CN102083282B - 电路板制作方法 - Google Patents
电路板制作方法 Download PDFInfo
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- CN102083282B CN102083282B CN2009103105339A CN200910310533A CN102083282B CN 102083282 B CN102083282 B CN 102083282B CN 2009103105339 A CN2009103105339 A CN 2009103105339A CN 200910310533 A CN200910310533 A CN 200910310533A CN 102083282 B CN102083282 B CN 102083282B
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CN2009103105339A CN102083282B (zh) | 2009-11-27 | 2009-11-27 | 电路板制作方法 |
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CN2009103105339A CN102083282B (zh) | 2009-11-27 | 2009-11-27 | 电路板制作方法 |
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CN102083282A CN102083282A (zh) | 2011-06-01 |
CN102083282B true CN102083282B (zh) | 2012-11-21 |
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CN2009103105339A Active CN102083282B (zh) | 2009-11-27 | 2009-11-27 | 电路板制作方法 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI621231B (zh) * | 2016-12-13 | 2018-04-11 | 南茂科技股份有限公司 | 晶片封裝結構的製作方法與基板結構 |
CN113766725B (zh) * | 2020-06-03 | 2023-06-20 | 鹏鼎控股(深圳)股份有限公司 | 高频电路板及其制作方法 |
CN113038718A (zh) * | 2021-01-27 | 2021-06-25 | 红板(江西)有限公司 | 超薄pcb板压合工艺 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101472404A (zh) * | 2007-12-25 | 2009-07-01 | 富葵精密组件(深圳)有限公司 | 多层电路板及其制作方法 |
CN101534613A (zh) * | 2008-03-14 | 2009-09-16 | 富葵精密组件(深圳)有限公司 | 一种具有断差结构的电路板的制作方法 |
CN101547573A (zh) * | 2008-03-27 | 2009-09-30 | 富葵精密组件(深圳)有限公司 | 具有断差结构的电路板的制作方法 |
CN101346047B (zh) * | 2007-07-13 | 2010-06-02 | 富葵精密组件(深圳)有限公司 | 多层电路板制作方法及用于制作多层电路板的内层基板 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101346047B (zh) * | 2007-07-13 | 2010-06-02 | 富葵精密组件(深圳)有限公司 | 多层电路板制作方法及用于制作多层电路板的内层基板 |
CN101472404A (zh) * | 2007-12-25 | 2009-07-01 | 富葵精密组件(深圳)有限公司 | 多层电路板及其制作方法 |
CN101534613A (zh) * | 2008-03-14 | 2009-09-16 | 富葵精密组件(深圳)有限公司 | 一种具有断差结构的电路板的制作方法 |
CN101547573A (zh) * | 2008-03-27 | 2009-09-30 | 富葵精密组件(深圳)有限公司 | 具有断差结构的电路板的制作方法 |
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CN102083282A (zh) | 2011-06-01 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent for invention or patent application | ||
CB02 | Change of applicant information |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant after: Zhending Technology Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant before: Honsentech Co., Ltd. |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170309 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |