CN102010686A - Double-solidification system fast-flowing underfill and preparation method thereof - Google Patents
Double-solidification system fast-flowing underfill and preparation method thereof Download PDFInfo
- Publication number
- CN102010686A CN102010686A CN201010297440XA CN201010297440A CN102010686A CN 102010686 A CN102010686 A CN 102010686A CN 201010297440X A CN201010297440X A CN 201010297440XA CN 201010297440 A CN201010297440 A CN 201010297440A CN 102010686 A CN102010686 A CN 102010686A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- underfill
- dual cure
- cure systems
- fast
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
The invention discloses a double-solidification system fast-flowing underfill and a preparation method thereof. The underfill comprises the following raw materials in parts by weight: 30-80% of epoxy resin, 10-50% of epoxy acrylate, 5-30% of acrylate, 2-20% of polyol, 1-20% of silane coupling agent, 0.3-4% of cationic initiator, 0.1-3% of radical initiator and 0.1-0.5% of carbon black; and the preparation method comprises the following steps of: weighing the epoxy resin and the cationic initiator in the proportion, putting in a reaction kettle and stirring into a uniform solution; weighing the epoxy acrylate, the acrylate, the polyol, the silane coupling agent, the radical initiator and the carbon black in the proportion, putting in the reaction kettle in sequence, mixing and stirring to obtain the finished product of the double-solidification system fast-flowing underfill.
Description
Technical field
The present invention relates to a kind of dual cure systems mobile underfill and preparation method thereof fast, be applicable to that encapsulation such as chip size packages (CSP), BGA Package (BGA) with the bottom filling, belong to the sizing agent field.
Background technology
Along with the fast development of electronic industry, closely-related with it Electronic Packaging technology is also more and more advanced.The main development trend intelligent, in light weight, that volume is little, speed is fast, function is strong, good reliability etc. becomes electronic product.For the development that adapts to this trend has produced flip-chip technology.The main advantage of flip-chip comprises can reduce and save the space, also has interconnection vias shorter and inductance is lower, high I/O density, do over again and the autoregistration ability in addition.Concerning radiating management, the performance of flip-chip is also very outstanding.And underfill is high-density flip-chip BGA, and CSP reaches one of crucial electronic material required in the SIP microelectronics Packaging; its main effect is protection high-density soldered ball node and chip; and BGA, processibility, reliability and the life-time service of CSP and SIP device have been guaranteed.
The underfill of cationic system has lot of advantages, and, curing back smell low as shrinking percentage is little etc.But also there are some defectives simultaneously,, may cause not solidified phenomenon of part glue because the consistency of glue and some soldering flux is not good enough.
Summary of the invention
The present invention is directed to the deficiencies in the prior art, a kind of radical cation dual cure systems underfill and preparation method thereof that flows fast is provided, do not solidify, the purpose of characteristics such as reach good stability, can keep in repair to avoid running into some soldering flux.
The technical scheme that the present invention solves the problems of the technologies described above is as follows: the mobile fast underfill of a kind of radical cation dual cure systems, form by each raw material of following weight percent: Resins, epoxy 30～80%, acrylic acid epoxy resin 10～50%, acrylate 5～30%, polyvalent alcohol 2～20%, silane coupling agent 1～20%, cationic initiator 0.3～4%, radical initiator 0.1～3%, carbon black 0.1～0.5%.
The invention has the beneficial effects as follows: the mobile fast underfill of dual cure systems of the present invention, shrinking percentage is low, has effectively guaranteed the reliability of encapsulation components and parts; It is little to solidify the back smell, has complied with the trend of environmental protection; Velocity of flow is fast, adapts to the requirement of high density packing; In warm fast setting, meet high efficiency beat in the modern production; Stability in storage is good, can keep in repair, and is applied widely.
On the basis of technique scheme, the present invention can also do following improvement.
Further, described Resins, epoxy is a kind of or any several mixture in cycloaliphatic epoxy resin, bisphenol A type epoxy resin, bisphenol f type epoxy resin and the phenol aldehyde type epoxy resin.
Adopt the beneficial effect of above-mentioned further scheme to be, select dissimilar Resins, epoxy to cooperate, can be so that curing speed, cohesive strength etc. reach a trim point, excellent combination property.
Further, described aliphatic epoxy resin is 3,4-epoxycyclohexyl methyl-3,4-epoxycyclohexyl manthanoate and two (7-oxabicyclo [4.1.0] 3-methyl in heptan) adipic acid ester; Described 3,4-epoxycyclohexyl methyl-3, the structural formula of 4-epoxycyclohexyl manthanoate is:
The structural formula of described two (7-oxabicyclo [4.1.0] 3-methyl in heptan) adipic acid esters is:
Further, the structural formula of described bisphenol A type epoxy resin is represented by following general formula I:
Wherein, n=0～19.
Further, the structural formula of described bisphenol f type epoxy resin is represented by following general formula I I:
Wherein, n=0～1
Further, the structural formula of described phenol aldehyde type epoxy resin is represented by following general formula I II:
Wherein, n=1～3.
Further, described acrylic acid epoxy resin is that an end of molecular chain is two keys, and the other end is an epoxide group, i.e. the cationically polymerizable resin of free redical polymerization again, and its structural formula is represented by following general formula I V:
Adopt the beneficial effect of above-mentioned further scheme to be, acrylic acid epoxy resin is positively charged ion, free radical two individual system bonded bridges, makes the mutual supplement with each other's advantages of two individual system, obtains a kind of have fast, the middle temperature fast setting of velocity of flow, filling glue that reliability is high.
Further, described acrylate is a kind of or any several mixture in butyl acrylate, Isooctyl acrylate monomer, the lauryl methacrylate(LMA).
Further, described polyvalent alcohol is polyester polyol, polyether glycol, polycaprolactone polyol, 1, a kind of or any several mixture in the 4-butyleneglycol.
Adopt the beneficial effect of above-mentioned further scheme to be, the curing speed that the adding of polyalcohols promptly can regulation system, toughness and any surface finish planeness that can regulate cured article again.
Further, described silane coupling agent is a kind of or any several mixture in β-(3, the 4-epoxycyclohexyl) ethyl trimethoxy silane, γ-glycidoxypropyltrimewasxysilane, γ-Qiu Jibingjisanjiayangjiguiwan, the γ-An Bingjisanyiyangjiguiwan.
Adopt the beneficial effect of above-mentioned further scheme to be, silane coupling agent helps improving fills the wettability of glue to base material, improves liquidity.
Further, described cationic initiator is a hexafluoro antimonate.
Further, described radical initiator is a kind of or any several mixture in benzoyl peroxide, Diisopropyl azodicarboxylate, di-tert-butyl peroxide, the peroxide-2-ethyl hexanoic acid tert-butyl.
Another technical scheme that the present invention solves the problems of the technologies described above is as follows: a kind of radical cation dual cure systems is the preparation method of mobile underfill fast, comprise by following weight percent and take by weighing Resins, epoxy 30～80%, cationic initiator 0.3～4%, it is dropped in the reactor, mixed 30 minutes at 30～35 ℃, make it dissolving and become uniform solution, and then take by weighing acrylic acid epoxy resin 10～50%, acrylate 5～30%, polyvalent alcohol 2～20%, silane coupling agent 1～20%, radical initiator 0.1～3% and carbon black 0.1～0.5%, add in the reactor successively, in 15～20 ℃ of temperature, vacuum tightness-0.08～-0.05MPa, 500～1000 rev/mins of rotating speeds, mixed 1～2 hour, and promptly got product.
Embodiment
Below principle of the present invention and feature are described, institute gives an actual example and only is used to explain the present invention, is not to be used to limit scope of the present invention.
Embodiment 1
Accurately take by weighing following various raw material, 3,4-epoxycyclohexyl methyl-3,4-epoxycyclohexyl manthanoate 40g, two (7-oxabicyclo [4.1.0] 3-methyl in heptan) adipic acid ester 40g, hexafluoro antimonate are that U.S. King Corporation's Super XC-7231 0.5g drops in the reactor, mixed 30 minutes at 30 ℃, make it dissolving and become uniform solution, add acrylic acid epoxy resin 10g, butyl acrylate 5g, 1 then, 4-butyleneglycol 3g, β-(3, the 4-epoxycyclohexyl) ethyl trimethoxy silane 1g, benzoyl peroxide 0.3g, carbon black 0.2g.Controlled temperature is at 15 ℃, and vacuum tightness is-0.05MPa, and revolution is 500 rev/mins, and vacuum stirring was mixed 2 hours, obtained the homogeneous product.
Embodiment 2
Accurately take by weighing following various raw material, two (7-oxabicyclo [4.1.0] 3-methyl in heptan) adipic acid ester 50g, bisphenol A type epoxy resin 20g, hexafluoro antimonate is that the K-PURE CXC-16123g of U.S. king company drops in the reactor, mixed 30 minutes at 35 ℃, making it dissolving becomes uniform solution, adds acrylic acid epoxy resin 10g, Isooctyl acrylate monomer 8g, polycaprolactone polyol 6.5g, γ-glycidoxypropyltrimewasxysilane 2g, Diisopropyl azodicarboxylate 0.3g, carbon black 0.2g then; Controlled temperature is at 15 ℃, and vacuum tightness is-0.05MPa, and revolution is 1000 rev/mins, and vacuum stirring was mixed 2 hours, obtained the homogeneous product.
Wherein, the structural formula of described bisphenol A type epoxy resin is:
N is the mixture of 0,1,2～18,19 compounds of forming.
Embodiment 3
Accurately take by weighing following various raw material, two (7-oxabicyclo [4.1.0] 3-methyl in heptan) adipic acid ester 30g, hexafluoro antimonate is that the K-PURE CXC-1612 1g of U.S. king company drops in the reactor, mixed 30 minutes at 30 ℃, making it dissolving becomes uniform solution, adds acrylic acid epoxy resin 15g, lauryl methacrylate(LMA) 30g, polyester polyol 20g, γ-Qiu Jibingjisanjiayangjiguiwan 3g, di-tert-butyl peroxide 0.5g, carbon black 0.5g then; Controlled temperature is at 15 ℃, and vacuum tightness is-0.07MPa, and revolution is 700 rev/mins, and vacuum stirring was mixed 2 hours, obtained the homogeneous product.
Embodiment 4
Accurately take by weighing following various raw material, 3,4-epoxycyclohexyl methyl-3,4-epoxycyclohexyl manthanoate 50g, phenol aldehyde type epoxy resin 15g, hexafluoro antimonate is that U.S. King Corporation's Super XC-72312g drops in the reactor, mixed 30 minutes at 35 ℃, making it dissolving becomes uniform solution, adds acrylic acid epoxy resin 15g, butyl acrylate 5g, polyester polyol 9.5g, γ-An Bingjisanyiyangjiguiwan 3g, peroxide-2-ethyl hexanoic acid tert-butyl 0.3g, carbon black 0.2g then; Controlled temperature is at 15 ℃, and vacuum tightness is-0.07MPa, and revolution is 1000 rev/mins, and vacuum stirring was mixed 2 hours, obtained the homogeneous product.
Wherein, the structural formula of described phenol aldehyde type epoxy resin is:
N is 1,2 or 3 compound compositions that constitute.
Embodiment 5
Accurately take by weighing following various raw material, bisphenol A type epoxy resin 15g, bisphenol f type epoxy resin 15g, hexafluoro antimonate is that U.S. King Corporation's Super XC-7231 4g drops in the reactor, mixed 30 minutes at 30 ℃, make it dissolving and become uniform solution, add acrylic acid epoxy resin 45g, lauryl methacrylate(LMA) 10g, polycaprolactone polyol 5g, β-(3, the 4-epoxycyclohexyl) ethyl trimethoxy silane 5g, benzoyl peroxide 0.5g, carbon black 0.5g then; Controlled temperature is at 15 ℃, and vacuum tightness is-0.05MPa, and revolution is 1000 rev/mins, and vacuum stirring was mixed 2 hours, obtained the homogeneous product.
The comparative example 1
Common bottom is filled glue prescription-traditional curing mode, take by weighing resin 828EL 13.2g, resin 830LVP 39.2g, colorant 0.5g, solidifying agent fujicure fxr 1020 25g, promotor PN-H 5g, coupling agent KH5600.56g, epoxy active diluent AGE 20g toasts resin 830LVP one night down at 70-75 ℃, then resin 828EL, resin 830LVP, color mixes, 30 minutes time, 25 ℃ of temperature add solidifying agent then, promotor, three-roller mixes, 25 ℃ of temperature, mix under the cooling drying condition, cold water is controlled at 15 ℃, mixes three times, mix in the back adding reactor and expire vacuum 15 minutes, after mixing, resin and solidifying agent add coupling agent, epoxide diluent mixes, and full vacuum 30 minutes obtains sample.
Concrete experimental example
Flow the fast performance of underfill of dual cure systems by following experimental test the above embodiment of the present invention 1-5 and comparative example.
The test of experimental example 1 curing performance
The DSC cure profile, 60 ℃/minute of temperature rise rates, 130 ℃ of curing of constant temperature.
The test of experimental example 2 flowing propertys
24mm * 24mm testing plate, cover glass and slide glass are formed, and the slit is 25 microns, the velocity of flow that (simulation packaged chip) is 25 ℃.
Experimental example 3 thermal expansivity tests (CTE)
The TMA test, 10 ℃/minute of temperature rise rates, the μ m/m of unit ℃
Test according to ASTM D696
The test of experimental example 4 shearing resistances
The AL/AL shearing resistance, 130 ℃ of conditions of cure, 2 hours.
Test according to GB/T7124-1986.
Test result is shown in following table 1.
Sample that table 1 embodiment 1-5 makes and comparative example's sample common bottom are filled colloidality can the contrast test result
Data from table 1 as can be seen, the dual cure systems of the present invention underfill that flows fast all has a clear superiority at more traditional underfills in aspect such as curing speed, velocity of flow, thermal expansivity, shearing resistances; When having higher reliability, be fit to the requirement of fast beat packaging process more.
The above only is preferred embodiment of the present invention, and is in order to restriction the present invention, within the spirit and principles in the present invention not all, any modification of being done, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. the dual cure systems underfill that flows fast, it is characterized in that, form: Resins, epoxy 30～80%, acrylic acid epoxy resin 10～50%, acrylate 5～30%, polyvalent alcohol 2～20%, silane coupling agent 1～20%, cationic initiator 0.3～4%, radical initiator 0.1～3%, carbon black 0.1～0.5% by each raw material of following weight percent.
2. the mobile fast underfill of dual cure systems according to claim 1, it is characterized in that described Resins, epoxy is a kind of or any several mixture in cycloaliphatic epoxy resin, bisphenol A type epoxy resin, bisphenol f type epoxy resin and the phenol aldehyde type epoxy resin.
3. the mobile fast underfill of dual cure systems according to claim 2, it is characterized in that, described aliphatic epoxy resin is 3,4-epoxycyclohexyl methyl-3,4-epoxycyclohexyl manthanoate and two (7-oxabicyclo [4.1.0] 3-methyl in heptan) adipic acid ester.
4. the mobile fast underfill of dual cure systems according to claim 2 is characterized in that the structural formula of described bisphenol A type epoxy resin is represented by following general formula I:
Wherein, n=0～19
5. the mobile fast underfill of dual cure systems according to claim 2 is characterized in that the structural formula of described bisphenol f type epoxy resin is represented by following general formula I I:
Wherein, n=0～1
6. the mobile fast underfill of dual cure systems according to claim 2 is characterized in that the structural formula of described phenol aldehyde type epoxy resin is represented by following general formula I II:
Wherein, n=1～3
7. the mobile fast underfill of dual cure systems according to claim 1 is characterized in that, described acrylic acid epoxy resin is that an end of molecular chain is two keys, and the other end is an epoxide group, and its structural formula is represented by following general formula I V:
8. the mobile fast underfill of dual cure systems according to claim 1 is characterized in that, described acrylate is a kind of or any several mixture in butyl acrylate, Isooctyl acrylate monomer, the lauryl methacrylate(LMA); Described polyvalent alcohol is polyester polyol, polyether glycol, polycaprolactone polyol, 1, a kind of or any several mixture in the 4-butyleneglycol; Described silane coupling agent is a kind of or any several mixture in β-(3, the 4-epoxycyclohexyl) ethyl trimethoxy silane, γ-glycidoxypropyltrimewasxysilane, γ-Qiu Jibingjisanjiayangjiguiwan, the γ-An Bingjisanyiyangjiguiwan.
9. the mobile fast underfill of dual cure systems according to claim 1 is characterized in that described cationic initiator is a hexafluoro antimonate; Described radical initiator is a kind of or any several mixture in benzoyl peroxide, Diisopropyl azodicarboxylate, di-tert-butyl peroxide, the peroxide-2-ethyl hexanoic acid tert-butyl.
A kind of dual cure systems is the preparation method of mobile underfill fast, it is characterized in that, described method comprises: take by weighing Resins, epoxy 30～80% by following weight percent, cationic initiator 0.3～4%, it is dropped in the reactor, mixed 30 minutes at 30～35 ℃, make it dissolving and become uniform solution, and then take by weighing acrylic acid epoxy resin 10～50%, acrylate 5～30%, polyvalent alcohol 2～20%, silane coupling agent 1～20%, radical initiator 0.1～3% and carbon black 0.1～0.5%, add in the reactor successively, in 15～20 ℃ of temperature, vacuum tightness-0.08～-0.05MPa, 500～1000 rev/mins of rotating speeds, mixed 1～2 hour, and promptly got product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010297440 CN102010686B (en) | 2010-09-30 | 2010-09-30 | Double-solidification system fast-flowing underfill and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010297440 CN102010686B (en) | 2010-09-30 | 2010-09-30 | Double-solidification system fast-flowing underfill and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102010686A true CN102010686A (en) | 2011-04-13 |
| CN102010686B CN102010686B (en) | 2013-04-17 |
Family
ID=43841021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010297440 Expired - Fee Related CN102010686B (en) | 2010-09-30 | 2010-09-30 | Double-solidification system fast-flowing underfill and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102010686B (en) |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102676064A (en) * | 2012-04-28 | 2012-09-19 | 烟台德邦科技有限公司 | Matte adhesive and preparation method thereof |
| WO2012177122A1 (en) * | 2011-06-23 | 2012-12-27 | Holland Novochem Technical Coatings B.V. | Composition to protect surfaces and its coating method |
| CN102952503A (en) * | 2012-11-29 | 2013-03-06 | 明尼苏达矿业制造特殊材料（上海）有限公司 | High temperature resisting pressure-sensitive adhesive composition and high temperature resisting pressure-sensitive adhesive tape |
| WO2013067947A1 (en) * | 2011-11-08 | 2013-05-16 | Henkel (China) Company Limited | Dual-curable adhesive composition, use thereof, and process for bonding substrates |
| CN103113842A (en) * | 2013-02-26 | 2013-05-22 | 烟台信友电子有限公司 | Single-component low-viscosity heat curing double-system structural adhesive and preparation method thereof |
| CN103436211A (en) * | 2013-09-10 | 2013-12-11 | 烟台德邦科技有限公司 | Underfill adhesive with good compatibility and preparation method thereof |
| CN103571418A (en) * | 2013-11-12 | 2014-02-12 | 烟台德邦科技有限公司 | Flexible underfill and preparation method thereof |
| WO2014113931A1 (en) * | 2013-01-23 | 2014-07-31 | Henkel IP & Holding GmbH | Underfill composition and packaging process using the same |
| CN104212365A (en) * | 2014-09-26 | 2014-12-17 | 烟台德邦科技有限公司 | Non-flowing bottom filling material and preparation method thereof |
| CN105348878A (en) * | 2015-12-11 | 2016-02-24 | 滁州斯迈特复合材料有限公司 | Water-proofing agent for water tower |
| CN106753143A (en) * | 2016-12-21 | 2017-05-31 | 南京诺邦新材料有限公司 | A kind of low-temperature setting underfill with heat conduction function and preparation method thereof |
| CN107852790A (en) * | 2015-11-19 | 2018-03-27 | 积水化学工业株式会社 | Organic electro-luminescent display unit sealant |
| CN108192549A (en) * | 2017-12-30 | 2018-06-22 | 南京陶特思软件科技有限公司 | A kind of anti-acid liquid crystal display adhesive and its preparation process |
| CN109401706A (en) * | 2018-10-31 | 2019-03-01 | 深圳广恒威科技有限公司 | One kind can quick-setting high reliability filling glue |
| CN110423435A (en) * | 2019-07-22 | 2019-11-08 | 西安天元化工有限责任公司 | A kind of photocuring and the common composition epoxy resin for solidifying combination |
| CN110628370A (en) * | 2019-08-22 | 2019-12-31 | 烟台德邦科技有限公司 | Dual-curing system underfill and preparation method thereof |
| WO2020073747A1 (en) * | 2018-10-11 | 2020-04-16 | 北京蓝海黑石科技有限公司 | Low-halogen underfiller, preparation method therefor and application thereof |
| CN111635730A (en) * | 2019-03-01 | 2020-09-08 | 泰州隆基乐叶光伏科技有限公司 | Insulating adhesive, preparation method of insulating adhesive and IBC solar cell |
| CN112063344A (en) * | 2020-08-07 | 2020-12-11 | 江苏东邦科技有限公司 | High toughness low volatility adhesive and adhesive film for automotive interiors |
| CN114709274A (en) * | 2022-03-04 | 2022-07-05 | 江苏日托光伏科技股份有限公司 | MWT photovoltaic assembly conductive core board integrated with insulating layer and manufacturing method thereof |
| CN115820181A (en) * | 2022-12-07 | 2023-03-21 | 东莞市新懿电子材料技术有限公司 | Underfill adhesive based on composite nano filler and preparation method and application thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003105060A (en) * | 2001-09-28 | 2003-04-09 | Nagase Chemtex Corp | Thermosetting resin composition having vibration-damping properties and adhesive using the same |
| CN1585807A (en) * | 2001-11-02 | 2005-02-23 | 3M创新有限公司 | Hybrid adhesives, articles, and methods |
| CN101580684A (en) * | 2009-06-05 | 2009-11-18 | 烟台德邦科技有限公司 | Low-temperature fast curing underfill adhesive and preparation method thereof |
| CN101654607A (en) * | 2009-09-08 | 2010-02-24 | 烟台德邦科技有限公司 | High purity photo-thermal curing adhesive and preparation method thereof |
-
2010
- 2010-09-30 CN CN 201010297440 patent/CN102010686B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003105060A (en) * | 2001-09-28 | 2003-04-09 | Nagase Chemtex Corp | Thermosetting resin composition having vibration-damping properties and adhesive using the same |
| CN1585807A (en) * | 2001-11-02 | 2005-02-23 | 3M创新有限公司 | Hybrid adhesives, articles, and methods |
| CN101580684A (en) * | 2009-06-05 | 2009-11-18 | 烟台德邦科技有限公司 | Low-temperature fast curing underfill adhesive and preparation method thereof |
| CN101654607A (en) * | 2009-09-08 | 2010-02-24 | 烟台德邦科技有限公司 | High purity photo-thermal curing adhesive and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 朱洪法: "《精细化工常用原材料手册》", 31 December 2003, article "丙烯酸环氧树脂 Epoxy Acrylate Resin", pages: 443 * |
Cited By (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012177122A1 (en) * | 2011-06-23 | 2012-12-27 | Holland Novochem Technical Coatings B.V. | Composition to protect surfaces and its coating method |
| NL1038884C2 (en) * | 2011-06-23 | 2013-01-02 | Holland Novochem Technical Coatings B V | Protective polymer layers. |
| NL1039699A (en) * | 2011-06-23 | 2013-01-02 | Holland Novochem Technical Coatings B V | Protective polymer layers. |
| WO2013067947A1 (en) * | 2011-11-08 | 2013-05-16 | Henkel (China) Company Limited | Dual-curable adhesive composition, use thereof, and process for bonding substrates |
| CN102676064A (en) * | 2012-04-28 | 2012-09-19 | 烟台德邦科技有限公司 | Matte adhesive and preparation method thereof |
| CN102676064B (en) * | 2012-04-28 | 2013-09-04 | 烟台德邦科技有限公司 | Matte adhesive and preparation method thereof |
| CN102952503B (en) * | 2012-11-29 | 2015-11-25 | 明尼苏达矿业制造特殊材料（上海）有限公司 | High temperature resistant pressure sensitive adhesive composition and high temperature resistant pressure sensitive adhesive band |
| CN102952503A (en) * | 2012-11-29 | 2013-03-06 | 明尼苏达矿业制造特殊材料（上海）有限公司 | High temperature resisting pressure-sensitive adhesive composition and high temperature resisting pressure-sensitive adhesive tape |
| CN104937027A (en) * | 2013-01-23 | 2015-09-23 | 汉高知识产权控股有限责任公司 | Underfill composition and packaging process using the same |
| WO2014113931A1 (en) * | 2013-01-23 | 2014-07-31 | Henkel IP & Holding GmbH | Underfill composition and packaging process using the same |
| KR101850592B1 (en) | 2013-01-23 | 2018-04-19 | 헨켈 아이피 앤드 홀딩 게엠베하 | Underfill composition and packaging process using the same |
| TWI649371B (en) * | 2013-01-23 | 2019-02-01 | 德商漢高智慧財產控股公司 | Bottom filling composition and packaging method using the same |
| CN104937027B (en) * | 2013-01-23 | 2018-10-12 | 汉高知识产权控股有限责任公司 | Underfill composition and the packaging technology for using the composition |
| US9688892B2 (en) | 2013-01-23 | 2017-06-27 | Henkel Ag & Co. Kgaa | Underfill composition and packaging process using the same |
| CN103113842A (en) * | 2013-02-26 | 2013-05-22 | 烟台信友电子有限公司 | Single-component low-viscosity heat curing double-system structural adhesive and preparation method thereof |
| CN103436211A (en) * | 2013-09-10 | 2013-12-11 | 烟台德邦科技有限公司 | Underfill adhesive with good compatibility and preparation method thereof |
| CN103571418A (en) * | 2013-11-12 | 2014-02-12 | 烟台德邦科技有限公司 | Flexible underfill and preparation method thereof |
| CN104212365A (en) * | 2014-09-26 | 2014-12-17 | 烟台德邦科技有限公司 | Non-flowing bottom filling material and preparation method thereof |
| CN104212365B (en) * | 2014-09-26 | 2015-12-02 | 烟台德邦科技有限公司 | A kind of no-flow underfill material and preparation method thereof |
| CN107852790A (en) * | 2015-11-19 | 2018-03-27 | 积水化学工业株式会社 | Organic electro-luminescent display unit sealant |
| JPWO2017086144A1 (en) * | 2015-11-19 | 2018-06-07 | 積水化学工業株式会社 | Sealant for organic electroluminescence display element |
| JP2019147963A (en) * | 2015-11-19 | 2019-09-05 | 積水化学工業株式会社 | Sealing agent for organic electroluminescence display element |
| CN107852790B (en) * | 2015-11-19 | 2020-05-12 | 积水化学工业株式会社 | Sealing agent for organic electroluminescent display element |
| CN105348878A (en) * | 2015-12-11 | 2016-02-24 | 滁州斯迈特复合材料有限公司 | Water-proofing agent for water tower |
| CN106753143A (en) * | 2016-12-21 | 2017-05-31 | 南京诺邦新材料有限公司 | A kind of low-temperature setting underfill with heat conduction function and preparation method thereof |
| CN108192549A (en) * | 2017-12-30 | 2018-06-22 | 南京陶特思软件科技有限公司 | A kind of anti-acid liquid crystal display adhesive and its preparation process |
| WO2020073747A1 (en) * | 2018-10-11 | 2020-04-16 | 北京蓝海黑石科技有限公司 | Low-halogen underfiller, preparation method therefor and application thereof |
| CN109401706A (en) * | 2018-10-31 | 2019-03-01 | 深圳广恒威科技有限公司 | One kind can quick-setting high reliability filling glue |
| CN109401706B (en) * | 2018-10-31 | 2021-06-25 | 深圳广恒威科技有限公司 | High-reliability filling adhesive capable of being rapidly cured |
| CN111635730A (en) * | 2019-03-01 | 2020-09-08 | 泰州隆基乐叶光伏科技有限公司 | Insulating adhesive, preparation method of insulating adhesive and IBC solar cell |
| CN110423435A (en) * | 2019-07-22 | 2019-11-08 | 西安天元化工有限责任公司 | A kind of photocuring and the common composition epoxy resin for solidifying combination |
| CN110628370A (en) * | 2019-08-22 | 2019-12-31 | 烟台德邦科技有限公司 | Dual-curing system underfill and preparation method thereof |
| CN110628370B (en) * | 2019-08-22 | 2021-07-13 | 烟台德邦科技股份有限公司 | Dual-curing system underfill and preparation method thereof |
| CN112063344A (en) * | 2020-08-07 | 2020-12-11 | 江苏东邦科技有限公司 | High toughness low volatility adhesive and adhesive film for automotive interiors |
| CN114709274A (en) * | 2022-03-04 | 2022-07-05 | 江苏日托光伏科技股份有限公司 | MWT photovoltaic assembly conductive core board integrated with insulating layer and manufacturing method thereof |
| CN114709274B (en) * | 2022-03-04 | 2024-01-23 | 江苏日托光伏科技股份有限公司 | MWT photovoltaic module conductive core plate integrated with insulating layer and manufacturing method thereof |
| CN115820181A (en) * | 2022-12-07 | 2023-03-21 | 东莞市新懿电子材料技术有限公司 | Underfill adhesive based on composite nano filler and preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102010686B (en) | 2013-04-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102010686B (en) | Double-solidification system fast-flowing underfill and preparation method thereof | |
| CN102559115B (en) | Chip-level bottom filling adhesive and preparation method thereof | |
| CN102504745B (en) | Double curing encapsulating adhesive and preparation method thereof | |
| CN105802563B (en) | A kind of flow model chip-level bottom filling adhesive and preparation method thereof | |
| CN1125488C (en) | Liquid epoxy composite for packaging semiconductor and its application | |
| JP3891554B2 (en) | Epoxy resin composition for optical semiconductor encapsulation and optical semiconductor device | |
| CN101186802B (en) | Epoxy resin composition for multi-chip package and multi-chip package using same | |
| CN101580685A (en) | High-reliability fast curing underfill adhesive and preparation method thereof | |
| CN102031081A (en) | Liquid epoxy encapsulating material and preparation method thereof | |
| CN102504743B (en) | Single-component underfill capable of being stored at room temperature and preparation method thereof | |
| JP5899498B2 (en) | Epoxy resin composition for semiconductor encapsulation, method for producing the same, and semiconductor device | |
| CN103436211B (en) | Underfill adhesive with good compatibility and preparation method thereof | |
| JP2001234032A (en) | Epoxy resin composition for optical semiconductor sealing use | |
| CN105462531B (en) | Underfill and preparation method thereof and flip-chip | |
| KR20200094792A (en) | Epoxy resin composition for sealing a ball grid array package, cured epoxy resin, and electronic component device | |
| CN101440266B (en) | Novel paster glue for surface mounting technology and preparation thereof | |
| CN102898785B (en) | Encapsulation adhesive for smart card, and preparation method thereof | |
| CN106398617A (en) | Bottom filling adhesive having good compatibility with scaling powder and preparation method thereof | |
| CN102061060B (en) | High-reliability intelligent-card encapsulating glue and preparation method thereof | |
| JP2015227390A (en) | Resin composition for encapsulating optical semiconductor and optical semiconductor device | |
| CN109517335B (en) | Epoxy resin composition for molding compound and preparation method thereof | |
| CN111073572A (en) | Two-component normal-temperature curing epoxy resin pouring sealant, preparation and use method thereof | |
| CN111454679A (en) | L ED molding packaging adhesive and using method thereof | |
| CN102002235B (en) | Method for reducing thermal expansion coefficient of polybenzoxazine-based underfill | |
| CN103361016B (en) | A kind of Underfill adhesive composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: DARBOND TECHNOLOGY CO., LTD., YANTAI Free format text: FORMER OWNER: YANTAI DARBOND ELECTRONICS MATERIALS CO., LTD. Effective date: 20120720 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20120720 Address after: 264006 Jinsha River Road, Yantai Development Zone, Shandong, No. 98 Applicant after: Yantai Darbond Technology Co., Ltd. Address before: 264006 No. 98, Jinsha River Road, Yantai Development Zone, Shandong Applicant before: Yantai Darbond Electronic Materials Co., Ltd. |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130417 Termination date: 20150930 |
|
| EXPY | Termination of patent right or utility model |