CN102210022B - 包括多个封装的半导体芯片的固态驱动器或者其它存储装置 - Google Patents
包括多个封装的半导体芯片的固态驱动器或者其它存储装置 Download PDFInfo
- Publication number
- CN102210022B CN102210022B CN200980144853.XA CN200980144853A CN102210022B CN 102210022 B CN102210022 B CN 102210022B CN 200980144853 A CN200980144853 A CN 200980144853A CN 102210022 B CN102210022 B CN 102210022B
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- Prior art keywords
- chip
- interface
- memory
- stacking
- state drive
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- Expired - Fee Related
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/06—Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
- G06F3/0601—Interfaces specially adapted for storage systems
- G06F3/0602—Interfaces specially adapted for storage systems specifically adapted to achieve a particular effect
- G06F3/0626—Reducing size or complexity of storage systems
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/06—Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
- G06F3/0601—Interfaces specially adapted for storage systems
- G06F3/0628—Interfaces specially adapted for storage systems making use of a particular technique
- G06F3/0655—Vertical data movement, i.e. input-output transfer; data movement between one or more hosts and one or more storage devices
- G06F3/0658—Controller construction arrangements
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/06—Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
- G06F3/0601—Interfaces specially adapted for storage systems
- G06F3/0668—Interfaces specially adapted for storage systems adopting a particular infrastructure
- G06F3/0671—In-line storage system
- G06F3/0673—Single storage device
- G06F3/0679—Non-volatile semiconductor memory device, e.g. flash memory, one time programmable memory [OTP]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10159—Memory
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Abstract
Description
Claims (30)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11415408P | 2008-11-13 | 2008-11-13 | |
US61/114154 | 2008-11-13 | ||
US12/367056 | 2009-02-06 | ||
US12/367,056 US8472199B2 (en) | 2008-11-13 | 2009-02-06 | System including a plurality of encapsulated semiconductor chips |
PCT/CA2009/001638 WO2010054478A1 (en) | 2008-11-13 | 2009-11-13 | Solid state drive or other storage apparatus that includes a plurality of encapsulated semiconductor chips |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102210022A CN102210022A (zh) | 2011-10-05 |
CN102210022B true CN102210022B (zh) | 2014-12-24 |
Family
ID=42165019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200980144853.XA Expired - Fee Related CN102210022B (zh) | 2008-11-13 | 2009-11-13 | 包括多个封装的半导体芯片的固态驱动器或者其它存储装置 |
Country Status (6)
Country | Link |
---|---|
US (2) | US8472199B2 (zh) |
EP (1) | EP2347442A4 (zh) |
JP (1) | JP5792624B2 (zh) |
KR (1) | KR20110099217A (zh) |
CN (1) | CN102210022B (zh) |
WO (1) | WO2010054478A1 (zh) |
Families Citing this family (23)
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US8472199B2 (en) | 2008-11-13 | 2013-06-25 | Mosaid Technologies Incorporated | System including a plurality of encapsulated semiconductor chips |
US8604593B2 (en) * | 2009-10-19 | 2013-12-10 | Mosaid Technologies Incorporated | Reconfiguring through silicon vias in stacked multi-die packages |
CN102439718B (zh) * | 2010-06-25 | 2015-07-01 | 新普力科技有限公司 | 数据存储装置 |
US9659600B2 (en) | 2014-07-10 | 2017-05-23 | Sap Se | Filter customization for search facilitation |
JP5396415B2 (ja) | 2011-02-23 | 2014-01-22 | 株式会社東芝 | 半導体装置 |
US9159374B2 (en) * | 2011-11-02 | 2015-10-13 | Novachips Canada Inc. | Flash memory module and memory subsystem |
US9740439B2 (en) | 2011-12-23 | 2017-08-22 | International Business Machines Corporation | Solid-state storage management |
US9128662B2 (en) * | 2011-12-23 | 2015-09-08 | Novachips Canada Inc. | Solid state drive memory system |
US20140036435A1 (en) * | 2012-08-03 | 2014-02-06 | Mosaid Technologies Incorporated | Storage system having a heatsink |
KR101212253B1 (ko) * | 2012-08-16 | 2012-12-13 | 주식회사 유니테스트 | 리드라이버(Redrivr)를 이용하는 DUT(Devic unde Test) 테스트 장치 |
KR102046985B1 (ko) * | 2012-11-26 | 2019-12-03 | 삼성전자 주식회사 | 보조 기억 장치 |
KR102084553B1 (ko) | 2013-01-03 | 2020-03-04 | 삼성전자주식회사 | 메모리 시스템 |
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KR102144367B1 (ko) * | 2013-10-22 | 2020-08-14 | 삼성전자주식회사 | 반도체 패키지 및 이의 제조 방법 |
KR102282191B1 (ko) | 2014-06-05 | 2021-07-27 | 삼성전자 주식회사 | 인쇄 회로 기판, 반도체 패키지 및 반도체 패키지의 제조방법 |
JP5902335B2 (ja) * | 2015-03-27 | 2016-04-13 | 株式会社東芝 | 半導体メモリ装置およびシステム |
KR102387973B1 (ko) | 2015-12-01 | 2022-04-19 | 삼성전자주식회사 | 이중화 저장 장치, 그것을 포함한 서버 시스템 및 그것의 동작 방법 |
US10714148B2 (en) * | 2015-12-30 | 2020-07-14 | Shenzhen Longsys Electronics Co., Ltd. | SSD storage module, SSD component, and SSD |
WO2017113756A1 (zh) * | 2015-12-30 | 2017-07-06 | 深圳市江波龙电子有限公司 | 一种固态硬盘存储模块、固态硬盘组件及固态硬盘 |
JP5940752B1 (ja) * | 2016-03-01 | 2016-06-29 | 株式会社東芝 | 半導体メモリ装置 |
JP6109995B2 (ja) * | 2016-05-16 | 2017-04-05 | 株式会社東芝 | 半導体記憶装置 |
US10381327B2 (en) * | 2016-10-06 | 2019-08-13 | Sandisk Technologies Llc | Non-volatile memory system with wide I/O memory die |
CN109271147B (zh) * | 2018-09-13 | 2021-09-28 | 无锡车联天下信息技术有限公司 | 一种智能座舱***分层设计方法及智能座舱*** |
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- 2009-11-13 KR KR1020117010009A patent/KR20110099217A/ko not_active Application Discontinuation
- 2009-11-13 CN CN200980144853.XA patent/CN102210022B/zh not_active Expired - Fee Related
- 2009-11-13 JP JP2011535844A patent/JP5792624B2/ja not_active Expired - Fee Related
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JP2012508968A (ja) | 2012-04-12 |
US20130271910A1 (en) | 2013-10-17 |
CN102210022A (zh) | 2011-10-05 |
US20100118482A1 (en) | 2010-05-13 |
KR20110099217A (ko) | 2011-09-07 |
EP2347442A1 (en) | 2011-07-27 |
US8908378B2 (en) | 2014-12-09 |
WO2010054478A1 (en) | 2010-05-20 |
EP2347442A4 (en) | 2017-01-04 |
US8472199B2 (en) | 2013-06-25 |
JP5792624B2 (ja) | 2015-10-14 |
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