JP2008297574A - Method of manufacturing electroplated film on fine material and apparatus used for the same - Google Patents

Method of manufacturing electroplated film on fine material and apparatus used for the same Download PDF

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JP2008297574A
JP2008297574A JP2007142418A JP2007142418A JP2008297574A JP 2008297574 A JP2008297574 A JP 2008297574A JP 2007142418 A JP2007142418 A JP 2007142418A JP 2007142418 A JP2007142418 A JP 2007142418A JP 2008297574 A JP2008297574 A JP 2008297574A
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cathode
mixed liquid
cylindrical
anode
electrolytic plating
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Takeshi Yoshimi
武 吉見
Yoshiaki Tsuchitani
与志明 槌谷
Takashi Oki
孝 大木
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Nitto Denko Corp
JX Metals Trading Co Ltd
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Nitto Denko Corp
Nikko Shoji Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electroplated film on a fine material by which an electroplated film is efficiently formed on the conductive fine material and an apparatus used for the same. <P>SOLUTION: A mixed solution prepared by dispersing the conductive fine materials 6 in an electroplating solution 5 is made to flow in a circulating passage to be circulated. By applying voltage between an anode 31 and a cathode 32 provided at a part of the circulation passage along the flowing direction of the mixed solution to be opposed to each other, when the conductive fine materials 6 is brought into contact with the cathode 32, the electroplated film is formed on the conductive fine materials 6. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、異方導電性フィルム（ＡＣＦ）等の形成材料に含有させる電解めっき膜形成微細物、チップコンデンサ，ダイオード，コネクタ等の微細物に電解めっき膜を形成した電解めっき膜形成微細物の製造方法およびそれに用いる製造装置に関するものである。   The present invention relates to an electroplating film-forming fine product obtained by forming an electroplating film on a fine material such as a chip capacitor, a diode, or a connector to be contained in a forming material such as an anisotropic conductive film (ACF). The present invention relates to a manufacturing method and a manufacturing apparatus used therefor.

異方導電性フィルム，導電性ペースト，導電性接着剤等には、その導電性を発現するために、各形成材料に導電材が含有されている。この導電材として、例えば、導電性微細物に電解めっき膜を形成した電解めっき膜形成微細物があげられる。   An anisotropic conductive film, a conductive paste, a conductive adhesive, and the like contain a conductive material in each forming material in order to exhibit the conductivity. As this conductive material, for example, an electroplated film-formed fine product in which an electroplated film is formed on a conductive fine material can be used.

上記電解めっき膜形成微細物の製造方法として、つぎのような方法が提案されている（例えば、特許文献１参照）。すなわち、まず、上記電解めっき膜形成微細物の製造装置として、電解めっき液に導電性微細物を分散させた混合液を収容する容器と、その混合液を循環させる循環流路とを備えた装置を準備する。上記容器の底面には、陰極板が横になって配置され、陽極が上記混合液の液面近くに配置されている。また、循環流路は、容器の側壁から上記混合液を吸い込む吸込管と、その吸い込んだ混合液を容器の底面に向けて吐出する吐出管と、上記混合液を循環させるポンプとを備えており、上記吸込管の吸込口は、上記吐出管の吐出口よりも上方に位置決めされている。そして、上記導電性微細物に電解めっき膜を形成する際には、上記ポンプにより混合液を循環させながら、上記陽極と陰極板との間に電圧を印加する。この状態において、導電性微細物が陰極板と衝突した際に、その導電性微細物に電解めっき膜が形成される。
特開平１−２７２７９２号公報（第５図） The following method is proposed as a manufacturing method of the said electrolytic plating film formation fine substance (for example, refer patent document 1). That is, first, as an apparatus for manufacturing the above-mentioned electrolytic plating film forming fine object, an apparatus provided with a container that contains a mixed liquid in which conductive fine substances are dispersed in an electrolytic plating solution, and a circulation channel that circulates the mixed liquid Prepare. On the bottom surface of the container, a cathode plate is disposed side by side, and an anode is disposed near the liquid surface of the mixed solution. The circulation channel includes a suction pipe for sucking the mixed liquid from the side wall of the container, a discharge pipe for discharging the sucked mixed liquid toward the bottom surface of the container, and a pump for circulating the mixed liquid. The suction port of the suction pipe is positioned above the discharge port of the discharge pipe. And when forming an electroplating film in the said electroconductive fine substance, a voltage is applied between the said anode and a cathode plate, circulating a liquid mixture with the said pump. In this state, when the conductive fine material collides with the cathode plate, an electrolytic plating film is formed on the conductive fine material.
Japanese Patent Laid-Open No. 1-272792 (FIG. 5)

しかしながら、上記特許文献１の方法では、上記混合液を吸い込む吸込管の吸込口が、吐出管の吐出口よりも上方に位置決めされているため、上記混合液の流れは、吐出管の吐出口から下方に排出された後、底面の陰極板との衝突を経て、上方に向きを変え、吸込管の吸込口に吸い込まれる。このため、容器の底面近傍では、上記混合液の下向きの流れと上向きの流れとが存在して乱流となり、上記混合液の循環および導電性微細物と陰極板との衝突が効率よく行われず、電解めっき膜形成微細物の生産効率が悪くなっている。   However, in the method of Patent Document 1, since the suction port of the suction pipe that sucks the mixed liquid is positioned above the discharge port of the discharge pipe, the flow of the mixed liquid flows from the discharge port of the discharge pipe. After being discharged downward, after colliding with the cathode plate on the bottom surface, the direction is changed upward and sucked into the suction port of the suction pipe. For this reason, a downward flow and an upward flow of the mixed liquid exist in the vicinity of the bottom surface of the container, resulting in turbulent flow, and the circulation of the mixed liquid and the collision between the conductive fine substance and the cathode plate are not performed efficiently. The production efficiency of the electrolytically plated film-forming fine product has deteriorated.

本発明は、このような事情に鑑みなされたもので、導電性微細物に効率よく電解めっき膜を形成することができる、電解めっき膜形成微細物の製造方法およびそれに用いる製造装置の提供をその目的とする。   The present invention has been made in view of such circumstances, and provides a method for producing an electrolytic plating film-formed fine product and a manufacturing apparatus used therefor capable of efficiently forming an electrolytic plating film on a conductive fine material. Objective.

上記の目的を達成するため、本発明は、電解めっき液に導電性微細物を分散させた混合液を循環流路に流して循環させるとともに、その循環流路の一部に上記混合液の流れる方向に沿って設けられた、対向する陽極と陰極の間に電圧を印加することにより、上記導電性微細物が上記陰極に接触した際に、その導電性微細物に電解めっき膜が形成されるようにした、電解めっき膜形成微細物の製造方法を第１の要旨とする。   In order to achieve the above-mentioned object, the present invention allows a mixed solution in which conductive fines are dispersed in an electrolytic plating solution to flow and circulate in a circulation channel, and the mixed solution flows in a part of the circulation channel. By applying a voltage between the opposing anode and cathode provided along the direction, an electroplated film is formed on the conductive fine material when the conductive fine material contacts the cathode. The manufacturing method of the electrolytically plated film-formed fine article thus made is a first gist.

また、本発明は、電解めっき液に導電性微細物を分散させた混合液を循環させる循環流路と、この循環流路の一部に上記混合液の流れる方向に沿って設けられた、陽極と陰極とからなる対向電極とを備えている、電解めっき膜形成微細物の製造装置を第２の要旨とする。   The present invention also provides a circulation channel for circulating a mixed solution in which conductive fine particles are dispersed in an electrolytic plating solution, and an anode provided in a part of the circulation channel along the direction in which the mixed solution flows. A second gist of an apparatus for producing an electroplated film-forming fine product, comprising a counter electrode composed of a cathode and a cathode.

本発明の、電解めっき膜形成微細物の製造方法は、電解めっき液に導電性微細物を分散させた混合液を循環流路に流して循環させるため、その混合液の循環中（電解めっき膜形成微細物の製造中）は、その混合液は攪拌され、均一な状態になっている。しかも、対向する陽極と陰極とが循環流路の一部に上記混合液の流れる方向に沿って設けられているため、陰極部分において混合液の乱流がなく、混合液中の導電性微細物が効率よく陰極に接触する。その結果、導電性微細物に効率よく電解めっき膜を形成することができる。   According to the method for producing an electrolytic plating film-forming fine product of the present invention, since a mixed solution in which conductive fine materials are dispersed in an electrolytic plating solution is caused to flow and circulate in a circulation channel, the mixed solution is being circulated (electrolytic plating film). During the production of the formed fines, the mixture is stirred and in a uniform state. Moreover, since the opposing anode and cathode are provided in a part of the circulation channel along the flow direction of the mixed liquid, there is no turbulent flow of the mixed liquid at the cathode portion, and the conductive fine substance in the mixed liquid Efficiently contacts the cathode. As a result, an electrolytic plating film can be efficiently formed on the conductive fine material.

特に、上記陰極が、循環流路の内周面に沿って円筒状に設けられ、上記陽極が、上記円筒状の陰極の中心軸に設けられ、上記円筒状の陰極の中空部が上記混合液の流路になっている場合には、上記混合液が流れる方向において、陽極と陰極との距離が一定となるため、均一な電界が形成され、電解めっき膜の厚みをより簡単に均一に形成することができる。   In particular, the cathode is provided in a cylindrical shape along the inner peripheral surface of the circulation channel, the anode is provided on the central axis of the cylindrical cathode, and the hollow portion of the cylindrical cathode is the mixed liquid. In the direction of the flow of the mixed liquid, the distance between the anode and the cathode is constant in the flow direction of the mixed liquid, so that a uniform electric field is formed and the thickness of the electrolytic plating film is more easily and uniformly formed. can do.

さらに、上記円筒状の陰極の中空部に、上記混合液の渦流を発生させ、その渦流の遠心力により、上記混合液中の導電性微細物を上記円筒状の陰極に接触させる場合には、導電性微細物が陰極に接触する効率がより向上するため、均一な厚みの電解めっき膜をより効率よく形成することができる。   Furthermore, in the case where the vortex of the mixed liquid is generated in the hollow part of the cylindrical cathode and the conductive fine substance in the mixed liquid is brought into contact with the cylindrical cathode by the centrifugal force of the vortex, Since the efficiency with which the conductive fine material comes into contact with the cathode is further improved, an electrolytic plating film having a uniform thickness can be formed more efficiently.

本発明の、電解めっき膜形成微細物の製造装置は、電解めっき液に導電性微細物を分散させた混合液を循環させる循環流路と、この循環流路の一部に上記混合液の流れる方向に沿って設けられた、陽極と陰極とからなる対向電極とを備えているため、上記循環流路においては、上記混合液の状態を均一にすることができ、しかも、その混合液の流れを乱すことなく、混合液中の導電性微細物を効率よく陰極に接触させることができる。その結果、導電性微細物に効率よく電解めっき膜を形成することができる。   An apparatus for producing an electroplated film-forming fine product according to the present invention includes a circulation channel that circulates a mixed solution in which conductive fine particles are dispersed in an electroplating solution, and the mixture solution flows through a part of the circulation channel. In the circulation flow path, the state of the mixed liquid can be made uniform, and the flow of the mixed liquid is provided. Without disturbing, the conductive fine substance in the mixed liquid can be brought into contact with the cathode efficiently. As a result, an electrolytic plating film can be efficiently formed on the conductive fine material.

特に、上記対向電極が、円筒状に設けられた陰極と、この円筒状の陰極の中心軸に設けられた陽極とからなり、上記円筒状の陰極の中空部が上記混合液の流路になっている場合には、上記混合液が流れる方向において、陽極と陰極との距離が一定となるため、均一な電界が形成され、電解めっき膜の厚みをより簡単に均一に形成することができる。   In particular, the counter electrode is composed of a cathode provided in a cylindrical shape and an anode provided on the central axis of the cylindrical cathode, and the hollow portion of the cylindrical cathode serves as a flow path for the mixed liquid. In this case, since the distance between the anode and the cathode is constant in the direction in which the mixed solution flows, a uniform electric field is formed, and the thickness of the electrolytic plating film can be formed more easily and uniformly.

さらに、上記円筒状の陰極の中空部に至る流路が、その陰極の円筒状と同軸的な鉢状に形成されている場合には、上記混合液の流れに渦流が発生し易くなり、その渦流により、上記混合液中の導電性微細物が陰極に接触する効率がより向上するため、均一な厚みの電解めっき膜をより効率よく形成することができる。   Furthermore, when the flow path leading to the hollow portion of the cylindrical cathode is formed in a bowl shape coaxial with the cylindrical shape of the cathode, eddy current tends to occur in the flow of the mixed liquid, Due to the eddy current, the efficiency with which the conductive fine substance in the mixed solution comes into contact with the cathode is further improved, so that an electrolytic plating film having a uniform thickness can be formed more efficiently.

つぎに、本発明の実施の形態を図面にもとづいて詳しく説明する。   Next, embodiments of the present invention will be described in detail with reference to the drawings.

図１は、本発明の、電解めっき膜形成微細物の製造装置の一実施の形態を示している。この実施の形態の、電解めっき膜形成微細物の製造装置は、電解めっき液５に導電性微細物６を分散させた混合液を収容する容器１と、この容器１から混合液を吸引して排出するポンプ２と、このポンプ２から排出された混合液に電圧を印加する電極部３とを備えている。そして、混合液は、容器１から、ポンプ２，電極部３をこの順に経て、再度容器１に戻ることにより、循環するようになっており、これが上記混合液の循環流路となっている。   FIG. 1 shows an embodiment of an apparatus for producing an electroplated film-forming fine article of the present invention. In this embodiment, the apparatus for producing an electroplated film-forming fine product is a container 1 that contains a mixed solution in which a conductive fine product 6 is dispersed in an electroplating solution 5, and sucks the mixed solution from the container 1. A pump 2 for discharging and an electrode unit 3 for applying a voltage to the mixed liquid discharged from the pump 2 are provided. The mixed liquid is circulated by returning from the container 1 through the pump 2 and the electrode unit 3 in this order and returning to the container 1 again, and this is a circulation channel for the mixed liquid.

より詳しく説明すると、上記容器１は、この実施の形態では、上端面が開口した有底筒状となっている。   More specifically, in this embodiment, the container 1 has a bottomed cylindrical shape with an open upper end surface.

上記ポンプ２には、吸引管２ａと排出管２ｂとが接続されており、そのうち吸引管２ａの先端部は、上記容器１内の混合液中に位置決めされ、排出管２ｂの先端部は、上記電極部３の上部の下記鉢状部分３ａ内に位置決めされている。そして、上記ポンプ２が、上記混合液の循環駆動源となっている。   The pump 2 is connected to a suction pipe 2a and a discharge pipe 2b, of which the tip of the suction pipe 2a is positioned in the liquid mixture in the container 1, and the tip of the discharge pipe 2b is It is positioned in the following pot-shaped part 3a above the electrode part 3. The pump 2 serves as a circulation drive source for the mixed liquid.

上記電極部３は、この実施の形態では、上部が鉢状に形成され、それに連通して、下部が円筒状に形成されている。そして、下部の円筒状部分３ｂには、内周面に円筒状の陰極３２が設けられており、その中心軸に、棒状の陽極３１が設けられている。上記陰極３２としては、特に限定されないが、例えば銅箔等があげられ、陽極３１としては、白金等があげられる。また、上記陽極３１と陰極３２との間で均一な電界が得られ、均一な厚みのめっき膜が形成されるようにする観点から、陽極３１と陰極３２の軸方向の長さは同じであることが好ましい。さらに、上記陽極３１と陰極３２との間に形成される電界に影響を与えないよう、上記電極部３のうち、上記陽極３１および陰極３２以外の部分（上部の鉢状部分３ａおよび下部の円筒状部分３ｂ）は、ポリ塩化ビニル等の絶縁性材料で形成されている。なお、図１において、符号４は、上記陽極３１と陰極３２との間に印加する電圧の電源である。   In this embodiment, the upper part of the electrode part 3 is formed in a bowl shape, communicates with the upper part, and the lower part is formed in a cylindrical shape. A cylindrical cathode 32 is provided on the inner peripheral surface of the lower cylindrical portion 3b, and a rod-like anode 31 is provided on the central axis thereof. Although it does not specifically limit as the said cathode 32, For example, copper foil etc. are mention | raise | lifted, As the anode 31, platinum etc. are mention | raise | lifted. Further, from the viewpoint of obtaining a uniform electric field between the anode 31 and the cathode 32 and forming a plating film having a uniform thickness, the lengths of the anode 31 and the cathode 32 in the axial direction are the same. It is preferable. Further, in order not to affect the electric field formed between the anode 31 and the cathode 32, portions of the electrode portion 3 other than the anode 31 and the cathode 32 (the upper bowl-shaped portion 3a and the lower cylinder). The shaped part 3b) is formed of an insulating material such as polyvinyl chloride. In FIG. 1, reference numeral 4 denotes a voltage power source applied between the anode 31 and the cathode 32.

また、上記電極部３の寸法は、循環させる上記混合液の量等により適宜設定され、特に限定されるものではないが、例えば、上部の鉢状部分３ａにより、下部の円筒状部分３ｂ（円筒状の陰極３２部分）に、上記混合液の渦流を発生させ、その渦流の遠心力により、混合液中の導電性微細物６を円筒状の陰極３２に接触させ易くする観点から、上部の鉢状部分３ａの内面の傾斜角度は水平から３０〜７０°の範囲内、鉢状部分３ａの深さと上端開口の内径との比率は、１：（０．５〜１．４）の範囲内、鉢状部分３ａの深さと下部の円筒状部分３ｂの長さ（陽極３１および陰極３２の長さ）の比率は、１：（０．５〜１０）の範囲内、円筒状部分３ｂの内径は鉢状部分３ａの上端開口の内径の１／１０〜１／３の範囲内であることが好ましい。   Further, the dimensions of the electrode part 3 are appropriately set depending on the amount of the mixed liquid to be circulated and the like, and are not particularly limited. For example, the upper pot-like part 3a causes the lower cylindrical part 3b (cylinder) From the viewpoint of facilitating contact of the conductive fine substance 6 in the mixed solution with the cylindrical cathode 32 by generating a vortex of the mixed solution at the cathode 32 portion) and centrifugal force of the vortex. The inclination angle of the inner surface of the portion 3a is within a range of 30 to 70 ° from the horizontal, and the ratio of the depth of the pot-like portion 3a to the inner diameter of the upper end opening is within a range of 1: (0.5 to 1.4). The ratio of the depth of the pot-shaped part 3a to the length of the lower cylindrical part 3b (the length of the anode 31 and the cathode 32) is within the range of 1: (0.5 to 10), and the inner diameter of the cylindrical part 3b is It is preferably within a range of 1/10 to 1/3 of the inner diameter of the upper end opening of the pot-shaped portion 3a.

つぎに、上記電解めっき膜形成微細物の製造に用いる混合液（電解めっき液５，導電性微細物６）の材料等について説明する。   Next, materials and the like of the mixed solution (electrolytic plating solution 5 and conductive fine material 6) used for the production of the electrolytic plated film-formed fine material will be described.

上記電解めっき液５としては、例えば、銅めっき液，金めっき液，錫−亜鉛めっき液等があげられ、これらは市販品として購入することができる。   Examples of the electrolytic plating solution 5 include a copper plating solution, a gold plating solution, and a tin-zinc plating solution, which can be purchased as commercial products.

上記導電性微細物６としては、その表面の少なくとも一部に導電性が付与された微細物であれば、特に限定されるものではなく、例えば、非導電性微細物の表面に、無電解ニッケルめっき膜等を形成する等することにより、導電性を付与したもの、金属粒子等それ自身が導電性を有するもの、チップコンデンサ，ダイオード，コネクタ等の電子部品等があげられる。上記非導電性微細物は市販品として購入することができ、その材質は、特に限定されるものではなく、例えば、ベンゾグアナミン・ホルムアルデヒド縮合物，ポリメタクリル酸メチル系架橋物，ポリスチレン架橋物等の有機微細物、シリカ，酸化チタン等の無機微細物等があげられる。上記非導電性微細物の外径は、特に限定されないが、微細配線間を接続するという観点から、０．５〜５０μｍの範囲内が好ましい。   The conductive fine material 6 is not particularly limited as long as it is a fine material with conductivity imparted to at least a part of its surface. For example, the surface of the nonconductive fine material may be electroless nickel. Examples thereof include those provided with conductivity by forming a plating film or the like, those having metal particles such as metal particles, and electronic parts such as chip capacitors, diodes, and connectors. The non-conductive fine material can be purchased as a commercial product, and the material thereof is not particularly limited. Examples include fine substances, inorganic fine substances such as silica and titanium oxide, and the like. The outer diameter of the nonconductive fine material is not particularly limited, but is preferably in the range of 0.5 to 50 μm from the viewpoint of connecting the fine wirings.

つぎに、上記電解めっき膜形成微細物の製造装置および混合液を用いた電解めっき膜形成微細物の製造方法について説明する。   Next, an apparatus for manufacturing the above-mentioned electrolytic plating film forming fine product and a method for manufacturing the electrolytic plating film forming fine product using the mixed solution will be described.

まず、上記容器１に、所定量の混合液を入れる。ついで、ポンプ２を作動させるとともに、電極部３の陽極３１と陰極３２との間に電圧を印加する。これにより、混合液が循環し、混合液中の導電性微細物６が陰極３２に接触した際に、その導電性微細物６の表面に電解めっき膜が形成される。そして、所定の時間循環させた後、ポンプ２を止めるとともに、陽極３１と陰極３２との間の電圧を切る。その後、上記混合液をろ過し、導電性微細物６の表面に電解めっき膜が形成された電解めっき膜形成微細物を回収する。   First, a predetermined amount of the mixed solution is put into the container 1. Next, the pump 2 is operated and a voltage is applied between the anode 31 and the cathode 32 of the electrode unit 3. Thereby, when the mixed liquid circulates and the conductive fine substance 6 in the mixed liquid comes into contact with the cathode 32, an electrolytic plating film is formed on the surface of the conductive fine substance 6. Then, after circulating for a predetermined time, the pump 2 is stopped and the voltage between the anode 31 and the cathode 32 is turned off. Thereafter, the mixed solution is filtered, and the electroplated film-forming fine product in which the electroplated film is formed on the surface of the conductive fine product 6 is collected.

特に、この実施の形態では、上記電極部３の上部に鉢状部分３ａが形成されているため、その鉢状部分３ａに上記混合液が流れることにより、下部の円筒状部分３ｂ（円筒状の陰極３２部分）に、その円筒状部分３ｂ（円筒状の陰極３２部分）と同軸的に上記混合液の渦流が発生し、その渦流による遠心力が混合液中の導電性微細物６に作用し、その導電性微細物６が円筒状の陰極３２に接触し易くなっている。これにより、電解めっき膜の形成がより効率よくなっている。   In particular, in this embodiment, since the bowl-shaped part 3a is formed on the upper part of the electrode part 3, when the mixed liquid flows into the bowl-shaped part 3a, the lower cylindrical part 3b (cylindrical-shaped part) is formed. A vortex of the mixed solution is generated at the cathode 32 portion coaxially with the cylindrical portion 3b (cylindrical cathode 32 portion), and the centrifugal force caused by the vortex acts on the conductive fines 6 in the mixture. The conductive fine substance 6 is easy to come into contact with the cylindrical cathode 32. Thereby, the formation of the electrolytic plating film is more efficient.

上記製造方法において、形成する電解めっき膜の厚みは、特に限定されないが、接続信頼性と生産性の観点から、０．５〜３．０μｍの範囲内であることが好ましい。また、めっき処理時間は、形成する電解めっき膜の厚みによって決まるが、その厚みが上記範囲内（０．５〜３．０μｍ）であれば、２０分間〜３時間の範囲内である。また、ポンプ２から排出される混合液の流速は、装置の大きさ（流路径等）等によって決まり、特に限定されないが、例えば、好ましくは１〜２００ｍ／分の範囲内、より好ましくは３０〜１２０ｍ／分の範囲内に設定される。１ｍ／分を下回ると、混合液の渦流が発生し難く、２００ｍ／分を上回ると、鉢状部分３ａから溢れるおそれがあるからである。   In the manufacturing method, the thickness of the electrolytic plating film to be formed is not particularly limited, but is preferably in the range of 0.5 to 3.0 μm from the viewpoint of connection reliability and productivity. The plating treatment time is determined depending on the thickness of the electrolytic plating film to be formed. If the thickness is within the above range (0.5 to 3.0 μm), it is within the range of 20 minutes to 3 hours. Further, the flow rate of the mixed liquid discharged from the pump 2 is determined by the size of the apparatus (flow path diameter and the like) and the like, and is not particularly limited. For example, it is preferably in the range of 1 to 200 m / min, more preferably 30 to It is set within the range of 120 m / min. This is because if the flow rate is less than 1 m / min, the vortex of the mixed solution is hardly generated, and if it exceeds 200 m / min, the bowl-shaped portion 3a may overflow.

なお、電解めっき膜形成微細物の製造装置は、上記実施の形態のものに限定されるものではない。例えば、上記実施の形態では、陰極３２を円筒状、陽極３１を棒状としたが、陰極３２も陽極３１も平板状でもよい。また、電極部３の上部に鉢状部分３ａは設けなくてもよい。さらに、ポンプ２に接続されている排出管２ｂの先端部に直接、電極部３の円筒状部分３ｂ（陰極３２および陽極３１が設けられている部分）を接続してもよい。   In addition, the manufacturing apparatus of the electrolytic plating film formation fine substance is not limited to the thing of the said embodiment. For example, in the above embodiment, the cathode 32 is cylindrical and the anode 31 is rod-shaped, but the cathode 32 and the anode 31 may be flat. Further, the bowl-shaped portion 3 a may not be provided on the electrode portion 3. Further, the cylindrical portion 3b (the portion where the cathode 32 and the anode 31 are provided) of the electrode portion 3 may be directly connected to the distal end portion of the discharge pipe 2b connected to the pump 2.

つぎに、実施例について比較例と併せて説明する。但し、本発明は、実施例に限定されるわけではない。   Next, examples will be described together with comparative examples. However, the present invention is not limited to the examples.

〔非導電性微細物〕
非導電性微細物として、ベンゾグアナミン・ホルムアルデヒド縮合物（日本触媒社製、Ｍ０５：平均粒径５μｍ）を３ｇ準備した。 [Non-conductive fine material]
As a non-conductive fine substance, 3 g of benzoguanamine / formaldehyde condensate (manufactured by Nippon Shokubai Co., Ltd., M05: average particle size 5 μm) was prepared.

〔非導電性微細物の導電化〕
上記非導電性微細物に無電解ニッケルめっき膜を形成し、導電性微細物を作製した。 [Conductivity of non-conductive fine materials]
An electroless nickel plating film was formed on the non-conductive fine material to produce a conductive fine material.

〔電解めっき膜形成微細物の製造装置〕
図１に示す製造装置を準備した。この製造装置において、円筒状の陰極（銅箔）および棒状の陽極（白金）の軸方向の長さをいずれも８０ｍｍ、陰極の内径を１０ｍｍ、陽極の外径を３ｍｍとした。また、ポンプによる循環流路の流速を６７ｍ／分とした。 [Production equipment for electroplated film forming fines]
The manufacturing apparatus shown in FIG. 1 was prepared. In this manufacturing apparatus, the axial lengths of the cylindrical cathode (copper foil) and the rod-shaped anode (platinum) were both 80 mm, the inner diameter of the cathode was 10 mm, and the outer diameter of the anode was 3 mm. Further, the flow rate of the circulation flow path by the pump was set to 67 m / min.

〔電解めっき膜形成微細物の製造方法〕
錫−亜鉛電解めっき液８００ｍＬに上記導電性微細物を混合し、この混合液を上記製造装置の容器に入れた後、ポンプを作動させるとともに、陽極と陰極との間に電圧５．５Ｖ、電流１Ａを印加した。この状態で上記混合液を２時間循環させた。その後、上記混合液をろ過し、導電性微細物の表面に錫−亜鉛電解めっき膜が形成された電解めっき膜形成微細物を得た。この電解めっき膜形成微細物の中の任意の５０個について、錫−亜鉛電解めっき膜の厚みをレーザ回折／散乱式粒度分布測定機（堀場製作所社製、ＬＡ−９１０）により測定した結果、いずれも厚み１μｍ程度の均質な錫−亜鉛電解めっき膜が形成されていた。 [Method for producing electrolytic plated film-forming fine product]
The conductive fine material is mixed with 800 mL of tin-zinc electroplating solution, and the mixed solution is put in the container of the manufacturing apparatus. Then, the pump is operated and the voltage between the anode and the cathode is 5.5 V, the current 1A was applied. In this state, the mixed solution was circulated for 2 hours. Thereafter, the mixed solution was filtered to obtain an electrolytic plating film-forming fine product in which a tin-zinc electrolytic plating film was formed on the surface of the conductive fine material. As a result of measuring the thickness of the tin-zinc electrolytic plating film with a laser diffraction / scattering type particle size distribution measuring instrument (LA-910, manufactured by Horiba, Ltd.) for any 50 of the electrolytic plating film forming fines, In addition, a homogeneous tin-zinc electrolytic plating film having a thickness of about 1 μm was formed.

〔アルミナ微細物の導電化〕
アルミナ微細物〔０．３ｍｍ×０．２ｍｍ×０．２ｍｍ（厚み）〕を準備し、その片側（０．１ｍｍ）に銀ペーストを塗布し、導電性アルミナ微細物を作製した。 [Conductivity of fine alumina]
Alumina fines [0.3 mm × 0.2 mm × 0.2 mm (thickness)] were prepared, and a silver paste was applied to one side (0.1 mm) to prepare conductive alumina fines.

〔電解めっき膜形成アルミナ微細物の製造装置〕
図１に示す製造装置を準備した。この製造装置において、円筒状の陰極（銅箔）および棒状の陽極（白金）の軸方向の長さをいずれも８０ｍｍ、陰極の内径を１８ｍｍ、陽極の外径を３ｍｍとした。また、ポンプによる循環流路の流速を１００ｍ／分とした。 [Production equipment for electroplated film-formed alumina fines]
The manufacturing apparatus shown in FIG. 1 was prepared. In this manufacturing apparatus, the axial lengths of the cylindrical cathode (copper foil) and the rod-shaped anode (platinum) were both 80 mm, the inner diameter of the cathode was 18 mm, and the outer diameter of the anode was 3 mm. Further, the flow rate of the circulation flow path by the pump was set to 100 m / min.

〔電解めっき膜形成アルミナ微細物（チップコンデンサ）の製造方法〕
錫−亜鉛電解めっき液８００ｍＬに上記導電性アルミナ微細物を混合し、この混合液を上記製造装置の容器に入れた後、ポンプを作動させるとともに、陽極と陰極との間に電圧６．０Ｖ、電流１Ａを印加した。この状態で上記混合液を２時間循環させた。その後、上記混合液をろ過し、上記導電性アルミナ微細物の表面に錫−亜鉛電解めっき膜が形成された電解めっき膜形成アルミナ微細物を得た。この電解めっき膜形成アルミナ微細物の中の任意の５０個について、錫−亜鉛電解めっき膜の厚みをレーザ回折／散乱式粒度分布測定機（堀場製作所社製、ＬＡ−９１０）により測定した結果、いずれも厚み１μｍ程度の均質な錫−亜鉛電解めっき膜が形成されており、その錫−亜鉛電解めっき膜は、上記銀ペーストが塗布された部分以外には形成されていなかった。 [Manufacturing method of electrolytic plating film-formed fine alumina (chip capacitor)]
The conductive alumina fine product is mixed with 800 mL of tin-zinc electroplating solution, and the mixed solution is put into the container of the manufacturing apparatus. Then, the pump is operated, and a voltage of 6.0 V is applied between the anode and the cathode. A current of 1 A was applied. In this state, the mixed solution was circulated for 2 hours. Thereafter, the mixed solution was filtered to obtain an electrolytic plated film-formed alumina fine product in which a tin-zinc electrolytic plated film was formed on the surface of the conductive alumina fine product. As a result of measuring the thickness of the tin-zinc electrolytic plating film with a laser diffraction / scattering type particle size distribution measuring instrument (LA-910, manufactured by HORIBA, Ltd.) for any 50 of the electrolytic plated film-forming alumina fines, In each case, a homogeneous tin-zinc electroplating film having a thickness of about 1 μm was formed, and the tin-zinc electroplating film was not formed except for the portion where the silver paste was applied.

本発明の、電解めっき膜形成微細物の製造装置の一実施の形態を模式的に示す説明図である。It is explanatory drawing which shows typically one Embodiment of the manufacturing apparatus of the electrolytic plating film formation fine substance of this invention.

符号の説明Explanation of symbols

５ 電解めっき液
６ 導電性微細物
３１ 陽極
３２ 陰極 5 Electrolytic plating solution 6 Conductive fine material 31 Anode 32 Cathode

Claims (6)

電解めっき液に導電性微細物を分散させた混合液を循環流路に流して循環させるとともに、その循環流路の一部に上記混合液の流れる方向に沿って設けられた、対向する陽極と陰極の間に電圧を印加することにより、上記導電性微細物が上記陰極に接触した際に、その導電性微細物に電解めっき膜が形成されるようにしたことを特徴とする、電解めっき膜形成微細物の製造方法。   A mixed liquid in which conductive fine substances are dispersed in an electrolytic plating solution is caused to flow and circulate through a circulation channel, and an opposing anode provided in a part of the circulation channel along the direction in which the mixed solution flows. An electroplating film, wherein an electroplating film is formed on the conductive fine material when a voltage is applied between the cathode and the conductive fine material contacts the cathode. Manufacturing method of formed fines. 上記陰極が、循環流路の内周面に沿って円筒状に設けられ、上記陽極が、上記円筒状の陰極の中心軸に設けられ、上記円筒状の陰極の中空部が上記混合液の流路になっている請求項１記載の、電解めっき膜形成微細物の製造方法。   The cathode is provided in a cylindrical shape along the inner peripheral surface of the circulation channel, the anode is provided on the central axis of the cylindrical cathode, and the hollow portion of the cylindrical cathode is the flow of the mixed liquid. The manufacturing method of the electrolytic plating film formation fine substance of Claim 1 used as the path. 上記円筒状の陰極の中空部に、上記混合液の渦流を発生させ、その渦流の遠心力により、上記混合液中の導電性微細物を上記円筒状の陰極に接触させる請求項２記載の、電解めっき膜形成微細物の製造方法。   The vortex of the mixed liquid is generated in the hollow part of the cylindrical cathode, and the conductive fine substance in the mixed liquid is brought into contact with the cylindrical cathode by the centrifugal force of the vortex. Manufacturing method of electrolytic plating film forming fine substance. 電解めっき液に導電性微細物を分散させた混合液を循環させる循環流路と、この循環流路の一部に上記混合液の流れる方向に沿って設けられた、陽極と陰極とからなる対向電極とを備えていることを特徴とする、電解めっき膜形成微細物の製造装置。   A circulation channel that circulates a mixed solution in which conductive fines are dispersed in an electroplating solution, and a counter electrode composed of an anode and a cathode provided in a part of the circulation channel along the flowing direction of the mixed solution. An apparatus for producing an electroplated film-forming fine product, comprising: an electrode. 上記対向電極が、円筒状に設けられた陰極と、この円筒状の陰極の中心軸に設けられた陽極とからなり、上記円筒状の陰極の中空部が上記混合液の流路になっている請求項４記載の、電解めっき膜形成微細物の製造装置。   The counter electrode includes a cathode provided in a cylindrical shape and an anode provided on a central axis of the cylindrical cathode, and a hollow portion of the cylindrical cathode serves as a flow path for the mixed liquid. The manufacturing apparatus of the electrolytic plating film formation fine substance of Claim 4. 上記円筒状の陰極の中空部に至る流路が、その陰極の円筒状と同軸的な鉢状に形成され、その鉢状の流路部分により、上記混合液の流れに渦流を発生させるようになっている請求項５記載の、電解めっき膜形成微細物の製造装置。   The flow path leading to the hollow portion of the cylindrical cathode is formed in a bowl shape coaxial with the cylindrical shape of the cathode, and the bowl-shaped flow path portion generates a vortex in the flow of the mixed liquid. The manufacturing apparatus of the electroplating film formation fine substance of Claim 5 which has become.
JP2007142418A 2007-05-29 2007-05-29 Method of manufacturing electroplated film on fine material and apparatus used for the same Pending JP2008297574A (en)

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Cited By (4)

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CN102011162A (en) * 2010-09-29 2011-04-13 苏州创峰光电科技有限公司 Method and device for electroplating sheets
JP2014162927A (en) * 2013-02-21 2014-09-08 Ideya:Kk Electroplating apparatus and electroplating method
CN105612643A (en) * 2013-07-19 2016-05-25 奥迪股份公司 Method and system for core-shell catalyst processing
JP2017095787A (en) * 2015-11-27 2017-06-01 株式会社村田製作所 Plating apparatus and plating method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102011162A (en) * 2010-09-29 2011-04-13 苏州创峰光电科技有限公司 Method and device for electroplating sheets
JP2014162927A (en) * 2013-02-21 2014-09-08 Ideya:Kk Electroplating apparatus and electroplating method
CN105612643A (en) * 2013-07-19 2016-05-25 奥迪股份公司 Method and system for core-shell catalyst processing
JP2016525444A (en) * 2013-07-19 2016-08-25 アウディ アクチェンゲゼルシャフトＡｕｄｉ Ａｇ Core-shell catalyst treatment method and treatment system
US10541425B2 (en) 2013-07-19 2020-01-21 Audi Ag Method and system for core-shell catalyst processing
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