CN104419915A - Chemical plating device - Google Patents
Chemical plating device Download PDFInfo
- Publication number
- CN104419915A CN104419915A CN201310385799.6A CN201310385799A CN104419915A CN 104419915 A CN104419915 A CN 104419915A CN 201310385799 A CN201310385799 A CN 201310385799A CN 104419915 A CN104419915 A CN 104419915A
- Authority
- CN
- China
- Prior art keywords
- welding wire
- liquid holding
- holding box
- liquid
- holding tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
Abstract
The invention relates to a chemical plating device. The chemical plating device comprises a first liquid-holding tank and a second liquid-holding tank, wherein the second liquid-holding tank is arranged inside the first liquid-holding tank, the height of the second liquid-holding tank is greater than that of the first liquid-holding tank, a plurality of welding wire limiting guide wheels are arranged at the top of the first liquid-holding tank at certain intervals and are distributed at both sides of the second liquid-holding tank, a welding wire inlet and a welding wire outlet are formed in positions, having the same height as the welding wire limiting guide wheels, on wall surfaces of both sides of the second liquid-holding tank, a guide pipe joint is formed in the bottom of the first liquid-holding tank and is connected to the interior of the second liquid-holding tank by virtue of the guide pipe and a water pump. By the chemical plating device, the complete contact of the chemical plating liquid and the welding wire can be ensured and the uniform and dense plated copper on the surface of the welding wire is ensured and the energy consumption can also be reduced.
Description
Technical field
The present invention relates to welding wire production field, particularly oneization plating appts.
Background technology
Welding is production technique conventional during current workpiece connects, and therefore, the demand of welding wire is larger.Welding wire in process of production, can at welding wire surface plating layer of metal copper, copper electroplating method is having plating and plating two kinds of modes usually, changing plating is pass in copper-bath by welding wire, welding wire surface is made to form layers of copper by replacement(metathesis)reaction, existingization plating appts, normally holding plating solution in a square groove, clean at welding wire surface after storing liquid material absorptionization plating solution by sponge etc., welding wire surface is made to form layers of copper, this mode welding wire is insufficient with the contact changing plating solution, therefore, usually fine and close layers of copper cannot be formed at welding wire surface, therefore, needs make improvements.
Summary of the invention
The object of the invention is to for existingization plating appts pointed in background technology in use welding wire with change plating solution and contact insufficient, the problem of the layers of copper of densification cannot be formed at welding wire surface, a kind of change plating appts that can solve foregoing problems is provided.
The technical scheme realizing goal of the invention of the present invention is as follows:
Oneization plating appts, it comprises the first liquid holding box and the second liquid holding box, second liquid holding box is arranged in the first liquid holding box, the height of the second liquid holding box is higher than the first liquid holding box, the top of the first liquid holding box is that certain intervals is provided with several welding wire spacing guide wheels, welding wire spacing guide wheel is distributed in the both sides of the second liquid holding box, the wall of the second liquid holding box both sides is provided with welding wire entrance with the position of welding wire spacing guide wheel equal height and welding wire exports, the bottom of the first liquid holding box is provided with catheter interface, catheter interface is connected in the second liquid holding box by conduit and water pump.
In order to slowing down plating solution take-off rate, described welding wire entrance and welding wire exit are provided with the stopper of the preventing plating solution ejection of quality of rubber materials.
Of the present inventionization plating appts in use, welding wire is led by the welding wire spacing guide wheel of the second liquid holding box side, enter in the second liquid holding box through welding wire entrance, because the height of the second liquid holding box is higher than the first liquid holding box, the liquid level of the second liquid holding box internalization plating solution is far above the height of welding wire entrance, therefore, after welding wire enters the second liquid holding box, welding wire can fully contact with change plating solution, guarantee that it completes replacement(metathesis)reaction fast, fine and close layers of copper is formed at welding wire surface, then, welding wire is through the welding wire outlet on the second liquid holding box, transfer to next station by welding wire spacing guide wheel and carry out respective handling, because welding wire entrance and welding wire exit having plating solution flow out, the change plating solution flowed out can be collected in the first liquid holding box, it can be made to be back in the second liquid holding box by water pump, pass through this set, can outside atmosphere be flowed into by preventing plating solution, cause environmental pollution.When changing plating appts work, water pump does not need to continue to open, and only have when the change plating solution in the first liquid holding box is expired soon, then open water pump, therefore, this set is more energy-conservation.Of the present inventionization plating appts structure is simple, can raising plate quality, reduce energy consumption simultaneously, enhance productivity.
Accompanying drawing explanation
Fig. 1 is the structural representation of of the present inventionization plating appts;
The vertical view of being of Fig. 2 plating appts;
In figure, 1 is the first liquid holding box, and 2 is the second liquid holding box, and 3 is welding wire spacing guide wheel, and 4 is welding wire entrance, and 5 is welding wire outlet, and 6 is catheter interface, and 7 is water pump, and 8 is stopper.
Embodiment
With reference to the one plating appts shown in Fig. 1 and Fig. 2, it comprises the first liquid holding box 1 and the second liquid holding box 2, second liquid holding box 2 is arranged in the first liquid holding box 1, the height of the second liquid holding box 2 is higher than the first liquid holding box 1, the top of the first liquid holding box 1 is that certain intervals is provided with several welding wire spacing guide wheels 3, welding wire spacing guide wheel 3 is distributed in the both sides of the second liquid holding box, the wall of the second liquid holding box 2 both sides is provided with welding wire entrance 4 with the position of welding wire spacing guide wheel 3 equal height and welding wire exports 5, the bottom of the first liquid holding box 1 is provided with catheter interface 6, catheter interface 6 is connected in the second liquid holding box 2 by conduit and water pump 7.
In order to slowing down plating solution take-off rate, described welding wire entrance and welding wire exit are provided with the stopper 8 of the preventing plating solution ejection of quality of rubber materials.
Claims (2)
1. change plating appts for one kind, it is characterized in that: it comprises the first liquid holding box and the second liquid holding box, second liquid holding box is arranged in the first liquid holding box, the height of the second liquid holding box is higher than the first liquid holding box, the top of the first liquid holding box is that certain intervals is provided with several welding wire spacing guide wheels, welding wire spacing guide wheel is distributed in the both sides of the second liquid holding box, the wall of the second liquid holding box both sides is provided with welding wire entrance with the position of welding wire spacing guide wheel equal height and welding wire exports, the bottom of the first liquid holding box is provided with catheter interface, catheter interface is connected in the second liquid holding box by conduit and water pump.
2. according to claim 1ization plating appts, is characterized in that: described welding wire entrance and welding wire exit are provided with the stopper of the preventing plating solution ejection of quality of rubber materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310385799.6A CN104419915A (en) | 2013-08-30 | 2013-08-30 | Chemical plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310385799.6A CN104419915A (en) | 2013-08-30 | 2013-08-30 | Chemical plating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104419915A true CN104419915A (en) | 2015-03-18 |
Family
ID=52970023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310385799.6A Pending CN104419915A (en) | 2013-08-30 | 2013-08-30 | Chemical plating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104419915A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106148924A (en) * | 2016-08-30 | 2016-11-23 | 德州恒远焊材有限公司 | A kind of high speed copper plating device |
| CN106191951A (en) * | 2016-08-30 | 2016-12-07 | 德州恒远焊材有限公司 | A kind of high speed copper plating production line |
| CN107660239A (en) * | 2015-07-13 | 2018-02-02 | 贺利氏德国有限两合公司 | Manufacture method by including the line of clad made of the second metal made of the first metal |
| CN108848621A (en) * | 2018-07-26 | 2018-11-20 | 江门崇达电路技术有限公司 | A kind of line defct method for repairing and mending |
-
2013
- 2013-08-30 CN CN201310385799.6A patent/CN104419915A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107660239A (en) * | 2015-07-13 | 2018-02-02 | 贺利氏德国有限两合公司 | Manufacture method by including the line of clad made of the second metal made of the first metal |
| CN106148924A (en) * | 2016-08-30 | 2016-11-23 | 德州恒远焊材有限公司 | A kind of high speed copper plating device |
| CN106191951A (en) * | 2016-08-30 | 2016-12-07 | 德州恒远焊材有限公司 | A kind of high speed copper plating production line |
| CN106191951B (en) * | 2016-08-30 | 2018-02-27 | 德州市立尊焊丝有限公司 | A kind of high speed copper plating production line |
| CN106148924B (en) * | 2016-08-30 | 2018-05-25 | 德州市立尊焊丝有限公司 | A kind of high speed copper plating device |
| CN108848621A (en) * | 2018-07-26 | 2018-11-20 | 江门崇达电路技术有限公司 | A kind of line defct method for repairing and mending |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150318 |
|
| WD01 | Invention patent application deemed withdrawn after publication |