the advantage of applied range.The typical structure of power LED support is to have reflection cavity at present.The reflection cavity of ceramic substrate is the extra band through hole ceramic wafer of installing, and surface attaching type power LED support essence of the present invention is two-sided line PCB, its reflection cavity is the conventional pcb board that has through hole, the chip mount portion of carrying led chip is the part of the two-sided line layer of pcb board---place the sheet metal that covers copper PCB single sided board bottom and seal described through hole, therefore led support of the present invention is simpler, compact than the structure of ceramic substrate; The plastic casing of the PLCC type support of prior art is the PBM material that adopts price expensive, and be unsuitable for follow-up mass automatic production, and surface attaching type power LED support of the present invention comes down to two-sided line PCB, its selection is cheap, compact conformation, processing technology is simple, and its LED device is applicable to surface mount process in follow-up LED product processing, can realize large-scale automated production, overcome LED device complex process in subsequent product is made of the PLCC type support of prior art, can not be applicable to the defective of large-scale automated production.In addition, high-powerly need adopt the high metal heat sink material of price with PLCC type support, ceramic substrate material cost height so power LED support cost based on common pcb board of the present invention is lower than the cost of PLCC type support and ceramic substrate, has very outstanding price advantage.
A kind of surface attaching type power LED support provided by the invention, its structure combines the sheet metal that covers copper PCB single sided board and be used to carry led chip, can reduce cost greatly as mentioned above on the one hand, led chip directly contacts with heat conduction good metal sheet on the other hand, the heat that discharges when allowing led chip work can directly be released into the external world by sheet metal, so this led support has better heat radiating effect.For example, low-power LED is generally 160 ℃/W with the thermal resistance of PLCC type support, and led support thermal resistance provided by the invention only is 3～5 ℃/W.As seen, led support of the present invention not only can be applied to the low-power LED device, also can be applied in the great power LED device, has broken those skilled in the art and has generally believed that common pcb board can not be applied to the technology prejudice of great power LED device.Simultaneously, this led support belongs to the surface attaching type encapsulating structure, and its frame bottom directly is close on the soldered parts, so the direct contact component of the sheet metal of led support, more convenient heat transferred is to extraneous.Therefore, surface attaching type power LED support of the present invention just can provide more better heat radiating effect with lower cost, has the potentiality that alternative PLCC type support and ceramic substrate occupy great power LED market.
In addition, power LED support provided by the invention belongs to the surface attaching type encapsulating structure, is applicable to the test and the Tape Technology of solder reflow process and automatic lotization, also is applicable to the mass welded and installed of its downstream product.
Description of drawings
Shown in Figure 1 is the PLCC type support of a prior art;
Shown in Figure 2 is the ceramic substrate of a prior art;
The manufacture method flow chart that has provided surface attaching type power LED support of the present invention shown in Figure 3;
First embodiment that has provided a kind of surface attaching type power LED carrier unit structure of the present invention shown in Figure 4;
Second embodiment that has provided a kind of surface attaching type power LED carrier unit structure of the present invention shown in Figure 5;
The specific embodiment that has provided a kind of surface attaching type power LED supporting structure of the present invention shown in Figure 6.
Label declaration in the accompanying drawing
01 plastic casing, 02 metal lead wire frame, 03 04LED of chip mount portion chip, 05 pin
06 substrate, 07 reflection cavity, 08 through hole, 1 carrier unit, 10 insulated substrates, 101 through holes
11 chip mount portions, 12 line layers
121 lead-in wire connecting portions, 13 negative electrode 131 small through hole, 16 metallic coppers or silver layers
132 conductive layers, 133 electric conducting materials, 14 welding resisting layers
20 insulated substrates, 201 through holes, 21 chip mount portions, 22 line layers, 202 lines of cut
203 lines of cut
Shown in Figure 1 is the PLCC type support of a prior art, has the plastic casing 01 coated metal lead frame 02 of reflection cavity structure, and this metal lead wire frame 02 has the pin 05 that the chip mount portion 03 of carrying led chip 04 and electrode are used.
Shown in Figure 2 is the ceramic substrate of a prior art, carries the substrate 06 of led chip and places the reflection cavity 07 on this substrate 06 all to adopt ceramic material.
Embodiment
Embodiment one
Fig. 3 has provided the manufacture method flow chart of surface attaching type power LED carrier unit of the present invention, is specified below in conjunction with accompanying drawing 3.
As shown in Figure 3, the manufacture method of surface attaching type power LED support and unit thereof is specific as follows: step 1) is prepared one and is covered copper PCB single sided board; Step 2) forms at least one by mechanical technology or laser technology and run through the described through hole that covers copper PCB single sided board; Step 3) covers the described lower surface that covers copper PCB single sided board by jointing material with a sheet metal, and seals the bottom of described through hole; Step 4) forms line layer one, forms line layer two on described sheet metal on the described copper layer that covers copper PCB single sided board; 5) the cutting led support divides independently led support unit.
In step 1), cover copper PCB single face insulation board and form by the PCB insulation flat board of copper layer and this copper layer of carrying.For the LED device can bear the encapsulation with welding process in high-temperature and high-pressure conditions, require this insulation flat board that covers the copper single sided board to satisfy following condition: glass transition temperature Tg (belongs to middle Tg) between 140 ℃ and 165 ℃, thermal cracking temperature T d is not less than 300 ℃; When temperature during less than glass transition temperature Tg, the thermal coefficient of expansion CTE of Z axle is no more than 60PPM/ ℃; When temperature during greater than glass transition temperature Tg, the thermal coefficient of expansion CTE of Z axle is no more than 300PPM/ ℃; When temperature when 50 ℃ are changed to 260 ℃, the thermal coefficient of expansion CTE of Z axle is no more than 1.7 * 10
-4/ ℃; Insulation dull and stereotyped separation time be that T288 is no less than 4 minutes, T260 is no less than 30 minutes.In a preferred embodiment, the dull and stereotyped glass transition temperature Tg of this insulation is that 150～160 ℃, thermal cracking temperature T d are 310～330 ℃.
Show by test, in the solid brilliant technology of silver slurry of LED encapsulation, adopt the dull and stereotyped copper PCB single sided board that covers of above-mentioned middle Tg insulation distortion and lamination problem not to occur.As seen, Tg covers the packaging technology requirement that heat resistance that copper PCB single sided board has can satisfy LED in using in the present invention, and price is low, overcomes those skilled in the art and generally believes that pcb board not can be applicable to the technology prejudice of great power LED device.
In step 2) in, the preferred version of present embodiment is that the shape of described through hole can be straight hole or cup-shaped through hole, preferably the through hole of Xing Chenging can be M capable * via-hole array of N row.
In implementation step 3) preceding, the dull and stereotyped through-hole wall that insulate is provided with metal film plays reflex, as copper facing or silver coating.
In step 3), require the thickness of the thickness of sheet metal greater than Copper Foil in the conventional copper-clad plate, preferred version of the present invention is that the thickness of sheet metal is 2～6 times of copper thickness, the material of sheet metal is preferably copper coin.Because the sheet metal of sealing via bottoms is as the chip mount portion of carrying led chip, so sheet metal must be able to bear the pressure that produces in the LED encapsulation processs such as spot welding led chip, mold pressing plastic packaging.In the present embodiment, preferred sheet metal is a copper coin, and preferred copper layer thickness is 0.1～0.3mm.
The aspect can satisfy the pressure requirement in the LED encapsulation process, more helps controlling the cost of led support on the other hand under the situation that satisfies the heat radiation requirement.
In implementation step 4) in, also comprise the step that forms positive and negative electrode, specifically comprise: a) form at least one respectively in described through hole both sides and run through the small through hole that covers copper PCB single sided board and sheet metal by mechanical technology or laser technology; B) form the metal level that electrically connects with described line layer one and line layer two by metalized at the inwall of described small through hole, the material of described metal level is preferably copper.In other embodiments, can change the step that forms positive and negative electrode and replace said method, the change method is: a) form at least one by mechanical technology or laser technology respectively in described through hole both sides and run through the small through hole that covers copper PCB single sided board and metal level; B) toward the inner electric conducting material that electrically connects with line layer one and line layer two of filling of described through hole,, described electric conducting material is preferably the silver slurry.
In step 4), the method that forms line layer one and line layer two is an etching process.Wherein, line layer one comprises that around the positive and negative electrode layer one of the lead-in wire connecting portion of described through hole and the described lead-in wire connecting portion of electric connection, this positive and negative electrode layer one electrically connects the metal level or the inner electric conducting material of small through hole inwall; Line layer two comprises the chip mount portion that seals described via bottoms and the positive and negative electrode layer two that is electrically insulated with described chip mount portion, and this positive and negative electrode layer two electrically connects the metal level or the inner electric conducting material of small through hole inwalls.
Line layer one also comprises the capable line of cut of M+1 bar that lays respectively at two ends, the led support left and right sides and is positioned at the led support N+1 bar row line of cut at two ends up and down, wherein adjacent two capable lines of cut live apart both sides of every row through hole of the both sides in hole, adjacent two row lines of cut of whenever working of living apart.
In implementation step 4) after, also comprise step: cover welding resisting layer at line layer one upper surface, the connecting portion that wherein goes between is exposed to outside the welding resisting layer.The material of this welding resisting layer is white oil preferably.
In step 5), adopt cutting machine to follow line of cut and row line of cut cutting led support respectively, isolate a plurality of independently led supports unit.In the present embodiment, separablely go out M * N independently led support unit.
A kind of surface attaching type power LED support manufacturing method that present embodiment provides is because its key step is to adopt the pcb board processing technology, so manufacture method is simple, cost of manufacture is low, popularization is strong.On the contrary, the manufacture craft of PLCC type support needs many molds, die cost height, and complex process; The ceramic substrate technology difficulty is big, the required precision height.Therefore, led support manufacture method provided by the invention helps breaking through foreign enterprise monopolized, avoids high-power LED bracket making commonly used to the core technology of PLCC type support technological difficulties, further reduce the production and the manufacturing cost of high-power LED bracket, finally promote LED and be popularized for the general illumination field.
Embodiment two
Fig. 4 has provided the embodiment of a kind of surface attaching type power LED carrier unit of the present invention, now its structure 4 is specifically addressed in conjunction with the accompanying drawings.
As shown in Figure 4, a kind of surface attaching type power LED carrier unit 1, shown in Fig. 4 A is the surface structure schematic diagram of described carrier unit, shown in Fig. 4 B is its lower surface configuration schematic diagram, shown in Fig. 4 C is its profile, the structure of illustrated described led support unit comprises: one have a through hole 101 cover copper PCB single sided board, wherein this covers copper PCB single sided board and is made up of the common PCB insulation dull and stereotyped 10 of copper line layer 12 and this copper layer of carrying, and one is arranged at the chip mount portion 11 of these insulate dull and stereotyped 10 lower surfaces and sealing through hole 101 bottoms and is arranged on line layer 12 on the insulation flat board 10.Wherein, line layer 12 comprises and is positioned at around the through hole 101, is used for the lead-in wire connecting portion 121 of welded wire, and the positive and negative electrode 13 that is positioned at 1 two ends, led support unit; Chip mount portion 11 is a sheet metal, preferably copper plate material, and described chip mount portion 11 and positive and negative electrode 13 are separated by, and reach the purpose of insulation with it; The shape of through hole 101 is clear opening or cup-shaped through hole preferably, is coated with 16 reflexs of metal level at through hole 101 inwalls, and preferably metal level 16 is copper layer or silver layer; Plus or minus electrode 13 by at least one run through the small through hole 131 of insulation dull and stereotyped 10 and line layer 12, the conductive layer 132 that is arranged on described small through hole 131 inwalls is formed, wherein conductive layer 132 electrically connects with line layer 12, the preferred number of described small through hole is for being 3, and the material of conductive layer 132 is preferably the copper layer.In the preferred version of present embodiment, also be coated with one deck welding resisting layer 14 at positive and negative electrode 13 upper surfaces, the material of this welding resisting layer 14 is preferably white oil.In other embodiments, the small through hole number of described plus or minus electrode can be 1 or more than, be not limited to present embodiment.
The surface attaching type power LED support that present embodiment provides has advantage simple in structure, that cost is low and radiating effect is good.The typical structure of surface attaching type power LED support is to have reflection cavity.The reflection cavity of ceramic substrate is the extra band through hole ceramic wafer of installing; And the surface attaching type power LED support of present embodiment is to adopt the pcb board that has through hole, and the chip mount portion of carrying led chip is the part of the two-sided line layer of pcb board, and pcb board and line layer are into a single integrated structure.Therefore, led support of the present invention is simpler, compact than the structure of ceramic substrate.
Because the plastic casing of the PLCC type support of prior art is the PBM material that adopts price expensive, and its supporting bracket is metal material, and the surface attaching type power LED support of present embodiment comes down to double-deck line PCB.Therefore, led support cost of the present invention has greatly reduced production cost with expensive the comparing of PLCC type support and ceramic substrate.Low-power LED is generally 160 ℃/W with the thermal resistance of PLCC type support, and led support thermal resistance provided by the invention only is 3～5 ℃/W.As seen, led support of the present invention just can provide more better heat radiating effect with lower cost, has the potentiality that alternative PLCC type support and ceramic substrate occupy power LED market.
In addition, the power LED support of present embodiment belongs to the surface attaching type encapsulating structure, is applicable to the test and the Tape Technology of solder reflow process and automatic lotization, also is applicable to the mass welded and installed of its downstream product.
Embodiment three
Fig. 5 has provided another specific embodiment of a kind of surface attaching type power LED carrier unit 1 of the present invention.Below in conjunction with accompanying drawing 5 its structure is specifically described.
The difference of present embodiment three and previous embodiment two is the structure of positive and negative electrode 13: as shown in Figure 5, plus or minus electrode 13 runs through insulation dull and stereotyped 10 by at least one to be formed with the small through hole 131 of line layer 12 and the electric conducting material 133 of the described small through hole 131 of filling.Wherein, described electric conducting material 133 electrically connects with line layer 12.Wherein, preferred small through hole quantity is three, and electric conducting material 133 is preferably the silver slurry
Embodiment four
Fig. 6 has provided the specific embodiment of a kind of surface attaching type power LED support 2 of the present invention, is specified below in conjunction with accompanying drawing 6.
As shown in Figure 6, the disclosed a kind of surface attaching type power LED support 2 of present embodiment by M capable * the led support unit 1 of N row previous embodiment two or embodiment three forms, its concrete structure comprises: one covers copper PCB insulation dull and stereotyped 20, have M * N through hole on it, be illustrated as 6 * 13 through holes 201, there is M * N piece to be arranged at the chip mount portion 21 of these insulate dull and stereotyped 20 lower surfaces and each through hole 201 bottom of corresponding sealing, be illustrated as 6 * 13 and be arranged at line layer 22 in the insulation dull and stereotyped 20; Wherein, line layer 22 is positioned at around each through hole 201, is used for the lead-in wire connecting portion 221 of welded wire by 6 * 13 groups, and the positive and negative electrode 23 that is positioned at each through hole 201 both sides is formed; The two ends, dull and stereotyped 20 left and right sides of insulating are respectively arranged with M+1 bar (being illustrated as 7) row line of cut 202, the both sides of adjacent two each capable led support unit 1 of capable lines of cut 202 separations; The insulation flat board is respectively arranged with N+1 bar (being illustrated as 14) row line of cut 203 in two ends about in the of 20, the both sides of adjacent two row lines of cut 203 each row led support unit 1 of separation.Follow line of cut and row line of cut cutting led support, just can isolate a plurality of independently led supports unit.In the present embodiment, separablely go out M * N independently led support unit.
In the present embodiment of the present invention, the surface attaching type power LED supporting structure that provides belongs to the array supporting structure, helps mass packaged LED device, enhances productivity and homogeneity of product.
In sum, manufacture method of the present invention is simple, cost of manufacture is cheap, enlarged the range of application of product following process, save the numerous and diverse processing technology that needs many molds in the existing technology, overcome processing technology complexity in the prior art, material requirements height, the range limited shortcoming of product adaptation.
Surface attaching type power LED supporting structure provided by the invention, because of having superior radiating effect, with low cost, can be good at being applicable to great power LED, solved the high problem of existing power LED support cost, simultaneously, surface attaching type power LED supporting structure provided by the invention extremely helps mass packaged LED device, well enhance productivity and homogeneity of product, have the potentiality that alternative PLCC type support and ceramic substrate occupy surface attaching type power LED market.
Claims (31)
1. the manufacture method of a surface attaching type power LED support, it is characterized in that: described method is made up of following step:
Step 1): prepare one and cover copper PCB single sided board by what the common PCB insulated substrate of copper layer and this copper layer of carrying was formed, the described glass transition temperature Tg that covers copper PCB single sided board is not less than 300 ℃ between 140～165 ℃ of C, thermal cracking temperature T d;
Step 2): form at least one by mechanical technology or laser technology and run through the described through hole that covers copper PCB single sided board;
Step 3): by jointing material one sheet metal is covered the described lower surface that covers copper PCB single sided board, and seal the bottom of described through hole;
Step 4): by forming line layer one on the described copper layer that covers copper PCB single sided board, on the described described sheet metal of lower surface that covers copper PCB single sided board, forming line layer two, to constitute led support;
Step 5): cut described led support, isolate independently led support unit.
2. the method for claim 1 is characterized in that: in step 1), the described copper PCB single sided board that covers is when temperature during less than glass transition temperature Tg, and the thermal coefficient of expansion CTE of Z axle is no more than 60PPM/ ℃; When temperature during greater than glass transition temperature Tg, the thermal coefficient of expansion CTE of Z axle is no more than 300PPM/ ℃; When temperature when 50 ℃ are changed to 260 ℃, the thermal coefficient of expansion CTE of Z axle is no more than 1.7 * 10
-4/ ℃.
3. the method for claim 1, it is characterized in that: in step 1): the described separation time that covers copper PCB single sided board is that T288 is no less than 4 minutes, and T260 is no less than 30 minutes.
4. the method for claim 1, it is characterized in that: in step 1), the described glass transition temperature Tg that covers copper PCB single sided board is 150～160 ℃, and thermal cracking temperature T d is 310～330 ℃.
5. the method for claim 1, it is characterized in that: in step 1), described insulated substrate material is a glass cloth epoxy resin.
6. the method for claim 1 is characterized in that: in step 2) in, described shape by mechanical technology or laser technology formation through hole is straight hole or cup-shaped through hole, in described through hole metallic reflector is set.
7. method as claimed in claim 6 is characterized in that: in implementation step 3) preceding, in described through-hole wall copper facing or silver coating.
8. the method for claim 1 is characterized in that: in step 2) in, the described through hole that forms by mechanical technology or laser technology be M capable * the N row run through the via-hole array that this covers copper PCB single sided board.
9. the method for claim 1, it is characterized in that: in step 3), the thickness of described sheet metal is greater than the described thickness that covers Copper Foil on the copper PCB single sided board.
10. method as claimed in claim 9 is characterized in that: in step 3), described sheet metal be copper coin, the thickness of described copper coin is to cover 2～6 times of copper PCB single sided board copper thickness
11. method as claimed in claim 10 is characterized in that: described copper plate thickness is 0.1～0.3mm.
12. the method for claim 1, it is characterized in that: in described step 4), comprise the step that forms positive and negative electrode, specifically comprise: a) form at least one respectively in described through hole both sides and run through the small through hole that covers copper PCB single sided board and metal level by mechanical technology or laser technology; B) form the metal level that electrically connects with described line layer one and line layer two by metalized at the inwall of described small through hole.
13. method as claimed in claim 12 is characterized in that: the material of the metal level in the described small through hole is a copper.
14. the method for claim 1, it is characterized in that: in described step 4), comprise the step that forms positive and negative electrode, specifically comprise: a) form at least one respectively in described through hole both sides and run through the small through hole that covers copper PCB single sided board and sheet metal by mechanical technology or laser technology; B) toward the inner electric conducting material that electrically connects with line layer one and line layer two of filling of described through hole.
15. method as claimed in claim 14 is characterized in that: described electric conducting material is the silver slurry.
16. the method for claim 1 is characterized in that: in step 4), the method that forms described line layer one and described line layer two is an etching process.
17. as claim 12,14 or 16 described methods, it is characterized in that: the described line layer one of formation comprises around the positive and negative electrode layer one of the lead-in wire connecting portion of described through hole and the described lead-in wire connecting portion of electric connection; Described positive and negative electrode layer one electrically connects the metal level of small through hole inwall or the electric conducting material of small through hole inside; Described line layer two comprises the chip mount portion that seals described via bottoms and the positive and negative electrode layer two that is electrically insulated with described chip mount portion, and described positive and negative electrode layer two electrically connects the metal level of small through hole inwalls or the electric conducting material of small through hole inside.
18. method as claimed in claim 17 is characterized in that: in implementation step 4) after, also comprise step: cover welding resisting layer at line layer one upper surface, the connecting portion that wherein goes between is exposed to outside the welding resisting layer.
19. method as claimed in claim 18 is characterized in that: the material of described welding resisting layer is a white oil.
20. method as claimed in claim 7, it is characterized in that: in step 4), also comprise, formation lays respectively at the capable line of cut of M+1 bar that covers two ends, the copper PCB single sided board upper surface left and right sides and is positioned at covers the copper PCB single sided board upper surface N+1 bar row line of cut at two ends up and down, wherein adjacent two capable lines of cut live apart both sides of every row through hole of the both sides in hole, adjacent two row lines of cut of whenever working of living apart.
21. method as claimed in claim 20 is characterized in that: in step 5), adopt cutting machine to follow line of cut and row line of cut cutting led support respectively, isolate M * N independently led support unit.
22. surface attaching type power LED support as the manufacturing of one of described method of claim 1-21, it is characterized in that: the structure of described support is to be stent substrate with the copper PCB single sided board that covers formed of common PCB insulated substrate by copper layer and this copper layer of carrying, and the described glass transition temperature Tg that covers the copper single sided board is not less than 300 ℃ between 140 ℃～165 ℃, thermal cracking temperature T d; The described copper PCB single sided board that covers is provided with through hole; The described copper PCB single sided board lower surface bonds of covering is provided with the sheet metal of the described via bottoms of sealing as chip mount portion; Cover copper PCB single sided board and be provided with line layer.
23. surface attaching type power LED support as claimed in claim 22 is characterized in that: described through hole be shaped as straight hole or cup-shaped through hole, described through-hole wall is coated with metallic reflector; Described line layer comprises that being arranged on the line layer one that covers copper PCB single sided board upper surface covers copper PCB single sided board lower surface line layer two with being arranged on, described line layer one comprises around the positive and negative electrode layer one of the lead-in wire connecting portion of described through hole and the described lead-in wire connecting portion of electric connection, described line layer two comprises the chip mount portion that seals described via bottoms and the positive and negative electrode layer two that is electrically insulated with described chip mount portion, and described positive and negative electrode layer one and described positive and negative electrode layer two are formed positive and negative electrodes.
24. surface attaching type power LED support as claimed in claim 23, it is characterized in that: the positive and negative electrode of described through hole both sides is respectively arranged with at least one and runs through the small through hole that covers copper PCB single sided board and metal level, and described small through hole inwall is provided with conductive metal layer or is filled with the inner conductive material; Electric conducting material in the metal level of described small through hole inwall or the described small through hole and described positive and negative electrode layer one, positive and negative electrode layer two electrically connect, and constitute positive and negative electrode.
25. surface attaching type power LED support as claimed in claim 24 is characterized in that: the described copper PCB single sided board that covers is when temperature during less than glass transition temperature Tg, and the thermal coefficient of expansion CTE of Z axle is no more than 60PPM/ ℃; When temperature during greater than glass transition temperature Tg, the thermal coefficient of expansion CTE of Z axle is no more than 300PPM/ ℃; When temperature when 50 ℃ are changed to 260 ℃, the thermal coefficient of expansion CTE of Z axle is no more than 1.7 * 10
-4/ ℃; The metallic reflector of described through-hole wall is copper layer or silver layer; The sheet metal of the described via bottoms of described sealing is a copper coin; The small through hole inwall conductive layer of described positive and negative electrode is that the electric conducting material in copper layer or the described small through hole is the silver slurry.
26. surface attaching type power LED support as claimed in claim 22 is characterized in that: the thickness of described sheet metal is greater than the described thickness that covers Copper Foil on the common PCB single sided board of copper.
27. surface attaching type power LED support as claimed in claim 22 is characterized in that: the described common PCB single sided board of copper that covers is for covering copper glass cloth epoxy resin board; Described sheet metal is a copper coin, and the thickness of described copper coin is to cover 2～6 times of copper PCB single sided board copper thickness.
28. surface attaching type power LED support as claimed in claim 27 is characterized in that: described copper plate thickness is 0.1～0.3mm.
29. surface attaching type power LED support as claimed in claim 24 is characterized in that: described each positive and negative electrode is to have three to run through the small through hole that covers copper PCB single sided board and line layer.
30. surface attaching type power LED support as claimed in claim 24 is characterized in that: also be coated with one deck welding resisting layer at described positive and negative electrode upper surface, described lead-in wire connecting portion is exposed to outside the welding resisting layer.
31. surface attaching type power LED support as claimed in claim 24, it is characterized in that: described through hole be M capable * N row run through the via-hole array that this covers copper PCB single sided board, be positioned at and cover two ends, the copper PCB single sided board upper surface left and right sides and be provided with the capable line of cut of M+1 bar, be positioned at and cover copper PCB single sided board upper surface and up and down be provided with N+1 bar row line of cut in two ends, whenever the work both sides in hole of wherein adjacent two capable lines of cut separation, the live apart both sides of every row through hole of adjacent two row lines of cut, cut described led support structure along described capable line of cut and described row line of cut, can isolate M * N independently led support unit.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201010165442 CN102237481B (en) | 2010-05-07 | 2010-05-07 | Surface mounted type power light-emitting diode (LED) bracket manufacturing method and product manufactured thereby |
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| CN 201010165442 CN102237481B (en) | 2010-05-07 | 2010-05-07 | Surface mounted type power light-emitting diode (LED) bracket manufacturing method and product manufactured thereby |
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| CN102237481A true CN102237481A (en) | 2011-11-09 |
| CN102237481B CN102237481B (en) | 2013-01-16 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103237411A (en) * | 2013-05-06 | 2013-08-07 | 田茂福 | LED (Light Emitting Diode) single-sided circuit board manufactured by using thin conducting wire row and method |
| CN103746048A (en) * | 2013-12-26 | 2014-04-23 | 深圳市国冶星光电子有限公司 | Production technology of LED nixie tube connecting board |
| CN104518066A (en) * | 2013-09-30 | 2015-04-15 | 佛山市国星光电股份有限公司 | LED device with transition substrates and packaging method of LED device |
| US9157610B2 (en) | 2010-06-04 | 2015-10-13 | Foshan Nationstar Optoelectronics Co., Ltd. | Manufacture method for a surface mounted power LED support and its product |
| US10051723B2 (en) | 2016-07-29 | 2018-08-14 | Microsoft Technology Licensing, Llc | High thermal conductivity region for optoelectronic devices |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101146595A (en) * | 2005-01-28 | 2008-03-19 | 杜克大学 | Apparatuses and methods for manipulating droplets on a printed circuit board |
| CN101188164A (en) * | 2007-08-17 | 2008-05-28 | 上海思麦电子有限公司 | An instantaneous voltage restraint component and its making method |
| CN101456276A (en) * | 2009-01-08 | 2009-06-17 | 浙江华正电子集团有限公司 | Method for manufacturing copper clad laminated board adapted to leadless process |
| CN101483217A (en) * | 2009-02-04 | 2009-07-15 | 宋立峰 | LED high heat conduction ceramic copper coating heat radiation circuit board |
-
2010
- 2010-05-07 CN CN 201010165442 patent/CN102237481B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101146595A (en) * | 2005-01-28 | 2008-03-19 | 杜克大学 | Apparatuses and methods for manipulating droplets on a printed circuit board |
| CN101188164A (en) * | 2007-08-17 | 2008-05-28 | 上海思麦电子有限公司 | An instantaneous voltage restraint component and its making method |
| CN101456276A (en) * | 2009-01-08 | 2009-06-17 | 浙江华正电子集团有限公司 | Method for manufacturing copper clad laminated board adapted to leadless process |
| CN101483217A (en) * | 2009-02-04 | 2009-07-15 | 宋立峰 | LED high heat conduction ceramic copper coating heat radiation circuit board |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9157610B2 (en) | 2010-06-04 | 2015-10-13 | Foshan Nationstar Optoelectronics Co., Ltd. | Manufacture method for a surface mounted power LED support and its product |
| CN103237411A (en) * | 2013-05-06 | 2013-08-07 | 田茂福 | LED (Light Emitting Diode) single-sided circuit board manufactured by using thin conducting wire row and method |
| CN104518066A (en) * | 2013-09-30 | 2015-04-15 | 佛山市国星光电股份有限公司 | LED device with transition substrates and packaging method of LED device |
| CN104518066B (en) * | 2013-09-30 | 2017-08-08 | 佛山市国星光电股份有限公司 | A kind of LED component and its method for packing with transition substrate |
| CN103746048A (en) * | 2013-12-26 | 2014-04-23 | 深圳市国冶星光电子有限公司 | Production technology of LED nixie tube connecting board |
| US10051723B2 (en) | 2016-07-29 | 2018-08-14 | Microsoft Technology Licensing, Llc | High thermal conductivity region for optoelectronic devices |
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