CN104105344A - Method for protecting step slot, metal plating method for substrate of circuit board and circuit board - Google Patents
Method for protecting step slot, metal plating method for substrate of circuit board and circuit board Download PDFInfo
- Publication number
- CN104105344A CN104105344A CN201310127891.2A CN201310127891A CN104105344A CN 104105344 A CN104105344 A CN 104105344A CN 201310127891 A CN201310127891 A CN 201310127891A CN 104105344 A CN104105344 A CN 104105344A
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- step trough
- circuit board
- dampness elimination
- protection
- film
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- Electroplating Methods And Accessories (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention provides a method for protecting a step slot, a metal plating method for a substrate of a circuit board and a circuit board. The method for protecting the step slot comprises the following steps: carrying out surface treatment on the substrate of the circuit board; carrying out selected wet film coating treatment on the step slot, and filling selected wet film into the step slot to a preset position; carrying out metallic coating on a board of the substrate of the circuit board and the selected wet film; and carrying out pattern transfer treatment on the board, preparing a circuit and removing metal plated on the selected wet film Inside the step slot. Through the above method, the selected wet film can form a protective layer in a specific area so as to strengthen binding force with a copper surface and guarantee that the pattern of the undersurface of the step slot and the circuit during the follow-up manufacturing process are not influenced. The manufacturing cost is low. Waste formed by follow-up film removal can be effectively minimized. The method is beneficial to environmental protection. Meanwhile, the case that height of the step slot influences pressed film quality is avoided, and reject ratio is minimized.
Description
Technical field
The present invention relates to printed circuit board (PCB) and manufacture field, in particular to a kind of method for plating metal and a kind of circuit board of protecting the method for step trough, a kind of circuit board ground.
Background technology
Along with the development of electronic technology, various electronic products are progressively to multi-functional, low energy consumption, easy portable future development; In order to reach the object that reduces small product size, volume requirement as the wiring board of main composition part is more and more less, manufacturing enterprise, except increasing wiring by dense wire, is used step-wise manner that portions of electronics device is stretched in plate, and after reduction piece, the method for integral thickness progressively forms.This product design meeting forms the step trough in the recessed plate in wiring board subregion, but can bring larger challenge to manufacturing process in actual production process, and traditional operating type has been difficult to meet its production requirement.Make difficult point mainly at step trough window ink printing, exposure and the word production etc. of position copper face and route protection, outer graphics anti-welding steps ladder groove after shifting.
The defect that correlation technique exists: traditional press dry film or wet film production procedure is long, cost is high; the difference in height of step trough is easily damaged after using dry film to cover; cannot effectively protect the figure in step trough; and the anti-welding making that internal layer step trough is windowed easily causes darkening through subsequent production flow process, affect wiring board performance and outward appearance.
Summary of the invention
For solving the problems of the technologies described above or one of at least, the invention provides a kind of method of protecting step trough, can in circuit board ground plating process, protect figure in step trough and cabling not to be subject to the impact of successive process, reduce product bad.
In view of this, the invention provides a kind of method of protecting step trough, comprising:
Step 101, carries out surface treatment to described circuit board ground;
Step 102, selects the coating of dampness elimination film to process to described step trough, and fill the described dampness elimination film that selects to precalculated position in described step trough;
Step 104, the plate face on described circuit board ground and describedly select plating on dampness elimination film;
Step 105, carries out figure transfer processing to described plate face, makes circuit and removes the described metal plating on dampness elimination film that selects in described step trough.
In this technical scheme; select dampness elimination film can form targetedly protective layer in specific region; strengthen the adhesion with copper face; the figure and the circuit that ensure ladder groove bottom in successive process are unaffected, and its cost of manufacture is low, and production procedure is short; can effectively reduce the follow-up film formed discarded object that goes; be conducive to the protection to environment, avoid, because the difference in height of step trough affects press mold quality, reducing bad simultaneously.
The present invention also provides a kind of method for plating metal of circuit board ground, adopts the method for the protection step trough described in technique scheme with the step trough on protective circuit boards supporting substrates.
The method for plating metal of circuit board ground provided by the invention; select dampness elimination film to form protective layer in the specific region in step trough targetedly; increased and the adhesion of copper face, ensured that the figure of ladder groove bottom in successive process and circuit are unaffected, its cost of manufacture is low; can effectively reduce the follow-up film formed discarded object that goes; be conducive to the protection to environment, avoid, because the difference in height of step trough affects press mold quality, reducing bad simultaneously; improve conforming product rate, increase product output.
The present invention also provides a kind of circuit board, is provided with the step trough that adopts the method for the protection step trough described in technique scheme to protect on described circuit board.
Circuit board provided by the invention, selects dampness elimination film to form protective layer in the specific region in step trough targetedly, does not damage step trough, and the quality of circuit board significantly improves, and can improve product market share, increases the performance of enterprises.
Brief description of the drawings
Fig. 1 is the schematic top plan view of circuit board ground according to an embodiment of the invention;
Fig. 2 is A-A cutaway view embodiment illustrated in fig. 1;
Fig. 3 is the structural representation that dampness elimination film is completely selected in filling embodiment illustrated in fig. 2;
Fig. 4 is the structural representation after plating embodiment illustrated in fig. 3;
Fig. 5 is that embodiment illustrated in fig. 4 etching away selected the structural representation after institute's plating on dampness elimination film;
Fig. 6 is that the structural representation after dampness elimination film is selected in removal embodiment illustrated in fig. 5;
Fig. 7 is the flow chart of the method for one embodiment of the invention protection step trough;
Fig. 8 is the flow chart of the method for another embodiment of the present invention protection step trough.
Wherein, in Fig. 1 to Fig. 6, the corresponding relation between Reference numeral and component names is:
1 circuit board ground 11 plate face 12 metal level 2 step trough 21 cablings 3 select carburetion China ink protection wet film.
Embodiment
In order more clearly to understand above-mentioned purpose of the present invention, feature and advantage, below in conjunction with the drawings and specific embodiments, the present invention is further described in detail.It should be noted that, in the situation that not conflicting, the feature in the application's embodiment and embodiment can combine mutually.
A lot of details are set forth in the following description so that fully understand the present invention; but; the present invention can also adopt other to be different from mode described here and implement, and therefore, protection scope of the present invention is not subject to the restriction of following public specific embodiment.
The method of protection step trough provided by the invention, as shown in Figures 1 to 7, comprising:
Step 101, carries out surface treatment to circuit board ground 1;
Step 102, selects the coating of dampness elimination film to process to step trough 2, and selects dampness elimination film to precalculated position to the interior filling of step trough 2;
Step 104, plate face on circuit board ground 1 11 and select plating on dampness elimination film;
Step 105, carries out figure transfer processing to plate face 11, makes circuit and removes the interior metal plating on dampness elimination film that selects of step trough 2.
In this technical scheme; select dampness elimination film can form targetedly protective layer in specific region; strengthen the adhesion with copper face; the figure and the circuit that ensure ladder groove bottom in successive process are unaffected, and its cost of manufacture is low, and production procedure is short; can effectively reduce the follow-up film formed discarded object that goes; be conducive to the protection to environment, avoid, because the difference in height of step trough affects press mold quality, reducing bad simultaneously.
Surface treatment is for to carry out oil removing, cleaning etc. to plate face 11.
Label 12 is the metal level 12 after plating.
Preferably, as shown in Figures 3 to 5, in step 102, select dampness elimination film for selecting carburetion China ink protection wet film 3, precalculated position is the position of filling full step trough 2.
Preferably, as shown in Figure 3, in step 102, utilize wire mark mode to select 3 coatings of carburetion China ink protection wet film to process to step trough 2, and fill full step trough 2; Wire mark mode is: use scraper and half tone to select carburetion China ink protection wet film 3 to be applied in step trough 2.
By selecting dampness elimination film to fill full step trough, ensure that the figure of ladder groove bottom in successive process and circuit are unaffected, avoid because the difference in height of step trough affects press mold quality, reduce product fraction defective; Adopt wire mark mode be coated with to step trough processings, coating evenly, filling is substantial, increased and the adhesion of copper face, further ensured that the figure of ladder groove bottom in successive process and circuit are unaffected.
Certainly, also can select the coating processing of other modes, these are and depart from design philosophy of the present invention, all belong to the protection range of this patent.
Preferably, as shown in Fig. 3 to Fig. 5, Fig. 8, between step 102 and step 104, also comprise: step 103, dampness elimination film is selected in sclerosis.
Dampness elimination film is selected in sclerosis, removes the moisture in step trough, ensures that in step trough, selecting dampness elimination film to fill enriches, do not flow; Meanwhile, after sclerosis, select not cracky of dampness elimination film, carry out further step trough being protected in plating process at plate face.
Preferably, as shown in Figure 6 and Figure 8, after step 105, also comprise: step 106, remove and select dampness elimination film in step trough 2.
Remove and select dampness elimination film in step trough, make circuit board.
Preferably, as shown in Figure 1 and Figure 2, in step 101, the surface treatment of plate face 11 is the surface treatment before anti-welding printing.
Select the surface treatment before anti-welding printing, technical maturity, cost are low, and surface treatment efficiency is high, can effectively remove the oil stain on plate face, and cleaning plate face reduces the fraction defective of product.
Preferably, as shown in Figures 3 to 5, in step 103, harden and select dampness elimination film by mode pre-baked and/or baking.
Pre-baked and baking requires lowly to equipment, and employee's Job Operations is required low, can reduce productions, manufacturing cost, and thrifty enterprise pays wages.
Certainly also can select other modes to harden and select dampness elimination film, as dry in shade etc., be and depart from design philosophy of the present invention, should belong to the protection range of this patent.
Preferably, in step 104, plate face 11 carries out through hole and/or blind hole plating.
The technical maturity of through hole, blind hole plating technology, after plating, the fraction defective of product is low, can reduce enterprise's manufacturing cost, improve the performance of enterprises.
Certainly also can select other modes to carry out plating, be and depart from design philosophy of the present invention, should belong to the protection range of this patent.
Preferably, in step 105, figure transfer processing comprises the processing of plate face, press mold, exposure, development and etching.
The method technical maturity, with short production cycle, the plate face clear patterns of making, good conductivity, can effectively improve the performance of enterprises.
Preferably, the metal plating comprise in copper, aluminium, silver, platinum, tin or nickel any or its combination, the bottom surface of step trough 2 has cabling 21.
The good conductivity of above-mentioned material, cost is low, and the product energy consumption of making is low, and environmentally safe; In step trough, there is cabling, select dampness elimination film to protect the cabling in step trough, prevent that cabling is influenced in successive process.
The present invention also provides a kind of method for plating metal of circuit board ground, adopts the method for the protection step trough described in above-mentioned arbitrary embodiment with the step trough 2 on protective circuit boards supporting substrates 1.
The method for plating metal of circuit board ground provided by the invention; select dampness elimination film to form protective layer in the specific region in step trough targetedly; increase the adhesion with copper face; the figure and the circuit that ensure ladder groove bottom in successive process are unaffected; its cost of manufacture is low, can effectively reduce the follow-up film formed discarded object that goes, and is conducive to the protection to environment; avoid, because the difference in height of step trough affects press mold quality, reducing bad simultaneously.
Preferably, select the defoamer that contains 2%-3% composition weight in dampness elimination film.
Selecting the defoamer that adds certain ingredients in dampness elimination film, can effectively reduce the bubble producing in coating process, ensure that coating is even, it is compact to make between each coating, further step trough is protected.
Preferably, this selects dampness elimination film 1-5 minute to select dampness elimination film to be coated with the front stirring of processing, has stirred rear standing this and has selected dampness elimination film 20-30 minute.
To selecting dampness elimination film to stir in advance, and leave standstill this select dampness elimination film, ensured to select dampness elimination coating solution to mix; Precipitation is selected the impurity in dampness elimination film, to improve coating quality, and then ensures that in step trough, the dampness elimination film that selects of coating is clogged full whole step trough.
The present invention also provides a kind of circuit board, is provided with the step trough 2 that adopts the method for the protection step trough described in above-mentioned arbitrary embodiment to protect on described circuit board.
Circuit board provided by the invention, selects dampness elimination film to form protective layer in the specific region in step trough targetedly, does not damage step trough, and the quality of circuit board significantly improves, and can improve product market share, increases the performance of enterprises.
Preferably, the bottom surface of described step trough 2 has cabling 2.
The bottom surface of step trough has cabling, selects dampness elimination film to protect the cabling in step trough, prevents that cabling is influenced in successive process.
Preferably, on the plate face 11 of described circuit board, be coated with metal.
The plate face of circuit board is coated with metal, and circuit board can pass through plated metal and other electronic components carry out electrical signal transfer, ensures that signal transmits smoothly, and then expands the range of application of circuit board.
Preferably, the metal plating comprises any or its combination in copper, aluminium, silver, platinum, tin or nickel.
The good conductivity of above-mentioned material, cost is low, and the product energy consumption of making is low, and environmentally safe.
In sum; the method of protection step trough provided by the invention; select dampness elimination film to form protective layer in the specific region in step trough targetedly; increase the adhesion with copper face; and select after dampness elimination film sclerosis not cracky; the figure and the circuit that ensure ladder groove bottom in successive process are unaffected; its cost of manufacture is low; production procedure is short; can effectively reduce the follow-up film formed discarded object that goes; be conducive to the protection to environment, avoid, because the difference in height of step trough affects press mold quality, reducing bad simultaneously.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (17)
1. a method of protecting step trough, is characterized in that, comprising:
Step 101, carries out surface treatment to described circuit board ground (1);
Step 102, selects the coating of dampness elimination film to process to described step trough (2), and fills the described dampness elimination film that selects to precalculated position in described step trough (2);
Step 104, the plate face (11) on described circuit board ground (1) and describedly select plating on dampness elimination film;
Step 105, carries out figure transfer processing to described plate face (11), makes circuit and removes the described metal plating on dampness elimination film that selects in described step trough (2).
2. the method for protection step trough according to claim 1, is characterized in that, in step 102, the described dampness elimination film that selects is for selecting carburetion China ink protection wet film (3), and described precalculated position is for filling the position of full described step trough (2).
3. the method for protection step trough according to claim 2, is characterized in that, in step 102, utilizes wire mark mode to carry out the described carburetion China ink protection wet film (3) that selects to described step trough (2) and is coated with processing, and fill full described step trough (2);
Described wire mark mode is: use scraper and half tone that the described carburetion China ink protection wet film (3) that selects is applied in described step trough (2).
4. the method for protection step trough according to claim 1, is characterized in that, between step 102 and step 104, also comprises: step 103, the described dampness elimination film that selects hardens.
5. according to the method for the protection step trough described in any one in claim 1 to 4, it is characterized in that, after step 105, also comprise: step 106, remove the described dampness elimination film that selects in described step trough (2).
6. according to the method for the protection step trough described in any one in claim 1 to 4, it is characterized in that, in step 101, the surface treatment of described plate face (11) is the surface treatment before anti-welding printing.
7. the method for protection step trough according to claim 1, is characterized in that, in step 103, by the mode described dampness elimination film that selects that hardens of pre-baked and/or baking.
8. the method for protection step trough according to claim 5, is characterized in that, in step 104, described plate face (11) carries out through hole and/or blind hole plating.
9. the method for protection step trough according to claim 5, is characterized in that, in step 105, described figure transfer processing comprises the processing of plate face, press mold, exposure, development and etching.
10. the method for protection step trough according to claim 5, is characterized in that, the metal plating comprise in copper, aluminium, silver, platinum, tin or nickel any or its combination, the bottom surface of described step trough (2) has cabling (21).
The method for plating metal of 11. 1 kinds of circuit board grounds, is characterized in that, adopts the method for the protection step trough as described in any one in claim 1 to 10 with the step trough (2) on protective circuit boards supporting substrates (1).
The method for plating metal of 12. circuit board grounds according to claim 11, is characterized in that, the described defoamer that contains 2%-3% composition weight in dampness elimination film that selects.
The method for plating metal of 13. circuit board grounds according to claim 12, is characterized in that, described stirring described in this before selecting dampness elimination film to be coated with to process selected dampness elimination film 1-5 minute, has stirred standingly to select dampness elimination film 20-30 minute described in this afterwards.
14. 1 kinds of circuit boards, is characterized in that, are provided with the step trough (2) that adopts the method for the protection step trough as described in any one in claim 1 to 10 to protect on described circuit board.
15. circuit boards according to claim 14, is characterized in that, the bottom surface of described step trough (2) has cabling (21).
16. according to the circuit board described in claims 14 or 15, it is characterized in that, on the plate face (11) of described circuit board, is coated with metal.
17. circuit boards according to claim 16, is characterized in that, the metal plating comprises any or its combination in copper, aluminium, silver, platinum, tin or nickel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310127891.2A CN104105344B (en) | 2013-04-12 | 2013-04-12 | Method for protecting step slot, metal plating method for substrate of circuit board and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310127891.2A CN104105344B (en) | 2013-04-12 | 2013-04-12 | Method for protecting step slot, metal plating method for substrate of circuit board and circuit board |
Publications (2)
| Publication Number | Publication Date |
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| CN104105344A true CN104105344A (en) | 2014-10-15 |
| CN104105344B CN104105344B (en) | 2017-05-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310127891.2A Active CN104105344B (en) | 2013-04-12 | 2013-04-12 | Method for protecting step slot, metal plating method for substrate of circuit board and circuit board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110691476A (en) * | 2019-08-27 | 2020-01-14 | 东莞康源电子有限公司 | Cavity opening processing method for protecting PCB inner layer circuit by adopting wet film |
| CN110891377A (en) * | 2018-09-11 | 2020-03-17 | 健鼎（无锡）电子有限公司 | Circuit board and method for manufacturing the same |
| CN111491464A (en) * | 2019-01-29 | 2020-08-04 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of PCB with convex welding plate |
| CN112492767A (en) * | 2021-01-18 | 2021-03-12 | 四川英创力电子科技股份有限公司 | PCB (printed circuit board) with step groove and processing method thereof |
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| US20100068467A1 (en) * | 2008-09-17 | 2010-03-18 | Samsung Electro-Mechanics Co., Ltd | Method for treating surface of substrate resin and substrate resin treated thereby |
| CN102523688A (en) * | 2011-12-06 | 2012-06-27 | 东莞生益电子有限公司 | Method for manufacturing PCB (Printed Circuit Board) with stepped grooves |
| CN102523684A (en) * | 2011-12-02 | 2012-06-27 | 东莞生益电子有限公司 | Manufacture method for printed circuit board (PCB) with step groove |
| CN202310279U (en) * | 2011-10-17 | 2012-07-04 | 广州杰赛科技股份有限公司 | Graphical printed board at bottom of dual-step ladder groove |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100068467A1 (en) * | 2008-09-17 | 2010-03-18 | Samsung Electro-Mechanics Co., Ltd | Method for treating surface of substrate resin and substrate resin treated thereby |
| CN202310279U (en) * | 2011-10-17 | 2012-07-04 | 广州杰赛科技股份有限公司 | Graphical printed board at bottom of dual-step ladder groove |
| CN102523684A (en) * | 2011-12-02 | 2012-06-27 | 东莞生益电子有限公司 | Manufacture method for printed circuit board (PCB) with step groove |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110891377A (en) * | 2018-09-11 | 2020-03-17 | 健鼎（无锡）电子有限公司 | Circuit board and method for manufacturing the same |
| CN111491464A (en) * | 2019-01-29 | 2020-08-04 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of PCB with convex welding plate |
| CN110691476A (en) * | 2019-08-27 | 2020-01-14 | 东莞康源电子有限公司 | Cavity opening processing method for protecting PCB inner layer circuit by adopting wet film |
| CN112492767A (en) * | 2021-01-18 | 2021-03-12 | 四川英创力电子科技股份有限公司 | PCB (printed circuit board) with step groove and processing method thereof |
| CN112492767B (en) * | 2021-01-18 | 2021-04-20 | 四川英创力电子科技股份有限公司 | PCB (printed circuit board) with step groove and processing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104105344B (en) | 2017-05-17 |
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Effective date of registration: 20220620 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. |