CN102140690A - 光致发光晶片及其制备方法和应用 - Google Patents
光致发光晶片及其制备方法和应用 Download PDFInfo
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- CN102140690A CN102140690A CN2010106168281A CN201010616828A CN102140690A CN 102140690 A CN102140690 A CN 102140690A CN 2010106168281 A CN2010106168281 A CN 2010106168281A CN 201010616828 A CN201010616828 A CN 201010616828A CN 102140690 A CN102140690 A CN 102140690A
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
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Abstract
Description
Claims (20)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010106168281A CN102140690B (zh) | 2010-12-31 | 2010-12-31 | 光致发光晶片及其制备方法和应用 |
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CN2010106168281A CN102140690B (zh) | 2010-12-31 | 2010-12-31 | 光致发光晶片及其制备方法和应用 |
Publications (2)
Publication Number | Publication Date |
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CN102140690A true CN102140690A (zh) | 2011-08-03 |
CN102140690B CN102140690B (zh) | 2013-05-01 |
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CN2010106168281A Expired - Fee Related CN102140690B (zh) | 2010-12-31 | 2010-12-31 | 光致发光晶片及其制备方法和应用 |
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CN (1) | CN102140690B (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102925975A (zh) * | 2011-08-09 | 2013-02-13 | 上海祥羚光电科技发展有限公司 | 一种白光led用yag单晶体的制作方法 |
CN103194709A (zh) * | 2013-04-01 | 2013-07-10 | 何迎春 | 金属复合材料的制作方法 |
CN104681682A (zh) * | 2015-02-04 | 2015-06-03 | 浙江大学 | 一种基于铒掺杂CeO2薄膜的电致发光器件及其制备方法 |
CN105405949A (zh) * | 2014-08-29 | 2016-03-16 | 无锡华润华晶微电子有限公司 | 一种发光二极管灯丝及其制备方法 |
CN105438060A (zh) * | 2014-09-19 | 2016-03-30 | 福特全球技术公司 | 光致发光车辆踏脚板灯 |
CN106835262A (zh) * | 2017-02-09 | 2017-06-13 | 中国科学院福建物质结构研究所 | 一种生长四硼酸铝盐晶体的方法 |
CN108735873A (zh) * | 2018-04-25 | 2018-11-02 | 广州市欧玛灯光设备有限公司 | 一种led发光源制备工艺 |
WO2019056209A1 (en) * | 2017-09-20 | 2019-03-28 | Materion Precision Optics (Shanghai) Limited | LUMINOPHORE WHEEL WITH INORGANIC BINDER |
CN115142130A (zh) * | 2022-06-30 | 2022-10-04 | 同济大学 | 一种微下拉区熔法生长片状氧化镓晶体的方法与生长装置 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
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US5998925A (en) * | 1996-07-29 | 1999-12-07 | Nichia Kagaku Kogyo Kabushiki Kaisha | Light emitting device having a nitride compound semiconductor and a phosphor containing a garnet fluorescent material |
CN1445562A (zh) * | 2002-03-18 | 2003-10-01 | 保谷株式会社 | 光学元件及其生产方法和生产薄膜的方法 |
US6669866B1 (en) * | 1999-07-23 | 2003-12-30 | Patent-Treuhand-Gesellschaft Fuer Elektrische Gluehlampen Mbh | Luminous substance for a light source and light source associates therewith |
CN1558453A (zh) * | 2004-01-30 | 2004-12-29 | 天津中环三津有限公司 | 采用发蓝光或紫光的二极管晶片制备发白光二极管的方法 |
CN1564332A (zh) * | 2004-03-30 | 2005-01-12 | 深圳市蓝科电子有限公司 | 白光二极管制造方法 |
CN1815765A (zh) * | 2005-12-19 | 2006-08-09 | 中山大学 | 一种yag晶片式白光发光二极管及其封装方法 |
CN1931958B (zh) * | 2006-09-20 | 2010-05-19 | 王锦高 | 一种白光发光二极管用荧光粉及其制备方法 |
CN101894900A (zh) * | 2010-06-25 | 2010-11-24 | 北京工业大学 | 一种将单晶体用于白光led的制作方法 |
-
2010
- 2010-12-31 CN CN2010106168281A patent/CN102140690B/zh not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5998925A (en) * | 1996-07-29 | 1999-12-07 | Nichia Kagaku Kogyo Kabushiki Kaisha | Light emitting device having a nitride compound semiconductor and a phosphor containing a garnet fluorescent material |
US6669866B1 (en) * | 1999-07-23 | 2003-12-30 | Patent-Treuhand-Gesellschaft Fuer Elektrische Gluehlampen Mbh | Luminous substance for a light source and light source associates therewith |
CN1445562A (zh) * | 2002-03-18 | 2003-10-01 | 保谷株式会社 | 光学元件及其生产方法和生产薄膜的方法 |
CN1558453A (zh) * | 2004-01-30 | 2004-12-29 | 天津中环三津有限公司 | 采用发蓝光或紫光的二极管晶片制备发白光二极管的方法 |
CN1564332A (zh) * | 2004-03-30 | 2005-01-12 | 深圳市蓝科电子有限公司 | 白光二极管制造方法 |
CN1815765A (zh) * | 2005-12-19 | 2006-08-09 | 中山大学 | 一种yag晶片式白光发光二极管及其封装方法 |
CN1931958B (zh) * | 2006-09-20 | 2010-05-19 | 王锦高 | 一种白光发光二极管用荧光粉及其制备方法 |
CN101894900A (zh) * | 2010-06-25 | 2010-11-24 | 北京工业大学 | 一种将单晶体用于白光led的制作方法 |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102925975A (zh) * | 2011-08-09 | 2013-02-13 | 上海祥羚光电科技发展有限公司 | 一种白光led用yag单晶体的制作方法 |
CN103194709A (zh) * | 2013-04-01 | 2013-07-10 | 何迎春 | 金属复合材料的制作方法 |
CN105405949A (zh) * | 2014-08-29 | 2016-03-16 | 无锡华润华晶微电子有限公司 | 一种发光二极管灯丝及其制备方法 |
CN105438060A (zh) * | 2014-09-19 | 2016-03-30 | 福特全球技术公司 | 光致发光车辆踏脚板灯 |
CN104681682B (zh) * | 2015-02-04 | 2017-06-20 | 浙江大学 | 一种基于铒掺杂CeO2薄膜的电致发光器件及其制备方法 |
CN104681682A (zh) * | 2015-02-04 | 2015-06-03 | 浙江大学 | 一种基于铒掺杂CeO2薄膜的电致发光器件及其制备方法 |
CN106835262A (zh) * | 2017-02-09 | 2017-06-13 | 中国科学院福建物质结构研究所 | 一种生长四硼酸铝盐晶体的方法 |
CN106835262B (zh) * | 2017-02-09 | 2019-08-20 | 中国科学院福建物质结构研究所 | 一种生长四硼酸铝盐晶体的方法 |
WO2019056209A1 (en) * | 2017-09-20 | 2019-03-28 | Materion Precision Optics (Shanghai) Limited | LUMINOPHORE WHEEL WITH INORGANIC BINDER |
US11578264B2 (en) | 2017-09-20 | 2023-02-14 | Materion Precision Optics (Shanghai) Limited | Phosphor wheel with inorganic binder |
CN108735873A (zh) * | 2018-04-25 | 2018-11-02 | 广州市欧玛灯光设备有限公司 | 一种led发光源制备工艺 |
CN115142130A (zh) * | 2022-06-30 | 2022-10-04 | 同济大学 | 一种微下拉区熔法生长片状氧化镓晶体的方法与生长装置 |
CN115142130B (zh) * | 2022-06-30 | 2024-02-27 | 同济大学 | 一种微下拉区熔法生长片状氧化镓晶体的方法与生长装置 |
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CN102140690B (zh) | 2013-05-01 |
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