CN102054716B - 导线架条的封胶方法与封胶结构 - Google Patents
导线架条的封胶方法与封胶结构 Download PDFInfo
- Publication number
- CN102054716B CN102054716B CN2010105221500A CN201010522150A CN102054716B CN 102054716 B CN102054716 B CN 102054716B CN 2010105221500 A CN2010105221500 A CN 2010105221500A CN 201010522150 A CN201010522150 A CN 201010522150A CN 102054716 B CN102054716 B CN 102054716B
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- CN
- China
- Prior art keywords
- lead frame
- frame unit
- conductive wire
- cast gate
- strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010105221500A CN102054716B (zh) | 2010-10-26 | 2010-10-26 | 导线架条的封胶方法与封胶结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010105221500A CN102054716B (zh) | 2010-10-26 | 2010-10-26 | 导线架条的封胶方法与封胶结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102054716A CN102054716A (zh) | 2011-05-11 |
CN102054716B true CN102054716B (zh) | 2013-03-27 |
Family
ID=43958908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010105221500A Active CN102054716B (zh) | 2010-10-26 | 2010-10-26 | 导线架条的封胶方法与封胶结构 |
Country Status (1)
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CN (1) | CN102054716B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105161479B (zh) * | 2015-08-24 | 2018-09-18 | 日月光封装测试(上海)有限公司 | 导线框架条及使用该导线框架条的半导体封装方法 |
CN106876355A (zh) * | 2017-02-23 | 2017-06-20 | 日月光封装测试(上海)有限公司 | 球栅阵列封装基板及使用该基板的球栅阵列封装体 |
CN112117125B (zh) * | 2020-08-27 | 2022-04-08 | 江门市蓬江区恒驰新材料有限公司 | 一种自动化线圈缠胶带设备 |
CN115050720B (zh) * | 2022-08-15 | 2023-01-06 | 华羿微电子股份有限公司 | 一种顶部散热功率器件引线框架 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101477973A (zh) * | 2009-01-23 | 2009-07-08 | 日月光半导体制造股份有限公司 | 导线架条及其封胶方法与封胶构造 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2701766B2 (ja) * | 1995-01-27 | 1998-01-21 | 日本電気株式会社 | 半導体装置用リ−ドフレ−ム及びこれを用いるモ−ルド装置 |
US7927923B2 (en) * | 2006-09-25 | 2011-04-19 | Micron Technology, Inc. | Method and apparatus for directing molding compound flow and resulting semiconductor device packages |
CN101483167B (zh) * | 2009-01-22 | 2011-03-30 | 日月光半导体制造股份有限公司 | 导线架条及其封胶方法与封胶结构 |
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2010
- 2010-10-26 CN CN2010105221500A patent/CN102054716B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101477973A (zh) * | 2009-01-23 | 2009-07-08 | 日月光半导体制造股份有限公司 | 导线架条及其封胶方法与封胶构造 |
Also Published As
Publication number | Publication date |
---|---|
CN102054716A (zh) | 2011-05-11 |
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TR01 | Transfer of patent right |
Effective date of registration: 20161222 Address after: 201201 room -T3-10-202, No. 5001 East Road, Shanghai, Pudong New Area Patentee after: Advanced integrated circuit manufacturing (Chinese) Co. Ltd. Patentee after: ASE Assembly & Test (Shanghai) Ltd. Address before: 200137 Shanghai Guo Shou Jing Road, Pudong Zhangjiang hi tech Park No. 669 Patentee before: ASE Assembly & Test (Shanghai) Ltd. |
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TR01 | Transfer of patent right |
Effective date of registration: 20170503 Address after: 201203 Shanghai city Chinese (Shanghai) free trade zone 669 GuoShouJing Road No. six building Patentee after: ASE Assembly & Test (Shanghai) Limited Address before: 201201 room -T3-10-202, No. 5001 East Road, Shanghai, Pudong New Area Co-patentee before: ASE Assembly & Test (Shanghai) Limited Patentee before: Advanced integrated circuit manufacturing (Chinese) Co. Ltd. |
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TR01 | Transfer of patent right |
Effective date of registration: 20210113 Address after: No. 669, GuoShouJing Road, Pudong New Area pilot Free Trade Zone, Shanghai, 201203 Patentee after: Rirong semiconductor (Shanghai) Co.,Ltd. Address before: 6th floor, 669 GuoShouJing Road, China (Shanghai) pilot Free Trade Zone, Shanghai, 201203 Patentee before: ASE ASSEMBLY & TEST (SHANGHAI) Ltd. |
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TR01 | Transfer of patent right |