CN101916635B - Manufacturing method of patch concave electrode network resistor and product thereof - Google Patents
Manufacturing method of patch concave electrode network resistor and product thereof Download PDFInfo
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- CN101916635B CN101916635B CN2009101826709A CN200910182670A CN101916635B CN 101916635 B CN101916635 B CN 101916635B CN 2009101826709 A CN2009101826709 A CN 2009101826709A CN 200910182670 A CN200910182670 A CN 200910182670A CN 101916635 B CN101916635 B CN 101916635B
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Abstract
The invention discloses a manufacturing method of a patch concave electrode network resistor and a product thereof. Before front electrodes are printed, an anti-overflow layer is arranged in the position between the longitudinal directions of the front electrodes in advance to avoid front electrode extension which can possibly occur in the subsequent electroplating process, so that the reduction of the distance between the front electrodes is prevented, and welding spots can not be short-circuited easily by a client in the subsequent welding process, thereby enabling the product to be better used by the client and improving the quality of the product. After the front electrodes are printed, a lateral electrode conducting layer is formed in a hole pouring mode, a back electrode is formed by filmily sputtering in a mask sputtering mode, and the cost and the consumption of raw materials for sputtering are lower, thereby effectively reducing the production cost and enhancing the market competitiveness of the product. In the sputtering process, a sputtering layer formed on a hole wall covers the lateral electrode conducting layer to effectively form a lateral electrode to overcome the defect that the traditional process possibly can not realize full connection to form the lateral electrode caused by warping of an insulated substrate, thereby greatly reducing the quality hidden danger.
Description
Technical field
The present invention relates to a kind of manufacturing approach and goods thereof of resistor, particularly about the manufacturing approach and the goods thereof of patch concave electrode network resistor.
Background technology
Patch concave electrode network resistor can be widely used in communication products such as each electric appliances, personal data memory, mobile phone, and promote the further miniaturization of this electronic product because little, the power of its small product size is big, dense arrangement, be easy to mount; Simultaneously less relatively because of the spacing of its electrode, make its electrode that internal stress is installed and reduce and problem such as substrate fracture is reduced greatly.
Typical patch concave electrode network resistor processing procedure is described below:
1. adopt silk screen printing to form front electrode in the front of large stretch of insulated substrate, and adopt special-purpose grout equipment to form the top of side electrode, and carry out drying;
2. adopt silk screen printing to form backplate at the back side of above-mentioned insulated substrate, and adopt special-purpose grout equipment grout to form the lower part of side electrode, carry out drying and burn till, the lower part of this side electrode links to each other with top fully;
Above-mentioned front electrode vertically between adopt silk screen printing to form resistive layer, and carry out drying and burn till. the two ends of this resistive layer are connected in above-mentioned front electrode;
4. on above-mentioned resistive layer, form first protective layer (being glassivation), and carry out drying and burn till;
5. for above-mentioned resistive layer, carry out accurate resistance trimming, make its resistance value reach setting through laser;
6. on above-mentioned first protective layer, adopt screen printing mode to form second protective layer (being resin protective layer) and label layer once more, and carry out drying and burn till;
7. adopt special equipment that above-mentioned big plate base is vertically rolled over the bar line along each in regular turn substrate is converted into strip, and be stacked in the special fixture automatically;
8. it is granular to adopt special equipment that above-mentioned strip product is converted into the strip product along each horizontal folding grain line in regular turn, forms a plurality of single patch concave electrode network resistor semi-finished product;
9. above-mentioned patch concave electrode network resistor semi-finished product are passed through the barrel plating mode, on above-mentioned front electrode, backplate and end electrode, forming by metallic nickel and tin is main component nickel coating and tin coating.
Yet above-mentioned patch concave electrode network resistor manufacturing approach has following shortcoming:
1. patch concave electrode network resistor is when forming side electrode; Adopt the mode of positive printing grout and the combination of back up grout to form side electrode; In manufacture process, because the song of substrate sticks up problem, make the vacuum of grout can produce inconsistent phenomenon, it is different that other adds the position of upper substrate perforation; Make the inconsistent end electrode grout degree of depth that also can cause in path of air-flow can not guarantee unanimity; The situation that upper and lower like this grout electrode just can occur unavoidably that electrode can not connect or not exclusively connect, can there be certain quality hidden danger in product when client is used, cause bad rising and client's satisfaction decline in the production process.
2. patch concave electrode network resistor generally is to adopt flagpole pattern to print when forming the second protection layer, only plays the effect of protective resistance layer.Coating during plating on the electrode has certain extension, dwindling more because of the electrode extension can make interelectrode spacing through after electroplating, the client when welding, cause easily the solder joint weak point by, and make inefficacy of client product function or circuit burnout.
Patch concave electrode network resistor when forming backplate and end electrode, just adopting, the mode of back up grout; It is thicker that backplate and end electrode burn till back thickness; Large usage quantity, and the printing raw material be to be the slug type slurry of main component with silver, its price is higher; Cause production cost of products higher, the market competitiveness weakens.
Summary of the invention
In order to overcome above-mentioned defective, the invention provides a kind of manufacturing approach and goods thereof of patch concave electrode network resistor, improved the hidden danger of quality in the patch concave electrode network resistor production process effectively, practiced thrift manufacturing cost.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of manufacturing approach of patch concave electrode network resistor is benchmark to use direction, and its manufacturing step is following:
A. prepare an insulated substrate; Upper surface and the even corresponding clathrate of lower surface ground at this insulated substrate form some vertical folding bar lines and some horizontal folding grain lines; Correspondence is interval with some perforation on each vertical folding bar line, and center of circle of each perforation is positioned on the vertical folding bar line of its place;
B. after forming the anti-overflow fluid layer on the vertical folding bar line between each perforation of insulated substrate upper surface, carry out drying;
C. front electrode is printed at the position of corresponding perforation on the upper surface of insulated substrate, and the geometric center of this front electrode overlaps with the center of circle of perforation, then grout is carried out in each perforation and forms the side electrode conductting layer on each perforation hole wall top;
D. each front electrode of insulated substrate laterally between respectively printing form resistive layer; This resistive layer extend on the end of front electrode near this resistive layer at its two ends (be each front electrode laterally between corresponding to each resistive layer UNICOM), carry out burning till again after the drying;
E. each resistive layer of insulated substrate vertically between and on each resistive layer printing form one deck first protective layer, burn till again after the drying;
Thereby each protective layer and the resistive layer that f. adopt the laser machine to make laser pass insulated substrate form line of cut to carry out the resistance adjustment of each resistive layer on the correspondence position of each protective layer and resistive layer, make said resistance be adapted to required resistance value;
G. printing forms mask layer on the part outside the front electrode position of the corresponding upper surface of the lower surface of insulated substrate, and carries out drying;
H. the lower surface to insulated substrate carries out sputter, on the position of the front electrode of the hole wall of said mask layer, perforation and the corresponding upper surface of insulated substrate lower surface, forms sputtering layer and toasts;
I. with the sputtering layer on said mask layer and the mask layer wash and air-dry after; The locational sputtering layer of each front electrode of the corresponding upper surface of this insulated substrate lower surface forms each backplate, and the sputtering layer on hole wall of each perforation covers the conducting side electrode conductting layer that hole wall top forms of respectively boring a hole, the sputtering layer formation side electrode on this side electrode conductting layer and the hole wall; Thereby make front electrode and backplate through the side electrode conducting; It is thicker that the electrode that printing forms burns till back thickness, and the raw material of printing is for making the slug type slurry of main composition amount, the higher and large usage quantity of its price with silver; And adopt the sputter mode can select with the metal nickel chromium triangle is that the electric conducting material of main component is a raw material; Film like ground sputter forms electrode, effectively reduces production cost, has strengthened product market competitiveness; Again because of the inevitable warpage issues that exists slightly of insulated substrate; Mode through sputter forms sputtering layer and the side electrode conductting layer is covered conducting on the hole wall of each perforation; Formed side electrode conducting its pairing front electrode and backplate have been guaranteed; Effectively overcome the shortcoming that can not be connected to form side electrode fully that possibly exist in the traditional handicraft, greatly reduced hidden danger of quality;
J. on first protective layer of insulated substrate upper surface and each front electrode vertically between printing one deck second protective layer, and carry out drying;
K. on second protective layer, print character code, burn till after the drying;
L. along the vertical folding bar line on the insulated substrate insulated substrate is fractureed and form the strip substrate, and each strip substrate is stacked in the tool through special-purpose board;
M. above-mentioned each strip substrate that is stacked in the tool is fractureed along a horizontal folding grain line and form independently patch concave electrode network resistor semi-finished product;
N. the patch concave electrode network resistor semi-finished product are put into the electro-plating roller of electroplating bath; Electro-plating roller is rotated with setting speed; Under electric current of setting and time condition; Make on the half-finished front electrode of patch concave electrode network resistor, backplate and the side electrode and all be formed uniformly one deck nickel dam; During plating on the front electrode coating have certain extension, dwindle because of the electrode extension can make the spacing between front electrode through electroplating the back, the client causes the solder joint short circuit easily and the client product function was lost efficacy or short circuit is burnt when later welded; Anti-overflow fluid layer among the step b is effective must to have been deadened the electrode that front electrode may occur and has extended phenomenon, better supports the client to use in the future and has improved end product quality;
O. be formed uniformly one deck tin layer on the surface of nickel dam through electro-plating roller again, and through cleaning and dry back formation patch concave electrode network resistor.
As further improvement of the present invention: the material of said first protective layer is mainly glass paste.
As further improvement of the present invention: the material of said second protective layer is an epoxy resin.
The made patch concave electrode network resistor of a kind of above-mentioned manufacturing approach; Comprise an insulated substrate; To use direction to be benchmark; This insulated substrate is rectangular, and the two sides, place, long limit of this insulated substrate are corresponding respectively to be recessed to form the recessed post of some half round posts at interval, and the position that the upper surface of this insulated substrate closes on each recessed post all is printed with some front electrodes; And each front electrode extends to the wall top of recessed post and forms the side electrode conductting layer; There is backplate at the position of corresponding each front electrode of the lower surface of this insulated substrate all sputter, on the recessed post jamb face outside the side electrode conductting layer of said recessed post and this side electrode conductting layer all sputter sputtering layer is arranged, this side electrode conductting layer and sputtering layer composition side electrode; This is printed with resistive layer near correspondence between the front electrode of two long sides of insulated substrate; And each resistive layer extends on the end of front electrode near this resistive layer that covers its two ends, and the position between said each resistive layer and the resistive layer is all printed and is coated with first protective layer, all prints on the insulated substrate between said first protective layer and each front electrode to be coated with second protective layer; All be electroplate with nickel dam on said front electrode, side electrode and the backplate, be electroplate with the tin layer on this nickel dam.
Said resistive layer is for being adjusted to the resistive layer of setting resistance through laser.
Be printed with character code on said second protective layer.
The invention has the beneficial effects as follows: the electrode that front electrode may occur when having deadened follow-up the plating through being provided with of anti-overflow fluid layer is effective extends phenomenon; And prevented that the spacing between front electrode from dwindling; The client can not dwindle because of the spacing between front electrode when later welded and cause the solder joint short circuit; Thereby make product support that better the client uses in the future, improved end product quality; It is thicker that the electrode that printing forms burns till back thickness; The raw material of printing is for making the slug type slurry of main composition amount with silver, and the higher and large usage quantity of its price is that the electric conducting material of main component is a raw material and adopt the sputter mode can select with the metal nickel chromium triangle; Film like ground sputter forms electrode (being backplate among the present invention); Effectively reduce production cost, strengthened product market competitiveness, again because of the inevitable warpage issues that exists slightly of insulated substrate; Mode through sputter is closed the formation sputtering layer and the side electrode conductting layer is covered conducting at the sky of each perforation; Guarantee formed side electrode conducting its pairing front electrode and backplate, effectively overcome the shortcoming that can not be connected to form side electrode fully that possibly exist in the traditional handicraft, greatly reduced hidden danger of quality.
Description of drawings
Fig. 1 is the insulated substrate sketch map behind the step a according to the invention;
Fig. 2 is the insulated substrate upper surface sketch map behind the step b according to the invention;
Fig. 3 is the insulated substrate upper surface sketch map behind the step c according to the invention;
Fig. 4 is the insulated substrate upper surface sketch map after the steps d according to the invention;
Fig. 5 is the insulated substrate upper surface sketch map behind the step e according to the invention;
Fig. 6 is the insulated substrate upper surface sketch map behind the step f according to the invention;
Fig. 7 is the insulated substrate lower surface sketch map after the step g according to the invention;
Fig. 8 is the insulated substrate lower surface sketch map behind the step h according to the invention;
Fig. 9 is the insulated substrate lower surface sketch map after the step I according to the invention;
Figure 10 is the insulated substrate upper surface sketch map behind the step j according to the invention;
Figure 11 is the insulated substrate upper surface sketch map behind the step k according to the invention;
Figure 12 is the strip substrate sketch map behind the step l according to the invention;
Figure 13 is the patch concave electrode network resistor semi-finished product sketch map behind the step m according to the invention;
Figure 14 is the patch concave electrode network resistor semi-finished product sketch map behind the step n according to the invention;
Figure 15 is the patch concave electrode network resistor sketch map behind the step o according to the invention;
Figure 16 is the profile of patch concave electrode network resistor according to the invention.
Embodiment
Embodiment: a kind of manufacturing approach of patch concave electrode network resistor, be benchmark to use direction, its manufacturing step is following:
A. prepare an insulated substrate 1; Upper surface 2 at this insulated substrate forms some vertical folding bar lines 11 and some horizontal folding grain lines 12 with lower surface 3 even corresponding clathrate ground; Each vertically on folding bar line 11 correspondence be interval with some perforation 13, and 13 the center of circle of respectively boring a hole is positioned at its place vertically on the folding bar line 11;
B. after forming anti-overflow fluid layer 21 on the vertical folding bar line between each perforation of insulated substrate upper surface 2, carry out drying;
D. each front electrode 22 of insulated substrate laterally between respectively printing form resistive layer 23; This resistive layer 23 extend on the end of front electrode 22 near this resistive layer at its two ends (be each front electrode laterally between corresponding to each resistive layer UNICOM), carry out burning till again after the drying;
E. each resistive layer 23 of insulated substrate vertically between and on each resistive layer 23 printing form one deck first protective layer 24, burn till again after the drying;
Thereby each protective layer 24 and the resistive layer 23 that f. adopt the laser machine to make laser pass insulated substrate form line of cut 25 to carry out the resistance adjustment of each resistive layer 23 on the correspondence position of each protective layer and resistive layer, make said resistance be adapted to required resistance value;
G. printing forms mask layer 31 on the part outside front electrode 22 positions of the lower surface 3 corresponding upper surfaces of insulated substrate, and carries out drying;
H. the lower surface 3 to insulated substrate carries out sputter, on the position of the front electrode 22 of the hole wall of said mask layer 31, perforation 13 and insulated substrate lower surface 3 corresponding upper surfaces, forms sputtering layer 34 and toasts;
I. with the sputtering layer on said mask layer 31 and the mask layer wash and air-dry after; The locational sputtering layer of each front electrode 22 of these insulated substrate lower surface 3 corresponding upper surfaces forms each backplate 32, and the sputtering layer on each hole wall of 13 of boring a hole covers the conducting side electrode conductting layer that hole wall top forms of respectively boring a hole, the sputtering layer formation side electrode 33 on this side electrode conductting layer and the hole wall; Thereby make front electrode and backplate through the side electrode conducting; It is thicker that the electrode that printing forms burns till back thickness, and the raw material of printing is for making the slug type slurry of main composition amount, the higher and large usage quantity of its price with silver; And adopt the sputter mode can select with the metal nickel chromium triangle is that the electric conducting material of main component is a raw material; Film like ground sputter forms electrode, effectively reduces production cost, has strengthened product market competitiveness; Again because of the inevitable warpage issues that exists slightly of insulated substrate; Mode through sputter forms sputtering layer and the side electrode conductting layer is covered conducting on the hole wall of each perforation; Formed side electrode conducting its pairing front electrode and backplate have been guaranteed; Effectively overcome the shortcoming that can not be connected to form side electrode fully that possibly exist in the traditional handicraft, greatly reduced hidden danger of quality;
J. on first protective layer 24 of insulated substrate upper surface and each front electrode 22 vertically between printing one deck second protective layer 26, and carry out drying;
K. printing character code 27 on second protective layer 26 is burnt till after the drying;
L. along the vertical folding bar line 11 on the insulated substrate insulated substrate is fractureed and form strip substrate 4, and each strip substrate 4 is stacked in the tool through special-purpose board;
M. above-mentioned each strip substrate 4 that is stacked in the tool is fractureed along a horizontal folding grain line 12 and form independently patch concave electrode network resistor semi-finished product 5;
N. patch concave electrode network resistor semi-finished product 5 are put into the electro-plating roller of electroplating bath; Electro-plating roller is rotated with setting speed; Under electric current of setting and time condition; Make on front electrode 22, backplate 32 and the side electrode 33 of patch concave electrode network resistor semi-finished product 5 and all be formed uniformly one deck nickel dam 10; During plating on the front electrode coating have certain extension, dwindle because of the electrode extension can make the spacing between front electrode through electroplating the back, the client causes the solder joint short circuit easily and the client product function was lost efficacy or short circuit is burnt when later welded; Anti-overflow fluid layer among the step b is effective must to have been deadened the electrode that front electrode may occur and has extended phenomenon, better supports the client to use in the future and has improved end product quality;
O. be formed uniformly one deck tin layer 20 on the surface of nickel dam through electro-plating roller again, and through cleaning and dry back formation patch concave electrode network resistor.
The material of said first protective layer is mainly glass paste.
The material of said second protective layer is an epoxy resin.
The patch concave electrode network resistor that the above-mentioned manufacturing approach of a kind of usefulness is made; Comprise an insulated substrate 1; To use direction to be benchmark; This insulated substrate 1 is rectangular, and the two sides, place, long limit of this insulated substrate 1 are corresponding respectively to be recessed to form the recessed post of some half round posts at interval, and the position that the upper surface of this insulated substrate 1 closes on each recessed post all is printed with some front electrodes 22; And each front electrode 22 extends to the wall top of recessed post and forms the side electrode conductting layer; There is backplate 32 at the position of corresponding each front electrode 22 of the lower surface of this insulated substrate 1 all sputter, on the recessed post jamb face outside the side electrode conductting layer of said recessed post and this side electrode conductting layer all sputter sputtering layer is arranged, this side electrode conductting layer and sputtering layer composition side electrode 33; This is printed with resistive layer 6 near correspondence between the front electrode 22 of two long sides of insulated substrate 1; And each resistive layer 23 extends on the end of front electrode 22 near this resistive layer that covers its two ends, and the position between said each resistive layer and the resistive layer is all printed and is coated with first protective layer 24, all prints on the insulated substrate between said first protective layer and each front electrode to be coated with second protective layer 25; All be electroplate with nickel dam 10 on said front electrode, side electrode and the backplate, be electroplate with tin layer 20 on this nickel dam 10.
Said resistive layer is for being adjusted to the resistive layer of setting resistance through laser.
Be printed with character code 27 on said second protective layer 26.
The electrode that front electrode may occur when having deadened follow-up the plating through being provided with of anti-overflow fluid layer is effective extends phenomenon; And prevented that the spacing between front electrode from dwindling; The client can not dwindle because of the spacing between front electrode when later welded and cause the solder joint short circuit; Thereby make product support that better the client uses in the future, improved end product quality; It is thicker that the electrode that printing forms burns till back thickness; The raw material of printing is for making the slug type slurry of main composition amount with silver, and the higher and large usage quantity of its price is that the electric conducting material of main component is a raw material and adopt the sputter mode can select with the metal nickel chromium triangle; Film like ground sputter forms electrode (being backplate among the present invention); Effectively reduce production cost, strengthened product market competitiveness, again because of the inevitable warpage issues that exists slightly of insulated substrate; Mode through sputter is closed the formation sputtering layer and the side electrode conductting layer is covered conducting at the sky of each perforation; Guarantee formed side electrode conducting its pairing front electrode and backplate, effectively overcome the shortcoming that can not be connected to form side electrode fully that possibly exist in the traditional handicraft, greatly reduced hidden danger of quality.
Claims (6)
1. the manufacturing approach of a patch concave electrode network resistor, it is characterized in that: be benchmark to use direction, its manufacturing step is following:
A. prepare an insulated substrate (1); Upper surface (2) and the even corresponding clathrate of lower surface (3) ground at this insulated substrate form some vertical folding bar lines (11) and some horizontal folding grain lines (12); Each vertically folding bar line (11) go up correspondence and be interval with some perforation (13), and the center of circle of each perforation (13) is positioned at its place vertically on folding bar line (11);
B. after forming anti-overflow fluid layer (21) on the vertical folding bar line between each perforation of insulated substrate upper surface (2), carry out drying;
C. go up the position printing front electrode (22) of corresponding perforation (13) at the upper surface (2) of insulated substrate; The geometric center of this front electrode (22) overlaps with the center of circle of perforation (13), then grout is carried out in each perforation and forms the side electrode conductting layer on each perforation hole wall top;
D. each front electrode (22) of insulated substrate laterally between respectively printing form resistive layer (23), this resistive layer (23) extends on the end of front electrode (22) near this resistive layer at its two ends, carries out burning till after the drying again;
E. each resistive layer (23) of insulated substrate vertically between and each resistive layer (23) go up printing and form one deck first protective layer (24), burn till again after the drying;
F. adopt the laser machine to make laser pass each protective layer (24) and the resistive layer (23) of insulated substrate thus on the correspondence position of each protective layer and resistive layer, form line of cut (25) to carry out the resistance adjustment of each resistive layer (23), make said resistance be adapted to required resistance value;
G. printing forms mask layer (31) on the part outside front electrode (22) position of the corresponding upper surface of lower surface (3) of insulated substrate, and carries out drying;
H. the lower surface (3) to insulated substrate carries out sputter, on the position of the front electrode (22) of hole wall and the corresponding upper surface of insulated substrate lower surface (3) of said mask layer (31), perforation (13), forms sputtering layer (34) and toasts;
I. with the sputtering layer on said mask layer (31) and the mask layer wash and air-dry after; The locational sputtering layer of each front electrode (22) of the corresponding upper surface of this insulated substrate lower surface (3) forms each backplate (32); Sputtering layer on the hole wall of each perforation (13) covers the conducting side electrode conductting layer that hole wall top forms of respectively boring a hole; Sputtering layer on this side electrode conductting layer and the hole wall forms side electrode (33), thereby makes front electrode and backplate through the side electrode conducting;
J. first protective layer (24) of insulated substrate upper surface go up and each front electrode (22) vertically between printing one deck second protective layer (26), and carry out drying;
K. go up printing character code (27) at second protective layer (26), burn till after the drying;
L. along the vertical folding bar line (11) on the insulated substrate insulated substrate is fractureed and form strip substrate (4), and each strip substrate (4) is stacked in the tool through special-purpose board;
M. above-mentioned each strip substrate (4) that is stacked in the tool is fractureed along a horizontal folding grain line (12) and form independently patch concave electrode network resistor semi-finished product (5);
N. patch concave electrode network resistor semi-finished product (5) are put into the electro-plating roller of electroplating bath; Electro-plating roller is rotated with setting speed; Under electric current of setting and time condition, make on front electrode (22), backplate (32) and the side electrode (33) of patch concave electrode network resistor semi-finished product (5) and all be formed uniformly one deck nickel dam (10);
O. be formed uniformly one deck tin layer (20) on the surface of nickel dam through electro-plating roller again, and through cleaning and dry back formation patch concave electrode network resistor.
2. the manufacturing approach of a kind of patch concave electrode network resistor according to claim 1, it is characterized in that: the material of said first protective layer is mainly glass paste.
3. the manufacturing approach of a kind of patch concave electrode network resistor according to claim 1, it is characterized in that: the material of said second protective layer is an epoxy resin.
4. one kind with the made patch concave electrode network resistor of the said manufacturing approach of claim 1; It is characterized in that: comprise an insulated substrate (1); To use direction to be benchmark; This insulated substrate (1) is rectangular; The corresponding respectively recessed post of some half round posts that has been recessed to form at interval in the two sides, place, long limit of this insulated substrate (1); The position that the upper surface of this insulated substrate (1) closes on each recessed post all is printed with some front electrodes (22), and each front electrode (22) extends to the wall top of recessed post and form the side electrode conductting layer, and there is backplate (32) at the position of corresponding each front electrode of the lower surface of this insulated substrate (1) (22) all sputter; On the recessed post jamb face outside the side electrode conductting layer of said recessed post and this side electrode conductting layer all sputter sputtering layer is arranged; This side electrode conductting layer and sputtering layer are formed side electrode (33), and this is printed with resistive layer (6) near correspondence between the front electrode (22) of two long sides of insulated substrate (1), and each resistive layer (23) extends on the end of front electrode (22) near this resistive layer that covers its two ends; Position between said each resistive layer and the resistive layer is all printed and is coated with first protective layer (24); On the insulated substrate between said first protective layer and each front electrode all the printing be coated with second protective layer (25), all be electroplate with nickel dam (10) on said front electrode, side electrode and the backplate, be electroplate with tin layer (20) on this nickel dam (10).
5. according to claim 4 with the made patch concave electrode network resistor of the said manufacturing approach of claim 1, it is characterized in that: said resistive layer is for being adjusted to the resistive layer of setting resistance through laser.
6. according to claim 4 or 5 described, it is characterized in that: be printed with character code (27) on said second protective layer (26) with the made patch concave electrode network resistor of the said manufacturing approach of claim 1.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2009101826709A CN101916635B (en) | 2009-09-18 | 2009-09-18 | Manufacturing method of patch concave electrode network resistor and product thereof |
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| CN2009101826709A CN101916635B (en) | 2009-09-18 | 2009-09-18 | Manufacturing method of patch concave electrode network resistor and product thereof |
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| CN101916635B true CN101916635B (en) | 2012-04-18 |
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| CN102280159A (en) * | 2011-07-19 | 2011-12-14 | 彩虹集团公司 | Electrode material applied to chip resistor |
| CN103165250B (en) * | 2013-04-09 | 2016-07-06 | 昆山厚声电子工业有限公司 | Thick-film anti-vulcanization paster resistor and manufacture method thereof |
| CN107134330A (en) * | 2017-05-22 | 2017-09-05 | 丽智电子(昆山)有限公司 | A kind of high power thick film Chip-R and its manufacture method |
| CN108597705A (en) * | 2018-04-19 | 2018-09-28 | 旺诠科技(昆山)有限公司 | A kind of production method of Chip-R |
| KR102160500B1 (en) * | 2018-07-11 | 2020-09-28 | 주식회사 테토스 | Method of forming wiring on side surface of substrate |
| CN109346256A (en) * | 2018-12-05 | 2019-02-15 | 中国振华集团云科电子有限公司 | A kind of resistor chain and preparation method thereof |
| KR20210074612A (en) * | 2019-12-12 | 2021-06-22 | 삼성전기주식회사 | Resistor component |
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