CN103589381B - Virgin rubber and preparation method thereof is gone back in a kind of polymer location - Google Patents
Virgin rubber and preparation method thereof is gone back in a kind of polymer location Download PDFInfo
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- CN103589381B CN103589381B CN201310628575.3A CN201310628575A CN103589381B CN 103589381 B CN103589381 B CN 103589381B CN 201310628575 A CN201310628575 A CN 201310628575A CN 103589381 B CN103589381 B CN 103589381B
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Abstract
The present invention relates to a kind of polymer location and go back virgin rubber, the raw material that it comprises following component and content (weight) is made: resin emulsion 40%-60%, aluminium powder 10%-35%, polymer naphtha 1%-15% and silicon-dioxide 5%-20%; By above-mentioned resin emulsion, aluminium powder, silicon-dioxide adds and polymer naphtha adds stirred vessel, is fully uniformly mixed, and obtains described polymer location and go back virgin rubber.Virgin rubber is gone back in polymer location provided by the invention, and can directly use as the electro-conductive material of wiring board, direct printed wiring on glass-fiber-plate, its cost is low, and technique is simple.
Description
Technical field
The present invention relates to locating glue, particularly virgin rubber and preparation method thereof is gone back in a kind of polymer location that can be applicable on wiring board.
Background technology
Wiring board is using copper-clad base plate as base material, through boring, Graphic transitions, the techniques such as graphic plating are formed, and namely copper-clad base plate is the sheet material that surface is covered with copper film, wiring board is made with this copper-clad base plate, on the one hand, because copper film cost is higher, so, the cost of whole wiring board is increased, on the other hand, have to pass through pattern transfer step, and pattern transfer step comprises pad pasting, contraposition, exposure, development, etching, multiple operation such as striping, its processing step is quite complicated, with this, cause wiring board fabrication cycle long, the cost of equipment and artificial input is all higher.
Summary of the invention
Main purpose of the present invention is, for above-mentioned deficiency of the prior art, provides a kind of polymer to locate and goes back virgin rubber and preparation method thereof.
The present invention solves the technical scheme that prior art problem adopts: virgin rubber is gone back in a kind of polymer location, and the raw material that it comprises following component and content (weight) is made: resin emulsion 40%-60%, aluminium powder 10%-35%, polymer naphtha 1%-15% and silicon-dioxide 5%-20%.
Preferably, described resin emulsion is aqueous epoxy resin emulsion.
A preparation method for virgin rubber is gone back in polymer location, and it comprises the following steps:
According to following weight ratio, configuration raw material: resin emulsion 40%-60%, aluminium powder 10%-35%, polymer naphtha 1%-15% and silicon-dioxide 5%-20%;
Successively by above-mentioned resin emulsion, aluminium powder, silicon-dioxide adds and polymer naphtha adds stirred vessel;
Resin emulsion in above-mentioned stirred vessel, aluminium powder will be added to, silicon-dioxide adds and polymer naphtha is fully uniformly mixed, and obtain described polymer location and go back virgin rubber.
Described to be uniformly mixed in temperature be 21 DEG C-25 DEG C, and relative humidity is carry out in the environment of 30%-55%.
The invention has the beneficial effects as follows: virgin rubber is gone back in polymer location provided by the invention, can directly apply in wiring board, make wiring board, its technique is simple, concrete, only need to go back virgin rubber printed wiring on glass-fiber-plate with this polymer location, reduce on this circuit again one deck copper (using this polymer location the aluminium gone back in virgin rubber can restore layers of copper as initial reduction agent through one or many replacement(metathesis)reaction), avoid utilizing traditional copper-clad base plate to make the complex process of wiring board, also considerably reduce the production cost of wiring board.
Embodiment
Describe technical scheme of the present invention in detail below with reference to specific embodiment, so as clearer, understand invention essence of the present invention intuitively.
The invention provides a kind of polymer location and go back virgin rubber, the raw material that it comprises following component and content (weight) is made: resin emulsion 40%-60%, aluminium powder 10%-35%, polymer naphtha 1%-15% and silicon-dioxide 5%-20%.
Virgin rubber is gone back in this polymer location, be applied in wiring board, concrete, by printing technology directly using this locating glue as raw material, direct printed wiring on glass-fiber-plate, on this circuit, reduce one deck copper (one deck copper can be restored as initial reduction agent through one or many replacement(metathesis)reaction using this polymer location aluminium gone back in virgin rubber) again, avoid utilizing the complex process of traditional copper-clad base plate making wiring board, also considerably reduce the production cost of wiring board.
Go back in virgin rubber in this polymer location, resin emulsion, as adhesion agent, there is good shrinkability, make whole polymer location go back virgin rubber and there is good sticking power, ensure that in use procedure, the circuit of printing can firmly be adhered on glass-fiber-plate, preferably, this resin emulsion is aqueous epoxy resin emulsion.
Aluminium powder is as filler, for aluminium powder, its cost is lower, meanwhile, go back in virgin rubber due to this polymer location and there is aluminium powder composition, therefore, can further using aluminium wherein as reductive agent, through one or more replacement(metathesis)reaction, finally at the plated surface last layer copper of circuit, to ensure its circuit conductivity.
And one of the important component of polymer naphtha this locating glue the most, the mobility of locating glue can be strengthened on the one hand, make locating glue in printed wiring process, can evenly be printed on glass-fiber-plate densely, on the other hand, the cohesion between various component can be strengthened, make each composition can Homogeneous phase mixing, again on the one hand, polymer naphtha is the fractionation mixture of boiling point height what gasoline and low what kerosene, can be high temperature resistant, under high bake, the layers of copper that still can ensure to be plated in its circuit surface is firmly adhered to its surface, can not burst, layers of copper and the problem such as circuit is separated.
Silicon-dioxide is done mainly as a kind of anti-settling agent, its suspension has good effect for preventing the hard of this locating glue from precipitating, also can strengthen the weathering resistance etc. of this locating glue simultaneously, in addition, also bubble formation in locating glue can be prevented, in use the bubble be trapped in locating glue can be driven as far as possible away.
Embodiment one:
Virgin rubber is gone back in a kind of polymer location, and the raw material that it comprises following component and content (weight) is made: aqueous epoxy resin emulsion 60%, aluminium powder 15%, polymer naphtha 5% and silicon-dioxide 20%.
The preparation method of virgin rubber is gone back in above-mentioned polymer location, comprises the following steps:
According to following weight ratio, configuration raw material: aqueous epoxy resin emulsion 60%, aluminium powder 15%, polymer naphtha 5% and silicon-dioxide 20%;
Successively by above-mentioned resin emulsion, aluminium powder, silicon-dioxide adds and polymer naphtha adds stirred vessel;
To be added to aqueous epoxy resin emulsion in above-mentioned stirred vessel, aluminium powder, silicon-dioxide adds and polymer naphtha is fully uniformly mixed, and obtain described polymer location and go back virgin rubber, it is a kind of slurry state that virgin rubber is gone back in the polymer location of making.In this step, be generally 21 DEG C-25 DEG C in temperature, relative humidity is carry out in the environment of 30%-55%.
Embodiment two:
Virgin rubber is gone back in a kind of polymer location, and the raw material that it comprises following component and content (weight) is made: aqueous epoxy resin emulsion 40%, aluminium powder 30%, polymer naphtha 15% and silica 1 5%.
Adopt preparation method described in embodiment one, above-mentioned each raw material stirring is mixed, obtain described polymer location and go back virgin rubber.
Embodiment three:
Virgin rubber is gone back in a kind of polymer location, and the raw material that it comprises following component and content (weight) is made: aqueous epoxy resin emulsion 55%, aluminium powder 20%, polymer naphtha 8% and silica 1 7%.
Adopt preparation method described in embodiment one, above-mentioned each raw material stirring is mixed, obtain described polymer location and go back virgin rubber.
Embodiment four:
Virgin rubber is gone back in a kind of polymer location, and the raw material that it comprises following component and content (weight) is made: aqueous epoxy resin emulsion 50%, aluminium powder 25%, polymer naphtha 12% and silica 1 3%.
Adopt preparation method described in embodiment one, above-mentioned each raw material stirring is mixed, obtain described polymer location and go back virgin rubber.
Embodiment five:
Virgin rubber is gone back in a kind of polymer location, and the raw material that it comprises following component and content (weight) is made: aqueous epoxy resin emulsion 45%, aluminium powder 35%, polymer naphtha 10% and silica 1 0%.
Adopt preparation method described in embodiment one, above-mentioned each raw material stirring is mixed, obtain described polymer location and go back virgin rubber.
Embodiment six:
Virgin rubber is gone back in a kind of polymer location, and the raw material that it comprises following component and content (weight) is made: aqueous epoxy resin emulsion 60%, aluminium powder 19%, polymer naphtha 3% and silica 1 8%.
Adopt preparation method described in embodiment one, above-mentioned each raw material stirring is mixed, obtain described polymer location and go back virgin rubber.
The foregoing is only the preferred embodiments of the present invention; not thereby its scope of the claims is limited; every utilize specification sheets of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; directly or indirectly be used in the technical field that other are relevant, be all in like manner included in scope of patent protection of the present invention.
Claims (3)
1. virgin rubber is gone back in a polymer location, it is characterized in that, it is made up of the raw material of following parts by weight: resin emulsion 40%-60%, aluminium powder 10%-35%, polymer naphtha 1%-15% and silicon-dioxide 5%-20%, and described resin emulsion is aqueous epoxy resin emulsion.
2. a preparation method for virgin rubber is gone back in polymer location as claimed in claim 1, it is characterized in that: it comprises the following steps:
According to following weight ratio, configuration raw material: resin emulsion 40%-60%, aluminium powder 10%-35%, polymer naphtha 1%-15% and silicon-dioxide 5%-20%;
Successively by above-mentioned resin emulsion, aluminium powder, silicon-dioxide adds and polymer naphtha adds stirred vessel;
Resin emulsion in above-mentioned stirred vessel, aluminium powder will be added to, silicon-dioxide adds and polymer naphtha is fully uniformly mixed, and obtain described polymer location and go back virgin rubber.
3. preparation method according to claim 2, is characterized in that: described in be uniformly mixed in temperature be 21 DEG C-25 DEG C, relative humidity is carry out in the environment of 30%-55%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310628575.3A CN103589381B (en) | 2013-11-29 | 2013-11-29 | Virgin rubber and preparation method thereof is gone back in a kind of polymer location |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310628575.3A CN103589381B (en) | 2013-11-29 | 2013-11-29 | Virgin rubber and preparation method thereof is gone back in a kind of polymer location |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103589381A CN103589381A (en) | 2014-02-19 |
| CN103589381B true CN103589381B (en) | 2016-04-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310628575.3A Expired - Fee Related CN103589381B (en) | 2013-11-29 | 2013-11-29 | Virgin rubber and preparation method thereof is gone back in a kind of polymer location |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101643614A (en) * | 2009-08-14 | 2010-02-10 | 机械科学研究总院先进制造技术研究中心 | High temperature oxidation resistant environment-friendly coating with functions of lubricating and heat conducting |
| CN102190980A (en) * | 2011-03-28 | 2011-09-21 | 彩虹集团公司 | Low-temperature conductive adhesive and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010027629A (en) * | 1999-09-10 | 2001-04-06 | 정해린 | Flexible Epoxy Adhesive for flooring board installation |
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2013
- 2013-11-29 CN CN201310628575.3A patent/CN103589381B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101643614A (en) * | 2009-08-14 | 2010-02-10 | 机械科学研究总院先进制造技术研究中心 | High temperature oxidation resistant environment-friendly coating with functions of lubricating and heat conducting |
| CN102190980A (en) * | 2011-03-28 | 2011-09-21 | 彩虹集团公司 | Low-temperature conductive adhesive and preparation method thereof |
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| Publication number | Publication date |
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| CN103589381A (en) | 2014-02-19 |
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Granted publication date: 20160427 Termination date: 20191129 |