CN101877448B - 模组连接器 - Google Patents

模组连接器 Download PDF

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CN101877448B
CN101877448B CN200910301948XA CN200910301948A CN101877448B CN 101877448 B CN101877448 B CN 101877448B CN 200910301948X A CN200910301948X A CN 200910301948XA CN 200910301948 A CN200910301948 A CN 200910301948A CN 101877448 B CN101877448 B CN 101877448B
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circuit board
sub
conducting
conductive
module
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CN101877448A (zh
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吴立群
黄朝栋
师乐善
张�杰
徐勇春
胡建设
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6464—Means for preventing cross-talk by adding capacitive elements
    • H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/659—Shield structure with plural ports for distinct connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F2017/0093—Common mode choke coil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/6608—Structural association with built-in electrical component with built-in single component
    • H01R13/6625—Structural association with built-in electrical component with built-in single component with capacitive component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/6608—Structural association with built-in electrical component with built-in single component
    • H01R13/6633—Structural association with built-in electrical component with built-in single component with inductive component, e.g. transformer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/717—Structural association with built-in electrical component with built-in light source
    • H01R13/7175—Light emitting diodes (LEDs)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
    • H01R24/64—Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45

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  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

本发明公开了一种模组连接器，其包括设有收容腔的绝缘本体及收容于绝缘本体内的端子模组。端子模组包括子电路板、及安装于子电路板上的若干导电端子、若干磁性元件及用于转接信号的转接模组。子电路板上设有导通部。各导电端子具有向收容腔突伸的接触部及与导通部电性连接的尾部。其中，所述磁性元件包括植入子电路板内层的磁芯及通过印刷导电层技术配置于子电路板上的若干导电线路。磁芯与导电线路形成磁场。具有所述磁性元件的模组连接器可广泛应用于自动化生产中。

Description

模组连接器
【技术领域】
本发明关于一种模组连接器，尤其是关于具有若干磁性元件的模组连接器。
【背景技术】
2005年8月9日公告的公告号为US 6,926,558的专利揭示了一种模组连接器，其包括设有收容腔的绝缘本体，收容于绝缘本体收容腔内的端子模组及覆盖于绝缘本体上的遮蔽盖体。端子模组包括子电路板、与子电路板垂直连接的保持部、部分安装于保持部内且末端与子电路板电性连接的导电端子、安装于子电路板上的若干磁性元件及安装有转接端子的转接件。
但是该设计的缺陷在于：所述磁性元件是将绕线通过手工作业方式缠绕于铁芯上制得，如此不适于广泛应用于自动化生产中。
【发明内容】
本发明所要解决的技术问题在于提供一种有利于实现自动化生产的模组连接器。
为达到上述所要解决的技术问题，本发明提供一种模组连接器，其包括设有收容腔的绝缘本体及收容于绝缘本体内的端子模组。端子模组包括子电路板、及安装于子电路板上的若干导电端子、若干磁性元件及用于转接信号的转接模组。子电路板上设有导通部。各导电端子具有向收容腔突伸的接触部及与导通部电性连接的尾部。其中，所述磁性元件包括植入子电路板内层的磁芯及通过印刷导电层技术配置于子电路板上的若干导电线路。磁芯与导电线路形成磁场。
与现有技术相比，本发明模组连接器具有以下优点：所述磁性元件的磁芯植入子电路板内层，导电线路通过印刷导电层技术与磁芯形成磁场。磁性元件的制造过程中不需要采用手工缠绕方式，如此可以大规模应用于自动化生产中。
【附图说明】
图1是本发明模组连接器的立体组装图。
图2是图1所示模组连接器的部分分解图。
图3是图2所示的模组连接器的端子模组的立体组装图，其中磁芯为示意图。
图4是图3所示的端子模组的另一角度的立体组装图，其中磁芯为示意图。
图5是图3所示的端子模组的子电路板的前视图，其中磁芯为示意图。
图6是图4所示的端子模组的子电路板的后视图，其中磁芯为示意图。
【具体实施方式】
请参阅图1，本发明揭示一种模组连接器100，其包括：设有收容腔11的绝缘本体1、收容于绝缘本体1的收容腔11内的端子模组2、组设于绝缘本体1上的一对发光体3及覆盖于绝缘本体1上的遮蔽盖体4。
参阅图1及图2，绝缘本体1包括设置于收容腔11上方的一对***槽12及收容腔11下方的一对通用串行总线(Universal Serial Bus，USB)端口13。各通用串行总线端口13内设有舌扳131及配置于舌扳131上的若干端子132。于其他实施方式中，绝缘本体1亦可仅设有收容腔11或于收容腔11一侧设有其他端口。
遮蔽盖体4包括相互配合以分别覆盖于绝缘本体1的前侧与后侧的前盖体41与后盖体42。
参阅图3至图6，端子模组2包括具有第一侧面211、第二侧面212的子电路板21、安装于子电路板21之第一侧面211的若干导电端子22、装设于子电路板21内的磁性元件23、及安装于子电路板21的第二侧面212的若干电子元件24及转接模组25。子电路板21的第一侧面211、第二侧面212上分别设有若干导电片2111、导电区域2121。子电路板211底部进一步设有贯穿第一侧面211、第二侧面212的若干导电孔213。各导电端子22具有倾斜延伸的接触部221、竖直延伸的焊接部222及连接接触部221与焊接部222的连接部223。
各磁性元件23包括植入子电路板21内层的磁芯231及通过印刷导电层技术分别配置于子电路板21的第一侧面211、第二侧面212上的若干导电线路232、233。磁芯231植入子电路板21内层故无法于子电路板21外侧观看其结构。为了便于说明，图3至图6中增加了揭示磁芯231结构的示意图。子电路板21的第一侧面211上的导电线路232一端延伸至子电路板21之靠近对应磁芯231处从而与磁芯231形成磁场并产生电感，另一端与导电片2111或导电孔213电性连接以实现信号的传输和滤波阻抗的匹配。子电路板21的第二侧面212上的导电线路233一端延伸至子电路板21之靠近对应磁芯231处从而与磁芯231形成磁场，另一端与导电区域2121或导电孔213电性连接。若干磁性元件23中包括配置于靠近子电路板21上方的一对变压器23a及配置于靠近子电路板21下方的一对共模扼流线圈23b。
转接模组25包括主体部251及固持于主体部251上的若干转接端子252。各转接端子252大致呈“L”状，包括水平延伸的导电部2521及竖直延伸的尾部2522。
组装端子模组2时，首先将磁芯231植入设有导电片2111、导电区域2121及导电孔213的子电路板21的内层。通过印刷导电层技术制得与磁芯231形成磁场的导电线路232、233。将电容、电阻等电子元件24安装于子电路板21的第二侧面212且焊接于导电区域2121上。将导电端子22组装于子电路板21的第一侧面211上且令其焊接部222与导电片2111焊接。然后，将转接模组3安装于子电路板21的第二侧面212上，同时令转接端子25的导电部2521插设于子电路板21的导电孔213内，尾部2522与母电路板(未图示)电性连接。如此一体制成端子模组2。
组装模组连接器100时，将端子模组2安装于绝缘本体1内，令导电端子22的接触部221突伸于绝缘本体1的收容腔11内。再将一对发光件3收容于绝缘本体1的***槽12内，令设于发光件3上的引脚31与子电路板21电性连接。最后，将前、后遮蔽盖体41、42覆盖于绝缘本体1上。
磁性元件23的磁芯231植入子电路板21内层，导电线路232通过印刷导电层技术配置且与磁芯231形成磁场。磁性元件23的制造过程中不需要采用手工缠绕方式，如此可以大规模应用于自动化生产中。

Claims (8)

1.一种模组连接器，其包括：设有收容腔的绝缘本体及收容于绝缘本体内的端子模组，端子模组包括子电路板、及安装于子电路板上的若干导电端子、若干磁性元件及用于转接信号的转接模组，子电路板上设有导通部，各导电端子具有向收容腔突伸的接触部及与导通部电性连接的尾部，其特征在于：所述磁性元件包括植入子电路板内层的磁芯及通过印刷导电层技术配置于子电路板上的若干导电线路，磁芯与导电线路形成磁场，所述子电路板包括相对设置的第一、第二侧面，所述导电端子安装于子电路板的第一侧面，所述转接模组安装于子电路板的第二侧面，所述若干导电线路分别配置于所述第一、第二侧面上，所述子电路板上设有贯穿子电路板第一、第二侧面的若干导电孔，所述第一侧面上的导电线路一端延伸至子电路板上靠近对应磁芯处从而与所述磁芯形成磁场并产生电感，另一端与导通部或导电孔电性连接。
2.如权利要求1所述的模组连接器，其特征在于：所述导通部为配置于子电路板的第一侧面的若干导电片，所述导电端子的尾部与所述导电片焊接，导电端子进一步包括连接接触部与尾部的连接部。
3.如权利要求1所述的模组连接器，其特征在于：所述子电路板的第二侧面上设有若干导电区域，所述子电路板上进一步设有与所述导电区域电性连接的电子元件。
4.如权利要求3所述的模组连接器，其特征在于：所述子电路板的第二侧面上的导电线路一端延伸至子电路板上靠近对应磁芯处从而与磁芯形成磁场并产生电感，另一端与所述导电区域或导电孔电性连接。
5.如权利要求1所述的模组连接器，其特征在于：所述转接模组包括主体部及转接端子，转接端子设有插设于子电路板的导电孔内的导电部及自导电部弯折延伸的尾部。
6.如权利要求1所述的模组连接器，其特征在于：所述磁性元件包括配置于靠近子电路板上方的一对变压器及配置于靠近子电路板下方的一对共模扼流线圈。
7.如权利要求1所述的模组连接器，其特征在于：所述绝缘本体包括设置于收容腔下方的一对通用串行总线端口及用于收容发光体的一对***槽。
8.如权利要求1所述的模组连接器，其特征在于：所述模组连接器进一步包括覆盖于绝缘本体上的遮蔽盖体，遮蔽盖体包括相互配合的前盖体与后盖体。
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