CN101735558A - Glue solution for copper-clad plate - Google Patents
Glue solution for copper-clad plate Download PDFInfo
- Publication number
- CN101735558A CN101735558A CN200810219025A CN200810219025A CN101735558A CN 101735558 A CN101735558 A CN 101735558A CN 200810219025 A CN200810219025 A CN 200810219025A CN 200810219025 A CN200810219025 A CN 200810219025A CN 101735558 A CN101735558 A CN 101735558A
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- parts
- copper
- clad plate
- glue solution
- glue
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Abstract
The invention provides glue solution for a copper-clad plate. Better bonding performance and heat resistance are achieved between a reinforcing layer and a copper foil layer which are dipped with the glue solution; and the glue solution consists of the following compositions in part by weight: 125 parts of epoxy resin, 3 parts of dicyandiamide, 20 parts of dimethylfomamide, 0.1 part of dimethyl imidazole, 40 parts of acetone, 20 parts of aluminium hydroxide and 80 parts of talcpowder. The copper-clad plate which is prepared from the glue solution provided by the invention is applicable to occasions that electronic elements have high heat dissipating capacity and the working environment is severe.
Description
Technical field
The present invention relates to the copper-clad plate technical field, particularly a kind of copper-clad plate glue.
Background technology
Existing lead-free copper-clad plate, it is after glass cloth be impregnated in binding agent such as Resins, epoxy, Resins, epoxy be converted into semi-cured state with heating when forming the semicure layer and dry impregnated cloth so that remove molten Ji, press copper foil layer and it carried out autoclave moulding on the upper strata of one side at least of described semicure layer to make lead-free copper-clad plate.But known this lead-free copper-clad plate heat dispersion is poor, when the heat that sends when the various electronic devices and components on the circuit card can not in time be distributed, the circuit card temperature sharply raises, cause copper foil layer to separate with enhancement Layer, along with great power LED is universal day by day as means of illumination, the enhancement Layer of lead-free copper-clad plate is being further improved aspect thermotolerance and the binding property.And the performance of improving enhancement Layer mainly is exactly to improve and optimize the component of binding agent.
Summary of the invention
The purpose of this invention is to provide a kind of copper-clad plate glue, flood between the enhancement Layer of this glue and the copper foil layer and have better bond properties and resistance toheat.
The technical solution adopted in the present invention is such: a kind of copper-clad plate glue, described glue is made up of following components by weight part: 125 parts of Resins, epoxy, 3 parts of Dyhard RU 100s, 20 parts of dimethyl formamides, 0.1 part of methylimidazole, 40 parts of acetone, 20 parts of aluminium hydroxides and 80 parts of talcum powder.
By adopting the aforementioned techniques scheme, the invention has the beneficial effects as follows: glass cloth be impregnated in prepared glue, improving significantly aspect bounding force, intensity and the thermal conductivity with the compound plate that covers that makes of copper foil layer again after to be dried, be applicable to that electronics does not have that the device heat dissipation capacity is big, the occasion of work under bad environment.
Embodiment
Lead-free copper-clad plate is a baseplate material of making printed circuit board (PCB), and it supports the various components and parts except being used as, and can realize being electrically connected or electrical isolation between them.Embodiment discloses a kind of copper-clad plate glue, and it is made up of following components by weight part: 125 parts of Resins, epoxy, 3 parts of Dyhard RU 100s, 20 parts of dimethyl formamides, 0.1 part of methylimidazole, 40 parts of acetone, 20 parts of aluminium hydroxides and 80 parts of talcum powder.
The foregoing description has only provided the employed component of illustrated embodiments; the weight proportion of each component constitutes protection scope of the present invention simultaneously; if those skilled in the art based on the enlightenment of previous embodiment on the basis of each component to some or several set of dispense than the improvement of carrying out on the non-intrinsically safe, surely belong to the technical scheme that is equal to mutually with the present invention.
Claims (1)
1. copper-clad plate glue is characterized in that described glue is made up of following components by weight part: 125 parts of Resins, epoxy, 3 parts of Dyhard RU 100s, 20 parts of dimethyl formamides, 0.1 part of methylimidazole, 40 parts of acetone, 20 parts of aluminium hydroxides and 80 parts of talcum powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810219025A CN101735558A (en) | 2008-11-07 | 2008-11-07 | Glue solution for copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810219025A CN101735558A (en) | 2008-11-07 | 2008-11-07 | Glue solution for copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101735558A true CN101735558A (en) | 2010-06-16 |
Family
ID=42459621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810219025A Pending CN101735558A (en) | 2008-11-07 | 2008-11-07 | Glue solution for copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101735558A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106381111A (en) * | 2016-08-29 | 2017-02-08 | 上海国纪电子材料有限公司 | Glue solution for P10 copper clad laminate |
| CN106675480A (en) * | 2016-12-31 | 2017-05-17 | 铜陵华科电子材料有限公司 | Additive material formula of halogen-free CEM-1 composite substrate copper-clad plate |
| CN106700426A (en) * | 2016-12-31 | 2017-05-24 | 铜陵华科电子材料有限公司 | Additive material formula of halogen-free and stibium-free environment-friendly copper-clad plate |
| CN106753135A (en) * | 2016-12-31 | 2017-05-31 | 铜陵华科电子材料有限公司 | For the additive material formula of TG polyimide copper clad laminations high |
| CN110511538A (en) * | 2019-07-30 | 2019-11-29 | 苏州万润绝缘材料有限公司 | The glue of 0.6mm epoxy resin board |
| CN114274617A (en) * | 2021-11-18 | 2022-04-05 | 安徽鸿海新材料股份有限公司 | High-performance aluminum-based flame-retardant copper-clad plate and forming process thereof |
-
2008
- 2008-11-07 CN CN200810219025A patent/CN101735558A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106381111A (en) * | 2016-08-29 | 2017-02-08 | 上海国纪电子材料有限公司 | Glue solution for P10 copper clad laminate |
| CN106381111B (en) * | 2016-08-29 | 2019-05-03 | 上海国纪电子材料有限公司 | A kind of P10 glue solution for copper-clad plate |
| CN106675480A (en) * | 2016-12-31 | 2017-05-17 | 铜陵华科电子材料有限公司 | Additive material formula of halogen-free CEM-1 composite substrate copper-clad plate |
| CN106700426A (en) * | 2016-12-31 | 2017-05-24 | 铜陵华科电子材料有限公司 | Additive material formula of halogen-free and stibium-free environment-friendly copper-clad plate |
| CN106753135A (en) * | 2016-12-31 | 2017-05-31 | 铜陵华科电子材料有限公司 | For the additive material formula of TG polyimide copper clad laminations high |
| CN110511538A (en) * | 2019-07-30 | 2019-11-29 | 苏州万润绝缘材料有限公司 | The glue of 0.6mm epoxy resin board |
| CN114274617A (en) * | 2021-11-18 | 2022-04-05 | 安徽鸿海新材料股份有限公司 | High-performance aluminum-based flame-retardant copper-clad plate and forming process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent for invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Liu Yulian Inventor after: Liu Danmin Inventor after: Li Tianyuan Inventor before: Liu Yulian |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: LIU YULIAN TO: LIU YULIAN LIU DANMIN LI TIANYUAN |
|
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20100616 |