CN102190980A - Low-temperature conductive adhesive and preparation method thereof - Google Patents
Low-temperature conductive adhesive and preparation method thereof Download PDFInfo
- Publication number
- CN102190980A CN102190980A CN 201110074220 CN201110074220A CN102190980A CN 102190980 A CN102190980 A CN 102190980A CN 201110074220 CN201110074220 CN 201110074220 CN 201110074220 A CN201110074220 A CN 201110074220A CN 102190980 A CN102190980 A CN 102190980A
- Authority
- CN
- China
- Prior art keywords
- low
- silver
- temperature conductive
- component
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention relates to a low-temperature conductive adhesive and a preparation method thereof. The low-temperature conductive adhesive is prepared from the following raw materials in percentage by weight: 55 to 65 percent of silver coated metal powder, 25 to 35 percent of thermoset resin, 3 to 8 percent of high-boiling-point solvent, 0.2 to 1 percent of coupling agent, 5 to 8 percent of curing agent and 0.2 to 0.5 percent of dispersing agent. A preparation method of conductive printing ink comprises the following steps of: mixing components A comprising the silver coated metal powder, the thermoset resin, the high-boiling-point solvent and the coupling agent completely, grinding the mixture by using a three-roller and dispersing to form a uniform mixed phase; and mixing components B comprising a curing agent and a dispersing agent completely and dispersing the mixture by using a stirring machine uniformly. The low-temperature conductive adhesive has the advantages of excellent electric conductivity, high adhesive performance, convenience in operation and the like, can be stored for a long time and is widely applied to encapsulating and adhering electronic components and assemblies such as a light-emitting diode (LED), a liquid crystal display screen (LCD), a printed circuit board assembly (PCBA), a film switch, an intelligent card, a dot matrix block, a ceramic capacitor and the like.
Description
Technical field
The present invention relates to the encapsulation and the bonding caking agent of using of device, element and assemblies such as photodiode, liquid crystal display, particularly a kind of low-temperature conductive glue and preparation method thereof.
Background technology
Conductive resin mainly is made up of resin matrix, conducting particles and dispersing additive, auxiliary agent etc., is the sizing agent that has certain conductivity after a kind of curing or the drying.These sizing agents have formed the molecular structure of conductive resin after curing, mechanical property and adhesiveproperties guarantee are provided, and make filler grain form conductive channel. electric adhesive is used for the microelectronics assembling, comprise that thin wire is connected with printed wiring, plating base plate, the metal level of ceramic adherend, metal chassis, bonding lead and base, bonding element and the hole, plane of passing printed wiring, the tuning and hole repairing of bonding waveguide.
Existing encapsulation and the bonding caking agent of using that is used for electronic components such as photodiode (LED), liquid crystal display (LCD), pcb component (PCBA), thin film switch, smart card, lattice block, ceramic condenser and assembly, use silver powder, cost of sizing agent is very high; Use other metal-powders, because the powder antioxidant property is poor, oxidation easily, the performance of reduction slurry.Therefore research and develop the low conductive resin of stable performance again of a kind of cost and become the technical problem that needs to be resolved hurrily at present.
Summary of the invention
The object of the present invention is to provide a kind of good low-temperature conductive glue, can be used for that microwave device lead-in wire connects, the printed-wiring board (PWB) circuit connects, the wire cloth shielding strip is bonding and metal and metal sticking.
Another object of the present invention is to provide a kind of preparation method of conductive resin.
The objective of the invention is to be achieved through the following technical solutions, a kind of low-temperature conductive glue, this conductive resin is formed by the feedstock production of following mass percentage content:
The silver powder 55-65% that belongs to covered with gold leaf;
Thermosetting resin 25-35%;
High boiling solvent 3-8%;
Coupling agent 0.2-1%;
Solidifying agent 5-8%;
Dispersion agent 0.2-0.5%;
Described silver genus covered with gold leaf powder is silver-coated copper powder, silver-colored alclad powder or silver-colored nickel coat powder, and radius is 2-15 μ m.
Described thermosetting resin is a Resins, epoxy.
Described high boiling solvent is a kind of in diethylene adipate or the 2-Butoxyethyl acetate.
Described coupling agent is silane resin acceptor kh-550, KH-551 or KH-590.
Described solidifying agent is selected modified fatty amine, modified aromatic amine or modified multicomponent amine hardener for use.
Described dispersion agent is a DA type dispersion agent.
The present invention gives the preparation method of this low-temperature conductive glue, and this method comprises the steps:
Preparation A component:
With radius is that 2-15 μ m, mass percent are the Resins, epoxy of the silver-coated copper powder of 55-65%, silver-colored alclad powder or silver-colored nickel coat powder and 25-35%, the diethylene adipate of 3-8% or silane resin acceptor kh-550, KH-551 or the KH-590 thorough mixing of 2-Butoxyethyl acetate and 0.2-1%, use three-roll grinder to disperse 4-6 time then according to each kilogram every time 3-15 minute, grinding, make it to form uniform mixed phase, i.e. De A component;
Preparation B component:
With mass percent is the DA type dispersion agent thorough mixing of modified fatty amine, modified aromatic amine or modified multicomponent amine and the 0.2-0.5% of 5-8%, is uniformly dispersed with stirrer, i.e. De B component;
A component and B component are mixed under normal temperature or low temperature, promptly get low-temperature conductive glue.
The present invention does conductive filler material with the silver powder that belongs to covered with gold leaf.This conductive filler material is more cheap than silver powder, and the antioxidant property than simple copper powder, aluminium powder and nickel powder is good again, and conductivity and other physicalies are more stable.So the every performance with the silver conductive resin that belongs to powdered preparation covered with gold leaf is more stable, have the electric and physical property of excellence, conductivity is good, has stronger adhesiveproperties, can preserve multiple advantages such as easy operation for a long time.During use, A component and B component are mixed, be coated on the required parts and then can.
Multiple advantages such as this conductive resin has the electric and physical property of excellence, and conductivity is good, has stronger adhesiveproperties, can preserve for a long time, and is easy and simple to handle.Be widely used in the encapsulation of electronic components such as photodiode (LED), liquid crystal display (LCD), pcb component (PCBA), thin film switch, smart card, lattice block, ceramic condenser and assembly and bonding.
Embodiment
Below by specific embodiment the present invention is described in further detail.Need to prove that following embodiment only is used to illustrate the present invention, but be not limited to practical range of the present invention.
Unless otherwise indicated, the following raw material add-on that adopts of the present invention is mass percent.
Embodiment 1
Take by weighing raw material according to following ratio:
Silver-coated copper powder 60%;
Resins, epoxy 30%;
Diethylene adipate 4%;
KH-550 0.5％；
Modified fatty amine 5%;
DA type dispersion agent 0.5%;
Preparation A component:
With radius is silver-coated copper powder, Resins, epoxy, diethylene adipate and the KH-550 thorough mixing of 7 μ m, uses three-roll grinder to disperse 5 times according to each kilogram every time 10 minutes, grinding then, makes it to form uniform mixed phase.
Preparation B component:
With modified fatty amine and DA type dispersion agent thorough mixing, be uniformly dispersed with stirrer.
A component and B component are mixed under normal temperature or low temperature, promptly get low-temperature conductive glue.
Embodiment 2
Take by weighing raw material according to following ratio:
Silver alclad powder 55%;
Resins, epoxy 35%;
2-Butoxyethyl acetate 3%;
KH-551 0.6％；
Modified aromatic amine 6%;
DA type dispersion agent 0.4%;
Preparation A component:
With radius is silver-colored alclad powder, Resins, epoxy, 2-Butoxyethyl acetate and the KH-551 thorough mixing of 15 μ m, uses three-roll grinder to disperse 4 times according to each kilogram every time 15 minutes, grinding then, makes it to form uniform mixed phase.
Preparation B component:
With modified aromatic amine and DA type dispersion agent thorough mixing, be uniformly dispersed with stirrer.
A component and B component are mixed under normal temperature or low temperature, promptly get low-temperature conductive glue.
Embodiment 3
Take by weighing raw material according to following ratio:
Silver nickel coat powder 65%;
Resins, epoxy 25%;
Diethylene adipate 3%;
KH-590 1％；
Modified multicomponent amine 5.8%;
DA type dispersion agent 0.2%;
Preparation A component:
With radius is silver-colored nickel coat powder, Resins, epoxy, diethylene adipate and the KH-590 thorough mixing of 2 μ m, uses three-roll grinder to disperse 6 times according to each kilogram every time 3 minutes, grinding then, makes it to form uniform mixed phase.
Preparation B component:
With modified multicomponent amine and DA type dispersion agent thorough mixing, be uniformly dispersed with stirrer.
A component and B component are mixed under normal temperature or low temperature, promptly get low-temperature conductive glue.
Embodiment 4
Take by weighing raw material according to following ratio:
Silver-coated copper powder 60%;
Resins, epoxy 26%;
2-Butoxyethyl acetate 8%;
KH-550 0.2％；
Modified multicomponent amine 5.5%;
DA type dispersion agent 0.3%;
Preparation A component:
With radius is silver-coated copper powder, Resins, epoxy, 2-Butoxyethyl acetate and the KH-550 thorough mixing of 6 μ m, uses three-roll grinder to disperse 4 times according to each kilogram every time 8 minutes, grinding then, makes it to form uniform mixed phase.
Preparation B component:
With modified multicomponent amine and DA type dispersion agent thorough mixing, be uniformly dispersed with stirrer.
A component and B component are mixed under normal temperature or low temperature, promptly get low-temperature conductive glue.
Embodiment 5
Take by weighing raw material according to following ratio:
Silver nickel coat powder 56%;
Resins, epoxy 30%;
Diethylene adipate 5.5%;
KH-551 0.3％；
Modified aromatic amine 8%;
DA type dispersion agent 0.2%;
Preparation A component:
With radius is silver-colored nickel coat powder, Resins, epoxy, diethylene adipate and the KH-551 thorough mixing of 5 μ m, uses three-roll grinder to disperse 6 times according to each kilogram every time 6 minutes, grinding then, makes it to form uniform mixed phase.
Preparation B component:
With modified aromatic amine and DA type dispersion agent thorough mixing, be uniformly dispersed with stirrer.
A component and B component are mixed under normal temperature or low temperature, promptly get low-temperature conductive glue.
Claims (8)
1. a low-temperature conductive glue is characterized in that, this conductive resin is formed by the feedstock production of following mass percentage content:
The silver powder 55-65% that belongs to covered with gold leaf;
Thermosetting resin 25-35%;
High boiling solvent 3-8%;
Coupling agent 0.2-1%;
Solidifying agent 5-8%;
Dispersion agent 0.2-0.5%.
2. a kind of low-temperature conductive glue according to claim 1 is characterized in that, described silver genus covered with gold leaf powder is silver-coated copper powder, silver-colored alclad powder or silver-colored nickel coat powder, and radius is 2-15 μ m.
3. a kind of low-temperature conductive glue according to claim 1 is characterized in that described thermosetting resin is a Resins, epoxy.
4. a kind of low-temperature conductive glue according to claim 1 is characterized in that, described high boiling solvent is a kind of in diethylene adipate or the 2-Butoxyethyl acetate.
5. a kind of low-temperature conductive glue according to claim 1 is characterized in that described coupling agent is silane resin acceptor kh-550, KH-551 or KH-590.
6. a kind of low-temperature conductive glue according to claim 1 is characterized in that described solidifying agent is selected modified fatty amine, modified aromatic amine or modified multicomponent amine hardener for use.
7. a kind of low-temperature conductive glue according to claim 1 is characterized in that, described dispersion agent is a DA type dispersion agent.
8. the preparation method of a low-temperature conductive glue is characterized in that, may further comprise the steps:
Preparation A component:
With radius is that 2-15 μ m, mass percent are the Resins, epoxy of the silver-coated copper powder of 55-65%, silver-colored alclad powder or silver-colored nickel coat powder and 25-35%, the diethylene adipate of 3-8% or silane resin acceptor kh-550, KH-551 or the KH-590 thorough mixing of 2-Butoxyethyl acetate and 0.2-1%, use three-roll grinder to disperse 4-6 time then according to each kilogram every time 3-15 minute, grinding, make it to form uniform mixed phase, i.e. De A component;
Preparation B component:
With mass percent is the DA type dispersion agent thorough mixing of modified fatty amine, modified aromatic amine or modified multicomponent amine and the 0.2-0.5% of 5-8%, is uniformly dispersed with stirrer, i.e. De B component;
A component and B component are mixed under normal temperature or low temperature, promptly get low-temperature conductive glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110074220 CN102190980A (en) | 2011-03-28 | 2011-03-28 | Low-temperature conductive adhesive and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110074220 CN102190980A (en) | 2011-03-28 | 2011-03-28 | Low-temperature conductive adhesive and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102190980A true CN102190980A (en) | 2011-09-21 |
Family
ID=44599875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110074220 Pending CN102190980A (en) | 2011-03-28 | 2011-03-28 | Low-temperature conductive adhesive and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102190980A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102898991A (en) * | 2012-09-25 | 2013-01-30 | 苏州汾湖电梯有限公司 | Ultralow-temperature epoxy adhesive |
| CN103000250A (en) * | 2012-11-07 | 2013-03-27 | 宁波广博纳米新材料股份有限公司 | Back silver paste for low-silver-content crystalline silicon solar battery and preparation method thereof |
| CN103468159A (en) * | 2013-03-11 | 2013-12-25 | 苏州牛剑新材料有限公司 | Silver coated nickel powder conductive adhesive and preparation method thereof |
| CN103589381A (en) * | 2013-11-29 | 2014-02-19 | 丁保美 | High-molecular positioning reducing adhesive and preparation method thereof |
| CN103881308A (en) * | 2014-04-08 | 2014-06-25 | 安捷利（番禺）电子实业有限公司 | Plugging material with high thermal conductivity and preparation method of plugging material |
| CN104017511A (en) * | 2014-06-20 | 2014-09-03 | 莱芜金鼎电子材料有限公司 | Preparation method of epoxy resin conductive adhesive film and conductive adhesive layer of epoxy resin conductive adhesive film |
| WO2017063406A1 (en) * | 2015-10-16 | 2017-04-20 | 中兴通讯股份有限公司 | Aluminum alloy die-casting member defect repairing agent |
| CN109337625A (en) * | 2018-09-28 | 2019-02-15 | 北京理工大学珠海学院 | A kind of low-temperature setting copper alloy conducting resinl and preparation method thereof |
| CN109337624A (en) * | 2018-09-28 | 2019-02-15 | 北京理工大学珠海学院 | Low-temperature setting wicker copper conducting resinl and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101033379A (en) * | 2006-03-10 | 2007-09-12 | 国家淀粉及化学投资控股公司 | Anisotropic conductive adhesive |
| JP2009256539A (en) * | 2008-04-21 | 2009-11-05 | Three Bond Co Ltd | Electrically conductive resin composition |
| CN101622324A (en) * | 2006-11-16 | 2010-01-06 | 凯米特电子公司 | Low temperature curable conductive adhesive and capacitors formed thereby |
| CN101792627A (en) * | 2010-03-10 | 2010-08-04 | 彩虹集团公司 | Shielding electrically conductive printing ink and preparation method thereof |
| CN101928540A (en) * | 2009-10-16 | 2010-12-29 | 北京工业大学 | Epoxy conductive adhesive and preparation method thereof |
| CN101935483A (en) * | 2010-09-27 | 2011-01-05 | 彩虹集团公司 | Low-temperature conductive ink and preparation method thereof |
| CN101942287A (en) * | 2010-09-27 | 2011-01-12 | 彩虹集团公司 | Low-temperature electricity conducting glue and preparation method thereof |
-
2011
- 2011-03-28 CN CN 201110074220 patent/CN102190980A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101033379A (en) * | 2006-03-10 | 2007-09-12 | 国家淀粉及化学投资控股公司 | Anisotropic conductive adhesive |
| CN101622324A (en) * | 2006-11-16 | 2010-01-06 | 凯米特电子公司 | Low temperature curable conductive adhesive and capacitors formed thereby |
| JP2009256539A (en) * | 2008-04-21 | 2009-11-05 | Three Bond Co Ltd | Electrically conductive resin composition |
| CN101928540A (en) * | 2009-10-16 | 2010-12-29 | 北京工业大学 | Epoxy conductive adhesive and preparation method thereof |
| CN101792627A (en) * | 2010-03-10 | 2010-08-04 | 彩虹集团公司 | Shielding electrically conductive printing ink and preparation method thereof |
| CN101935483A (en) * | 2010-09-27 | 2011-01-05 | 彩虹集团公司 | Low-temperature conductive ink and preparation method thereof |
| CN101942287A (en) * | 2010-09-27 | 2011-01-12 | 彩虹集团公司 | Low-temperature electricity conducting glue and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 《粘接》 20100810 杜亮亮等 银包铜粉环氧导电胶的制备、结构与性能 38-41 权利要求1-8 , 第8期 * |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102898991A (en) * | 2012-09-25 | 2013-01-30 | 苏州汾湖电梯有限公司 | Ultralow-temperature epoxy adhesive |
| CN103000250B (en) * | 2012-11-07 | 2015-04-08 | 宁波广博纳米新材料股份有限公司 | Back silver paste for low-silver-content crystalline silicon solar battery and preparation method thereof |
| CN103000250A (en) * | 2012-11-07 | 2013-03-27 | 宁波广博纳米新材料股份有限公司 | Back silver paste for low-silver-content crystalline silicon solar battery and preparation method thereof |
| CN103468159A (en) * | 2013-03-11 | 2013-12-25 | 苏州牛剑新材料有限公司 | Silver coated nickel powder conductive adhesive and preparation method thereof |
| CN103589381A (en) * | 2013-11-29 | 2014-02-19 | 丁保美 | High-molecular positioning reducing adhesive and preparation method thereof |
| CN103589381B (en) * | 2013-11-29 | 2016-04-27 | 丁保美 | Virgin rubber and preparation method thereof is gone back in a kind of polymer location |
| CN103881308A (en) * | 2014-04-08 | 2014-06-25 | 安捷利（番禺）电子实业有限公司 | Plugging material with high thermal conductivity and preparation method of plugging material |
| CN104017511A (en) * | 2014-06-20 | 2014-09-03 | 莱芜金鼎电子材料有限公司 | Preparation method of epoxy resin conductive adhesive film and conductive adhesive layer of epoxy resin conductive adhesive film |
| WO2017063406A1 (en) * | 2015-10-16 | 2017-04-20 | 中兴通讯股份有限公司 | Aluminum alloy die-casting member defect repairing agent |
| CN109337625A (en) * | 2018-09-28 | 2019-02-15 | 北京理工大学珠海学院 | A kind of low-temperature setting copper alloy conducting resinl and preparation method thereof |
| CN109337624A (en) * | 2018-09-28 | 2019-02-15 | 北京理工大学珠海学院 | Low-temperature setting wicker copper conducting resinl and preparation method thereof |
| CN109337625B (en) * | 2018-09-28 | 2022-04-22 | 北京理工大学珠海学院 | Low-temperature curing copper alloy conductive adhesive and preparation method thereof |
| CN109337624B (en) * | 2018-09-28 | 2022-06-03 | 北京理工大学珠海学院 | Low-temperature curing silver-coated copper conductive adhesive and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102190980A (en) | Low-temperature conductive adhesive and preparation method thereof | |
| CN103468159A (en) | Silver coated nickel powder conductive adhesive and preparation method thereof | |
| CN101760147A (en) | Solvent type aeolotropic nano conductive adhesive and manufacturing method thereof | |
| CN108133768A (en) | A kind of high conductivity low temperature curing type electrocondution slurry and preparation method thereof | |
| CN102399523B (en) | Nano-grade-silver-filled room-temperature-cured conductive adhesive | |
| KR102386367B1 (en) | Connection body, connection body production method, connection method, anisotropic conductive adhesive | |
| CN107236485B (en) | A kind of dendritic heat curing type pastes conducting resinl and preparation method thereof | |
| CN101436442A (en) | Low-temperature conductive slurry | |
| CN101935480A (en) | Conductive ink and preparation method thereof | |
| WO2013129437A1 (en) | Method for manufacturing connection element, and anisotropic electroconductive adhesive | |
| CN102568656A (en) | Double-layered anisotropic conductive film and apparatus including the same | |
| CN102277109A (en) | Preparation method of environmentally-friendly photocuring silver conductive adhesive | |
| CN101942287A (en) | Low-temperature electricity conducting glue and preparation method thereof | |
| CN111243781A (en) | Silver paste and preparation method and application thereof | |
| CN109887639B (en) | Weldable low-temperature curing type functional silver paste and preparation method thereof | |
| CN104559880A (en) | Low-cost nanosilver conductive adhesive for crystal oscillator encapsulation, and preparation method of low-cost nanosilver conductive adhesive | |
| CN101735558A (en) | Glue solution for copper-clad plate | |
| CN103571267A (en) | Printing ink with high adhesive force | |
| CN103497717B (en) | A kind of LED heat-conductive solid crystal glue binder and preparation method thereof | |
| CN104371616A (en) | Preparation method of phenolic resin conductive adhesive | |
| WO2023206939A1 (en) | Electronic structure and manufacturing method therefor | |
| CN102262915B (en) | Environment-friendly silver conductive paste based on surface mount of high-power light-emitting diode (LED) chip and preparation method for paste | |
| CN103996424A (en) | Wear-resistant printed circuit board silver slurry and preparation method thereof | |
| CN110444316A (en) | A kind of highly conductive, low silver content low-temperature cured conductive silver paste and preparation method thereof | |
| CN100405506C (en) | Conducting material with anisotropy |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110921 |