CN101993575A - 用于各向异性导电膜的组合物 - Google Patents
用于各向异性导电膜的组合物 Download PDFInfo
- Publication number
- CN101993575A CN101993575A CN2010102561515A CN201010256151A CN101993575A CN 101993575 A CN101993575 A CN 101993575A CN 2010102561515 A CN2010102561515 A CN 2010102561515A CN 201010256151 A CN201010256151 A CN 201010256151A CN 101993575 A CN101993575 A CN 101993575A
- Authority
- CN
- China
- Prior art keywords
- epoxy
- composition
- resins
- acrylic rubber
- conductive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Non-Insulated Conductors (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2009-0077079 | 2009-08-20 | ||
KR1020090077079A KR101138799B1 (ko) | 2009-08-20 | 2009-08-20 | 이방 도전성 필름용 조성물 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101993575A true CN101993575A (zh) | 2011-03-30 |
CN101993575B CN101993575B (zh) | 2013-03-27 |
Family
ID=43607426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010102561515A Active CN101993575B (zh) | 2009-08-20 | 2010-08-16 | 用于各向异性导电膜的组合物 |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR101138799B1 (zh) |
CN (1) | CN101993575B (zh) |
TW (1) | TWI423267B (zh) |
WO (1) | WO2011021780A2 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103666297A (zh) * | 2012-09-21 | 2014-03-26 | 第一毛织株式会社 | 各向异性导电膜和包括它的半导体装置 |
CN104099031A (zh) * | 2013-04-04 | 2014-10-15 | 迪睿合电子材料有限公司 | 各向异性导电膜、连接方法及接合体 |
CN104250525A (zh) * | 2013-06-25 | 2014-12-31 | 第一毛织株式会社 | 各向异性导电膜、图像显示器及半导体装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101464353B1 (ko) | 2011-12-28 | 2014-11-25 | 제일모직 주식회사 | 이방 도전성 필름용 조성물, 이방 도전성 필름, 및 이를 이용한 반도체 장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006031411A2 (en) * | 2004-09-09 | 2006-03-23 | Intel Corporation | A conductive lithographic polymer mixture and method of making devices using same |
CN1831073A (zh) * | 2005-03-07 | 2006-09-13 | 国家淀粉及化学投资控股公司 | 低应力导电胶粘剂 |
CN1883938A (zh) * | 2006-05-25 | 2006-12-27 | 刘萍 | 多层结构异方向导电膜及其制备方法 |
CN101308711A (zh) * | 2008-04-29 | 2008-11-19 | 刘萍 | 多层结构异方向导电膜及其制备方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3231814B2 (ja) * | 1991-07-12 | 2001-11-26 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | 異方性導電膜 |
KR101000798B1 (ko) * | 2003-07-04 | 2010-12-13 | 회명산업 주식회사 | 이방성 도전성 필름 접착제 및 이를 이용하여 제조한 평판디스플레이 |
KR100601341B1 (ko) * | 2004-06-23 | 2006-07-14 | 엘에스전선 주식회사 | 이방 도전성 접착제 및 이를 이용한 접착필름 |
JP2007091959A (ja) * | 2005-09-30 | 2007-04-12 | Sumitomo Electric Ind Ltd | 異方導電性接着剤 |
KR100673773B1 (ko) * | 2005-10-18 | 2007-01-24 | 제일모직주식회사 | 플루오렌계 (메타)아크릴레이트를 이용한 이방 전도성필름용 조성물 |
JP2007112949A (ja) * | 2005-10-24 | 2007-05-10 | Sumitomo Electric Ind Ltd | 異方導電性接着剤 |
TW200815560A (en) * | 2006-06-16 | 2008-04-01 | Hitachi Chemical Co Ltd | Film-shaped adhesive for circuit connection |
KR100722121B1 (ko) * | 2006-07-21 | 2007-05-25 | 제일모직주식회사 | 고신뢰성 이방 전도성 필름용 조성물 |
KR100787728B1 (ko) * | 2006-12-20 | 2007-12-24 | 제일모직주식회사 | 아크릴 고분자 중합체를 이용한 고신뢰성 이방 전도성필름용 조성물 및 이를 이용한 이방 전도성 필름 |
KR100891414B1 (ko) * | 2007-11-20 | 2009-04-02 | 제일모직주식회사 | 저장안정성이 개선된 이방 도전성 필름용 조성물 |
-
2009
- 2009-08-20 KR KR1020090077079A patent/KR101138799B1/ko active IP Right Grant
- 2009-12-30 TW TW098145851A patent/TWI423267B/zh active
-
2010
- 2010-07-20 WO PCT/KR2010/004720 patent/WO2011021780A2/ko active Application Filing
- 2010-08-16 CN CN2010102561515A patent/CN101993575B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006031411A2 (en) * | 2004-09-09 | 2006-03-23 | Intel Corporation | A conductive lithographic polymer mixture and method of making devices using same |
CN1831073A (zh) * | 2005-03-07 | 2006-09-13 | 国家淀粉及化学投资控股公司 | 低应力导电胶粘剂 |
CN1883938A (zh) * | 2006-05-25 | 2006-12-27 | 刘萍 | 多层结构异方向导电膜及其制备方法 |
CN101308711A (zh) * | 2008-04-29 | 2008-11-19 | 刘萍 | 多层结构异方向导电膜及其制备方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103666297A (zh) * | 2012-09-21 | 2014-03-26 | 第一毛织株式会社 | 各向异性导电膜和包括它的半导体装置 |
CN103666297B (zh) * | 2012-09-21 | 2016-03-02 | 第一毛织株式会社 | 各向异性导电膜和包括它的半导体装置 |
CN104099031A (zh) * | 2013-04-04 | 2014-10-15 | 迪睿合电子材料有限公司 | 各向异性导电膜、连接方法及接合体 |
CN104099031B (zh) * | 2013-04-04 | 2017-04-12 | 迪睿合电子材料有限公司 | 各向异性导电膜、连接方法及接合体 |
TWI588235B (zh) * | 2013-04-04 | 2017-06-21 | 迪睿合股份有限公司 | 各向異性導電薄膜、其連接方法及其接合體 |
CN104250525A (zh) * | 2013-06-25 | 2014-12-31 | 第一毛织株式会社 | 各向异性导电膜、图像显示器及半导体装置 |
Also Published As
Publication number | Publication date |
---|---|
TW201108253A (en) | 2011-03-01 |
CN101993575B (zh) | 2013-03-27 |
WO2011021780A2 (ko) | 2011-02-24 |
KR20110019519A (ko) | 2011-02-28 |
WO2011021780A3 (ko) | 2011-05-19 |
KR101138799B1 (ko) | 2012-04-24 |
TWI423267B (zh) | 2014-01-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7588698B2 (en) | Circuit connecting adhesive | |
CN103160221B (zh) | 各向异性导电膜和通过该膜结合的半导体装置 | |
JP3885896B2 (ja) | 補修可能な電極接続用接着剤組成物および該組成物からなる電極接続用接続部材 | |
US20110256342A1 (en) | Film adhesive and anisotropic conductive adhesive | |
US20090140210A1 (en) | Anisotropic Conductive Adhesive | |
JP5838674B2 (ja) | フィルム状異方導電性接着剤 | |
WO2005078034A1 (ja) | 導電性接着剤 | |
KR20050049452A (ko) | 접착제, 배선단자의 접속방법 및 배선구조체 | |
CN101755025B (zh) | 粘合剂和接合体 | |
CN101993575B (zh) | 用于各向异性导电膜的组合物 | |
JP2008097922A (ja) | 電極接続用接着剤 | |
JPH083081B2 (ja) | 回路接続用接着剤組成物 | |
US11008488B2 (en) | Adhesive composition and film roll | |
JPH09291268A (ja) | 接着剤組成物および該組成物からなる接続部材 | |
KR20100020029A (ko) | 회로 접속용 필름상 접착제 | |
JPH09143252A (ja) | 回路用接続部材 | |
JP2002327162A (ja) | 異方導電性接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 | |
JP4867805B2 (ja) | 電極接続用接着剤 | |
JP2003147306A (ja) | 導電性接着剤 | |
TWI649399B (zh) | 非等向性導電膜用組成物、非等向性導電膜及使用其的顯示裝置 | |
TWI609938B (zh) | 電子零件接著材料及電子零件之接著方法 | |
JP2009084307A (ja) | 電極接続用接着剤 | |
JP5273514B2 (ja) | 電極接続用接着剤とその製造方法 | |
JP2009004603A (ja) | 基板の製造方法 | |
JP5630639B2 (ja) | フィルム状導電性接着剤 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: Han Guojingjidao Patentee after: Samsung SDI Co.,Ltd. Address before: Han Guoqingshangbeidao Patentee before: CHEIL INDUSTRIES Inc. |
|
CP03 | Change of name, title or address | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191126 Address after: Seoul, South Kerean Patentee after: GUKTOH CHEMICAL Co.,Ltd. Address before: Han Guojingjidao Patentee before: Samsung SDI Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220921 Address after: Gyeonggi Do, South Korea Patentee after: Guo Dujianduansucai Address before: Seoul, South Kerean Patentee before: GUKTOH CHEMICAL Co.,Ltd. |
|
TR01 | Transfer of patent right |