CN102011162A - Method and device for electroplating sheets - Google Patents
Method and device for electroplating sheets Download PDFInfo
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- CN102011162A CN102011162A CN 201010295935 CN201010295935A CN102011162A CN 102011162 A CN102011162 A CN 102011162A CN 201010295935 CN201010295935 CN 201010295935 CN 201010295935 A CN201010295935 A CN 201010295935A CN 102011162 A CN102011162 A CN 102011162A
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- shoves
- plating tank
- electroplate liquid
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Abstract
The invention discloses a method and a device for electroplating sheets. The method comprises the steps of: adopting an electroplating bath with an inner width below 2cm; arranging surge flow devices and anode devices at two opposite sides in the electroplating bath; and providing suction force on the bottom surface of the electroplating bath, wherein the suction force is used for causing the electroplating liquid in the electroplating bath to flow downwards so as to discharge the electroplating liquid; the electroplating liquid flows out from the surge flow devices and the anode devices and then enters the electroplating bath; included angles are formed between the surge flow outlets of the surge flow devices and the horizontal plane; the flow rate of the electroplating liquid flowing out from the surge flow devices is greater than that of the electroplating liquid flowing out from the anode devices; and sheets are vertically conveyed in the electroplating liquid in the electroplating bath so that the electroplating operation is carried out. The device cooperated with the method comprises the electroplating bath, a plurality of surge flow devices, a plurality of anode devices and a traversing conveyer. In the invention, the sheets are prevented from deforming or swaying in the conveying process in the electroplating bath, and sheet blocking caused by the deflection of the ultrathin sheets and the interference of the separation sheets of the anode devices is prevented, and the product yield is greatly enhanced.
Description
Technical field
The present invention be more particularly directed to a kind of avoiding at the method and apparatus that ultra-thin plate is carried out touching in the electroplating processes process plate face.
Background technology
The plate processing procedure that printed circuit board (PCB) or other are laid with circuit must pass through the electroplating processes program.Therefore early stage plate all adopts the horizontal feed mode to carry in the electroplating processes processing procedure because thickness is bigger.Along with the continuous evolution of technology and the requirement of electronic product slimming and light and handyization; the thickness of some printed circuit board (PCB)s or relevant plate is thin (about 25 μ m～75 μ m) more and more; so that plate has become ultrafine soft board; therefore, if adopt traditional horizontal feed mode to carry soft board, sheet material will cause the plate distortion because of flexibility and the action of gravity of self; cause clamp at course of conveying easily; plate is damage therefore, even causes shutdown, and the product fraction defective is quite high.
Summary of the invention
The objective of the invention is to propose a kind of method and apparatus of electroplating thin plate; when adopting the horizontal feed mode to carry out the electroplating processes processing procedure, cause clamp at course of conveying easily, the plate damage to solve ultra-thin soft board; even cause shutdown, the problem that the product fraction defective is high.
For reaching the foregoing invention purpose, the present invention has adopted following technical scheme:
A kind of method of electroplating thin plate, it is characterized in that, this method is: adopting an inner width is the plating tank of 1～2cm, and the relative both sides in this plating tank all are provided with shove device and anode assembly, be provided as simultaneously and discharge electroplate liquid and make electroplate liquid mobile suction down in the plating tank in the bottom surface of plating tank, electroplate liquid flows out in the plating tank from shove device and anode assembly respectively, the shoving of device of shoving has an angle between outlet and the horizontal plane, the electroplate liquid flow velocity that shoves from the device that shoves is greater than from the effusive electroplate liquid flow velocity of anode assembly, one plate carries out electroplating activity to be transferred in the electroplate liquid of upright state in plating tank, by the described electroplate liquid that shoves plate is supported, avoid plate to contact with anode assembly.
Say that further described anode assembly is located at two of the relative both sides of plating tank and is shoved between the device.
The described device that shoves is the pipe that shoves, described angle be shove pipe axially and the angle between the horizontal plane.
The described pipe that shoves axially and the angle between the horizontal plane be 70 °～80 °, and the upper end of the pipe that shoves than approaching being transferred in lower end and plate.
The flow velocity of the described electroplate liquid that shoves is 0.3～1m/sec.
Described plate is in plating tank the time, and the optimum distance between the outermost surfaces of this plate surface and this anode assembly is 6～15mm.
A kind of device of electroplating thin plate is characterized in that, this device comprises:
One plating tank, having inner width is the district of immersing of 1～2cm, the bottom surface of this plating tank is provided with the return port that plural number distributes along its length direction;
The plural number device that shoves is located at the relative both sides in the plating tank, provides the electroplate liquid that shoves to enter in the plating tank, and shoving of the device that shoves has an angle between outlet and the horizontal plane, and the device that shoves of the relative both sides of plating tank staggers mutually in asymmetric position;
The plural number anode assembly is located at the relative both sides in the plating tank, and each anode assembly is located at two and is shoved between the device, and this anode assembly provides electroplate liquid to pass through and flows in the plating tank;
One traversing transfer roller is in order to carry a plate to move towards horizontal direction in the electroplate liquid of upright state in plating tank.
Particularly, the described device that shoves is the pipe that shoves, described angle be this pipe that shoves axially and the angle between the horizontal plane, this angle is 70 °～80 °, and the upper end of the pipe that shoves than approaching being transferred in lower end and plate.
Described anode assembly includes the baffler that an anode network and has plural inclination slotted eye, and the vergence direction of this slotted eye is that a high end is met to described plate and carried and the direction of coming.
Two lateral walls in the described plating tank is respectively equipped with first chute of plural number inclination one aforementioned angle, the relative both sides of the described device that shoves are respectively equipped with one first slide rail and one second slide rail, the relative both sides of described baffler are respectively equipped with one second chute, by the cooperate interior sidewall surface that for shove device be combined in plating tank of this first slide rail, make anode assembly be combined in two by this second slide rail and cooperating of second chute and shove between the device with first chute.
Below principle of the present invention is done to discuss in detail:
The present invention system utilizes traversing transfer roller with thin plate clamping and conveying, makes thin plate maintain in the plating tank of splendid attire electroplate liquid horizontal direction with upright state and carries; When thin plate moves horizontally in plating tank, provide the electroplate liquid that shoves to flow at the inner surface of plating tank, and both sides are provided with plural anode assembly in plating tank, the metal ion that electroplate liquid contains positively charged after by anode assembly forms coating to be attached on the plate that electrically connects negative electrode, utilize the electroplate liquid that shoves as the spacer medium between thin plate and anode assembly simultaneously, avoid plate to contact and may cause abrading or scrape the broken string road, even cause the problem of clamp with anode assembly.
Moreover, the relative both sides that the present invention ties up in the plating tank provide the from top to bottom electroplate liquid of gradual reactive force to plate, and the generation of the bottom in plating tank suction down, the sheet member that makes the top be held in traversing transfer roller is maintained stable upright state conveying and advances in plating tank.
Postscript, the present invention ties up to the plating tank both sides and provides toward asymmetric direction and spray the electroplate liquid that dashes respectively, make electroplate liquid can with high exchange rate by plate through hole or enter blind hole.
In addition, the present invention system provides modular shove device and anode assembly can be assembled in the design of plating tank both sides apace.
It only is the plating tank of 1～2cm that mat of the present invention provides an inner width, relative both sides in the plating tank are provided with plural number shove device and anode assembly respectively, the device that shoves has the pipe that shoves, shove pipe axially and the angle that tilts between the horizontal plane, the upper end that makes the pipe that shoves than approaching being transferred in lower end and plate; One anode assembly of each side of plating tank is located at two and is shoved between the device.Plate is transferred towards horizontal direction in plating tank with upright state, by the effusive electroplate liquid of anode assembly except provide band just with metal ion form the coating to be attached to the plate surface that electrically connects negative electrode, the electroplate liquid that shoves also provides as the spacer medium between plate and the anode assembly; In addition, plate is transferred when shoving device and anode assembly, the different positions of plate both sides bears the electroplate liquid that shoves from top to bottom gradually, disperse to shove the reactive force of electroplate liquid by this to plate, avoid plate to be subjected to the reactive force of concentrations and be out of shape or rock, cooperate the plural return port of being located at the plating tank bottom surface to discharge the down suction that electroplate liquid produced again, be maintained ultra-thin plate and carry stably.
As a kind of selection, the pipe that shoves that the present invention is obliquely installed, its axially and the optimum angle between the horizontal plane be 70 °～80 °.
As another preferable selection, the flow rate of liquid that the present invention is shoved from the device that shoves is 0.3～1m/s.
The present invention's anode assembly includes an anode network, and a baffler with plural inclination slotted eye, and this anode network is located at the one side of this resistance pole plate, the baffler both sides can with the two device combinations of shoving, use that anode assembly is shoved between the device two; The vergence direction of described slotted eye is that a high end is met to described plate and carried and the direction of coming, and uses and reduces in the plate course of conveying, and plate angle end snaps in slotted eye and causes clamp.
By aforementioned method and apparatus of the present invention, for thin plate with upright state in plating tank during horizontal feed, the utilization electroplate liquid that shoves flows as the spacer medium between thin plate and the anode assembly at the inner surface of plating tank, can avoid thin plate to contact with anode assembly, and the electroplate liquid that utilizes an angle to shove, avoided ultra-thin plate both sides to be subjected to the electroplate liquid reactive force that shoves of concentrations, thereby avoid plate in plating tank course of conveying distortion or rock, prevent that ultra-thin plate from because of the baffler interference of deflection and anode assembly causes clamp, significantly improving product yield.
Description of drawings
Fig. 1 electroplates the front view of thin-plate devices for the present invention;
Fig. 2 electroplates the side-view of thin-plate devices for the present invention;
Fig. 2 A is the partial enlarged drawing in the 2A zone of Fig. 2;
Fig. 3 electroplates the partial elevation view of thin-plate devices for the present invention;
Fig. 4 electroplates the partial top view of thin-plate devices for the present invention;
Fig. 5 A is installed on anode assembly one of partial elevation view of plating tank for the present invention;
Fig. 5 B for the present invention anode assembly is installed on plating tank partial elevation view two;
Fig. 5 C for the present invention anode assembly is installed on plating tank partial elevation view three;
Fig. 6 A is one of structural representation of anode assembly of the present invention;
Fig. 6 B is two of the structural representation of anode assembly of the present invention;
Fig. 6 C is three of the structural representation of anode assembly of the present invention;
Fig. 6 D is four of the structural representation of anode assembly of the present invention;
More than assembly shown in each figure and symbol thereof be respectively:
1 ... plating tank, 10 ... immerse the district, 11 ... first chute, 12 ... return port, 2 ... device shoves, 20 ... pipe shoves, 21 ... the hole of shoving, 22 ... first slide rail, 23 ... second slide rail, 3 ... anode assembly, 31 ... baffler, 311 ... second chute, 312 ... slotted eye, 32 ... anode network, 33 ... the titanium frame, 34 ... PP cloth, 4 ... traversing transfer roller, 41 ... clamper, 5 ... plate, W ... the plating tank width, θ ... angle.
Embodiment
Following conjunction with figs. is done more detailed description to embodiments of the present invention, in order to do those skilled in the art can be implemented after studying this specification sheets carefully according to this.
Fig. 1 electroplates the device of thin plate to the present invention of being shown in Figure 4, it includes a plating tank 1, be configured to immersing of splendid attire electroplate liquid between plating tank 1 two lateral walls and distinguish 10, the optimum width W scope of immersing between the district 10 is 1～2cm, the top of plating tank 1 is provided with the traversing transfer roller 4 that comprises the lifting plate fetching machine, and the clamper 41 that can move along traversing transfer roller 4, clamper 41 is to be used for clamping thin type plate 5, carries plates 5 to move horizontally in immersing district 10 by traversing transfer roller 4 again; Plate 5 is immersing 10 top, district when terminal, then carries by the lifting plate fetching machine and respectively plate is immersed or take out and immerse the district.
Relative both sides in the plating tank 1 are provided with plural number shove device 2 and anode assembly 3 respectively obliquely; Its set-up mode, relative two inner-wall surfaces that tie up to plating tank 1 are provided with first chute 11 (consulting shown in Fig. 5 A) of plural number inclination one angle respectively.The device 2 that shoves is a kind of pipes 20 that shove at embodiments of the invention, on one side it is provided with along the plural number of axially the lining up at least one row hole 21 of shoving of the pipe that shoves; Pipe 20 the relative both sides, rear end of shoving are provided with symmetric first slide rail 22, pipe 20 the relative both sides of front end of shoving are provided with symmetric second slide rail 23, first slide rail 22 is slipped into first chute 11 (consulting shown in Fig. 5 B), and the pipe 20 that can will shove is combined in the interior wall of plating tank one by one; After the pipe 20 that respectively shoves was finished and is combined in plating tank, adjacent two second slide rails 23 that shove pipe were symmetry, by second slide rail, 23 recombinant anode assemblies 3 (consulting shown in Fig. 5 C).The bottom surface of plating tank 1 is provided with a plurality of return ports 12 that distribute along its length direction, and return port 12 is connected to the filter plant (not shown) with pipeline, and the electroplate liquid after will being filtered by pumping again is delivered to plating tank and recycles.
Consult shown in Fig. 6 A to Fig. 6 D, the present invention's anode assembly 3 includes an iridium oxide anode network 32 (consulting Fig. 6 A), that is located on the titanium frame 33 and covers in the baffler 31 (consulting Fig. 6 C and Fig. 6 D) that the PP of anode network 32 cloth 34 (consulting Fig. 6 B) and one is used for and anode network 32 makes up, baffler 31 is provided with the slotted eye 312 of plural number inclination one angle, and be provided with second chute 311 in the relative both sides of baffler 31, the inclination mode of this slotted eye 312 is the high end of slotted eye to be met to plate carry and next direction; After the anode network 32 that is provided with PP cloth 34 is combined in baffler 31 rears, again second chute 311 of baffler 31 both sides, second slide rail 23 with pipe 20 both sides of shoving is slidingly matched, makes whole anode assembly 3 be located at two and shove between the device 2; Structure design by this, no matter be to shove device or anode assembly maintenance or eliminate and change renewal, all very convenient.In addition, anode assembly 3 of the present invention is combined in plating tank two rear flank, the plate of in immersing the district, advancing, and its plate surface and the optimum distance between the anode network 32 of anode assembly 3 outermost are 6～15mm.
To shove pipe 20 of the present invention system is connected to the pumping (not shown) via pipeline, and pumping is delivered to the pipe 20 that shoves with electroplate liquid via pipeline, and then is shoved by the hole 21 of shoving; The optimum flow rate that electroplate liquid shoves from the hole 21 of shoving is 0.3～1m/sec, to avoid ultra-thin plate is caused too high reactive force and be out of shape or rock.The angle of inclination that the pipe 20 that shoves is located at plating tank, be its axially and the angle theta optimum range between the horizontal plane be 70 °～80 °, and the pipe 20 that shoves that tilts, its upper end than the lower end near being transferred and the plate 5 that comes.The device 2 that shoves of plating tank 1 relative both sides is not to be located at symmetric position, but the suitable distance (consulting shown in Figure 4) that staggers mutually, in order to do make the effusive electroplate liquid of pipe that shoves from both sides can high exchange rate through hole or blind hole by plate.
Utilize aforesaid carrying method and device, the present invention uses when electroplating the thin plate processing procedure, tie up to thin plate be erected to enter in the plating tank 1 before, promptly enter plating tank, and return port 12 also continues the electroplate liquid in the plating tank is expelled to and carries regurgitate stream pipe 20 to flow into plating tanks again after filter plant is finished filtration from the pipe 20 that shoves of plating tank 1 both sides hole 21 electroplate liquid that continues to gush out that respectively shoves; Electroplate liquid forms one deck medium flowing of plating tank 1 relative two inner surfaces by shoving, enter plating tank 1 and conveying in the horizontal direction by 41 gripping panels 5 of the clamper on the traversing transfer roller 4 then, in course of conveying, plate 5 relative both sides are subjected to shoving the supporting of electroplate liquid and effect and produce buffer actions with anode assembly 3, avoid ultra-thin plate 5 to contact with inflexible baffler 31, cooperate the design of the tilting slotted eye 312 on the baffler 31, can prevent the clamp problem that may cause.In addition, the present invention utilizes the device 2 that shoves that tilts an angle and be provided with, can be when shoving hole 21 in plate 5 horizontal feed, allow the both sides different positions of plate 5 from top to bottom bear the reactive force of the electroplate liquid that shoves progressively, produce plate toward drop-down suction when cooperating return port 12 to discharge electroplate liquid again, can avoid ultra-thin plate 5 to be subjected to the reactive force of concentrations and be out of shape or rock, cause the plate deflection and interfere with anode assembly and to cause clamp.
The above person only is in order to explain the present invention's preferred embodiment; be not that the attempt tool is to do any formal restriction to the present invention; be with, all have in following any modification or change of doing relevant the present invention of identical invention spirit, all must be included in the category that the invention is intended to protection.
Claims (10)
1. method of electroplating thin plate, it is characterized in that, this method is: adopting an inner width is the plating tank of 1～2cm, and the relative both sides in this plating tank all are provided with shove device and anode assembly, be provided as simultaneously and discharge electroplate liquid and make electroplate liquid mobile suction down in the plating tank in the bottom surface of plating tank, electroplate liquid flows out in the plating tank from shove device and anode assembly respectively, the shoving of device of shoving has an angle between outlet and the horizontal plane, the electroplate liquid flow velocity that shoves from the device that shoves is greater than from the effusive electroplate liquid flow velocity of anode assembly, one plate carries out electroplating activity to be transferred in the electroplate liquid of upright state in plating tank, by the described electroplate liquid that shoves plate is supported, avoid plate to contact with anode assembly.
2. the method for plating thin plate according to claim 1 is characterized in that, described anode assembly is located at two of the relative both sides of plating tank and is shoved between the device.
3. the method for plating thin plate according to claim 1 is characterized in that, the described device that shoves is the pipe that shoves, described angle be shove pipe axially and the angle between the horizontal plane.
4. the method for plating thin plate according to claim 3 is characterized in that, the described pipe that shoves axially and the angle between the horizontal plane be 70 °～80 °, and the upper end of the pipe that shoves than approaching being transferred in lower end and plate.
5. the method for plating thin plate according to claim 1 is characterized in that, the flow velocity of the described electroplate liquid that shoves is 0.3～1m/sec.
6. the method for plating thin plate according to claim 1 is characterized in that, described plate is in plating tank the time, and the optimum distance between the outermost surfaces of this plate surface and this anode assembly is 6～15mm.
7. a device of electroplating thin plate is characterized in that, this device comprises:
One plating tank, having inner width is the district of immersing of 1～2cm, the bottom surface of this plating tank is provided with the return port that plural number distributes along its length direction;
The plural number device that shoves is located at the relative both sides in the plating tank, provides the electroplate liquid that shoves to enter in the plating tank, and shoving of the device that shoves has an angle between outlet and the horizontal plane, and the device that shoves of the relative both sides of plating tank staggers mutually in asymmetric position;
The plural number anode assembly is located at the relative both sides in the plating tank, and each anode assembly is located at two and is shoved between the device, and this anode assembly provides electroplate liquid to pass through and flows in the plating tank;
One traversing transfer roller is in order to carry a plate to move towards horizontal direction in the electroplate liquid of upright state in plating tank.
8. the device of plating thin plate according to claim 7, it is characterized in that the described device that shoves is the pipe that shoves, described angle be this pipe that shoves axially and the angle between the horizontal plane, this angle is 70 °～80 °, and the plate that comes than approaching being transferred in lower end of the upper end of the pipe that shoves.
9. the device of plating thin plate according to claim 7 is characterized in that, described anode assembly comprises the baffler that an anode network and has plural inclination slotted eye, and the vergence direction of this slotted eye is that a high end is met to described plate and carried and the direction of coming.
10. the device of plating thin plate according to claim 7, it is characterized in that, two lateral walls in the described plating tank is respectively equipped with first chute of plural number inclination one aforementioned angle, the relative both sides of the described device that shoves are respectively equipped with one first slide rail and one second slide rail, the relative both sides of described baffler are respectively equipped with one second chute, by the cooperate interior sidewall surface that for shove device be combined in plating tank of this first slide rail, make anode assembly be combined in two by this second slide rail and cooperating of second chute and shove between the device with first chute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010295935 CN102011162B (en) | 2010-09-29 | 2010-09-29 | Method and device for electroplating sheets |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010295935 CN102011162B (en) | 2010-09-29 | 2010-09-29 | Method and device for electroplating sheets |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102011162A true CN102011162A (en) | 2011-04-13 |
| CN102011162B CN102011162B (en) | 2013-04-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201010295935 Active CN102011162B (en) | 2010-09-29 | 2010-09-29 | Method and device for electroplating sheets |
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| CN (1) | CN102011162B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103993339A (en) * | 2014-05-16 | 2014-08-20 | 昆山东威电镀设备技术有限公司 | Device and system for electroplating thin sheets |
| CN105063709A (en) * | 2015-09-18 | 2015-11-18 | 安捷利电子科技（苏州）有限公司 | Electroplating device for printed circuit board |
| CN107313085A (en) * | 2016-04-26 | 2017-11-03 | 中国科学院金属研究所 | The copper plating fill method of fine blind hole in a kind of high density circuit board |
| CN109972188A (en) * | 2017-12-28 | 2019-07-05 | 亚硕企业股份有限公司 | The movable protective mechanism of electroplating device |
| CN114686955A (en) * | 2020-12-29 | 2022-07-01 | 矽磐微电子(重庆)有限公司 | Anode assembly, electroplating apparatus, and method of manufacturing anode assembly |
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| CN201801621U (en) * | 2010-09-29 | 2011-04-20 | 苏州创峰光电科技有限公司 | Device for electroplating thin plate |
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| JP2008297574A (en) * | 2007-05-29 | 2008-12-11 | Nitto Denko Corp | Method of manufacturing electroplated film on fine material and apparatus used for the same |
| CN101815407A (en) * | 2010-05-10 | 2010-08-25 | 苏州创峰光电科技有限公司 | Sheet immersing treatment method and device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103993339A (en) * | 2014-05-16 | 2014-08-20 | 昆山东威电镀设备技术有限公司 | Device and system for electroplating thin sheets |
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| CN107313085A (en) * | 2016-04-26 | 2017-11-03 | 中国科学院金属研究所 | The copper plating fill method of fine blind hole in a kind of high density circuit board |
| CN107313085B (en) * | 2016-04-26 | 2019-10-22 | 中国科学院金属研究所 | The copper electroplating filling method of fine blind hole in a kind of high density circuit board |
| CN109972188A (en) * | 2017-12-28 | 2019-07-05 | 亚硕企业股份有限公司 | The movable protective mechanism of electroplating device |
| CN114686955A (en) * | 2020-12-29 | 2022-07-01 | 矽磐微电子(重庆)有限公司 | Anode assembly, electroplating apparatus, and method of manufacturing anode assembly |
| CN114686955B (en) * | 2020-12-29 | 2024-02-27 | 矽磐微电子(重庆)有限公司 | Anode assembly, electroplating device and manufacturing method of anode assembly |
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| CN102011162B (en) | 2013-04-03 |
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