CN102214776A - 发光二极管封装结构、照明装置及发光二极管封装用基板 - Google Patents
发光二极管封装结构、照明装置及发光二极管封装用基板 Download PDFInfo
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- CN102214776A CN102214776A CN2011100931245A CN201110093124A CN102214776A CN 102214776 A CN102214776 A CN 102214776A CN 2011100931245 A CN2011100931245 A CN 2011100931245A CN 201110093124 A CN201110093124 A CN 201110093124A CN 102214776 A CN102214776 A CN 102214776A
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- connection pad
- array
- emitting diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
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Claims (11)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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US32230910P | 2010-04-09 | 2010-04-09 | |
US61/322,309 | 2010-04-09 | ||
US13/078,933 | 2011-04-02 | ||
US13/078,933 US8492777B2 (en) | 2010-04-09 | 2011-04-02 | Light emitting diode package, lighting device and light emitting diode package substrate |
Publications (2)
Publication Number | Publication Date |
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CN102214776A true CN102214776A (zh) | 2011-10-12 |
CN102214776B CN102214776B (zh) | 2013-05-01 |
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CN2011100931245A Expired - Fee Related CN102214776B (zh) | 2010-04-09 | 2011-04-08 | 发光二极管封装结构、照明装置及发光二极管封装用基板 |
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CN (1) | CN102214776B (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104115293A (zh) * | 2011-12-06 | 2014-10-22 | 克利公司 | 用于改善光萃取的发光器件及方法 |
CN106449622A (zh) * | 2012-04-26 | 2017-02-22 | 新世纪光电股份有限公司 | 发光模块 |
CN107393911A (zh) * | 2017-06-08 | 2017-11-24 | 山东晶泰星光电科技有限公司 | 一种节能型rgb‑led封装体、封装模组及其显示屏 |
US10008637B2 (en) | 2011-12-06 | 2018-06-26 | Cree, Inc. | Light emitter devices and methods with reduced dimensions and improved light output |
WO2018158739A1 (en) * | 2017-03-03 | 2018-09-07 | Shanghai Jenwhee Technology, Inc. | Systems and methods for curing coatings on optical fibers |
US10211380B2 (en) | 2011-07-21 | 2019-02-19 | Cree, Inc. | Light emitting devices and components having improved chemical resistance and related methods |
US10490712B2 (en) | 2011-07-21 | 2019-11-26 | Cree, Inc. | Light emitter device packages, components, and methods for improved chemical resistance and related methods |
US10686107B2 (en) | 2011-07-21 | 2020-06-16 | Cree, Inc. | Light emitter devices and components with improved chemical resistance and related methods |
CN114963054A (zh) * | 2021-02-25 | 2022-08-30 | 杭州赛美蓝光电科技有限公司 | 一种生物照明光源 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1605790A (zh) * | 2003-10-01 | 2005-04-13 | 恩纳特隆公司 | Led灯设备及方法 |
US20080149945A1 (en) * | 2003-08-28 | 2008-06-26 | Hideo Nagai | Semiconductor light emitting device, light emitting module, lighting apparatus, display element and manufacturing method of semiconductor light emitting device |
CN101614333A (zh) * | 2009-03-23 | 2009-12-30 | 广州南科集成电子有限公司 | 高效散热led照明光源及制造方法 |
US20100032692A1 (en) * | 2006-11-21 | 2010-02-11 | Seoul Opto Device Co., Ltd. | Light emitting device for ac operation |
CN201407528Y (zh) * | 2009-05-07 | 2010-02-17 | 深圳市劲升迪龙科技发展有限公司 | 一种大功率led灯 |
-
2011
- 2011-04-08 CN CN2011100931245A patent/CN102214776B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080149945A1 (en) * | 2003-08-28 | 2008-06-26 | Hideo Nagai | Semiconductor light emitting device, light emitting module, lighting apparatus, display element and manufacturing method of semiconductor light emitting device |
CN1605790A (zh) * | 2003-10-01 | 2005-04-13 | 恩纳特隆公司 | Led灯设备及方法 |
US20100032692A1 (en) * | 2006-11-21 | 2010-02-11 | Seoul Opto Device Co., Ltd. | Light emitting device for ac operation |
CN101614333A (zh) * | 2009-03-23 | 2009-12-30 | 广州南科集成电子有限公司 | 高效散热led照明光源及制造方法 |
CN201407528Y (zh) * | 2009-05-07 | 2010-02-17 | 深圳市劲升迪龙科技发展有限公司 | 一种大功率led灯 |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10211380B2 (en) | 2011-07-21 | 2019-02-19 | Cree, Inc. | Light emitting devices and components having improved chemical resistance and related methods |
US11563156B2 (en) | 2011-07-21 | 2023-01-24 | Creeled, Inc. | Light emitting devices and components having improved chemical resistance and related methods |
US10686107B2 (en) | 2011-07-21 | 2020-06-16 | Cree, Inc. | Light emitter devices and components with improved chemical resistance and related methods |
US10490712B2 (en) | 2011-07-21 | 2019-11-26 | Cree, Inc. | Light emitter device packages, components, and methods for improved chemical resistance and related methods |
US9496466B2 (en) | 2011-12-06 | 2016-11-15 | Cree, Inc. | Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction |
US10008637B2 (en) | 2011-12-06 | 2018-06-26 | Cree, Inc. | Light emitter devices and methods with reduced dimensions and improved light output |
CN104115293B (zh) * | 2011-12-06 | 2018-07-06 | 克利公司 | 用于改善光萃取的发光器件及方法 |
CN104115293A (zh) * | 2011-12-06 | 2014-10-22 | 克利公司 | 用于改善光萃取的发光器件及方法 |
US10060581B2 (en) | 2012-04-26 | 2018-08-28 | Genesis Photonics Inc. | Light emitting device |
CN106449622A (zh) * | 2012-04-26 | 2017-02-22 | 新世纪光电股份有限公司 | 发光模块 |
WO2018158739A1 (en) * | 2017-03-03 | 2018-09-07 | Shanghai Jenwhee Technology, Inc. | Systems and methods for curing coatings on optical fibers |
CN108686907A (zh) * | 2017-04-10 | 2018-10-23 | 上海臻辉光电技术有限公司 | 用于固化光纤上的涂料的***和方法 |
CN107393911A (zh) * | 2017-06-08 | 2017-11-24 | 山东晶泰星光电科技有限公司 | 一种节能型rgb‑led封装体、封装模组及其显示屏 |
CN107393911B (zh) * | 2017-06-08 | 2023-09-15 | 山东捷润弘光电科技有限公司 | 一种节能型rgb-led封装体、封装模组及其显示屏 |
CN114963054A (zh) * | 2021-02-25 | 2022-08-30 | 杭州赛美蓝光电科技有限公司 | 一种生物照明光源 |
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Publication number | Publication date |
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CN102214776B (zh) | 2013-05-01 |
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Owner name: EVERLIGHT ELECTRONICS (CHINA) CO., LTD. Free format text: FORMER OWNER: EVERLIGHT YI-GUANG TECHNOLOGY (SHANGHAI) CO., LTD. Effective date: 20130816 |
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Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 215200 SUZHOU, JIANGSU PROVINCE |
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Effective date of registration: 20130816 Address after: 215200, Zhongshan North Road, Wujiang Economic Development Zone, Jiangsu, 2135 Patentee after: Everlight Electronics (China) Co.,Ltd. Patentee after: Everlight Electronics Co.,Ltd. Address before: 201203, room 6, building 88, 302 Darwin Road, Zhangjiang hi tech park, Shanghai Patentee before: Everlight Yi-Guang Technology (Shanghai) Co.,Ltd. Patentee before: Everlight Electronics Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130501 Termination date: 20180408 |