CN102044309A - Conductive material shaped through optical energy or heat energy, method for preparing conductive material and conductive composition - Google Patents
Conductive material shaped through optical energy or heat energy, method for preparing conductive material and conductive composition Download PDFInfo
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- CN102044309A CN102044309A CN 201010152474 CN201010152474A CN102044309A CN 102044309 A CN102044309 A CN 102044309A CN 201010152474 CN201010152474 CN 201010152474 CN 201010152474 A CN201010152474 A CN 201010152474A CN 102044309 A CN102044309 A CN 102044309A
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Abstract
The invention relates to a conductive material shaped through optical energy or heat energy, a method for preparing the conductive material and a conductive composition. The conductive material comprises nano wires and nano linkers in a ratio of 9:1-1:9. The nano linkers can be melted through the optical energy or heat energy to be linked with ambient nano linkers or nano wires, and the electrical conductivity of the conductive material is improved further.
Description
Technical field
The present invention relates to a kind of electric conducting material, particularly a kind of electric conducting material with nanostructure.
Background technology
Human civilization enters 21 century, for the requirement of information products arrived gently, six characteristics such as thin, short, little, soft and deflection.Statistics in 2005, following soft electronic market scale will reach 4,700,000,000 5 thousand ten thousand U.S. dollars in 2010, can reach 250,000,000,000 dollars in 2025 according to IDTechEX.And along with the emergence of soft electronic, the electrically conductive ink that can make conductive layer on base material becomes more important.NanoMarkets predicts that in 2006 the electrically conductive ink market scale will grow to 13.61 hundred million dollars in 2013 from 0.11 hundred million dollar in 2007, and annual compound rate of growth is near 100%.Hence one can see that, and the development of electrically conductive ink will drive the development that " soft electronic " reaches new industries such as " soft transducers ".In addition, the electrically conductive ink patterning that modes such as spray printing or screen painting carry out conductive layer on the base material of can arranging in pairs or groups is made, and it does not need processing procedures such as loaded down with trivial details exposure, development or evaporation, reaches future trends such as " low costs " so more can meet " carbon reduction ".
The conductive filling material of electrically conductive ink can use metal materials such as gold, silver, copper, iron and aluminium at present, and after above-mentioned metal nanoization, the rapid increase of its surface area, cause the fusing point of metal material to descend, the sintering that helps conductive layer, for example: silver point is 690 ℃, and the Nano Silver fusing point of 2nm is about about 100 ℃, that is only need 100 ℃ temperature just can anneal to nano silver particles, promote conductivity.At present on the market the filler of the electrically conductive ink of normal employing be Nano Silver, it has at a middle or low price characteristics such as lattice, high conductivity, oxide tool conductivity, sintering temperature and low and stability is good than other metal, therefore is widely used.Though the cost of copper ratio silver is low and conductivity there is no too big-difference, its easy oxidation, so usability is subjected to bigger restriction.According to statistics, developing at present the electrically conductive ink product that has and all adopts Nano Silver to regard filler more than 95%.
Electrically conductive ink is made up of conducting particles, binding agent and auxiliary agent compositions such as (as shaking change agent etc.), when printing ink is coated on the base material by processing procedures such as spray printing or screen paintings, after it must be burnt the connection thing in it or other compounding substances through high temperature sintering, and make conducting particles produce the conductivity that could effectively promote electric conducting material after the agglomeration.Yet in the process of high temperature sintering, heat can cause the destruction of base material, particularly when using the base material of being made up of many unlike materials, because the rising-heat contracting-cold coefficient difference of each material, more is easy to generate the not desire phenomenon of seeing such as thermal cracking or warpage.In addition, if use on more low-melting flexible base plate (as: PET or PMMA), also can cause heat damages such as burning of substrate or thermal deformation.
U.S. Patent Publication No. US 2007/0,074, and 316 disclose a kind of electrically conducting transparent colloid (transparentconductor), and this transparent conductive body comprises a substrate and a plurality of nano-silver thread.These a plurality of nano-silver threads can effectively promote the conductivity of colloid in the inner formed network configuration of base material, and then reach the function of " transparent and tool conduction ".
United States Patent (USP) U.S.7,341, but the electrically conductive ink of 680 proposition spray printing formulas.Its composition can be the material of two kinds of forms and forms.First kind of form is line, taper, disc and plate shaped etc., and its length-width ratio must be greater than 1: 3.And another material can be circle, ellipse, cylindrical or angle vertebra shape, and the hole that it can fill up the first form material makes the evenness of conductive layer better.
To sum up, electric conducting material now needs to descend as cause conductivity because of sintering temperature is too high through being easy to generate bad result's high temperature sintering processing procedure when electrically conductive ink that makes the apparatus nano particle or coating making; Only have an electric conducting material of material of nano wire and use, but the bad situation of evenness and density takes place easily and can't further promote conductivity.Therefore, be necessary to develop and to have good evenness and can improve electric conducting material of conductivity and preparation method thereof.
Summary of the invention
One embodiment of the invention disclose a kind of electric conducting material, and it comprises nanometer wire rod and nanometer linker, and wherein the part by weight between this nanometer wire rod and this nanometer linker is 9: 1～1: 9.
One embodiment of the invention disclose a kind of preparation method who promotes the electric conducting material of conductivity by luminous energy or heat energy, it comprises the following step: provide to blend together solution, this blendes together solution and comprises nanometer wire rod and nanometer linker, and wherein the part by weight of this nanometer wire rod and this nanometer linker is 9: 1～1: 9; And solidify this and blend together solution, and obtain the conductive mixture that this nanometer wire rod and this nanometer linker are formed.
One embodiment of the invention disclose the electrically conductive composition of tool nanostructure, and it comprises and blendes together solution, nanometer wire rod and nanometer linker.Wherein, this nanometer wire rod and the shared part by weight of this nanometer linker be about 1: 9～9: 1.
Description of drawings
Fig. 1 and 2 shows nanometer linker in the electric conducting material of one embodiment of the invention after illumination or heat energy are bestowed, the schematic diagram of nanometer wire rod or nanometer linker around linking;
Fig. 3 shows the sweep electron microscope photo when interior Nano Silver wire rod of the electric conducting material of one embodiment of the invention and Yin Nami linker mixed proportion are 4: 1 weight ratios;
Fig. 4 shows the sweep electron microscope photo when interior Nano Silver wire rod of the electric conducting material of one embodiment of the invention and Yin Nami linker mixed proportion are 3: 2 weight ratios;
Fig. 5 shows the sweep electron microscope photo when interior Nano Silver wire rod of the electric conducting material of one embodiment of the invention and Yin Nami linker mixed proportion are 2: 3 weight ratios;
Fig. 6 shows the sweep electron microscope photo when interior Nano Silver wire rod of the electric conducting material of one embodiment of the invention and Yin Nami linker mixed proportion are 1: 4 weight ratio;
After Fig. 7 shows in one embodiment of the invention in varing proportions combined silver nanometer linker and nano silver wire, the experimental data figure of the surface roughness of electric conducting material;
Fig. 8 shows the sweep electron microscope photo of the electric conducting material after 200 ℃ of heating;
Fig. 9 shows the sweep electron microscope photo of the electric conducting material after 200 ℃ of heating;
Figure 10 shows the sweep electron microscope photo of the electric conducting material after 200 ℃ of heating;
Figure 11 shows the sweep electron microscope photo of the electric conducting material after 200 ℃ of heating;
After Figure 12 shows in varing proportions combined silver nanometer linker and nano silver wire, the experimental data figure of the sheet resistance of electric conducting material;
Figure 13 to 15 shows that the collocation spray printing processing procedure of one embodiment of the invention carries out the preparation method's of conducting film schematic flow sheet; And
Figure 16 to Figure 20 shows that the collocation screen painting processing procedure of one embodiment of the invention carries out the preparation method's of conducting film schematic flow sheet.
Symbol description
1 substrate
2,2 ', 2 ", 2 " ' nozzle
3, the conducting film of 3 ' inkjet type
4 half tones
5 scrapers
6 blend together solution
6 ', the 6 " electric conducting materials of wire mark type
20,21,22 positions
30,31 positions
100 substrates
101 nanometer linker
102 nanometer wire rods
103 conductive layers
104 electrically conductive inks
Embodiment
One embodiment of the invention disclose a kind of electric conducting material of tool nanostructure, and it comprises nanometer wire rod and nanometer linker.The nanometer wire rod can form the electric conducting material of network configuration or class network configuration on substrate, and makes electric conducting material that higher conductive characteristic be arranged.Formed network configuration of nanometer wire rod or class network configuration are porousness (porous) structure, and the nanometer linker of electric conducting material then can be filled up among this porous network configuration or class network configuration, make that electric conducting material inside can be more fine and close.And, the network configuration or the class network configuration that are made of the nanometer wire rod easily make electric conducting material have bad surface smoothness, fill up network configuration or the class network configuration that the nanometer wire rod is constituted by the nanometer linker, can be used for improving the surface smoothness of electric conducting material.In addition, the nanometer linker has the specific wavelength of absorption and low melting point characteristic because of the high surface ratio, therefore can make the fusing of nanometer linker by heat energy or luminous energy, and then reach the conductivity that promotes electric conducting material.
With reference to Fig. 1 and shown in Figure 2, U.S. Patent Publication No. US 2007/0,074,316 with different being of the present invention, the present invention is the electrically conductive ink 104 that utilizes nanometer linker 101 and nanometer wire rod 102 to be formed, it can pass through screen painting or spray printing mode, on substrate 100, form the conductive layer 103 of patterning, then can make nanometer linker 101 sintering of electrically conductive ink 104 by additional heat energy or luminous energy mode, and then nanometer linker 101 or nanometer wire rod 102 around linking, make conductive layer 103 when the similar conductive layer of nanometer wire rod 102 is only arranged, can promote the conductivity more than 50%.
In addition, than United States Patent (USP) U.S.7,341,680, first form of the present invention is nanometer wire rod 102 (AR＞10), its material comprises: the compound of gold, silver, copper, indium, palladium and aluminium or above material.The second form material is required to be the nanometer linker 101 that can link material around by luminous energy or heat energy, as: gold, silver, copper, indium, palladium or aluminium etc., its diameter is less than 100nm.Two kinds of material mixing are after luminous energy or heat energy influence, and the nano material of its second form can be melted and then be connect material around, make conductive layer form non-individual body.
In electric conducting material of the present invention, be the nanometer linker 101 of in nanometer wire rod 102 formed network configurations, adding proper proportion filling up the space between network configuration, and improve the conductive characteristic of electric conducting material thus.In the electric conducting material of the present invention, nanometer wire rod 102 can be 1: 9～9: 1 (ratio is 0.1～9) with the ratio of nanometer linker 101.In another embodiment, the electric conducting material of the present invention ratio that can comprise its nanometer wire rod 102 and nanometer linker 101 can be 1: 4～2: 3 (ratio is 0.2～4).
The material of nanometer linker 101 can be simple metal or more than one the composition metal that simple metal constituted.In one embodiment, the material of nanometer linker 101 is metals such as gold, silver, copper, indium, palladium or aluminium, and its diameter is less than 100nm.Nanometer linker 101 also can be the nano composite linker 101 that is formed by combining by gold, silver, copper, indium, palladium or aluminium, and wherein the nano composite linker can comprise golden coated with silver nano particle, silver-colored coating golden nanometer particle, gold coating copper nano-particle, copper clad golden nanometer particle, silver coating copper nano-particle, copper clad Nano silver grain or aforesaid combination.In addition, the material of nanometer wire rod can be the composition metal that simple metal or more than one simple metal constitute.In one embodiment, the material of nanometer wire rod 102 is metals such as gold, silver, copper, indium, palladium or aluminium.Nanometer wire rod 102 can also be the nano composite wire rod that is formed by combining by gold, silver, copper, indium, palladium or aluminium, and wherein the nano composite wire rod can comprise golden coated with silver nanometer wire rod, silver-colored coating gold nano wire rod, gold coating copper nano-wire material, copper clad gold nano wire rod, silver coating copper nano-wire material, copper clad nano silver wire material or aforesaid combination.
Among one embodiment, in the electric conducting material of the present invention, in nanometer wire rod 102 formed network configurations, only add the nanometer linker 101 of proper proportion, to fill up the space between the network configuration after the moulding at normal temperatures, mode through low-temperature heat or illumination, the nanometer linker is melted and binding nanometer wire rod or nanometer linker on every side, promote evenness, density and the conductive characteristic of electric conducting material thus.Heating-up temperature is one of them reason that influences conductivity, because be heated and when fusing, its cohesive force can make it agglomerated together when nano particle, and then forms island, causes whole conductivity to descend.Among one embodiment, the electric conducting material that mixes nanometer wire rod 102 and nanometer linker 101 can be heated to or less than 200 ℃, approximately through 1 hour time, mixes cohering of 101 of nanometer wire rod 102 and nanometer linker to promote.When using part fusing point lower nanometer wire rod 102 with nanometer linker 101, for example Yin Nami linker or nano silver wire, because its fusing point (below 180 ℃) is lower than 200 ℃, therefore nanometer wire rod 102 and 101 of nanometer linker can produce low sintering phenomenon, have bigger continuous part in the electric conducting material and make.Nanometer wire rod 102 produces tight binding by the sintering of nanometer linker 101, can further promote the conductivity of electric conducting material.Electric conducting material of the present invention need not high temperature sintering, therefore can avoid the harmful effect that produces because of high temperature sintering.
Following illustrative example is done more detailed explanation to the present invention.
Experimental example 1:
That experimental example 1 is described is the preparation method who makes electric conducting material.The ethylene glycol of preparing 100 grams are with as solvent.Add the Yin Nami linker of 15 grams and the mixture of nano silver wire, utilize mixer to stir then.Add the polyvinylpyrrolidone (polyvinyl-pyrrolidone) of 1.5 grams subsequently and be used as the binding agent, continue to stir action.At last, add the rheological agent (BYK-410 that Byk-Chemie produced) of about 0.3 gram, after stirring, can finish the making of spray printing with electrically conductive ink.To blend together solution (resulting solution) and coat on the substrate, and be heated to about 110 ℃ and made its curing in about 15 minutes, and promptly finish tentatively and on substrate, make conductive layer.In the experimental example 1, nano silver wire material and Yin Nami linker can be allocated in varing proportions, and its ratio can be 0.1～9 weight ratio allotment.
Electric conducting material after the curing, its silver-colored nanometer linker can be filled up the space between the network configuration that nano silver wire forms.
Fig. 3 shows that the ratio that the electric conducting material of one embodiment of the invention includes nanometer wire rod and nanometer linker is the sweep electron microscope photo of 4: 1 (ratio is 4.0).This photo demonstration Yin Nami linker can partly be filled up the space between the nano silver wire.
Fig. 4 shows that the ratio that the electric conducting material of one embodiment of the invention includes nanometer wire rod and nanometer linker is the sweep electron microscope photo of 3: 2 (ratio is 1.5).This photo shows that it is 4: 1 electric conducting material that the Yin Nami linker can be filled up ratio that the space between the nano silver wire and the rate of filling up be higher than nanometer wire rod and nanometer linker significantly.
Fig. 5 shows that the ratio that the electric conducting material of one embodiment of the invention includes nanometer wire rod and nanometer linker is the sweep electron microscope photo of 2: 3 (ratio is 0.7).This photo demonstration Yin Nami linker can be filled up between the nano silver wire fully, and forms suitable even curface.
Fig. 6 shows that the ratio that the electric conducting material of one embodiment of the invention includes nanometer wire rod and nanometer linker is the sweep electron microscope photo of 1: 4 (ratio is 0.3).This photo demonstration Yin Nami linker can intactly be filled up between the nano silver wire, and forms even curface.
Fig. 7 shows in one embodiment of the invention in varing proportions after the combined silver nanometer linker and nano silver wire, the experimental data figure of the surface roughness of electric conducting material.Significantly, do not add its roughness that measures of electric conducting material of any silver-colored nanometer linker above 500 nanometers.When the ratio of nanometer wire rod and nanometer linker was 4: 1, the roughness of electric conducting material can be reduced to below 250 nanometers.When reducing nano-silver thread when ratio is 3: 2, the roughness of electric conducting material can be reduced to below 50 nanometers.Afterwards, along with the ratio of adding the Yin Nami linker increases, the roughness of electric conducting material presents reduction lentamente.In other words, when the addition of silver-colored nanometer linker was in 40%, the roughness of electric conducting material can be improved significantly.When reaching 40% percentage by weight, than un-added electric conducting material, roughness improves 93%.Therefore, the Yin Nami linker is mixed into nano silver wire, can improves the roughness of electric conducting material significantly.
Be used to prepare the solvent that blendes together solution and can be water, alcohols such as methyl alcohol, butanols, isopropyl alcohol, terpinol or ethylene glycol etc., ketone such as acetone or cyclohexanone, aromatic series such as toluene or dimethylbenzene etc., ethers such as EGME or butyl glycol ether etc. or ester class such as polyvinyl acetate (polyvinyl acetate) etc.And the binding agent of electrically conductive ink can be used macromolecular material such as polyethylene (PE), polyvinyl alcohol (PVA), polyethylene glycol (PEG), polymethyl methacrylate (PMMA) etc.Other auxiliary agent such as methylcellulose (methylcellulose), ethyl cellulose (ethylcellulose), hydroxyethylcellulose (hydroxyethylcellulose) and algin (sodium alginate) etc.
In addition, the aforementioned only electric conducting material behind overcuring can heat 200 ℃, 1 hour, perhaps with low-energy rayed, promoted conductivity.
Fig. 8 shows the sweep electron microscope photo of the electric conducting material after 200 ℃ of heating, and nanometer wire rod and nanometer linker mixed proportion in this electric conducting material are 4: 1 weight ratios.After photo shows sintering, the thicker partial continuous structure that formation is cohered each other in the electric conducting material, list structure (elongatedbulk structure) and the bulk particle (bulk particle) of particle diameter above 200 nanometers.
Fig. 9 shows the sweep electron microscope photo of the electric conducting material after 200 ℃ of heating, and nanometer wire rod and nanometer linker mixed proportion in this electric conducting material are 3: 2 weight ratios.After photo shows sintering, formation is cohered each other in the electric conducting material thicker continuous structure, list structure, bulk particle and laminated structure.
Figure 10 shows the sweep electron microscope photo of the electric conducting material after 200 ℃ of heating, and nanometer wire rod and nanometer linker mixed proportion in this electric conducting material are 2: 3 weight ratios.After photo showed sintering, electric conducting material formed continuous structure, block structure (bulk structure) and bulk particle inner the branch.
Figure 11 shows the sweep electron microscope photo of the electric conducting material after 200 ℃ of heating, and nanometer wire rod and nanometer linker mixed proportion in this electric conducting material are 1: 4 weight ratio.After photo shows sintering, form block structure and the bulk particle that is attached to block structure in the electric conducting material.
Figure 12 show in varing proportions the Yin Nami linker and the experimental data figure of the sheet resistance (sheet resistance) of the mixed electric conducting material of nano silver wire, its unit is ohm/sq.According to shown in Figure 12, by the electric conducting material that the Yin Nami linker and the nano silver wire of different proportion are made, its sheet resistance is also different significantly.Only through program curing, electric conducting material (being represented by dotted lines) without heat-agglomerating, after a spot of silver-colored nanometer linker of interpolation is in the network configuration of nano silver wire, sheet resistance value can reduce gradually, up to when the Yin Nami linker of adding 20 percentage by weights is in the network configuration of nano silver wire, it is about 20% that sheet resistance value can reduce, and therefore has the effect that improves conductivity.Afterwards, sheet resistance value is again along with the ratio of Yin Nami linker interpolation increases and increases.
In addition, heating through 200 ℃, the sheet resistance value of all electrically conductive materials (representing with solid line) all reduces, when especially the shared content of Yin Nami linker is high, the degree that descends is obvious, and the electric conducting material that wherein adds the Yin Nami linker of percentage by weight 20% to 60% has lower sheet resistance value.
Experimental example 2:
But that experimental example 2 is described is the preparation method who makes the formed at normal temp electric conducting material.The low melting point solvent (as: ethanol, isopropyl alcohol) of preparing 100 grams is as solvent.Add the Yin Nami linker of 20 grams and mixture (the nanometer wire rod: nanometer linker=4: 1), utilize mixer to stir then of nano silver wire.Add the polyvinylpyrrolidone (polyvinyl-pyrrolidone) of 1.5 grams subsequently and be used as the binding agent, continue to stir action.At last, add the rheological agent (BYK-410 that Byk-Chemie produced) of about 0.3 gram, after stirring, can finish the making of spray printing with electrically conductive ink.To blend together solution (resultingsolution) and coat on the substrate, and place normal temperature and make its curing after about 20 minutes, and promptly finish tentatively and on substrate, make conductive layer.The result shows after testing, and when the electric conducting material coating thickness was 3um, its conductivity can reach 3.0 * 10
6S/m (sheet resistance is 0.11ohm/sq).When increasing the ratio of nanometer linker, its sheet resistance increases thereupon.
Experimental example 3:
That experimental example 3 is described is the electric conducting material preparation method who makes the screen painting processing procedure of can arranging in pairs or groups.The water of preparing 50 grams is as solvent.Add the methylcellulose (methylcellulose) of 1.5 grams subsequently and be used as thickener, utilize mixer to stir then.Add the Yin Nami linker of 50 grams and mixture (the nanometer wire rod: nanometer linker=4: 1), continue to stir action of nano silver wire.At last, add about 0.3 rheological agent (BYK-410 that Byk-Chemie produced) that restrains can be finished the electrically conductive ink of screen painting after stirring making.To blend together solution (resulting solution) and coat on the substrate, and be heated to about 100 ℃ and make its curing after about 20 minutes, and promptly finish tentatively and on substrate, make conductive layer by half tone.The result shows after testing, and when the electric conducting material coating thickness was 124um, its sheet resistance can reach 0.09ohm/sq.
The conducting film 3 of the collocation spray printing processing procedure of Figure 13 to 15 demonstration one embodiment of the invention and 3 ' preparation method's schematic flow sheet.As shown in figure 13, at first provide substrate 1, substrate 1 can be base materials such as polyphenyl dicarboxylate (PET), polyimides (PI), Silicon Wafer or glass substrate.But being blended together solution, the spray printing formula of aforementioned preparation coats on the substrate 1, to form conducting film 3 by nozzle 2.Base material top position between the position ( arrow 20,21 indications) that nozzle 2 is moved can produce conducting film 3.As shown in figure 15, but then can nozzle 2 be moved to other position (positions of arrow 22 indications) by programming and carry out conducting film and make 3 ', the conducting film of patterning can be got at last.The conducting film 3 and 3 of patterning ' can be through heating or illumination, to promote its conductivity.Aforesaid conducting film 3 can be used for providing electromagnetic shielding, antistatic, and its preparation method can be used for making the conductive layer of devices such as LCD screen, solar cell.
Figure 16 to Figure 20 shows the conducting film 6 of the collocation screen painting processing procedure of one embodiment of the invention ' and 6 " schematic flow sheets of preparation method.As shown in figure 16, at first provide substrate 1, substrate 1 can be base materials such as polyphenyl dicarboxylate (PET), polyimides (PI), Silicon Wafer or glass substrate.And place above it and had the half tone 4 and the scraper 5 of patterning.As shown in figure 17, but the screen painting formula of aforementioned preparation blended together solution 6 be applied to half tone 4 tops.As shown in figure 18, scraper 5 is moved arrow 30 indication positions with horizontal direction, the hole in the mobile route on the web plate 4 can be filled up by electric conducting material 6, the conducting film 6 that formation contacts with the base version '.As shown in figure 19, the remaining solution 6 that blendes together can be by other position that moves to of scraper, and breach designed on the half tone 4 is mended full, and form conducting film 6 ".As shown in figure 20, the half tone on the substrate 14, scraper 5 and residue are blended together after solution 6 removes, can obtain the substrate of tool patterning conductive material.The conducting film 6 of patterning ' reach 6 " can be through heating or illumination, to promote its conductivity.
In sum, mix nanometer linker and nanometer wire rod in the electric conducting material of the present invention simultaneously, can promote its conductivity and evenness.And when electric conducting material through the heating after, can further promote its conductivity.
Technology contents of the present invention and technical characterstic disclose as above, yet those skilled in the art still may be based on teaching of the present invention and announcements and done all replacement and modifications that does not deviate from spirit of the present invention.Therefore, protection scope of the present invention should be not limited to the content that embodiment discloses, and should comprise various do not deviate from replacement of the present invention and modifications, and is contained by the scope of following claims.
Claims (46)
1. electric conducting material that is shaped by luminous energy or heat energy, it comprises:
A plurality of nanometer wire rods; And
A plurality of nanometer linker;
Wherein, the part by weight between this nanometer wire rod and this nanometer linker is 9: 1～1: 9.
2. electric conducting material according to claim 1, wherein the length-width ratio of this nanometer wire rod is 10～800.
3. electric conducting material according to claim 2, wherein the length-width ratio of this nanometer wire rod is 200～500.
4. electric conducting material according to claim 1, wherein the particle diameter of this nanometer linker is less than 100 nanometers.
5. electric conducting material according to claim 1, wherein the part by weight of this nanometer wire rod and this nanometer linker is 8: 2～4: 6.
6. electric conducting material according to claim 1, wherein the material of this nanometer wire rod is gold, silver, copper or aforesaid combination.
7. electric conducting material according to claim 1, wherein the material of this nanometer linker is gold, silver, copper or aforesaid combination.
8. electric conducting material according to claim 1, wherein this nanometer wire rod is golden coated with silver nanometer wire rod, silver-colored coating gold nano wire rod, gold coating copper nano-wire material, copper clad gold nano wire rod, silver coating copper nano-wire material, copper clad nano silver wire material or aforesaid combination.
9. electric conducting material according to claim 1, wherein this nanometer linker is golden coated with silver nano particle, silver-colored coating golden nanometer particle, gold coating copper nano-particle, copper clad golden nanometer particle, silver coating copper nano-particle, copper clad Nano silver grain or aforesaid combination.
10. electric conducting material according to claim 1, wherein this electric conducting material is a conducting film.
11. an electric conducting material that is shaped by luminous energy or heat energy, it comprises nanometer wire rod and nanometer linker, wherein this nanometer wire rod and the shared part by weight of this nanometer linker be about 1: 9～9: 1.
12. electric conducting material according to claim 11, wherein the length-width ratio of this nanometer wire rod is 10～800.
13. electric conducting material according to claim 12, wherein the length-width ratio of this nanometer wire rod is 200～500.
14. electric conducting material according to claim 11, wherein the particle diameter of this nanometer linker is less than 100 nanometers.
15. electric conducting material according to claim 11, wherein this nanometer wire rod and the shared part by weight of nanometer linker be about 4: 1～2: 3.
16. electric conducting material according to claim 11, wherein the material of this nanometer wire rod is gold, silver, copper or aforesaid combination.
17. electric conducting material according to claim 11, wherein this nanometer wire rod is golden coated with silver nanometer wire rod, silver-colored coating gold nano wire rod, gold coating copper nano-wire material, copper clad gold nano wire rod, silver coating copper nano-wire material, copper clad nano silver wire material or aforesaid combination.
18. electric conducting material according to claim 11, wherein this nanometer linker is golden coated with silver nano particle, silver-colored coating golden nanometer particle, gold coating copper nano-particle, copper clad golden nanometer particle, silver coating copper nano-particle, copper clad Nano silver grain or aforesaid combination.
19. electric conducting material according to claim 11, wherein this electric conducting material is a conducting film.
20. the preparation method of an electric conducting material, it comprises the following step:
Provide to blend together solution, this blendes together solution and comprises nanometer wire rod and nanometer linker, and wherein the part by weight of this nanometer wire rod and this nanometer linker is 9: 1～1: 9; And
Solidify this and blend together solution, in order to obtain the mixture of this nanometer wire rod and this nanometer linker.
21. preparation method according to claim 20 wherein further comprises this mixture is heated to and is lower than 200 ℃ temperature.
22. preparation method according to claim 20, it further comprises with this mixture of rayed, promotes its conductivity.
23. preparation method according to claim 20, wherein the length-width ratio of this nanometer wire rod is 10～800.
24. preparation method according to claim 23, wherein the length-width ratio of this nanometer wire rod is 200～500.
25. preparation method according to claim 20, wherein the particle diameter of this nanometer linker is less than 100 nanometers.
26. preparation method according to claim 20, wherein the part by weight of this nanometer wire rod and this nanometer linker is 4: 1～2: 3.
27. preparation method according to claim 20, wherein the material of this nanometer wire rod is gold, silver, copper or aforesaid combination.
28. preparation method according to claim 20, wherein the material of this nanometer linker is gold, silver, copper or aforesaid combination.
29. preparation method according to claim 20, wherein this nanometer wire rod is golden coated with silver nanometer wire rod, silver-colored coating gold nano wire rod, gold coating copper nano-wire material, copper clad gold nano wire rod, silver coating copper nano-wire material, copper clad nano silver wire material or aforesaid combination.
30. preparation method according to claim 20, wherein this nanometer linker is golden coated with silver nano particle, silver-colored coating golden nanometer particle, gold coating copper nano-particle, copper clad golden nanometer particle, silver coating copper nano-particle, copper clad Nano silver grain or aforesaid combination.
31. preparation method according to claim 20, wherein this blendes together solution and comprises solvent, this solvent is water, alcohols, ketone, aromatic series, ethers, ester class or aforesaid mixture, and wherein the weight of this solvent accounts for 10%～80% in this blendes together the weight of solution.
32. preparation method according to claim 31, wherein this solvent is water, methyl alcohol, butanols, isopropyl alcohol, terpinol, ethylene glycol, acetone, cyclohexanone, toluene and dimethylbenzene, EGME, butyl glycol ether or polyvinyl acetate (polyvinyl acetate).
33. an electrically conductive composition, it comprises:
Blend together solution, comprise nanometer wire rod and nanometer linker;
Wherein this nanometer wire rod and the shared part by weight of this nanometer linker be about 1: 9～9: 1.
34. electrically conductive composition according to claim 33, wherein the length-width ratio of this nanometer wire rod is 10～800.
35. electrically conductive composition according to claim 34, wherein the length-width ratio of this nanometer wire rod is 200～500.
36. electrically conductive composition according to claim 33, wherein the particle diameter of this nanometer linker is less than 100 nanometers.
37. electrically conductive composition according to claim 33, wherein the part by weight of this nanometer wire rod and this nanometer linker is 8: 2～4: 6.
38. electrically conductive composition according to claim 33, wherein the material of this nanometer wire rod is gold, silver, copper or aforesaid combination.
39. electrically conductive composition according to claim 33, wherein the material of this nanometer linker is gold, silver, copper or aforesaid combination.
40. electrically conductive composition according to claim 33, wherein this nanometer wire rod is golden coated with silver nanometer wire rod, silver-colored coating gold nano wire rod, gold coating copper nano-wire material, copper clad gold nano wire rod, silver coating copper nano-wire material, copper clad nano silver wire material or aforesaid combination.
41. electrically conductive composition according to claim 33, wherein this nanometer linker is golden coated with silver nano particle, silver-colored coating golden nanometer particle, gold coating copper nano-particle, copper clad golden nanometer particle, silver coating copper nano-particle, copper clad Nano silver grain or aforesaid combination.
42. electrically conductive composition according to claim 33, wherein this blendes together solution and comprises solvent, this solvent is water, alcohols, ketone, aromatic series, ethers, ester class or aforesaid mixture, and wherein the weight of this solvent accounts for 10%～80% in the weight of this electrically conductive composition.
43. according to the described electrically conductive composition of claim 42, wherein this solvent is water, methyl alcohol, butanols, isopropyl alcohol, terpinol, ethylene glycol, acetone, cyclohexanone, toluene and dimethylbenzene, EGME, butyl glycol ether etc. or polyvinyl acetate (polyvinyl acetate).
44. electrically conductive composition according to claim 33 wherein also comprises macromolecular material, its weight accounts for below 20% of this electrically conductive composition weight.
45. according to the described electrically conductive composition of claim 44, wherein this macromolecular material is polyethylene (PE), polyvinyl alcohol (PVA), polyethylene glycol (PEG), polymethyl methacrylate (PMMA), methylcellulose (methylcellulose), ethyl cellulose (ethylcellulose), hydroxyethylcellulose (hydroxyethylcellulose) or algin (sodium alginate).
46. electrically conductive composition according to claim 33 wherein also comprises viscosity modifier, wherein the weight of this viscosity modifier accounts for below 5% of this electrically conductive composition weight.
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