CN101188164A - An instantaneous voltage restraint component and its making method - Google Patents
An instantaneous voltage restraint component and its making method Download PDFInfo
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- CN101188164A CN101188164A CNA2007100450060A CN200710045006A CN101188164A CN 101188164 A CN101188164 A CN 101188164A CN A2007100450060 A CNA2007100450060 A CN A2007100450060A CN 200710045006 A CN200710045006 A CN 200710045006A CN 101188164 A CN101188164 A CN 101188164A
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- copper foil
- instantaneous voltage
- voltage restraint
- pcb board
- restraint component
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Abstract
The invention relates to a transient voltage restraint element, which comprises two PCB boards, copper foils and a semicircular through hole electroplated layer, wherein, the PCB boards are processed with mechanical erosion, both sides of the PCB boards are coated with copper; the copper foils are positioned at both ends of the transient voltage restraint element. The invention is characterized in that bonding layer polymer base composite materials are arranged between the two PCB boards; the inner surfaces of the two PCB boards are provided with the copper foils, patterns of the copper foil form central symmetry, and gaps are left among the copper foils, but the copper foils are not connected with each other. The copper foils on the inner surface are communicated with the copper foils at the end part through the semicircular through hole electroplated layer, and the copper foils at both ends of the transient voltage restraint element are insulative. The invention also discloses a preparation method of the transient voltage restraint element. The invention has the advantages of simple processing process, fast response time, small capacitance of products, small volume, and duplex nonpolarity, thereby being suitable for the surface mounting process, etc. The response time reaches a level of nanosecond. The invention is suitable for transmission lines with high frequency and high speed, and miniaturized portable sets and terminals to use.
Description
Technical field
The invention belongs to technology of semiconductor chips field, be specifically related to a kind of instantaneous voltage restraint component and preparation method thereof.
Background technology
Because electronic product is more and more to the advancing by leaps and bounds of trend development, the especially technology of semiconductor chips of miniaturization, electronic product suffers transient overvoltage and the ratio damaged is increasing.So the impetus that instantaneous voltage restraint component develops in recent years is very swift and violent.
Being used for the protection components and parts of transient suppression voltage mainly includes: piezo-resistance, and Zener diode, silica-based transient voltage suppresses diode, and is after traditional piezo-resistance owing to receive is repeatedly impacted, aging easily; Electric capacity is higher, and leakage current is bigger, is not suitable for protecting medium-high frequency, the high-speed transfer circuit.Silica-based transient voltage suppresses diode, though there is clamp voltage low, electric capacity is lower, advantage such as be not easy to wear out, and volume is bigger than normal, and the cost height can not satisfy the demand in markets such as portable mobile termianl.
Summary of the invention
It is fast to the purpose of this invention is to provide a kind of response time, is fit to the Transient Voltage Suppressor of high frequency, high-speed transfer circuit and portable set and terminal and the preparation method that this Transient Voltage Suppressor is provided.
For achieving the above object, the technical scheme that adopts is: a kind of instantaneous voltage restraint component, comprise two double-sided copper-clad pcb boards, the Copper Foil that is positioned at the suppression element two ends, half-round cross hole electrodeposited coating through etching processing, it is characterized in that: between described two pcb boards, be equipped with the adhesive layer polymer-based composite, described two pcb board inner surfaces are equipped with pattern and are centrosymmetric, also leave the Copper Foil that the slit does not join mutually each other, and the width in slit is 0.01 to 0.5 millimeter.Described inner surface Copper Foil is electrically connected with the outer surface Copper Foil by the half-round cross hole electrodeposited coating that is positioned at the suppression element two ends respectively, suppression element two end surfaces Copper Foil electric insulations.
Described a kind of instantaneous voltage restraint component, its preparation method is:
1) preparation polymer-based composite: with following material by weight the percentage proportioning get the raw materials ready, and fully mix:
Liquid macromolecule resin 30～65%
Conducting metal particles 25～60%
Semiconductive ceramic particle 1～30%
2) get two and cover the copper pcb board, by the requirement of centre of figure symmetry, the single face etching also applies described preparation method 1) the middle polymer-based composite for preparing;
3) with an one side of having brushed polymer composite facing to described another piece pcb board of etching figure on the described pcb board, it is compound that contraposition stacks back pressurization vacuum solidification;
4) with the pcb board outer surface middle part etching behind the composite curing, at the position that etches away Copper Foil, printing welding resistance printing ink;
5) two ends are beaten semi-circular through hole and are electroplated solderable metal.
Described liquid macromolecule resin can be any in organic siliconresin, the epoxy resin.
Described conducting metal particles can be copper powder, nickel powder, aluminium powder, silver powder, any in the bronze, or their mixture.
Described semiconductive ceramic particle can be any in titanium dioxide, zinc oxide, the carborundum, or their mixture.
Solderable metal is meant any in nickel, tin, silver, the gold or their alloy in the described step 5).Described a kind of instantaneous voltage restraint component, its preparation method is
Described insulating particle is any in calcium oxide, aluminium oxide, the silica, or their mixture.
Good effect of the present invention is: the present invention has characteristics such as processing technology is simple, product electric capacity is little, volume is little, two-way nonpolarity, suitable surface mount.With Zener diode and piezo-resistance, and silica-based transient voltage suppresses diode and compares, and it is fast that product of the present invention possesses the response time, reaches nanosecond; Electric capacity is little, is very suitable for high frequency, the high-speed transfer circuit; Volume is little, is suitable for the portable set and the terminal of miniaturization day by day.When having transient voltage to pass through on the suppression element, the polymer-based composite between two pcb boards plays protection by the effect of element in parallel by the slit discharge between the internal layer Copper Foil,
Description of drawings
Below in conjunction with drawings and Examples, the invention will be further described.
Fig. 1: instantaneous voltage restraint component shape assumption diagram;
The A of Fig. 2: Fig. 1 is to view;
The B of Fig. 3: Fig. 1 is to view;
The A-A of Fig. 4: Fig. 1 is to cutaway view.
Among the figure, 1,1 '-Copper Foil; 2-welding resistance printing ink; 3,3 '-the electroplates in hole layer; 4,4 '-pcb board; The 5-polymer-based composite; The 6-slit; 7,7 '-internal layer Copper Foil.
Embodiment
A kind of instantaneous voltage restraint component, comprise double-sided copper-clad pcb board 4 and 4 ' through etching processing, be positioned at the Copper Foil 1 and 1 ' at suppression element two ends, half-round cross hole electrodeposited coating 3 and 3 ', it is characterized in that: between described pcb board 4 and 4 ', be equipped with adhesive layer polymer-based composite 5, described pcb board 4 and 4 ' inner surface are equipped with pattern and are centrosymmetric, and leave the Copper Foils 7 and 7 ' that slit 6 does not join mutually each other, described inner surface Copper Foil 7 is electrically connected with Copper Foil 1 by half-round cross hole electrodeposited coating 3, described inner surface Copper Foil 7 ' is electrically connected suppression element two end surfaces Copper Foils 1 and 1 ' electric insulation by half-round cross hole electrodeposited coating 3 ' with Copper Foil 1 '.
The width in described slit 6 is 0.01 to 0.5 millimeter.
Described a kind of instantaneous voltage restraint component, its preparation method is:
1) preparation polymer-based composite: with following material (commercially available, particle diameter is less than 2 μ m, AR level) by weight the percentage proportioning get the raw materials ready, and fully mix:
Epoxy resin 56%
Silver powder 20%
Titanium oxide 15%
Aluminium oxide 9%
2) get two and cover copper pcb board 4 and 4 ', by the requirement of centre of figure symmetry, the single face etching also applies described preparation method 1) the middle polymer-based composite for preparing;
3) with an one side of having brushed polymer composite facing to described pcb board 4 ' of etching figure on the described pcb board 4, it is compound that contraposition stacks back pressurization vacuum solidification;
4) with pcb board behind the composite curing 4 and 4 ' outer surface middle part etching, at the position that etches away Copper Foil, printing welding resistance printing ink;
5) two ends are beaten semi-circular through hole and are electroplated solderable metal.Solderable metal is meant any in nickel, tin, silver, the gold or their mixture in the described step 5).
Making product E IA0402 (instantaneous voltage restraint component of 1.0 * 0.5 * 0.36mm) sizes, the width in slit 6 is 0.02 millimeter, properties of product are as follows:
Trigger voltage: 450V; Clamp voltage: 100V; Electric capacity: 0.15pF.
1) preparation polymer-based composite: with following material (commercially available, particle diameter is less than 2 μ m, AR level) by weight the percentage proportioning get the raw materials ready, and fully mix:
Organic siliconresin 50%
Aluminium powder 30%
Carborundum 16%
Other step is with embodiment 1, obtain the EIA0603 product (1.60 * 0.8 * 0.36mm), slit 6 width 0.05mm, 0603 element function: trigger voltage: 1000V; Clamp voltage: 300V; Electric capacity: 0.2pF.
1) preparation polymer-based composite: with following material (commercially available, particle diameter is less than 2 μ m, AR level) by weight the percentage proportioning get the raw materials ready, and fully mix:
Organic siliconresin 40%
Nickel powder 46%
Carborundum 10%
Other step is with embodiment 1, obtain EIA0805 (2.0 * 1.2 * 0.5mm) products, slit 6 width are 0.1mm, 0805 element function: trigger voltage: 150V; Clamp voltage: 30V; Electric capacity: 0.2pF.
Claims (8)
1. instantaneous voltage restraint component, comprise double-sided copper-clad pcb board (4) and (4 ') through etching processing, be positioned at Copper Foil (1) and (1 ') at suppression element two ends, half-round cross hole electrodeposited coating (3) and (3 '), it is characterized in that: at described pcb board (4) be equipped with adhesive layer polymer-based composite (5) between (4 '), described pcb board (4) and (4 ') inner surface are equipped with pattern and are centrosymmetric, and leave Copper Foil (7) and (7 ') that slit (6) does not join mutually each other, described inner surface Copper Foil (7) is electrically connected with Copper Foil (1) by half-round cross hole electrodeposited coating (3), described inner surface Copper Foil (7 ') is electrically connected the Copper Foil (1) and (the 1 ') electric insulation at described suppression element two ends by half-round cross hole electrodeposited coating (3 ') with Copper Foil (1 ').
2. a kind of instantaneous voltage restraint component according to claim 1, its preparation method is:
1) preparation polymer-based composite: with following material by weight the percentage proportioning get the raw materials ready, and fully mix:
Liquid macromolecule resin 30～65%
Conducting metal particles 25～60%
Semiconductive ceramic particle 1～30%
Insulating particle 1～20%
2) get two and cover copper pcb board (4) and (4 '), by the requirement of centre of figure symmetry, the single face etching also applies described preparation method 1) the middle polymer-based composite for preparing;
3) described pcb board (4) is gone up an one side of having brushed polymer composite facing to described pcb board (4 ') of etching figure, it is compound that contraposition stacks back pressurization vacuum solidification;
4) with the pcb board behind the composite curing (4) and (4 ') outer surface middle part etching, at the position that etches away Copper Foil, printing welding resistance printing ink;
5) two ends are beaten semi-circular through hole and are electroplated solderable metal.
3. a kind of instantaneous voltage restraint component preparation method according to claim 2 is characterized in that: described liquid macromolecule resin can be any in organic siliconresin, the epoxy resin.
4. a kind of instantaneous voltage restraint component preparation method according to claim 2, it is characterized in that: described conducting metal particles can be copper powder, nickel powder, aluminium powder, silver powder, any in the bronze, or their mixture.
5. a kind of instantaneous voltage restraint component preparation method according to claim 2 is characterized in that: described semiconductive ceramic particle can be any in titanium dioxide, zinc oxide, the carborundum, or their mixture.
6. a kind of instantaneous voltage restraint component preparation method according to claim 2 is characterized in that: solderable metal is meant any in nickel, tin, silver, the gold or their alloy in the described step 5).
7. a kind of instantaneous voltage restraint component preparation method according to claim 2 is characterized in that: described insulating particle is any in calcium oxide, aluminium oxide, the silica, or their mixture.
8. a kind of instantaneous voltage restraint component according to claim 1 is characterized in that: the width of described slit (6) is 0.01 to 0.5 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100450060A CN101188164A (en) | 2007-08-17 | 2007-08-17 | An instantaneous voltage restraint component and its making method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100450060A CN101188164A (en) | 2007-08-17 | 2007-08-17 | An instantaneous voltage restraint component and its making method |
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| Publication Number | Publication Date |
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| CN101188164A true CN101188164A (en) | 2008-05-28 |
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| CNA2007100450060A Pending CN101188164A (en) | 2007-08-17 | 2007-08-17 | An instantaneous voltage restraint component and its making method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102237481A (en) * | 2010-05-07 | 2011-11-09 | 佛山市国星光电股份有限公司 | Surface mounted type power light-emitting diode (LED) bracket manufacturing method and product manufactured thereby |
| CN103107529A (en) * | 2013-02-04 | 2013-05-15 | 合肥云杉光电科技有限公司 | Lightning protection device capable of resisting fatigue and high voltage large current impact |
-
2007
- 2007-08-17 CN CNA2007100450060A patent/CN101188164A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102237481A (en) * | 2010-05-07 | 2011-11-09 | 佛山市国星光电股份有限公司 | Surface mounted type power light-emitting diode (LED) bracket manufacturing method and product manufactured thereby |
| CN102237481B (en) * | 2010-05-07 | 2013-01-16 | 佛山市国星光电股份有限公司 | Surface mounted type power light-emitting diode (LED) bracket manufacturing method and product manufactured thereby |
| CN103107529A (en) * | 2013-02-04 | 2013-05-15 | 合肥云杉光电科技有限公司 | Lightning protection device capable of resisting fatigue and high voltage large current impact |
| CN103107529B (en) * | 2013-02-04 | 2015-05-06 | 合肥云杉光电科技有限公司 | Lightning protection device capable of resisting fatigue and high voltage large current impact |
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Open date: 20080528 |