CN102821551A - Manufacturing method for heavy-copper printed circuit boards - Google Patents
Manufacturing method for heavy-copper printed circuit boards Download PDFInfo
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- CN102821551A CN102821551A CN2012103086202A CN201210308620A CN102821551A CN 102821551 A CN102821551 A CN 102821551A CN 2012103086202 A CN2012103086202 A CN 2012103086202A CN 201210308620 A CN201210308620 A CN 201210308620A CN 102821551 A CN102821551 A CN 102821551A
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Abstract
The invention discloses a manufacturing method for heavy-copper printed circuit boards. The manufacturing method includes steps of (1), providing an inner substrate; (2), pressing and fitting; (3) boring; (4) electroplating; (5), manufacturing outer circuits; (6), printing solder masks; (7), milling frames and hollow-out areas before spraying solders; (8) spraying the solders; and (9) molding. By the manufacturing method, problems such as poor quality and waste of time, manpower and material resources due to high temperature during solder spraying are solved, and board delamination during solder spraying in manufacturing of the heavy-copper printed circuit boards is overcome. In addition, by the manufacturing method which is simple and feasible, the yield of the solder spraying (especially lead-free solder spraying) process for heavy-copper boards can be improved greatly and production cost can be reduced further.
Description
Technical field
The present invention relates to a kind of manufacture method of printed wiring board, especially relate to a kind of manufacture method of thick copper type printed circuit board, belong to printed wiring board and make the field.
Background technology
At present; The thick copper type printed circuit board of this kind generally adopts elder generation's baking heating when spray tin, the plate surface temperature is suitably raise, and sprays the preceding preliminary treatment of tin then, goes up scaling powder, sprays tin; The shortcoming of the method is: spray tin (especially lead-free tin spray) back reliability risk is higher, is prone to have the plate bursting problem.
Summary of the invention
In order to solve the plate bursting problem that Yin Gaowen produces in the thick copper coin spray tin process stress causes; The frame of the present invention's mill off wiring board before spray tin also mills some vacancy sections with released heat stress between edges of boards non-active graphical zone or composing spacing; Overcome the low risk of spray tin reliability; Solved the plate bursting problem, spray tin also can reduce the use amount of tin behind the mill off frame, has further reduced the cost of spray tin.
In order to achieve the above object, the technical scheme that the present invention taked is:
A kind of manufacture method of thick copper type printed circuit board is characterized in that: may further comprise the steps:
(1) internal substrate is provided: at least two internal substrates are provided at first as required, and on every internal substrate, etch all internal layer circuits;
(2) pressing: bonding sheet is placed between the internal substrate, stacks the order of each internal substrate simultaneously, utilize the press pressing by design in advance;
(3) boring: utilize drilling machine on the wiring board after the pressing, to get out the hole of design in advance;
(4) electroplate: reach the surface electrical plated with copper in the circuit plate hole after will holing;
(5) outer-layer circuit: etch the circuit of design in advance at skin through line transitions;
(6) resistance weldering printing: resistance solder paste China ink on the wiring board surface printing;
(7) mill frame and vacancy section before the spray tin: use make-up machine mill off wiring board frame between edges of boards non-active graphical zone or composing spacing, to add simultaneously before the spray tin and mill vacancy section;
(8) spray tin: under 265 ℃ of high temperature, use tin-spraying machine to spray tin to wiring board;
(9) moulding: utilize make-up machine to mill out required wiring board external form, obtain the thick copper type printed circuit of this kind board finished product.
Further technical scheme is:
Further comprising the steps of between said step (7) and the step (8): roasting plate: it is roasting in advance to use baking box that wiring board is carried out.
Further comprising the steps of between said step (7) and the step (8): pre-treatment: as to use liquid medicine that wiring board is cleaned before the spray tin.
Further comprising the steps of between said step (7) and the step (8): as to go up scaling powder: before the spray tin on the wiring board surface coated scaling powder.
In the above-mentioned steps (1), said internal substrate have at least layer of copper thick >=3oz.
In the above-mentioned steps (7), the length of said vacancy section is not less than 10mm, and is not more than 1/2 of whole plate length, and width is 1～5mm.
In the above-mentioned steps (7), described vacancy section is a strip.
The invention has the beneficial effects as follows: mill frame and vacancy section before the present invention utilizes new simple process through spray tin in order to discharge the thermal stress that produces in the spray tin process; Reliability, the reliability of thick copper coin behind the spray tin have been guaranteed effectively; Improve the yield after thick copper type printed circuit board sprays tin, avoided the risk of plate bursting.
Description of drawings
Fig. 1 is a process chart of the present invention;
Stacked configuration sketch map when Fig. 2 is product pressing of the present invention;
Fig. 3 mills frame and vacancy section structural representation before the spray tin of the present invention.
Main Reference numeral implication is among the figure:
1. first internal substrate;
2. second internal substrate;
3. bonding sheet;
A. spray the frame of the preceding mill off of tin;
B. spray the vacancy section that between edges of boards non-active graphical zone and composing spacing, mills before the tin.
Embodiment
For further disclosing technical scheme of the present invention; Specify execution mode of the present invention below in conjunction with accompanying drawing: as shown in Figure 2, a kind of thick copper type printed circuit board comprises at least two internal substrates; Promptly be provided with bonding sheet 3 between first internal substrate 1 and 2, two internal substrates of second internal substrate.As shown in Figure 3, between edges of boards non-active graphical zone or composing spacing, be provided with vacancy section b.
To shown in Figure 3, a kind of manufacture method of thick copper type printed circuit board may further comprise the steps like Fig. 1:
(1) internal substrate is provided: at least two internal substrates are provided at first as required, and promptly first internal substrate 1 and second internal substrate 2 have at least the copper of one deck internal substrate thick >=3oz, on every internal substrate, etch all internal layer circuits;
(2) pressing: bonding sheet 3 is placed between first internal substrate 1 and second internal substrate 2, stacks the order of each internal substrate simultaneously, utilize the press pressing by design in advance;
(3) boring: utilize drilling machine on the wiring board after the pressing, to get out the hole of design in advance;
(4) electroplate: reach the surface electrical plated with copper in the circuit plate hole after will holing;
(5) outer-layer circuit: make the circuit of design in advance at skin through line transitions;
(6) resistance weldering printing: resistance solder paste China ink on the wiring board surface printing;
(7) mill frame and vacancy section before the spray tin: use make-up machine mill off wiring board frame a before the spray tin; Between edges of boards non-active graphical zone or composing spacing, add simultaneously and mill vacancy section b; Can not influence the active graphical design of wiring board, vacancy section b is a strip, and its length is not less than 10mm; And be not more than 1/2 of whole plate length, width is 1～5mm;
(8) roasting plate: it is roasting in advance to use baking box that wiring board is carried out;
(9) pre-treatment: use liquid medicine that wiring board is cleaned before the spray tin;
(10) go up scaling powder: before the spray tin on the wiring board surface coated scaling powder;
(11) spray tin: under 265 ℃ of high temperature, use tin-spraying machine to spray tin, be beneficial to welding and protection copper face to wiring board;
(12) moulding: utilize make-up machine to mill out required wiring board external form, obtain the thick copper type printed circuit of this kind board finished product.
In the thick copper type printed circuit board spray tin process because high temperature, and because the thick too thick reason of copper makes the suffered thermal shock of wiring board more strong (copper is thick thick more, and the wiring board heat radiator is fast more).
The present invention is through using before the spray tin mill off frame and milling the single of vacancy section or combination is used, and solved the problem that thick copper type printed circuit board reliability behind the spray tin is poor, be prone to plate bursting, also further reduced spray tin cost simultaneously.
More than show and described basic principle of the present invention, principal character and advantage.The technical staff of the industry should understand; The present invention is not restricted to the described embodiments; That describes in the foregoing description and the specification just explains principle of the present invention; Under the prerequisite that does not break away from spirit and scope of the invention, the present invention also has various changes and modifications, and these variations and improvement all fall in the scope of the invention that requires protection.The present invention requires protection range to be defined by appending claims and equivalent thereof.
Claims (7)
1. the manufacture method of a thick copper type printed circuit board is characterized in that: may further comprise the steps:
(1) internal substrate is provided: at least two internal substrates are provided at first as required, and on every internal substrate, etch all internal layer circuits;
(2) pressing: bonding sheet is placed between the internal substrate, stacks the order of each internal substrate simultaneously, utilize the press pressing by design in advance;
(3) boring: utilize drilling machine on the wiring board after the pressing, to get out the hole of design in advance;
(4) electroplate: reach the surface electrical plated with copper in the circuit plate hole after will holing;
(5) outer-layer circuit: etch the circuit of design in advance at skin through line transitions;
(6) resistance weldering printing: resistance solder paste China ink on the wiring board surface printing;
(7) mill frame and vacancy section before the spray tin: use make-up machine mill off wiring board frame between edges of boards non-active graphical zone or composing spacing, to add simultaneously before the spray tin and mill vacancy section;
(8) spray tin: under 265 ℃ of high temperature, use tin-spraying machine to spray tin to wiring board;
(9) moulding: utilize make-up machine to mill out required wiring board external form, obtain the thick copper type printed circuit of this kind board finished product.
2. the manufacture method of thick copper type printed circuit board according to claim 1 is characterized in that: further comprising the steps of between said step (7) and the step (8): roasting plate: it is roasting in advance to use baking box that wiring board is carried out.
3. the manufacture method of thick copper type printed circuit board according to claim 1 is characterized in that: further comprising the steps of between said step (7) and the step (8): pre-treatment: use liquid medicine that wiring board is cleaned before the spray tin.
4. the manufacture method of thick copper type printed circuit board according to claim 1 is characterized in that: further comprising the steps of between said step (7) and the step (8): go up scaling powder: before the spray tin on the wiring board surface coated scaling powder.
5. the manufacture method of thick copper type printed circuit board according to claim 1 is characterized in that: in the above-mentioned steps (1), said internal substrate have at least layer of copper thick >=3oz.
6. according to the manufacture method of each described thick copper type printed circuit board in the claim 1～5, it is characterized in that: in the above-mentioned steps (7), the length of said vacancy section is not less than 10mm, and is not more than 1/2 of whole plate length, and width is 1～5mm.
7. the manufacture method of thick copper type printed circuit board according to claim 6 is characterized in that: in the above-mentioned steps (7), described vacancy section is a strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210308620.2A CN102821551B (en) | 2012-08-28 | 2012-08-28 | Manufacturing method for heavy-copper printed circuit boards |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210308620.2A CN102821551B (en) | 2012-08-28 | 2012-08-28 | Manufacturing method for heavy-copper printed circuit boards |
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| CN102821551A true CN102821551A (en) | 2012-12-12 |
| CN102821551B CN102821551B (en) | 2015-06-03 |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103266336A (en) * | 2013-04-26 | 2013-08-28 | 胜宏科技（惠州）股份有限公司 | Method for thickening copper surface of thick copper circuit board |
| CN103730375A (en) * | 2014-01-14 | 2014-04-16 | 无锡江南计算技术研究所 | OSP surface treatment package substrate forming milling method |
| CN104812158A (en) * | 2014-01-28 | 2015-07-29 | 北大方正集团有限公司 | Circuit board layered explosion preventing method, circuit board manufacturing method and circuit board substrate |
| CN105376961A (en) * | 2015-11-03 | 2016-03-02 | 江门崇达电路技术有限公司 | HASL surface treatment PCB manufacturing method |
| CN107058930A (en) * | 2017-05-15 | 2017-08-18 | 深圳市景旺电子股份有限公司 | A kind of thick pcb board and its spray tin method |
| CN108055774A (en) * | 2017-11-09 | 2018-05-18 | 建业科技电子（惠州）有限公司 | A kind of selectivity thick copper circuit production method |
| CN109379854A (en) * | 2018-09-20 | 2019-02-22 | 奥士康精密电路（惠州）有限公司 | A kind of low TG spray tin plays the control method of white point |
| CN110099507A (en) * | 2019-05-29 | 2019-08-06 | 广东依顿电子科技股份有限公司 | Thick copper circuit board and its manufacturing method |
| CN111031674A (en) * | 2019-11-21 | 2020-04-17 | 惠州美锐电子科技有限公司 | Method for removing selective plating edge at specific position on PCB |
| CN113395842A (en) * | 2021-06-07 | 2021-09-14 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing circuit board with suspended circuit layer |
| CN114340188A (en) * | 2021-12-30 | 2022-04-12 | 清远市富盈电子有限公司 | Production method for improving blistering layering of copper layer of PTH slot of lead-free tin-sprayed plate |
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| CN102638940A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Preparation method of polytetrafluoroethylene high-frequency circuit board |
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2012
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| TW200841779A (en) * | 2007-04-13 | 2008-10-16 | Asia Electronic Material Co | Copper clad laminate for manufacturing flexible printed circuit board and the method for making the same |
| CN101695218A (en) * | 2009-09-30 | 2010-04-14 | 深圳市金百泽电路板技术有限公司 | Method for manufacturing printed circuit board with half-edge hole |
| CN102036462A (en) * | 2010-08-31 | 2011-04-27 | 北大方正集团有限公司 | Printed circuit board and protection method thereof |
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Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103266336B (en) * | 2013-04-26 | 2016-06-01 | 胜宏科技（惠州）股份有限公司 | A kind of thick copper circuit board copper face thickening method |
| CN103266336A (en) * | 2013-04-26 | 2013-08-28 | 胜宏科技（惠州）股份有限公司 | Method for thickening copper surface of thick copper circuit board |
| CN103730375A (en) * | 2014-01-14 | 2014-04-16 | 无锡江南计算技术研究所 | OSP surface treatment package substrate forming milling method |
| CN103730375B (en) * | 2014-01-14 | 2016-08-17 | 无锡江南计算技术研究所 | OSP surface processes base plate for packaging molding milling method |
| CN104812158A (en) * | 2014-01-28 | 2015-07-29 | 北大方正集团有限公司 | Circuit board layered explosion preventing method, circuit board manufacturing method and circuit board substrate |
| CN104812158B (en) * | 2014-01-28 | 2018-03-06 | 北大方正集团有限公司 | The substrate of the anti-method for being layered plate bursting of circuit board, the preparation method of circuit board and circuit board |
| CN105376961A (en) * | 2015-11-03 | 2016-03-02 | 江门崇达电路技术有限公司 | HASL surface treatment PCB manufacturing method |
| CN107058930B (en) * | 2017-05-15 | 2019-06-11 | 深圳市景旺电子股份有限公司 | It is a kind of thickness pcb board and its spray tin method |
| CN107058930A (en) * | 2017-05-15 | 2017-08-18 | 深圳市景旺电子股份有限公司 | A kind of thick pcb board and its spray tin method |
| CN108055774A (en) * | 2017-11-09 | 2018-05-18 | 建业科技电子（惠州）有限公司 | A kind of selectivity thick copper circuit production method |
| WO2019090860A1 (en) * | 2017-11-09 | 2019-05-16 | 建业科技电子（惠州）有限公司 | Method for selectively manufacturing thick copper circuit |
| CN109379854A (en) * | 2018-09-20 | 2019-02-22 | 奥士康精密电路（惠州）有限公司 | A kind of low TG spray tin plays the control method of white point |
| CN110099507A (en) * | 2019-05-29 | 2019-08-06 | 广东依顿电子科技股份有限公司 | Thick copper circuit board and its manufacturing method |
| CN111031674A (en) * | 2019-11-21 | 2020-04-17 | 惠州美锐电子科技有限公司 | Method for removing selective plating edge at specific position on PCB |
| CN111031674B (en) * | 2019-11-21 | 2023-04-21 | 惠州美锐电子科技有限公司 | Method for removing selective electroplating edge at specific position on PCB |
| CN113395842A (en) * | 2021-06-07 | 2021-09-14 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing circuit board with suspended circuit layer |
| CN114340188A (en) * | 2021-12-30 | 2022-04-12 | 清远市富盈电子有限公司 | Production method for improving blistering layering of copper layer of PTH slot of lead-free tin-sprayed plate |
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| CN102821551B (en) | 2015-06-03 |
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